AS1109BSOU - AMS - Datasheet.Live

AS1109

Constant-Current, 8-Bit LED Driver with Diagnostics

Data Sheet

www.austriamicrosystems.com Revision 1.18 1 - 26

1 General Description

The AS1109 is designed to drive up to 8 LEDs through a

fast serial interface and features 8 output constant cur-

rent drivers and an on-chip diagnostic read-back func-

tion.

The high clock-frequency (up to 50MHz), adjustable out-

put current, and flexible serial interface makes th e

device perfectly suited for high-volume transmission

applications.

Output current is adjustable (up to 100mA/channel )

using an external resistor (REXT).

The serial interface with Schmitt trigger inputs includes

an integrated shift register. Additionally, an internal data

The device features integrated diagnostics for over-

temperature, open-LED, and shorted-LED conditions.

Integrated registers store glob al fault status information

during load as well as the detailed te mperature/open-

LED/shorted-LED diagnostics results.

The AS1109 also features a low-current diagnostic

mode to minimize display flicker during fault testing.

With an operating temperature ra nge from -40 to

+125°C the AS1109 is also ideal for industrial applica-

tions.

The AS1109 is available in a 16-pi n SOIC-150, a 16-pin

QFN (4x4mm) and the 16-pin SSOP-150 package.

Figure 1. Main Diagram and Pin Assi gnments

2 Key Features

! 8 Constant-Current Output Channels

! Excellent Output Current Accuracy

- Between Channels: ±2%

- Between AS1109 Devices: ±2%

! Output Current Per Channel: 0.5 to 100mA

! Controlled In-Rush Curren t

! Over-Temperature, Open-LED, Shorted-LED

Diagnostics Functions

! Low-Current Test Mode

! Global Fault Monitoring

! Low Shutdown Mode Current: 3µA

! Fast Serial Interface: up to 50MHz

! Cascaded Configuration

! Fast Output Drivers Suitable for PWM

! 16-pin SOIC-150, 16-pin QFN (4x4mm) and 16-pin

SSOP-150 Package

3 Applications

The device is ideal for fixed- or slow-rolling displays

using static or multiplexed LED matrix and dimming

functions, large LED matrix displays, mixed LED display

and switch monitoring, displays in elevators, public

transports (underground, trains, buses, taxis, airplanes,

etc.), large displays in stadiums and public areas, price

indicators in retail stores, promotional panels, bar-graph

displays, industrial controller displays, white good pan-

els, emergency light indicators, and traffic signs.

AS1109

SDI SDO

CLK LD OEN REXT

+VLED

GND

AS1109

16 VDD

SDI

CLK

OUTN0

15 REXT

14 SDO

13 OEN

9OUTN4

OUTN3

OUTN2

OUTN1

12 OUTN7

11 OUTN6

10 OUTN5

OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 OUTN5 OUTN6 OUTN7

GND VDD

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AS1109

Data Sheet

Contents

1 General Description ............................................................................................................................. 1

2 Key Features ........................................................................................................................................ 1

3 Applications .......................................................................................................................................... 1

4 Pinout ................................................................................................................................................... 3

Pin Assignments ............ ................... ..................................... ................... .................... ...................................... 3

Pin Descriptions .............. .................................... .................... ................... .................... ...................................... 3

5 Absolute Maximum Ratings ................................................................................................................. 4

6 Electrical Characteristics ...................................................................................................................... 5

Switching Characteristics ..................................................................................................................................... 6

7 Typical Operating Characteristics ........................................................................................................ 7

8 Detailed Description ............................................................................................................................. 8

Serial Interface ..................................................................................................................................................... 9

Timing Diagrams .................................................................................................................................................. 9

Error-Detection Mode ............. ... .................... .. .................................................................................................. 11

Global Error Mode ............................................................................................................................................. 11

Error Detection Functions .................................................................................................................................. 12

Open-LED Detection ..................... .................... .................................... .................... .................................... 12

Shorted-LED ................................................................................................................................................. 12

Overtemperature ........................................................................................................................................... 12

Detailed Error Reports ....................................................................................................................................... 13

Detailed Temperature Warning Report ......................................................................................................... 13

Detailed Open-LED Error Report .................................................................................................................. 14

Detailed Shorted-LED Error Report ............ .................... ... ................... .................... ... ................................. 15

Low-Current Diagnostic Mode................................................................................................................ ... .... 15

Shutdown Mode ................................................................................................................................................. 16

