PC912L0NSZ0F Series PC912L0NSZ0F Series High Speed 25Mb/s, High CMR type DIP 8 pin OPIC Photocoupler Description Agency approvals/Compliance PC912L0NSZ0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0 kV. Data transfer rate is MAX. 25 Mb/s and CMR is MIN. 20 kV/s. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC912L) 2. Approved by VDE (DIN EN60747-5-2()) (as an option), file No. 40008898 (as model No. PC912L) 3. Package resin : UL flammability grade (94V-0) Features Applications 1. DIP 8 pin package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High speed response (tPHL : MAX. 40ns, tPLH : MAX. 40ns) 4. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. 20 kV/s, CML : MIN. -20 kV/s) 5. High isolation voltage between input and output (Viso(rms) : 5.0 kV) 6. Lead-free and RoHS directive compliant 1. FA equipment () DIN EN60747-5-2 : successor standard of DIN VDE0884 "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A05803EN Date Sep. 1. 2006 (c) SHARP Corporation PC912L0NSZ0F Series Internal Connection Diagram 1 VCC1 VIN NC GND1 1 8 2 2 3 7 Amp. 3 4 6 4 5 pin 3 and 7 5 6 7 8 GND2 VO NC VCC2 are not allowed external connection Truth table Input L H LED ON OFF Output L H L : Logic (0) H : Logic (1) Outline Dimensions (Unit : mm) 8 7 6 5 2 3 9.660.50 4 1 6 2 3 9.660.50 Date code 5 TYP. 0.5 Epoxy resin 0.10 0.26 0.50.1 :0 to 13 4 VDE Identification mark Date code Primary side mark 7.620.30 3.40.5 3.50.5 7 4 Primary side mark 2.540.25 8 0.850.20 PC912L 6.50.5 PC912L 1 SHARP mark "S" 7.620.30 3.40.5 3.50.5 SHARP mark "S" 1.20.3 0.850.20 2.540.25 0.5TYP. 1.20.3 2. Through-Hole (VDE option) [ex. PC912V0YSZ0F] 6.50.5 1. Through-Hole [ex. PC912L0NSZ0F] Epoxy resin 0.260.10 0.50.1 Product mass : approx. 0.49g Plating material : SnCu (Cu : TYP. 2%) :0 to 13 Product mass : approx. 0.49g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A05803EN 2 PC912L0NSZ0F Series (Unit : mm) 3. SMT Gullwing Lead-Form [ex. PC912L0NIZ0F] SHARP mark "S" 8 1.20.3 0.850.20 7 6 SHARP mark "S" 5 7 6 5 PC912L 6.50.5 PC912L 8 0.850.20 6.50.5 1.20.3 4. SMT Gullwing Lead-Form (VDE option) [ex. PC912L0YIZ0F] 4 VDE Identification mark 4 3 0.50 9.66 1 Date code Primary side mark 2 4 3 Date code Primary side mark 9.660.50 3.50.5 2.540.25 1.0+0.4 -0.0 Epoxy resin 2.540.25 1.0+0.4 -0.0 1.0+0.4 -0.0 10.0+0.0 -0.5 6. Wide SMT Gullwing Lead-Form (VDE option) [ex. PC912L0YUZ0F] 6 5 PC912L 8 SHARP mark "S" 6.50.5 7 1.20.3 0.850.20 7 6 5 PC912L 4 6.50.5 1.20.3 8 1.0+0.4 -0.0 Product mass : approx. 0.49g Plating material : SnCu (Cu : TYP. 2%) 5. Wide SMT Gullwing Lead-Form [ex. PC912L0NUZ0F] SHARP mark "S" Epoxy resin 10.0+0.0 -0.5 Product mass : approx. 0.49g Plating material : SnCu (Cu : TYP. 2%) 0.850.20 0.350.25 7.620.30 0.260.10 0.260.10 7.620.30 3.50.5 2 0.350.25 1 VDE Identification mark Date code Date code 2.540.25 4 0.25 2.540.25 Epoxy resin 10.160.50 12.0MAX. 7.620.30 0.260.10 9.660.50 0.25 Primary side mark 7.620.30 0.750.25 3 0.750.25 0.5TYP. 9.660.50 2 0.260.10 Primary side mark 1 3.50.5 4 0.250.25 3 3.50.5 2 0.5TYP. 1 Epoxy resin 0.750.25 Product mass : approx. 0.49g Plating material : SnCu (Cu : TYP. 2%) 10.160.50 12.0MAX. 0.750.25 Product mass : approx. 