PC912L0NSZ0F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC912L)
2. Approved by VDE (DIN EN60747-5-2(∗)) (as an op-
tion), file No. 40008898 (as model No. PC912L)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. FA equipment
■ Applications
High Speed 25Mb/s, High CMR type
DIP 8 pin ∗OPIC Photocoupler
1. DIP 8 pin package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High speed response
(tPHL : MAX. 40ns, tPLH : MAX. 40ns)
4. High noise immunity due to high instantaneous com-
mon mode rejection voltage
(CMH : MIN. 20 kV/µs, CML : MIN. −20 kV/µs)
5. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
6. Lead-free and RoHS directive compliant
■ Description
PC912L0NSZ0F Series contains a LED optically
coupled to an OPIC chip.
It is packaged in a 8 pin DIP, available in SMT gullw-
ing lead-form option.
Input-output isolation voltage(rms) is 5.0 kV. Data
transfer rate is MAX. 25 Mb/s and CMR is MIN.
20 kV/µs.
1Sheet No.: D2-A05803EN
Date Sep. 1. 2006
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC912L0NSZ0F Series
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
■ Internal Connection Diagram
2
Sheet No.: D2-A05803EN
■ Truth table
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC912L0NSZ0F] 2.
Through-Hole (VDE option) [ex. PC912V0YSZ0F]
PC912L0NSZ0F Series
PC912L
Primary side
mark
Date code
SHARP
mark
"S"
2.54±0.25
8 7 6 5
6.5±0.5
0.85±0.20
1.2±0.3
9.66±0.50
3.5
±0.5
0.5±0.1
0.5TYP.
1 2 3 4
3.4±0.5
θ θ
θ:0 to 13˚
7.62±0.30
0.26±0.10
Epoxy resin
VDE Identification mark
2.54±0.25
8 7 6 5
6.5±0.5
0.85±0.20
1.2±0.3
9.66±0.50
3.5
±0.5
0.5±0.1
0.5TYP.
1 2 3
3.4±0.5
θ θ
θ:0 to 13˚
7.62±0.30
0.26±0.10
Epoxy resin
Primary side
mark
Date code
PC912L
4
SHARP
mark
"S"
4
∗pin and are not allowed external connection
VCC1
VIN
NC
∗
GND1
GND2
VO
NC
1
1
2
4
3
8
7
5
6
2
3
3 7
4
5
6
7
VCC2
8
Amp.
Input LED Output
LL
HH
ON
OFF
L : Logic (0)
H : Logic (1)
Product mass : approx. 0.49g
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.49g
Plating material : SnCu (Cu : TYP. 2%)
3
Sheet No.: D2-A05803EN
(Unit : mm)
3. SMT Gullwing Lead-Form [ex. PC912L0NIZ0F] 4. SMT Gullwing Lead-Form (VDE option)
[ex. PC912L0YIZ0F]
5. Wide SMT Gullwing Lead-Form
[ex. PC912L0NUZ0F]
6. Wide SMT Gullwing Lead-Form (VDE option)
[ex. PC912L0YUZ0F]
PC912L0NSZ0F Series
Primary side
mark
PC912L
SHARP
mark
"S"
0.85±0.20
1.2±0.3
78 6 5
4
6.5±0.5
1 2 3
2.54±0.25
3.5±0.5
1.0+0.4
−0.0
0.26±0.10
Epoxy resin
10.0+0.0
−0.5
1.0+0.4
−0.0
0.35±0.25
7.62±0.30
9.66±0.50 Date code
VDE Identification mark
Primary side
mark
Date code
PC912L
4
SHARP
mark
"S"
0.85±0.20
1.2±0.3
78 6 5
4
6.5±0.5
1 2 3
2.54±0.25
3.5±0.5
1.0+0.4
−0.0
0.26±0.10
Epoxy resin
10.0+0.0
−0.5
1.0+0.4
−0.0
0.35±0.25
7.62±0.30
9.66±0.50
PC912L
7.62±0.30
0.75±0.25
0.26±0.10
0.25±0.25
0.75±0.25 10.16±0.50
12.0MAX.
9.66±0.50
Epoxy resin
2.54±0.25
3.5±0.5
0.5TYP. 6.5±0.5
0.85±0.20 1.2±0.3
Primary side
mark
Date code
SHARP
mark
"S"
1 2 3
6 58 7
4
VDE Identification mark
PC912L
7.62±0.30
0.75±0.25
0.26±0.10
0.25±0.25
0.75±0.25 10.16±0.50
12.0MAX.
