3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 1 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Features
1.Dimensions : 3.0mm X 2.0mm X 0.8mm.
2.Higher brightness .
3.Small package with high efficiency .
4.Surface mount technology .
5.ESD protection .
6.Moisture sensitivity level : level 2a.
7.Soldering methods: IR reflow soldering.
8.RoHS compliant.
Material as follows:
Package : Ceramics
Encapsulating resin : Silicone resin
Electrodes: Ag plating
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
Package Dimensions
Part Number: AT3020SYL1ZS-RV
Super Bright Yellow
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 2 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
Selection Guide
Absolute Maximum Ratings at TA = 25°C
Notes:
1. Results from mounting on PC board FR4 , mounted on pc board-metal core PCB is recommend
for lowest thermal resistance.
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA = 25°C
Notes:
1.Wavelength : + / -1nm.
2. Forward Voltage : + / - 0.1V.
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
Parameter Symbol Value Unit
DC Forward Current [1] IF 150 mA
Peak Forward Current [2] IFM 270 mA
Power dissipation PD 525 mW
Operating Temperature Top -40 To +10 0 °C
Storage Temperature Ts tg -40 To +11 0 °C
Junction temperature[1] TJ 110 °C
Thermal resistance [1] (Junction/ambient) Rth j-a 178 °C/W
Thermal resistance [1] (Junction/solder point) Rth j-s 78 °C/W
Reverse Voltage VR 5 V
Parameter Symbol Value Unit
Forward Voltage IF = 150mA [Min.]
VF [2]
2.5
V
Forward Voltage IF = 150mA [Typ.] 3.0
Forward Voltage IF = 150mA [Max.] 3.5
Wavelength at peak emission IF = 150mA [Typ.] λpeak 590 nm
Dominant Wavelength IF = 150mA [Typ.] λ dom [1] 590 nm
Spectral bandwidth at 50% ΦREL MAX IF = 150mA [Typ.] Δλ 20 nm
Temperature coefficient of λpeak
IF = 150mA, - 10 °C ≤ T ≤ 100 °C [Typ.] TC λpeak 0.13 nm/°C
Temperature coefficient of λdom
IF = 150mA, - 10 °C ≤ T ≤ 100 °C [Typ.] TC λdom 0.10 nm/°C
Temperature coefficient of VF
IF = 150mA, - 10 °C ≤ T≤ 100 °C [Typ.] TCV -3.3 mV/°C
Luminous Flux IF = 150mA [Typ.] Φv 7.5 lm
Reverse Current (VR = 5V) [Max.] IR 10 uA
Part No. Dice
Φv (lm) [2]
@ 150mA
V
iewing
Angle [1]
Code. Min. Max. 2θ1/2
AT3020SYL1ZS-RV Super Bright Yellow(AlGaInP) A16 7.2 8.6
120 °
A17 8.6 10
A15 6 7.2
B1 10 12
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 3 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
Super Bright Yellow AT3020SYL1ZS-RV
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 4 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 5 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
AT3020SYL1ZS-RV
Recommended Soldering Pattern
(Units : mm ; Tolerance: ± 0.1)
Reel Dimension
Tape Dimensions
(Units : mm)
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 6 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
Packaging:
1.The LEDs are packed in cardboard boxes after taping.
2.The label on the minimum packing unit shows: Part Number, Lot Number, Ranking, Quantity.
3.In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
4.The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions
must be taken to prevent any damage.
5.The boxes are not water resistant and therefore must be kept away from water and moisture.
6.When the LEDs are transported, we recommend that you use the same packing methods as Kingbright’s.
PACKING & LABEL SPECIFICATIONS AT3020SYL1ZS-RV
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 7 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
JEDEC Moisture Sensitivity:
Level Floor Life
Soak Requirements
Standard Accelerated Equivalent
Time Conditions Time (hours) Conditions Time (hours) Conditions
2a 4 weeks ≤ 30 °C / 60% RH 6962
+ 5 / - 0 30 °C / 60% RH 120
+ 1 / - 0 60 °C / 60% RH
Notes:
1. CAUTION - The ‘‘accelerated equivalent’’ soak requirements shall not be used until correlation of damage response, including electrical, after
soak and reflow is established with the ‘‘standard’’ soak requirements or if the known activation energy for diffusion is 0.4 - 0.48 eV. Accelerated
soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides a method for
determining the diffusion coefficient.
2. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
If the actual MET is less than 24 hours the soak time may be reduced. For soak conditions of 30 °C/60% RH the soak time is reduced by one hour
For each hour the MET is less than 24 hours. For soak conditions of 60 °C/60% RH, the soak time is reduced by one hour for each five hours the
MET is less than 24 hours.
If the actual MET is greater than 24 hours the soak time must be increased. If soak conditions are 30 °C/60% RH, the soak time is increased one
Hour for each hour that the actual MET exceeds 24 hours. If soak conditions are 60 °C/60% RH, the soak time is increased one hour for each five
Hours that the actual MET exceeds 24 hours.