0.49g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A05803EN 3 PC912L0NSZ0F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * Mark P R S T U V W X A B C ** * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Rank mark There is no rank mark indicator. Sheet No.: D2-A05803EN 4 PC912L0NSZ0F Series Absolute Maximum Ratings (Unless otherwise specified Ta=Topr) Parameter Symbol Rating Supply voltage VCC1 0 to 5.5 Input VIN Input voltage -0.5 to VCC1+0.5 VCC2 Supply voltage 0 to 5.5 Output High level output voltage VO -0.5 to VCC2+0.5 IO Low level output current 10 *1 Isolation voltage Viso (rms) 5.0 Operating temperature Topr -40 to +85 -55 to +125 Storage temperature Tstg *2 Soldering temperature Tsol 270 Unit V V V V mA kV C C C *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s Electro-optical Characteristics*3 Parameter Low level supply current High level supply current Input current High level supply current Low level supply current Symbol ICC1L ICC1H IIN ICC2H ICC2L Conditions VIN=0V VIN=VCC1 VCC1=5V VIN=5V VIN=0V High level output voltage VOH IO=-20A, VIN=5V IO=-4mA, VIN=5V Low level output voltage VOL Isolation resistance "HighLow" propagation delay time "LowHigh" propagation delay time Pulse width distortion |tPHL-tPLH| Propagation delay skew Data transfer rate Transfer Rise time characteristics Fall time Instantaneous common mode rejection voltage "Output : High level" RISO tPHL tPLH tw TPSK T tr tf Input Response time Output Instantaneous common mode rejection voltage "Output : Low level" IO=20A, VIN=0V IO=400A, VIN=0V IO=4mA, VIN=0V DC500V, 40 to 60%RH CL=15pF, CMOS Logic level VIN=05V tr=tf<1ns Pulse width 40ns Duty 50% (Unless otherwise specified Ta=Topr) TYP. MAX. MIN. Unit - mA 6.0 10.0 - 0.8 3.0 mA - -10 A 10 - 2.5 5.0 mA - 2.0 4.0 mA - 4.4 5.0 V - 4.0 4.8 V - 0 0.1 V - - 0.1 V - 1.0 V 0.2 - 5x1010 1011 - ns 23 40 - 22 40 ns - - 6 ns - - ns 20 - - 25 Mb/s - - 4 ns - - 3 ns CMH VIN=VCC1, VO<0.8xVCC2 VCM=1kV 20 - - kV/s CML VIN=0, VO<0.8V VCM=1kV -20 - - kV/s *3 When measuring output and transfer characteristics, connect a by-pass capacitor (0.01F or more) between VCC1 (pin 1 ) and GND1 (pin 4 ), between VCC2 (pin 8 ) and GND2 (pin 5 ) near the device. All typical values:at Ta=25C, VCC1=VCC2=5V Sheet No.: D2-A05803EN 5 PC912L0NSZ0F Series Model Line-up Through-Hole SMT Gullwing Wide SMT Gullwing Sleeve Sleeve Sleeve Package 50pcs/sleeve 50pcs/sleeve 50pcs/sleeve DIN EN60747-5-2 ------ Approved ------ Approved ------ Approved Model No. PC912L0NSZ0F PC912L0YSZ0F PC912L0NIZ0F PC912L0YIZ0F PC912L0NUZ0F PC912L0YUZ0F Lead Form Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A05803EN 6 PC912L0NSZ0F Series Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time tPLH 1 7 05V 0.1F Amp. VO 3 6 4 5 VCC2=5V VCC1=5V 2 CL 5V CMOS 50% Input VIN 0.1F tr = tf < 1ns Pulse width 40ns Duty 50% tPHL 8 VOH 2.5V CMOS VOL 90% Output 10% VOUT tr tf Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage 1kV 1 8 2 7 VCM VCC1=5V SW B VCC2=5V 0.1F 0.1F Amp. A CMH,VO 0.8V CML,VO 6 CL 4 VOH VCC2x0.8 SW at A, VIN=5V VO 3 GND VOL GND SW at B, VIN=0V 5 + - VCM Fig.3 Output Voltage vs. Input Voltage Fig.4 Input Threshold Voltage vs. Input Supply Voltage 1.6 VCC1=VCC2=5V VCC1=VCC2=5V VO=2.5V Input threshould voltage VITH (V) 5 Output voltage (V) 4 Ta=85C Ta= -40C 3 Ta=25C 2 1 1.5 1.4 Ta= -40C 1.3 1.2 Ta=25C 1.1 Ta=85C 0 0 1 2 3 4 1.0 4.50 5 Input voltage VIN (V) 4.75 5.00 5.25 5.50 Input supply voltage VCCI (V) Sheet No.: D2-A05803EN 7 PC912L0NSZ0F Series Fig.5 Input High Level Supply Current vs. Ambient Temperature Fig.6 Input Low Level Supply Current vs. Ambient Temperature 10 VCC1=5V VIN=5V Input low level supply current ICC1L (mA) Input