CPC1001N Optocoupler: Unidirectional Input, Single-Transistor Output INTEGRATED CIRCUITS DIVISION Parameter Breakdown Voltage BVCEO Current Transfer Ratio (Min) Saturation Voltage Input Control Current Rating 30 100 0.3 0.2 Features * * * * * 100mA Continuous Load Rating 1500Vrms Input/Output Isolation Small 4-Pin SOP Package Tape & Reel Version Available Flammability Rating UL 94 V-0 Applications * * * * * * * * Loop Detect Ringing Detect Sensor Circuitry Instrumentation Multiplexers Data Acquisition I/O Subsystems Industrial Control Units V % V mA Description CPC1001N is a unidirectional input optocoupler with a single transistor output. Current transfer ratios range from 100% to 800%. Approvals * UL Recognized Component: File # E76270 * CSA Certified Component: Certificate # 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # CPC1001N CPC1001NTR Description 4-Pin SOP (100/Tube) 4-Pin SOP Surface Mount (2000/Reel) Pin Configuration + Control - Control DS-CPC1001N-R06 www.ixysic.com 1 2 4 3 Load Load 1 INTEGRATED CIRCUITS DIVISION CPC1001N Absolute Maximum Ratings @ 25C Parameter Input Power Dissipation 1 Input Control Current Peak (10ms) Reverse Input Voltage Phototransistor 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 2.00 mW / C Ratings 150 5 1 5 150 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units mW mA A V mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameters Output Characteristics Phototransistor Blocking Voltage Phototransistor Output (Dark) Current Saturation Voltage Current Transfer Ratio Output Capacitance Input Characteristics Input Control Current Input Voltage Drop Input Reverse Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units ICEO=10A IF=0mA, VCEO=5V IF=1mA, IC=1mA IF=0.2mA, VCE=0.5V VCEO=25V, f=1MHz BVCEO ICEO VCE(sat) CTR COUT 30 100 - 90 9 330 6 500 0.3 800 - VP nA V % pF IC=0.2mA, VCE=0.5V IF=5mA VR=5V IF VF IR 0.9 - 0.1 1.2 - 0.2 1.5 10 mA V A - CI/O - 3 - pF Switching Characteristics @ 25C Characteristic Turn-On Time Turn-Off Time Symbol ton toff Test Condition Typ 1 30 IF=2mA, VCC=5V, RL=1K Switching Time Test Circuit Units s VCC RL Pulse Width=5ms Duty Cycle=1% IF VCE IF VCE 90% 10% t ON 2 www.ixysic.com t OFF R06 INTEGRATED CIRCUITS DIVISION CPC1001N PERFORMANCE DATA* LED Voltage vs. LED Current LED Voltage vs. LED Current 10 0 1.1 1.2 1.3 1.4 1.5 LED Forward Voltage (V) 1 0.1 1.6 Typical ICE Current vs. Temperature (VCE=0.5V) IF=10mA IF=5mA 10 IF=2mA IF=1mA IF=0.5mA 1 IF=0.2mA IF=0.1mA 1.1 1.2 1.3 1.4 1.5 LED Forward Voltage (V) 30 -20 0 20 40 60 Temperature (C) 80 IF=5mA 10 IF=2mA IF=1mA IF=0.5mA IF=0.2mA 5 0.10 3.0 0.0 Blocking Voltage (VP) 0.12 0.2 0.4 0.6 0.8 Collector Voltage (V) 1.0 100 Turn-On Time vs. Load Resistance (VCC=5V) 94 93 92 91 90 -40 1000 Turn-Off Time (Ps) Turn-On Time (Ps) IF=1mA 1.5 IF=2mA 1.0 IF=5mA 0.5 0.0 0.1 1 10 Load Resistance (k:) 100 80 100 Typical CTR vs. LED Forward Current (VCE=0.5V) 250 200 55C 25C 85C -40C 0.1 1 LED Forward Current (mA) 10 500 95 -20 0 20 40 60 Temperature (C) 80 100 400 VCC=10V VCC=5V 300 VCC=3V 200 100 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Turn-Off Time vs. Load Resistance (VCC=5V) 2.5 2.0 20 40 60 Temperature (C) Collector Leakage Current vs. Temperature 88 80 0 100 1.2 89 20 40 60 Temperature (C) -20 150 96 0.14 0 IF=2mA IF=1mA IF=0.2mA 1.1 Blocking Voltage vs. Temperature 0.16 -20 1.2 300 15 100 0.18 0.08 -40 1.3 350 IF=10mA 20 Typical Saturation Voltage vs. Temperature (IF=2mA, IC=1mA) 0.20 1.4 1.0 -40 1.6 25 0 -40 IF=50mA IF=20mA IF=10mA IF=5mA 1.5 Typical Voltage vs. Current 0.1 Saturation Voltage (V) LED Forward Voltage (V) 20 10 CTR (%) 30 Leakage Current (nA) Typical ICE (mA) LED Forward Current (mA) 40 100 LED Forward Voltage vs. Temperature 1.6 100 Collector Current (mA) LED Forward Current (mA) 50 100 10 0.1 Refer to the Test Circuit on the previous page for these two graphs. IF=5mA IF=2mA IF=1mA 1 10 Load Resistance (k:) 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1001N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1001N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1001N 260C 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1001N MECHANICAL DIMENSIONS CPC1001N 4.089 0.025 (0.161 0.001) Recommended PCB Land Pattern 0.203 0.025 (0.008 0.001) 6.096 0.102 (0.240 0.004) 3.810 0.025 (0.150 0.001) 0.559 0.127 (0.022 0.005) 0.910 0.025 (0.036 0.001) Pin 1 2.54 Typ (0.100 Typ) 3.85 (0.152) 1.54 (0.061) 2.030 0.025 (0.080 0.001) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.064 0.040 (0.0025 0.0015) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) 0.381 0.025 (0.015 0.001) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC1001NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P1=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1001N-R06 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/4/2018