Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 LM78L 100-mA Fixed Output Linear Regulator 1 Features 3 Description * * * The LM78L series (LM78Lxx throughout this document) of three terminal positive regulators is available with several fixed output voltages, making them useful in a wide range of applications. Used as a Zener-diode and resistor combination replacement, the LM78Lxx usually provides an effective output impedance improvement of two orders of magnitude and lower quiescent current. These regulators can provide local, on-card regulation, eliminating distribution problems associated with single-point regulation. The available voltages allow the LM78Lxx to be used in logic systems, instrumentation, HiFi, and other solid-state electronic equipment. 1 * * * * * * * * For lower cost alternative, see the UA78L Input voltage up to 30 V Output voltage tolerances of 5% over the temperature range Available output voltages: 5 V, 6.2 V, 8.2 V, 9 V, 12 V, and 15 V Output current of 100 mA Output transistor safe area protection Internal thermal overload protection Internal short-circuit current limit No external components Available in tiny DSBGA package Available in 3-pin TO-92 and 8-pin SOIC low profile packages 2 Applications * * * * Battery chargers Portable instrumentation LED lighting Appliances See the AN-1112 DSBGA Wafer Level Chip Scale Package application note for DSBGA considerations. For more information on the TO-92 package, see the TO-92 Packing Options/Ordering Instructions application report. Package Options DSBGA 8-Pin 1 The LM78Lxx is available in the plastic TO-92 (LP) package, the SOIC (D) package, and a chip-sized package (8-Bump DSBGA) using TI's DSBGA package technology. With adequate heat sinking, the regulator can deliver 100-mA output current. Current limiting is included to limit the peak output current to a safe value. Safe area protection for the output transistors is provided to limit internal power dissipation. If internal power dissipation is too high for the heat sinking provided, the thermal shutdown circuit prevents the IC from overheating. Device Information(1) 3 2 PART NUMBER 1 SOIC 8-Pin BODY SIZE (NOM) 1.30 mm x 1.30 mm SOIC (8) 3.90 mm x 4.90 mm TO-92 (3) 3.70 mm x 4.70 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. TO-92 3-Pin Not to scale LM78L PACKAGE DSBGA (8) 1 Fixed Output Regulator Circuit 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 5 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 5 5 5 5 6 6 7 7 8 9 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics -- LM78L05 ...................... Electrical Characteristics -- LM78L09 ...................... Electrical Characteristics -- LM78L12 ...................... Electrical Characteristics -- LM78L15 ...................... Electrical Characteristics -- LM78L62 ...................... Typical Characteristics ............................................ Detailed Description ............................................ 11 8.1 Overview ................................................................. 11 8.2 Functional Block Diagram ....................................... 11 8.3 Feature Description................................................. 12 8.4 Device Functional Modes........................................ 12 9 Application and Implementation ........................ 13 9.1 Application Information............................................ 13 9.2 Typical Applications ................................................ 13 10 Power Supply Recommendations ..................... 16 11 Layout................................................................... 16 11.1 Layout Guidelines ................................................. 16 11.2 Layout Example .................................................... 17 12 Device and Documentation Support ................. 18 12.1 12.2 12.3 12.4 12.5 12.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Support Resources ............................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 18 18 18 18 18 18 13 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision K (December 2016) to Revision L Page * Changed product name to LM78L so document matches product folder .............................................................................. 1 * Added first Features bullet ..................................................................................................................................................... 