1N5908
SM5908
TRANSILTM
®
UNIDIRECTIONAL TRANSIL DI ODE
PEAK P ULSE POWER : 1500 W (10/1000µs)
REVERSE STAND OFF VOLTAGE : 5 V
LOW CLAMPING FACTOR
FAST RESPONSE TIME
UL RECOGN IZED
FEATURES
CB429 SMC
Symbol Parameter Value Unit
PPP Peak pulse power dissipation (see note1) Tj initial = Tamb 1500 W
P Power dissipation on infinite heatsink Tamb = 75°C5W
I
FSM Non repetitive surge peak forward current
for unidirectional types tp = 10m s
Tj initial = Tamb 200 A
Tstg
Tj Storage temperature range
Maximum junc tion temperature - 65 to + 175
175 °C
°C
TLMaximum lead temperature for soldering
during 10s (at 5mm from case for CB429) CB429
SMC 230
260 °C
°C
Note 1 : For a surge gr eater than the maximum values, the diod e will fai l in short- circuit.
ABSOLUTE MAXIMUM RATINGS (Tamb = 25° C).
DESCRIPTION
The 1N5908 and SM5908 are dedicated to the 5 V
logic circuit protection (TTL and CMOS technologies).
Their low clamping voltage at high current level
guarantees excellent protection for sensitive
components.
August 1999 Ed : 2A
Symbol Parameter Value Unit
Rth (j-l) Junction to leads 20 °C/W
Rth (j-a) Junction to ambient
on printed circuit. L lead = 10 mm CB429 75 °C/W
On recommended pad layout SMC 75 °C/W
THER MAL RE SISTA NC ES
1/6
I
V
F
V
I
RM
I
PP
V
CL
V
BR
V
RM
I
F
Symbol Parameter
VRM Stand-off voltage
VBR Breakdown v oltage
VCL Clam ping voltage
IRM Leakage c urrent @ V RM
IPP Peak puls e current
αT Voltage temperature coefficient
VFForw ard voltage
ELECTRICAL CHARACTERISTICS(Tamb = 25°C)
Types
IRM @ VRM VBR @ IRVCL @ IPP VCL @ IPP VCL @ IPP αTC
max min max max max max typ
note2 10/1000µs 10/1000µs 10/1000µs note3 note4
µAVVmAVAVAVA10
-4/°CpF
1N5908
SM5908 300 5 6 1 7.6 30 8 60 8.5 120 5.7 9500
Fig. 1: Peak pulse power dissipation versus
initial junction temperature (printed circuit board).
%I
PP
10 s
µ
100
50
01000 s
µ
t
Note 2 : P ulse te st : tp < 50m s
Note 3 : ∆VBR = αT*(Tamb-25)* VBR (25°C).
Note 4 : VR = 0V, F = 1 MHz
1N5908/SM5908
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Fig. 2 : Peak pulse power versus exponential pulse duration.
Fig. 3 : Clamping voltage versus peak pulse current.
Exponential waveform tp = 10 m s...............
tp = 1 ms--- ------ --- -
tp = 20 µs________
Note : The curves of the figure 3 are specified for a junction temperature of 25 °C before surge.
The given results may be extrapolated for other junction temperatures by using the following formula :
∆VBR = αT *(Tamb - 25) * VBR (25° C ).
1N5908/SM5908
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Fig. 6b : SMC P ack age.
Mounting on FR4 PC Board with recommended
pad layout.
Fig. 5 : Peak forward voltage drop versus peak
fo rw ar d c u rr en t .
Fig. 6a : CB429 Package.
(For FR4 PC Board with L lead = 10 mm)
Fig. 4 : Capacitance versus reverse applied
volta ge (t ypical valu es).
Fig. 6a/6b : Transient thermal impedance junction-ambient versus pulse duration.
Fig. 7 : Relativ e v a ri at io n of lea ka ge cu r re nt
ver s us j unc t io n t e mp er at ur e.
1N5908/SM5908
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Package Type Marking
SMC SM5908 MDC
CB429 1N5908 1N5908
A w hite band indic ates the cathode
MARKING : Logo, type code and cathode band
Pack aging : S tandard pa cka ging i s in tape and reel.
PACKAGE M ECHANICAL DATA
SMC (Plastic)
REF. DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
Weight = 0.25 g.
FOOT PRINT (in millimeters)
ORDER CO DE
1N5908 RL SM 5908
Packaging :
= Ammopac k tape
RL = Tape and reel
Surface mount
2.0 4.2 2.0
3.3
E
C
L
E2
E1
D
A1
A2
b
Numerical code
D evice c ode
1N5908/SM5908
5/6
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
impl ication or ot herwise under any pa tent or patent rights of STM icroel ectronic s. Specif ications m entioned i n this publicat ion are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STM ic roelectroni cs pro duct s are n ot authorized for u se as crit ic al components i n l i fe s upport devices or systems withou t ex press w ri tten ap-
proval of S TMicroelectronics. The ST logo is a registered tr ademark of STMicroel ectronics
© 1999 STMicroelectr onics - Pri nted in Ital y - All ri ghts reserved.
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CB429 (Plastic)
Weight = 0.85 g.
PACKAGE MECHANICAL DAT A
REF. DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 9.45 9.50 9.80 0.372 0.374 0.386
B 26 1.024
∅ C 4.90 5.00 5.10 0.193 0.197 0.201
∅ D 0.94 1.00 1.06 0.037 0.039 0.042
L1 1.27 0.050
Note : The lead is not controlled within zone L1
Pac kaging : S tandard pa cka ging i s in tape and reel.
1N5908/SM5908
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