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QW-JP053
REV:B
Comchip Technology CO., LTD.
CPDT6-5V0UPC-HF
Mechanical data
- Case: SOT-23-6 standard package,
molded plastic.
- Terminals: Solder plated, solderable per
MIL-STD-750,method 2026.
- Mounting position: Any
- Weight: 0.015 grams(approx.).
Pin ConfigurationCircuit Diagram
°C
260 ( 10 sec)
TSOL
Lead soldering temperature
°C
-40 to +125
Tj
Operating temperature range
W
125
PPk
Peak pulse power ( tp = 8/20 us)
Parameter Symbol Value Unit
654
1 2 3
kV
VESD_VCC
ESD per IEC 61000-4-2(Air)(VCC-GND)
ESD per IEC 61000-4-2(Contact)(VCC-GND) ±30
kV
±30
VESD_I/O
ESD per IEC 61000-4-2(Air)
ESD per IEC 61000-4-2(Contact)
-55 to +150
Storage temperature range TSTG °C
I/O voltage tolerance VI/O -0.6 to VCC + 0.6 V
SMD ESD Protection Array
RoHs Device
Maximum Ratings (at TA=25°C unless otherwise noted)
Dimensions in inches and (millimeter)
SOT-23-6
Company reserves the right to improve product design , functions and reliability without notice.
Features
- ESD Protect for 4 high-speed I/O channels.
- IEC61000-4-2(ESD); ±30KV(contact)
- Working voltage: 5V
- Low capacitance: 2.2pF(Typ.).
- High component density.
Halogen Free
A
10
IPP
Peak pulse current ( tp = 8/20 us)
5
2
1346
0.123(3.12)
0.107(2.72)
0.071(1.80)
0.055(1.40)
0.075(1.90)
BSC
0.047(1.20)
0.037(0.95)
0.020(0.50)
0.012(0.30)
0.004(0.10) 0.024(0.60)
0.118(3.00)
0.102(2.60)
0.008(0.21)
0.004(0.10)
0.012(0.30)
0.000(0.00)
0.037(0.95)
BSC.
0.049(1.25)
Max.