1 * Added Device Comparison Table........................................................................................................................................... 3 Changes from Revision J (December 2013) to Revision K Page * Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Recommended Operating Conditions table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 * Deleted LM78L82 from the data sheet ................................................................................................................................... 1 * Added Thermal Information table. .......................................................................................................................................... 1 * Deleted Lead temperature (soldering) information ................................................................................................................. 5 * Changed RJA values for D (SOIC) From: 180 To: 128.8, LP (TO-92) from 230 to 158.7, and YPB (DSBGA) From: 230.9 To 108.4 ....................................................................................................................................................................... 5 * Changed RJC values for LP (TO-92) From: 60 To 75.2......................................................................................................... 5 Changes from Revision I (April 2013) to Revision J * 2 Page Added the AI suffix ................................................................................................................................................................. 6 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L LM78L www.ti.com SNVS754L - JANUARY 2000 - REVISED JUNE 2020 5 Device Comparison Table IOUT PARAMETER LM78xx UA78 LM340 LM340A UNIT Input voltage range 7 - 35 7 - 38 7 - 35 7 - 35 V 5, 12, 15 5, 8, 10, 12, 15, 24 5, 12, 15 5, 12, 15 V Fixed output voltage option 1.5 A Load regulation accuracy 4 4 4 2 % PSRR (120 Hz) 80 78 80 80 dB Recommended operating temperature 0 - 125 0 - 125 0 - 125 0 - 125 C TO-220 TJA 23.9 19 23.9 23.9 C/W SOT-223 TJA 62.1 N/A 62.1 62.1 C/W TO-3 TJA 39 N/A 39 39 C/W C/W TO-263 TJA 0.5 A 44.8 25.3 44.8 44.8 LM78Mxx UA78MxxC UA78MxxI LM341 Input voltage range 7.2 - 35 5.3 - 30 5.3 - 30 7.2 - 35 V Fixed output voltage option 5 3.3, 5, 6, 8, 9, 10, 12 3.3, 5 5 V Load regulation accuracy 4 3 3 4 % PSRR (120 Hz) 78 80 80 78 dB Recommended operating temperature -40 - 125 0 - 125 -40 - 125 -40 - 125 C TO-220 TJA 22.6 19 19 22.6 C/W SOT-223 TJA N/A 53 53 N/A C/W TO-3 TJA 162.4 N/A N/A N/A C/W TO-252 Powerflex TJA N/A 28 28 N/A C/W TO-252 TJA 38 30.3 30.3 N/A C/W LM78LxxAC LM78LxxAI, LM78LxxIT UA78LxxC UA78LxxI 7.0 - 30 7.0 - 30 4.75 - 30 4.75 - 30 V 5, 9 2.6, 5, 6.2, 8, 9, 10, 12, 15 5 V Input voltage range Fixed output voltage option 0.1 A 5, 6.2, 12, 15 Load regulation accuracy (A/non -A) 4 4 4, 8 4, 8 % PSRR (120 Hz) 62 62 51 51 dB Recommended operating temperature 0 - 125 -40 - 125 0 - 125 -40 - 125 C SOT-89 TJA N/A N/A 54.7 54.7 C/W SO-8 TJA 128.8 128.8 115 115 C/W DSBGA TJA N/A 108.4 N/A N/A C/W TO-92 TJA 158.7 N/A 143.6 143.6 C/W Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L 3 LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com 6 Pin Configuration and Functions YPB Package 8-Pin DSBGA Top View A 3 2 D Package 8-Pin SOIC Top View B VOUT C NC VOUT 1 8 VIN GND 2 7 GND GND 3 6 GND NC 4 5 NC GND VOUT GND Not to scale 1 VIN VIN NC Not to scale LP Package 3-Pin TO-92 Bottom View 3 VIN 2 GND 1 VOUT Not to scale Pin Functions PIN DESCRIPTION DSBGA SOIC GND C2, C3 2, 3, 6, 7 2 -- Ground NC B3, C1 4, 5 -- -- No connection VIN A1, B1 8 3 I Input supply voltage pin VOUT A2, A3 1 1 O Output voltage pin 4 TO-92 I/O NAME Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L LM78L www.ti.com SNVS754L - JANUARY 2000 - REVISED JUNE 2020 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT 35 V Input voltage Power dissipation Internally limited Operating junction temperature, TJ LM78LxxACZ (TO-92) 0 125 LM78LxxACM (SOIC) 0 125 LM78LxxAIM (SOIC) -40 125 LM78LxxITP (thin DSBGA) -40 85 -65 150 Storage temperature, Tstg (1) (2) C C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), VALUE UNIT 1000 V (1) Human body model, 1.5 k in series with 100 pF. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM Input voltage Continuous output current LM78LxxACZ (TO-92) TJ LM78LxxACM (SOIC) Junction temperature MAX UNIT 30 V 100 mA 0 125 0 125 LM78LxxAIM (SOIC) -40 125 LM78LxxITP (DSBGA) -40 85 C 7.4 Thermal Information LM78Lxx THERMAL METRIC (1) D (SOIC) LP (TO-92) YPB (DSBGA) 8 PINS 3 PINS 8 PINS UNIT 128.8 158.7 108.4 C/W RJA Junction-to-ambient thermal resistance RJC(top) Junction-to-case (top) thermal resistance 76 75.2 1.3 C/W RJB Junction-to-board thermal resistance 69.3 n/a 31.4 C/W JT Junction-to-top characterization parameter 26.3 30.2 4.5 C/W JB Junction-to-board characterization parameter 68.8 138.2 31.4 C/W RJC(bot) Junction-to-case (bottom) thermal resistance -- -- -- C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L 5 LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com 7.5 Electrical Characteristics -- LM78L05 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 10 V (unless otherwise noted). PARAMETER TEST CONDITIONS TJ = 25C VO Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage VIN/VO Ripple rejection MIN TYP MAX 4.8 5 5.2 VIN = 7 V to 20 V, IO = 1 mA to 40 mA (3) 4.75 5.25 IO = 1 mA to 70 mA (3) 4.75 5.25 VIN = 7 V to 20 V, TJ = 25C 18 75 VIN = 8 V to 20 V, TJ = 25C 10 54 IO = 1 mA to 100 mA, TJ = 25C 20 60 IO = 1 mA to 40 mA, TJ = 25C 5 30 TJ = 25C 3 5 VIN = 8 V to 20 V V mV mA 1 IO = 1 mA to 40 mA mA 0.1 f = 10 Hz to 100 kHz (4) 40 f = 120 Hz, VIN = 8 V to 16 V, TJ = 25C 47 V 62 dB 140 mA IPK Peak output current VO/T Average output voltage temperature coefficient IO = 5 mA -0.65 VIN(MIN) Minimum value of input voltage required to maintain line regulation TJ = 25C 6.7 (1) (2) (3) (4) UNIT mV/C 7 V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. Recommended minimum load capacitance of 0.01 F to limit high-frequency noise. 7.6 Electrical Characteristics -- LM78L09 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 15 V (unless otherwise noted). PARAMETER VO Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage VIN/VO Ripple rejection IPK Peak output current VO/T Average output voltage temperature coefficient VIN(MIN) Minimum value of input voltage required to maintain line regulation (1) (2) (3) 6 TEST CONDITIONS MIN TYP MAX TJ = 25C 8.64 9 9.36 VIN = 11.5 V to 24 V, IO = 1 mA to 40 mA (3) 8.55 9.45 IO = 1 mA to 70 mA (3) 8.55 9.45 VIN = 11.5 V to 24 V, TJ = 25C 100 200 VIN = 13 V to 24 V, TJ = 25C 90 150 IO = 1 mA to 100 mA, TJ = 25C 20 90 IO = 1 mA to 40 mA, TJ = 25C 10 45 2 5.5 TJ = 25C VIN = 11.5 V to 24 V 1.5 IO = 1 mA to 40 mA 0.1 70 f = 120 Hz, VIN = 15 V to 25 V, TJ = 25C IO = 5 mA 38 UNIT V mV mA mA V 44 dB 140 mA -0.9 mV/C 10.7 V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L LM78L www.ti.com SNVS754L - JANUARY 2000 - REVISED JUNE 2020 7.7 Electrical Characteristics -- LM78L12 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 19 V (unless otherwise noted). PARAMETER VO Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage VIN/VO Ripple rejection IPK Peak output current VO/T Average output voltage temperature coefficient VIN(MIN) Minimum value of input voltage required to maintain line regulation (1) (2) (3) MIN TYP MAX TJ = 25C TEST CONDITIONS 11.5 12 12.5 VIN = 14.5 V to 27 V, IO = 1 mA to 40 mA (3) 11.4 12.6 IO = 1 mA to 70 mA (3) 11.4 12.6 VIN = 14.5 V to 27 V, TJ = 25C 30 180 VIN = 16 V to 27 V, TJ = 25C 20 110 IO = 1 mA to 100 mA, TJ = 25C 30 100 IO = 1 mA to 40 mA, TJ = 25C 10 50 3 5 TJ = 25C VIN = 16 V to 27 V UNIT V mV mA 1 IO = 1 mA to 40 mA mA 0.1 80 f = 120 Hz, VIN = 15 V to 25 V, TJ = 25C 40 V 54 dB 140 mA IO = 5 mA -1 mV/C TJ = 25C 13.7 14.5 V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. 7.8 Electrical Characteristics -- LM78L15 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 23 V (unless otherwise noted). PARAMETER TEST CONDITIONS TJ = 25C VO Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage VIN/VO Ripple rejection IPK Peak output current VO/T Average output voltage temperature coefficient VIN(MIN) Minimum value of input voltage required to maintain line regulation (1) (2) (3) MIN TYP MAX 14.4 15 15.6 VIN = 17.5 V to 30 V, IO = 1 mA to 40 mA (3) 14.25 15.75 IO = 1 mA to 70 mA (3) 14.25 15.75 VIN = 17.5 V to 30 V, TJ = 25C 37 250 VIN = 20 V to 30 V, TJ = 25C 25 140 IO = 1 mA to 100 mA, TJ = 25C 35 150 IO = 1 mA to 40 mA, TJ = 25C 12 75 3 5 TJ = 25C VIN =20 V to 30 V 1 IO = 1 mA to 40 mA 0.1 90 f = 120 Hz, VIN = 18.5 V to 28.5 V, TJ = 25C 37 UNIT V mV mA mA V 51 dB 140 mA IO = 5 mA -1.3 mV/C TJ = 25C 16.7 17.5 V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L 7 LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com 7.9 Electrical Characteristics -- LM78L62 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 12 V (unless otherwise noted). PARAMETER TEST CONDITIONS TJ = 25C VO Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage VIN/VO Ripple rejection IPK Peak output current VO/T Average output voltage temperature coefficient VIN(MIN) Minimum value of input voltage required to maintain line regulation (1) (2) (3) (4) 8 MIN TYP MAX 5.95 6.2 6.45 VIN = 8.5 V to 20 V, IO = 1 mA to 40 mA (3) 5.9 6.5 IO = 1 mA to 70 mA (3) 5.9 6.5 VIN = 8.5 V to 20 V, TJ = 25C 65 175 VIN = 9 V to 20 V, TJ = 25C 55 125 IO = 1 mA to 100 mA, TJ = 25C 13 80 IO = 1 mA to 40 mA, TJ = 25C 6 40 TJ = 25C 2 5.5 VIN = 8 V to 20 V 1.5 IO = 1 mA to 40 mA 0.1 f = 10 Hz to 100 kHz (4) 50 f = 120 Hz, VIN = 10 V to 20 V, TJ = 25C IO = 5 mA 40 UNIT V mV mA mA V 46 dB 140 mA -0.75 7.9 mV/C V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. Recommended minimum load capacitance of 0.01 F to limit high-frequency noise. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L LM78L www.ti.com SNVS754L - JANUARY 2000 - REVISED JUNE 2020 7.10 Typical Characteristics LP Package Figure 1. Maximum Average Power Dissipation Figure 2. Peak Output Current Figure 3. Dropout Voltage Figure 4. Ripple Rejection Figure 5. Output Impedance Figure 6. Quiescent Current Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L 9 LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com Typical Characteristics (continued) Figure 7. Quiescent Current 10 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L LM78L www.ti.com SNVS754L - JANUARY 2000 - REVISED JUNE 2020 8 Detailed Description 8.1 Overview The LM78Lxx series of positive regulators is available in the following fixed output voltages: 5 V, 6.2 V, 8.2 V, 9 V, 12 V, and 15 V. The regulator can be configured to an adjustable output by connecting the GND pin to the center of a resistive voltage divider as shown in Figure 10. In this configuration, the fixed output voltage acts as the reference voltage across R1 allowing the output to be adjusted by changing the resistor. 8.2 Functional Block Diagram Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L 11 LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com 8.3 Feature Description 8.3.1 Load Regulation These devices regulate the voltage between the VOUT and GND pins, and can be made adjustable by using a resistive voltage divider. The output voltage tolerance is 5% over temperature. 8.3.2 Protection The LM78Lxx series of regulators has internal thermal overload protection that automatically shuts off the device if the operating temperature becomes too high. There is also internal short-circuit current limit and output transistor safe area protection that shuts down the device if the output current becomes too high. 8.4 Device Functional Modes 8.4.1 Normal Operation The VOUT pin sources current necessary to set the voltage on VOUT at a fixed voltage above the GND pin. See Specifications for VO of each device. 8.4.2 Shutdown The device automatically shuts down if the output current or its internal temperature becomes too high. 12 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L LM78L www.ti.com SNVS754L - JANUARY 2000 - REVISED JUNE 2020 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information These devices are versatile and high-performance regulators with a wide temperature range and tight line and load regulation. An input capacitor is required if the regulator is placed more than 3 inches from the power supply filter. TI recommends a minimum load capacitance of 0.01 F to limit high frequency. 9.2 Typical Applications 9.2.1 Fixed Output Regulator *Required if the regulator is located more than 3 inches from the power supply filter. **Recommended minimum load capacitance of 0.01 F to limit high-frequency noise. Figure 8. Fixed Output Regulator Circuit 9.2.1.1 Design Requirements The device component count is very minimal. No external components are usually required. However, TI recommends input or output capacitors depending on the distance between the device and the power supply and if extra filtering is needed at the output. The output voltage is set based on the selection of the two resistors (R1 and R2), as shown in Figure 14. 9.2.1.2 Detailed Design Procedure 9.2.1.2.1 Input Capacitor An input capacitor is required if the regulator is placed more than 3 inches from the power supply filter. A 0.33-F capacitor on the input is suitable for most applications. 