9.66±0.50
Epoxy resin
2.54±0.25
3.5±0.5
0.5TYP. 6.5±0.5
0.85±0.20 1.2±0.3
Primary side
mark
Date code
SHARP
mark
"S"
1 2 3
6 58 7
4
4
Product mass : approx. 0.49g
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.49g
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.49g
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.49g
Plating material : SnCu (Cu : TYP. 2%)
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
4
repeats in a 20 year cycle
Sheet No.: D2-A05803EN
PC912L0NSZ0F Series
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05803EN
■ Absolute Maximum Ratings
5
PC912L0NSZ0F Series
■ Electro-optical Characteristics*3
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
Parameter Symbol Rating Unit
Supply voltage VCC1 0 to 5.5 V
Input voltage
Input
Output
VIN
−0.5 to V
CC1
+0.5
V
V
Supply voltage
High level output voltage
Low level output current
VO
mA
10
IO
V
VCC2
Viso (rms) kV
Operating temperature Topr
−55 to +125
−40 to +85
0 to 5.5
−0.5 to V
CC2
+0.5
˚C
˚C
Storage temperature
Isolation voltage
Tstg
*2 Soldering temperature Tsol 270
5.0
˚C
*1
(Unless otherwise specified Ta=Topr)
Parameter Symbol Unit
Input
Low level supply current ICC1L mA
High level supply current ICC1H mA
Input current
High level supply current
High level output voltage
Low level output voltage
IIN VCC1=5V µA
Output
ICC2L
ICC2H
VOH
VOL
V
V
Transfer
charac-
teristics
Isolation resistance RISO Ω
tPLH
ns
tPHL
ns
Propagation delay skew
∆tw ns
Data transfer rate
Rise time
Fall time
Pulse width distortion |tPHL−tPLH|
TPSK
tr
tf
T
ns
Instantaneous common mode
rejection voltage
"Output : High level"
VIN=VCC1, VO<0.8×VCC2
VCM=1kV
VIN=0, VO<0.8V
VCM=1kV
kV/µs
Instantaneous common mode
rejection voltage
"Output : Low level"
CMLkV/µs
VIN=0V
VIN=VCC1
CL=15pF, CMOS Logic level
VIN=0→5V
tr=tf<1ns
Pulse width 40ns
Duty 50%
MIN.
−
−
−10
5×1010
−
−
−
−
−
−
20
−20
MAX.
3.0
10
0.1
0.1
−
6
20
−
−
10.0
40
40
Conditions
"Low→High" propagation delay time
"High→Low" propagation delay time
Response time
CMH
VIN=5V
IO=−20µA, VIN=5V
IO=−4mA, VIN=5V
VIN=0V
IO=20µA, VIN=0V
IO=400µA, VIN=0V
*3 When measuring output and transfer characteristics, connect a by-pass capacitor (0.01µF or more) between VCC1 (pin 1 ) and GND1 (pin 4 ), between VCC2 (pin 8 ) and GND2
(pin 5 ) near the device.
All typical values:at Ta=25˚C, VCC1=VCC2=5V
DC500V, 40 to 60%RH
TYP.
0.8
mA
−5.02.5
−
mA
−4.02.0
0
V4.4 −
5.0
V4.0 −
4.8
−
V
−1.0
IO=4mA, VIN=0V 0.2
1011
−
−
Mb/s
−25
−
ns
−−
4
ns
−−
3
6.0
23
22
−
−
(Unless otherwise specified Ta=Topr)
Low level supply current
Sheet No.: D2-A05803EN
■ Model Line-up
6
Please contact a local SHARP sales representative to inquire about production status.
PC912L0NSZ0F Series
PC912L0NSZ0F PC912L0YSZ0F
−−−−−− Approved
PC912L0NIZ0F PC912L0YIZ0F PC912L0NUZ0F PC912L0YUZ0F
Lead Form
Package
Model No.
DIN EN60747-5-2
Sleeve
Through-Hole
50pcs/sleeve
Sleeve
50pcs/sleeve
Sleeve
50pcs/sleeve
SMT Gullwing Wide SMT Gullwing
−−−−−− Approved −−−−−− Approved
Sheet No.: D2-A05803EN
7
Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time
Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage
Fig.3 Output Voltage vs. Input Voltage Fig.4 Input Threshold Voltage vs.
Input Supply Voltage
PC912L0NSZ0F Series
1
2
3
4
8
7
6
5
Amp.
0.1µF
0.1µF
tr=tf< 1ns
Pulse width 40ns
Duty 50%
tPLH
trtf
tPHL
0→5V
Input
90%
5V CMOS
50%
10%
VOH
VOL
2.5V CMOS
VIN
Output
VOUT
VO
CL
VCC2=5V
VCC1=5V
1
2
3
4
8
7
6
5
Amp.
0.1µF
0.1µF
1kV
GND
GND
VCM
CMH,VO
CML,VO
SW at A, VIN=5V
SW
A
B
SW at B, VIN=0V
VOH
VCM
VOL
VCC2×0.8
+−
0.8V
VO
CL
VCC2=5V
VCC1=5V
Output voltage (V)
Input voltage VIN (V)
0012345
1
2
3
4
5
VCC1=VCC2=5V
Ta=85˚C Ta= −40˚C
Ta=25˚C
Input threshould voltage VITH (V)
Input supply voltage VCCI (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
4.50 4.75 5.00 5.25 5.50
Ta= −40˚C
Ta=25˚C
Ta=85˚C
VCC1=VCC2=5V
VO=2.5V
Sheet No.: D2-A05803EN
8
PC912L0NSZ0F Series
Fig.6 Input Low Level Supply Current vs.