high level supply current ICC1H (mA) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 VCC1=5V VIN=0V 8 6 4 2 0 -40 80 -20 Ambient temperature Ta (C) Fig.7 Output High Level Supply Current vs. Ambient Temperature 3.0 Output low level supply current ICC2L (mA) VCC1=VCC2=5V VIN=5V 4.0 3.0 2.0 1.0 0.0 -40 -20 0 20 40 60 VCC1=VCC2=5V VIN=0V 2.5 2.0 1.5 1.0 0.5 0.0 -40 80 -20 Ambient temperature Ta (C) 0 20 40 60 Ambient temperature Ta (C) 80 Fig.10 Low Level Output Voltage vs. Ambient Temperature Fig.9 High Level Output Voltage vs. Ambient Temperature 5.2 0.5 IO=-20A VCC1=VCC2=5V VIN=0V 5.0 Low level output voltage VOL (V) High level output voltage VOH (V) 80 Fig.8 Output Low Level Supply Current vs. Ambient Temperature 5.0 Output high level supply current ICC2H (mA) 0 20 40 60 Ambient temperature Ta (C) 4.8 4.6 IO=-4mA 4.4 VCC1=VCC2=5V VIN=5V 4.2 4.0 -40 0.4 0.3 IO= 4mA 0.2 IO= 400A 0.1 IO= 20A -20 0 20 40 60 Ambient temperature Ta (C) 0.0 -40 80 -20 0 20 40 60 Ambient temperature Ta (C) 80 Sheet No.: D2-A05803EN 8 PC912L0NSZ0F Series Fig.12 Propagation Delay Time vs. Ambient Temperature Fig.11 Rise Time/Fall Time vs. Ambient Temperature 6 VCC1=VCC2=5V CL=15pF Propagation delay time tPHL/tPLH (ns) 29 Risetime tr / Fulltime tf (ns) 5 4 3 2 1 0 -40 -20 0 20 40 60 Ambient temperature Ta (C) 2 tPHL 23 21 tPLH 19 17 -20 0 20 40 60 Ambient temperature Ta (C) 80 29 VCC1=VCC2=5V VCC1=VCC2=5V CL=15pF Propagation delay time tPHL/tPLH (ns) Pulse width distortion |tPHL-tPLH| (ns) 25 Fig.14 Propagation Delay Time vs. Output Load Capacitance Fig.13 Pulse Width Distortion vs. Ambient Temperature 1 0 -1 -2 -40 27 15 -40 80 VCC1=VCC2=5V CL=15pF -20 0 20 40 60 Ambient temperature Ta (C) 27 23 21 tPLH 19 17 15 15 80 tPHL 25 20 25 30 35 40 45 Output load capacitance CL (pF) 50 Fig.15 Pulse Width Distortion vs. Ambient Temperature 6 Pulse width distortion |tPHL-tPLH| (ns) VCC1=VCC2=5V 5 4 3 2 1 0 15 20 25 30 35 40 45 Output load capacitance CL (pF) 50 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A05803EN 9 PC912L0NSZ0F Series Design Considerations Recommended operating conditions Parameter Supply voltage Supply voltage Low level input voltage High level input voltage Operating temperature Symbol VCC1 VCC2 VIL VIH Topr MIN. 4.5 4.5 0 2.0 -40 TYP. - - - - - MAX. 5.5 5.5 0.8 VCC1 +70 Unit V V V V C Notes about static electricity Transistor of detector side in CMOS configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01F or more between VCC1-GND and VCC2-GND near the device. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. Sheet No.: D2-A05803EN 10 PC912L0NSZ0F Series Recommended Foot Print (reference) SMT Gullwing Lead-form 1.7 2.54 2.54 2.54 8.2 2.2 (Unit : mm) Wide SMT Gullwing Lead-form 1.7 2.54 2.54 2.54 10.2 2.2 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A05803EN 11 PC912L0NSZ0F Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A05803EN 12 PC912L0NSZ0F Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive. *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A05803EN 13 PC912L0NSZ0F Series Package specification Sleeve package 1. Through-Hole or SMT Gullwing Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 2 5.8 10.8 520 6.7 (Unit : mm) 2. Wide SMT Gullwing Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 15.0 2 5.9 10.8 520 6.35 (Unit : mm) Sheet No.: D2-A05803EN 14 PC912L0NSZ0F Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E238] Sheet No.: D2-A05803EN 15