9 Application Information ...................................................................................................................... 17

Error Detection ................................................................................................................................................... 17

Error Detection On-The-Fly ........................................................................................................................... 17

Error Detection with Low-Current Diagnosis Mode ....................................................................................... 17

Cascading Devices ............................................................................................................................................ 18

Constant Current ................................................................................................................................................ 19

Adjusting Output Current ................................................................................................................................... 19

Package Power Dissipation ............................................................................................................................... 19

Delayed Outputs ................................... .................... ................... ..................................... ................................. 19

Switching-Noise Reduction .............................. ... .................... ... ................... .................... ... .............................. 19

Load Supply Voltage .......................................................................................................................................... 19

10 Package Drawings and Markings .................................................................................................... 21

11 Ordering Information ........................................................................................................................ 25

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AS1109

Data Sheet - P i n o ut

4 Pinout

Pin Assignments

Figure 2. Pin Assignments (Top View)

Pin Descriptions

Table 1. Pin Descriptio ns

Pin Number Pin Name Description

16-pin SSOP-150

16-pin SOIC-150 16-pin QFN

(4x4mm)

1 15 GND Ground

216SDI

Serial Data Input

31CLK

Serial Data Clock. The rising edge of the CLK signal is used to clock

data into and at the falling edge out of the AS1109 shift register. In error

mode, the rising edge of the CLK signal is used to switch error modes.

42LD

Serial Data Load. Data is transferred to the data register at the rising

edge of this pin.

5:12 3:10 OUTN0:7 Output Current Drivers. These pins are used as LED drivers or for

input sense for diagnostic modes.

13 11 OEN

Output Enable. The active-low pin OEN signal can always enable

output drivers to sink current independent of the AS1109 mode.

0 = Output drivers are enabled.

1 = Output drivers are disabled.

14 12 SDO

Serial Dat a Output. In normal mode SDO is clocked out 8.5 clock cycles

after SDI is clocked in.

In global error detecti on mode this pin indicates the occurrence of a

global error.

0 = Global error mode returned an error.

1 = No errors.

15 13 REXT External Resistor Connection. This pin connects through the external

resistor (REXT) to GND, to setup the load current.

16 14 VDD Positive Supply Voltage

GND

AS1109

16 VDD

SDI

CLK

OUTN0

15 REXT

14 SDO

13 OEN

9OUTN4

OUTN3

OUTN2

OUTN1

12 OUTN7

11 OUTN6

10 OUTN5

SDO

OUTN2

GND VDD REXT

OUTN7

1415

CLK 1

LD 2

OUTN1 4

AS1109

16-pin QFN

(4x4mm)

OUTN0 3

7 8

OUTN6

OEN

SDI

OUTN3

OUTN4

OUTN5

16-pin SSOP-150

16-pin SOIC-150

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AS1109

Data Sheet - A b s o l ut e M a x im u m R a ti n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Sectio n 6 Electrical

Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter Min Max Units Comments

VDD to GND 0 7 V

Input Voltage -0.4 VDD

+0.4 V

Output Voltage -0.4 15 V

GND Pin Current 1000 mA

Thermal Resistance ΘJA

83 ºC/W on PCB, 16-pin SOIC-150 package

113 ºC/W on PCB, 16-pin SSOP-150 package

32 ºC/W on PCB, 16-pin QFN (4x4mm) package

Operating Temperature Range -40 +85 ºC Device fully functional up to 125°C

Storage Temperature -55 150 ºC

Humidity 5 86 % Non-condensing

Electrostatic

Discharge Digital Outputs 2000 VNorm: MIL 833 E method 3015

All Other Pins 2000

Latch-Up Immunity -100 -

(INOM x 0.5) +100 +

INOM mA EIA/JESD78

Package Body Temperature +260 ºC

The reflow pea k soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-

020C “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded

packag es is matte tin (100% Sn).

* Min/max values are load dependent.

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AS1109

Data Sheet - E l e c tr i c a l Ch a r a c t e ri s t i c s

6 Electrical Characteristics

VDD = +3.0 to +5.5V, TAMB = -40 to +85°C (unless otherwise specified).

Typical values measured at VDD = 5V, TAMB = 25°C.