3. Supplier may extend the soak times at their own risk.
ESD Protection During Production
Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors.
The following procedures may decrease the possibility of ESD damage:
1.Minimize friction between the product and surroundings to avoid static buildup.
2.All production machinery and test instruments must be electrically grounded.
3.Operators must wear anti-static bracelets.
4.Wear anti-static suit when entering work areas with conductive machinery.
5.Set up ESD protection areas using grounded metal plating for component handling.
6.All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less.
7.Maintain a humidity level of 50% or higher in production areas.
8.Use anti-static packaging for transport and storage.
9.All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality.
Heat Generation:
1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making
the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the
circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat
generation and operate within the maximum ratings given in this specification.
2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot
of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please also take meas
ures to remove heat from the area near the LED to improve the operational characteristics on the LED.
3.The equation ① indicates correlation between Tj and Ta ,and the equation ② indicates correlation between Tj and Ts
Tj = Ta + Rthj-a *W ……… ①
Tj = Ts + Rthj-s *W ……… ②
Tj = dice junction temperature: °C
Ta = ambient temperature:°C
Ts = solder point temperature:°C
Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C/ W
Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C/ W
W = inputting power (IFx VF) : W
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 8 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might leads to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 9 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
Designing the Position of LED on a Board.
1.No twist/warp/bent/or other stress shall be applied to the board after mounting LED with
solder to avoid a crack of LED package.
Refer to the following recommended position and direction of LED.
Appropriate LED mounting is to place perpendicularly against the stress affected side.
2.Depending on the position and direction of LED,the mechanical stress on the LED package can be changed.
Refer to the following figure.
3.Do not split board by hand.Split with exclusive special tool.
4.If an aluminum circuit board is used,a large stress by thermal shock might cause a solder crack.
For this reason,it is recommended an appropriate verification should be taken before use.
3.0x2.0mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAJ0167 REV NO: V.6 DATE: MAY/27/2010 PAGE: 10 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.F.Lv ERP: 1212000053
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below
Lot Tolerance Percent Defective (LTPD) : 10%
No. Test Item Standards Test Condition Test Times /
Cycles
Number of
Damaged
1 Continuous operating test - Ta =25°C +10/-5°C ,RH=55+/-20%RH
IF = maximum rated current* 1,000 h 0 / 22
2 High Temp. operating test - Ta = 100°C(+/-10°C)
IF = maximum rated current* 1,000 h 0 / 22
3 Low Temp. operating test - Ta = -40°C+3/-5°C
IF = maximum rated current* 1,000 h 0 / 22
4 High temp. storage test JEITA ED-
4701/200 201
Ta = 100°C(+/-10°C)
Ta = maximum rated storage temperature 1,000 h 0 / 22
5 Low temp. storage test JEITA ED-
4701/200 202 Ta = -40°C+3/-5°C 1,000 h 0 / 22
6 High temp. & humidity storage test JEITA ED-
4701/100 103 Ta = 60°C+5/-3°C, RH = 90+5/-10%RH 1,000 h 0 / 22
7 High temp. & humidity operating
test - Ta = 60°C+5/-3°C, RH = 90%+5/-10%RH
IF = maximum rated current* 500h 0 / 22
8 Resistance to Soldering Heat
(Reflow Soldering)
JEITA ED-
4701/300 301 Tsld=260°C,10sec 2 times 0 / 22
9 Solderability
(Reflow Soldering)
JEITA ED-
4701/300 303
Tsld=245°C+/-5°C,5+/-1sec
1 time over
95% 0 / 22
11 Temperature Cycle JEITA ED-
4701/100 105
-40°C(30min) ~25°C(5min)~-100°C
(30min) ~25°C(5min) 100cycles 0 / 22
12 Thermal shock test MIL-STD-
202G Ta = -40°C(15min) ~100°C(15min) 500 cycles 0 / 22
13 Electric Static Discharge (ESD) JEITA ED-
4701/300 304 C = 100pF , R= 1.5KΩ V = 2kV
3 times
Negative/
Positive
0 / 22
* : Refer to forward current vs. derating curve diagram.
14 Vibration test JEITA ED-
4701/400 403
100~2000~100HZ Sweep 4min.
200m/s²
3directions,4cycles
48min. 0 / 22
10 Temperature Cycle operating test -
-40°C(30min) ~25°C(5min)~-100°C
(30min) ~25°C(5min)
IF = derated current at 100°C
10cycles 0 / 22
Symbol Test Conditions Criteria for Judgement
Min. Max.
Forward Voltage VF IF = 150mA - Initial Level x 1.1
Luminous Flux Φv IF = 150mA Initial Level x 0.7 -
Item
Criteria For Judging Damage
* : The test is performed after the board is cooled down to the room temperature.
