7-165
VN0545
VN0550
BVDSS /R
DS(ON) ID(ON)
BVDGS (max) (min) TO-39 TO-92 Die
450V 60150mA VN0545N3 VN0545ND
500V 60150mA VN0550N2 VN0550N3 VN0550ND
MIL visual screening available
Order Number / Package
Advanced DMOS Technology
These enhancement-mode (normally-off) transistors utilize a
vertical DMOS structure and Supertex’s well-proven silicon-gate
manufacturing process. This combination produces devices with
the power handling capabilities of bipolar transistors and with the
high input impedance and positive temperature coefficient inher-
ent in MOS devices. Characteristic of all MOS structures, these
devices are free from thermal runaway and thermally-induced
secondary breakdown.
Supertex’s vertical DMOS FETs are ideally suited to a wide range
of switching and amplifying applications where high breakdown
voltage, high input impedance, low input capacitance, and fast
switching speeds are desired.
Package Options
Note: See Package Outline section for dimensions.
N-Channel Enhancement-Mode
Vertical DMOS FETs
High Reliability Devices
See pages 5-4 and 5-5 for MILITARY STANDARD Process
Flows and Ordering Information.
Features
Free from secondary breakdown
Low power drive requirement
Ease of paralleling
Low CISS and fast switching speeds
Excellent thermal stability
Integral Source-Drain diode
High input impedance and high gain
Complementary N- and P-channel devices
Applications
Motor controls
Converters
Amplifiers
Switches
Power supply circuits
Drivers (relays, hammers, solenoids, lamps,
memories, displays, bipolar transistors, etc.)
Absolute Maximum Ratings
Drain-to-Source Voltage BVDSS
Drain-to-Gate Voltage BVDGS
Gate-to-Source Voltage ± 20V
Operating and Storage Temperature -55°C to +150°C
Soldering Temperature* 300°C
* Distance of 1.6 mm from case for 10 seconds.
TO-39
TO-92
Ordering Information
S G D
D G S
Case: DRAIN
7-166
VN0545/VN0550
Package ID (continuous)* ID (pulsed) Power Dissipation
θ
jc
θ
ja IDR*I
DRM
@ TC = 25°C°C/W °C/W
TO-39 100mA 300mA 6.0W 20.8 125 100mA 300mA
TO-92 50mA 250mA 1.0W 125 170 50mA 250mA
* ID (continuous) is limited by max rated Tj.
Thermal Characteristics
Symbol Parameter Min Typ Max Unit Conditions
BVDSS VN0550 500
VN0545 450
VGS(th) Gate Threshold Voltage 2 4 V VGS = VDS , ID = 1mA
VGS(th) Change in VGS(th) with Temperature -3.8 -5.0 mV/°CV
GS = VDS , ID = 1mA
IGSS Gate Body Leakage 100 nA VGS = ±20V, VDS = 0V
IDSS Zero Gate Voltage Drain Current 10 µAV
GS = 0V, VDS = Max Rating
1mAV
GS = 0V, VDS = 0.8 Max Rating
TA = 125°C
ID(ON) ON-State Drain Current 100 VGS = 5V, VDS = 25V
150 350 VGS = 10V, VDS = 25V
RDS(ON) 45 VGS = 5V, ID = 50mA
40 60 VGS = 10V, ID = 50mA
RDS(ON) Change in RDS(ON) with Temperature 1 1.7 %/°CV
GS = 10V, ID = 50mA
GFS Forward Transconductance 50 100 m VDS = 25V, ID = 50mA
CISS Input Capacitance 45 55
COSS Common Source Output Capacitance 8 10 pF
CRSS Reverse Transfer Capacitance 2 5
td(ON) Turn-ON Delay Time 10
trRise Time 15
td(OFF) Turn-OFF Delay Time 10
tfFall Time 10
VSD Diode Forward Voltage Drop 0.8 V VGS = 0V, ISD = 0.5A
trr Reverse Recovery Time 300 ns VGS = 0V, ISD = 0.5A
Notes:
1. All D.C. parameters 100% tested at 25°C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
Electrical Characteristics (@ 25°C unless otherwise specified)
Drain-to-Source
Breakdown Voltage
Static Drain-to-Source
ON-State Resistance
mA
VV
GS = 0V, ID = 1mA
VGS = 0V, VDS = 25V
f = 1 MHz
VDD = 25V,
ID = 150mA,
RGEN = 25
ns
Switching Waveforms and Test Circuit
90%
10%
90% 90%
10%
10%
PULSE
GENERATOR
V
DD
R
L
OUTPUT
D.U.T.
t
(ON)
t
d(ON)
t
(OFF)
t
d(OFF)
t
F
t
r
INPUT
INPUT
OUTPUT
10V
V
DD
R
gen
0V
0V
7-167
VN0545/VN0550
Typical Performance Curves
Output Characteristics
0.5
0.4
0.3
0.2
0.1
0
V
DS
(volts)
I
D
(amperes)
Saturation Characteristics
0.25
0.20
0.15
0.10
0.05
0
V
DS
(volts)
I
D
(amperes)
Maximum Rated Safe Operating Area
1 100010010
0.01
0.1
1.0
0.001
V
DS
(volts)
I
D
(amperes)
Thermal Response Characteristics
Thermal Resistance (normalized)
1.0
0.8
0.6
0.4
0.2
0.001 100.01 0.1 1
t
p
(seconds)
Transconductance vs. Drain Current
0.40
0.32
0.24
0.16
0.08
00 0.50.1 0.2 0.3 0.4
G
FS
(siemens)
I
D
(amperes)
Power Dissipation vs. Case Temperature
0 15010050
10
8
6
4
2
01257525
T
C
(°C)
P
D
(watts)
TO-92
P
D
= 1W
T
C
= 25°C
TO-92
T
A
= -55°C
T
A
= 25°C
T
A
= 125°C
V
DS
= 25V
TO-39 (DC)
TO-39 (pulsed)
0102030 5040
VGS = 10V
8V
6V
4V
0246 108
V
GS
= 10V 6V
8V
4V
TO-39
P
D
= 6W
T
C
= 25°C
TO-39
0
TO-92 (DC)
TC = 25°C
7-168
VN0545/VN0550
Typical Performance Curves
C
OSS
Gate Drive Dynamic Characteristics
Q
G
(nanocoulombs)
V
GS
(volts)
T
j
(°C)
V
GS(th)
(normalized)
V
DS(th)
and R Variation with Temperature
On-Resistance vs. Drain Current
R
DS(ON)
(ohms)
BV
DSS
(normalized)
T
j
(°C)
Transfer Characteristics
V
GS
(volts)
I
D
(amperes)
Capacitance vs. Drain-to-Source Voltage
100
75
50
25
0
C (picofarads)
V
DS
(volts)
I
D
(amperes)
BV
DSS
Variation with Temperature
0 10203040
0246810
0.5
0.4
0.3
0.2
0.1
0
-50 0 50 100 150
1.1
1.0
0.9
100
80
60
40
20
0
1.4
1.2
1.0
0.8
0.6
10
8
6
4
2
0 0.2 0.4 0.6 0.8 1.0
-50 0 50 100 150
50 pF
V
DS
= 40V
V
DS
= 10V
105 pF
V
(th)
@ 1mA
V
GS
= 5V
V
GS
= 10V
T= -55
A
C°
V
DS
= 25V
C
ISS
C
RSS
25°C
150°C
0 0.1 0.2 0.3 0.50.4
R
DS(ON)
@ 10V, 50mA
f = 1MHz
112 pF
1.8
1.4
1.0
0.6
0.2
0
R
DS(ON)
(normalized)