9.2.1.2.2 Output Capacitor TI recommends a minimum load capacitance of 0.01 F to limit high-frequency noise. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L 13 LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com Typical Applications (continued) 9.2.1.3 Application Curve Input - Output Differential (V) 1.9 1.8 1.7 1.6 1.5 1.4 1.3 25qC 1.2 0 20 40 60 Load Current (mA) 80 100 Figure 9. LM78Lxx Dropout 9.2.2 Other Application Circuits Figure 10 to Figure 14 show application circuit examples using the LM78Lxx devices. Customers must fully validate and test these circuits before implementing a design based on these examples. Unless otherwise noted, the design procedures in Fixed Output Regulator are applicable to these designs. VO = 5 V + (5 V / R1 + IQ) x R2* * The 5 V represents the fixed output voltage of the LM78L05. If using one of the other LM78Lxx devices, use that fixed output voltage value when calculating VO. IQ < 5 V / (3 x R1) Load regulation (LR) of LM78L05 (R1 + R2) / R1 Figure 10. Adjustable Output Regulator Circuit 14 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L LM78L www.ti.com SNVS754L - JANUARY 2000 - REVISED JUNE 2020 Typical Applications (continued) IOUT = (VO / R1) + IQ IQ = 1.5 mA over line and load changes Figure 11. Current Regulator Circuit *Solid tantalum **Heat sink Q1 ***Optional: Improves ripple rejection and transient response. Load Regulation = 0.6%, IL = 0 mA to 250 mA pulsed with tON = 50 ms. Figure 12. 5-V, 500-mA Regulator With Short-Circuit Protection Circuit *Solid tantalum Figure 13. 15-V, 100-mA Dual Power Supply Circuit Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L 15 LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com Typical Applications (continued) *Solid tantalum VO = VG + 5 V, R1 = (-VIN / IQ(LM78L05)) VO = 5 V (R2 / R4) for (R2 + R3) = (R4 + R5) A 0.5-V output will correspond to (R2 / R4) = 0.1, (R3 / R4) = 0.9 Figure 14. Variable Output Regulator Circuit (0.5 V to 18 V) 10 Power Supply Recommendations The linear regulator input supply must be well regulated and kept at a voltage level to not exceed the maximum input to output voltage differential allowed by the device. The minimum dropout voltage (VIN - VO) must be met with extra headroom when possible to keep the output well regulated. A 0.33-F or higher capacitor must be placed at the input to bypass noise. 11 Layout 11.1 Layout Guidelines For the best overall performance, some layout guidelines may be disregarded. Place all circuit components on the same side of the circuit board and as near as practical to the respective linear regulator pins. Traces must be kept short and wide to reduce the amount of parasitic elements in the system. The actual width and thickness of traces depends on the current carrying capability and heat dissipation required by the end system. 16 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L LM78L www.ti.com SNVS754L - JANUARY 2000 - REVISED JUNE 2020 11.2 Layout Example GND U1 C1 C2 VOUT VIN Figure 15. LM78Lxx Example Circuit Layout Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L 17 LM78L SNVS754L - JANUARY 2000 - REVISED JUNE 2020 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: * Texas Instruments, UA78L00 Series Positive-Voltage Linear Regulators data sheet * Texas Instruments, AN-1112 DSBGA Wafer Level Chip Scale Package application note * Texas Instruments, TO-92 Packing Options/Ordering Instructions application report 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Support Resources TI E2ETM support forums are an engineer's go-to source for fast, verified answers and design help -- straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM78L PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM78L05ACM NRND SOIC D 8 95 Non-RoHS & Green Call TI Call TI 0 to 125 LM78L 05ACM LM78L05ACM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LM78L 05ACM LM78L05ACMX NRND SOIC D 8 2500 Non-RoHS & Green Call TI Call TI 0 to 125 LM78L 05ACM LM78L05ACMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LM78L 05ACM LM78L05ACZ/LFT1 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05ACZ/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05ACZ/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05ACZ/LFT7 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05ACZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05AIM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM78L 05AM LM78L05AIMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM78L 