Ambient Temperature
Fig.5 Input High Level Supply Current vs.
Ambient Temperature
Fig.8 Output Low Level Supply Current vs.
Ambient Temperature
Fig.10 Low Level Output Voltage vs.
Ambient Temperature
Fig.9 High Level Output Voltage vs.
Ambient Temperature
Fig.7 Output High Level Supply Current vs.
Ambient Temperature
Input high level supply current ICC1H (mA)
Ambient temperature Ta (°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
−40 −20020406080
VCC1=5V
VIN=5V
Input low level supply current ICC1L (mA)
Ambient temperature Ta (°C)
0
2
4
6
8
10
−40 −20 0 20 406080
V
CC1
=5V
V
IN
=0V
Output high level supply current ICC2H (mA)
Ambient temperature Ta (°C)
0.0
1.0
2.0
3.0
4.0
5.0
−40 −20 0 20 406080
VCC1=VCC2=5V
VIN=5V
Output low level supply current ICC2L (mA)
Ambient temperature Ta (°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
−40 −20 0 20 406080
VCC1=VCC2=5V
VIN=0V
Low level output voltage VOL (V)
Ambient temperature Ta (°C)
0.0
0.1
0.2
0.3
0.4
0.5
−40 −20 0 20 406080
VCC1=VCC2=5V
VIN=0V
IO= 4mA
IO= 400µA
IO= 20µA
High level output voltage VOH (V)
Ambient temperature Ta (°C)
4.0
4.2
4.4
4.6
4.8
5.0
5.2
−40 −20 0 20 406080
VCC1=VCC2=5V
VIN=5V
IO=−20µA
IO=−4mA
Sheet No.: D2-A05803EN
9
PC912L0NSZ0F Series
Fig.12 Propagation Delay Time vs.
Ambient Temperature
Fig.11 Rise Time/Fall Time vs.
Ambient Temperature
Fig.14 Propagation Delay Time vs.
Output Load Capacitance
Fig.15 Pulse Width Distortion vs.
Ambient Temperature
Fig.13 Pulse Width Distortion vs.
Ambient Temperature
Propagation delay time tPHL/tPLH (ns)
Ambient temperature Ta (°C)
15
17
19
21
23
25
27
29
−40 −20 0 20 406080
VCC1=VCC2=5V
CL=15pF
t
PHL
t
PLH
Pulse width distortion |tPHL-tPLH| (ns)
Ambient temperature Ta (°C)
−2
−1
0
1
2
−40 −20 0 20 406080
VCC1=VCC2=5V
CL=15pF
Risetime tr / Fulltime tf (ns)
Ambient temperature Ta (°C)
0
1
2
3
4
5
6
−40 −20 0 20 406080
VCC1=VCC2=5V
CL=15pF
Pulse width distortion |tPHL-tPLH| (ns)
Output load capacitance CL (pF)
0
1
2
3
4
5
6
15 20 25 30 35 40 45 50
VCC1=VCC2=5V
Propagation delay time tPHL/tPLH (ns)
Output load capacitance CL (pF)
15
17
19
21
23
25
27
29
15 20 25 30 35 40 45 50
VCC1=VCC2=5V
tPHL
tPLH
Remarks : Please be aware that all data in the graph
are just for reference and not for guarantee.
Sheet No.: D2-A05803EN
10
PC912L0NSZ0F Series
■ Design Considerations
Transistor of detector side in CMOS configuration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Notes about static electricity
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC1-GND and VCC2-GND near the device.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
● Design guide
Parameter Symbol MIN. MAX.
Supply voltage
High level input voltage
Low level input voltage
Supply voltage
Operating temperature
VCC1
VIH
VIL
VCC2
Topr
4.5
4.5
0
−40
2.0
5.5
5.5
0.8
+70
VCC1
Unit
V
V
V
˚C
V
TYP.
−
−
−
−
−
● Recommended operating conditions
Sheet No.: D2-A05803EN
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
11
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
2.542.54
1.7
2.2
8.2
2.54
(Unit : mm)
Wide SMT Gullwing Lead-form
(Unit : mm)
2.542.54
1.7
2.2
10.2
2.54
PC912L0NSZ0F Series
Sheet No.: D2-A05803EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
12
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC912L0NSZ0F Series
Sheet No.: D2-A05803EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive.
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
● Presence of ODC
13
PC912L0NSZ0F Series
Sheet No.: D2-A05803EN
■ Package specification
14
12.0
6.7
5.8
10.8
520
±2
(Unit : mm)
PC912L0NSZ0F Series
● Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
6.35
5.9
10.8
520
±2
(Unit : mm)
2. Wide SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
15
Sheet No.: D2-A05803EN
■ Important Notices
PC912L0NSZ0F Series
[E238]
