VDI 100-06P1 VII 100-06P1 VID 100-06P1 VIO 100-06P1 IC25 = 93 A = 600 V VCES VCE(sat) typ. = 2.4 V IGBT Modules in ECO-PAC 2 Short Circuit SOA Capability Square RBSOA Preliminary data sheet VII X15 SV18 NTC X16 T16 NTC X16 IK10 F1 Pin arangement see outlines Features Symbol Conditions Maximum Ratings VCES TVJ = 25C to 150C VGES IC25 IC80 TC = 25C TC = 80C ICM VCEK VGE = 15 V; RG = 15 ; TVJ = 125C RBSOA, Clamped inductive load; L = 100 H tSC (SCSOA) VCE = VCES; VGE = 15 V; RG = 15 ; TVJ = 125C non-repetitive Ptot TC = 25C Symbol Conditions 600 V 20 V 93 63 A A 150 VCES A 10 s 294 W Characteristic Values (TVJ = 25C, unless otherwise specified) min. typ. max. VCE(sat) IC = 100 A; VGE = 15 V; TVJ = 25C TVJ = 125C VGE(th) IC = 1.5 mA; VGE = VCE ICES VCE = VCES; IGES VCE = 0 V; VGE = 20 V 2.4 2.8 4.5 VGE = 0 V; TVJ = 25C TVJ = 125C Inductive load, TVJ = 125C VCE = 300 V; IC = 60 A VGE = 15/0 V; RG = 15 Cies VCE = 25 V; VGE = 0 V; f = 1 MHz RthJC RthJH (per IGBT) with heatsink compound (0.42 K/m.K; 50 m) IXYS reserves the right to change limits, test conditions and dimensions. (c) 2003 IXYS All rights reserved 2.8 V V 6.5 V 1.4 6.5 mA mA 150 nA 150 60 450 40 3.2 2.2 ns ns ns ns mJ mJ 4.2 nF 0.85 0.43 K/W K/W * NPT IGBT's - positive temperature coefficient of saturation voltage - fast switching * FRED diodes - fast reverse recovery - low forward voltage * Industry Standard Package - solderable pins for PCB mounting - isolated DCB ceramic base plate Advantages * space and weight savings * reduced protection circuits * leads with expansion bend for stress relief Typical Applications * AC and DC motor control * AC servo and robot drives * power supplies * welding inverters 303 IGBTs td(on) tr td(off) tf Eon Eoff B3 PS18 X15 L9 VX18 LMN X16 NTC X15 K10 L9 AC1 S GH10 E2 AC1 IK10 L9 X13 A VDI VID OP9 IJK VIO 1-2 VDI 100-06P1 VII 100-06P1 VID 100-06P1 VIO 100-06P1 VII Reverse diodes (FRED) Symbol Conditions Maximum Ratings IF25 IF80 TC = 25C TC = 80C 134 82 Symbol Conditions Characteristic Values min. typ. max. VF IF = 60 A; TVJ = 25C TVJ = 125C 1.78 1.33 IRM trr IF = 60 A; diF/dt = 500 A/s; TVJ = 125C VR = 300 V; VGE = 0 V 28 100 A ns RthJC RthJH with heatsink compound (0.42 K/m.K; 50 m) 1.32 0.66 K/W K/W A A 1.99 V V B3 Temperature Sensor NTC Symbol Conditions Characteristic Values min. typ. max. R25 B25/50 T = 25C 4.75 5.0 3375 5.25 k K VIO Module Conditions Maximum Ratings TVJ Tstg -40...+150 -40...+150 C C VISOL IISOL 1 mA; 50/60 Hz 3000 V~ Md mounting torque (M4) a Max. allowable acceleration 1.5 - 2.0 14 - 18 50 Nm lb.in. m/s2 Symbol Conditions Characteristic Values min. typ. max. dS dA Creepage distance on surface (Pin to heatsink) Strike distance in air (Pin to heatsink) 11.2 11.2 Weight mm mm 24 VDI Data according to IEC 60747 and refer to a single transistor or diode unless otherwise stated. IXYS reserves the right to change limits, test conditions and dimensions. (c) 2003 IXYS All rights reserved g VID 303 Symbol 2-2