05AM LM78L05ITP/NOPB ACTIVE DSBGA YPB 8 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 P 03 LM78L05ITPX/NOPB ACTIVE DSBGA YPB 8 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 P 03 LM78L09ITPX/NOPB ACTIVE DSBGA YPB 8 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 P 02 LM78L12ACM NRND SOIC D 8 95 Non-RoHS & Green Call TI Call TI 0 to 125 LM78L 12ACM LM78L12ACM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LM78L 12ACM LM78L12ACMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LM78L Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Jan-2021 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) 12ACM LM78L12ACZ/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 12ACZ LM78L12ACZ/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 12ACZ LM78L12ACZ/LFT7 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 12ACZ LM78L12ACZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 12ACZ LM78L15ACM NRND SOIC D 8 95 Non-RoHS & Green Call TI Call TI 0 to 125 LM78L 15ACM LM78L15ACM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LM78L 15ACM LM78L15ACMX NRND SOIC D 8 2500 Non-RoHS & Green Call TI Call TI 0 to 125 LM78L 15ACM LM78L15ACMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 LM78L 15ACM LM78L15ACZ/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 15ACZ LM78L15ACZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 15ACZ LM78L62ACZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 125 LM78L 62ACZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 26-Aug-2020 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM78L05ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05ITP/NOPB DSBGA YPB 8 250 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L05ITPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L09ITPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L12ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L15ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L15ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Aug-2020 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM78L05ACMX SOIC D 8 2500 367.0 367.0 35.0 LM78L05ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L05AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L05ITP/NOPB DSBGA YPB 8 250 210.0 185.0 35.0 LM78L05ITPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0 LM78L09ITPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0 LM78L12ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L15ACMX SOIC D 8 2500 367.0 367.0 35.0 LM78L15ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP SEATING PLANE (2.54) NOTE 3 2X 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 2X 2.6 0.2 3X 12.7 MIN 3X 3X 0.55 0.38 0.43 0.35 2X 1.27 0.13 FORMED LEAD OPTION STRAIGHT LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION 3X 2.67 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 0.05 MAX ALL AROUND TYP FULL R TYP METAL TYP (1.07) 3X ( 0.85) HOLE 2X METAL (1.5) 2X (1.5) 2 1 (R0.05) TYP 3 2X (1.07) (1.27) SOLDER MASK OPENING 2X SOLDER MASK OPENING (2.54) LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ALL AROUND TYP ( 1.4) 2X ( 1.4) METAL 3X ( 0.9) HOLE METAL (R0.05) TYP 2 1 (2.6) SOLDER MASK OPENING 3 2X SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 8.5 9.75 8.50 19.0 17.5 6.75 5.95 2.9 TYP 2.4 3.7-4.3 TYP 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com PACKAGE OUTLINE YPB0008 DSBGA - 0.575 mm max height SCALE 9.000 DIE SIZE BALL GRID ARRAY B A E BALL A1 CORNER D 0.575 MAX C SEATING PLANE 0.15 0.11 BALL TYP 0.05 C 1 TYP C 1 TYP SYMM B D: Max = 1.337 mm, Min =1.276 mm 0.5 TYP E: Max = 1.337 mm, Min =1.276 mm A 8X 0.015 0.18 0.16 C A B 1 2 3 0.5 TYP SYMM 4215100/B 07/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT YPB0008 DSBGA - 0.575 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.16) 1 3 2 A (0.5) TYP SYMM B C SYMM LAND PATTERN EXAMPLE SCALE:40X ( 0.16) METAL 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN ( 0.16) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4215100/B 07/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). www.ti.com EXAMPLE STENCIL DESIGN YPB0008 DSBGA - 0.575 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP (R0.05) TYP 8X ( 0.3) 1 2 3 A (0.5) TYP SYMM B METAL TYP C SYMM SOLDER PASTE EXAMPLE BASED ON 0.125mm THICK STENCIL SCALE:50X 4215100/B 07/2016 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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