Table 3. Electrical Characte ristics

Symbol Parameter Condition Min Typ Max Unit

VDD Supply Voltage 3.0 5.5 V

VDS Output Voltage OUTN0:7 0 15.0 V

IOUT

Output Current

OUTN0:7, VDD = 5V (see Figure 8) 0.5 100

IOH SDO -1.0

IOL SDO 1.0

VIH Input Voltage High Level CLK, OEN, LD, SDI

0.7 x

VDD VDD +

0.3 V

VIL Low Level -0.3 0.3 x

VDD

IDS(OFF) Output Leakage Current OEN = 1, VDS = 15.0V 0.5 µA

VOL Output

Voltage SDO IOL = +1.0mA 0.4 V

VOH IOH = -1.0mA VDD -

0.4V

IAV(LC1) Devi ce-to-Device Average Output

Current from OUTN0 to OUTN7 VDS = 0.5V, VDD = Const.,

REXT = 744Ω24.5 25.26 26 mA

ΔIAV(LC1) Current Skew

(Between Channels) VDS ≥ 0.5V, VDD = Const.,

REXT = 744Ω ±0.9 ±3 %

IAV(LC2) Devi ce-to-Device Average Output

Current from OUTN0 to OUTN7 VDS = 0.6V, VDD > 3.3V,

REXT = 372Ω49.50 50.52 51.55 mA

ΔIAV(LC2) Current Skew

(Between Channels) VDS ≥ 0.6V, VDD = Const.,

REXT = 372Ω ±0.8 ±2 %

IAV(LC3) Devi ce-to-Device Average Output

Current from OUTN0 to OUTN7 VDS = 0.8V, VDD = 5.0V,

REXT = 186Ω 98 101 104 mA

ΔIAV(LC3) Current Skew

(Between Channels) VDS ≥ 0.8V, VDD = Const.,

REXT = 186Ω ±0.5 ±2 %

ILC Low-Current Diagnosis Mode VDS = 0.8V, VDD = 5.0V 0.4 0.6 0.8 mA

IPD Power Down Supply Current VDS = 0.8V, VDD = 5.0V,

REXT = 372Ω, OUTN0:7 = On 320µA

%/ΔVDS Output Current vs.

Output Voltage Regulation VDS within 1.0 and 3.0V ±0.1 %/V

%/ΔVDD Output Current vs.

Supply Voltage Regulation VDD within 3.0 and 5.0 V ±1 %/V

RIN(UP) Pullup Resistance OEN 250 500 800 kΩ

RIN(DOWN) Pulldown Resistance LD 250 500 800 kΩ

VTHL* Open Error Detection Threshold

Voltage No load 0.25 0.35 0.45 V

VTHH* Short Error Detection Threshold

Voltage VDD = 3.0V, no load 1.2 1.3 1.4 V

VDD = 5.0V, no load 2.0 2.2 2.4

TOV1 Overtemperature Threshold Flag 150 ºC

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AS1109

Data Sheet - E l e c tr i c a l Ch a r a c t e ri s t i c s

Switching Characteristics

VDD = 3.0 to 5.5V, VDS = 0.8V, VIH = VDD, VIL = GND, REXT = 372Ω, VLOAD = 4.0V, RLOAD = 64Ω, CLOAD = 10pF; guar-

anteed by design.

* If multiple AS1109 devices are cascaded and tr or tf is large, it may be critical to achieve the timing required for data

transfer between two cascaded LED drivers.

IDD(OFF)0

Supply

Current

Off

REXT = Open‚ OUTN0:7 = Off 1.3 2

IDD(OFF)1 REXT = 744Ω‚ OUT N0:7 = Off 3.0 3.68

IDD(OFF)2 REXT = 372Ω‚ OUT N0:7 = Off 4.7 5.37

IDD(OFF)3 REXT = 186Ω, OUTN0:7 = Off 8.1 8.73

IDD(ON)1

REXT = 744Ω‚ OUTN0:7 = On 4.5 5

IDD(ON)2 REXT = 372Ω‚ OUTN0:7 = On 7.5 8

IDD(ON)3 REXT = 186Ω‚ OUTN0:7 = On 13.7 15

Table 4. Switching Characteristics

Symbol Parameter Conditions Min Typ Max Unit

tP1 Propagation Delay Time CLK - SDO 5 10 nstP2 Propagation Delay Time (Without

Staggered Output Delay) LD - OUTNn 100 200

tP3 OEN - OUTNn 100 200

tP4 Propagation Delay Time 10 ns

tW(CLK) Pulse Width CLK 15 nstW(L) LD 15

tW(OE) OEN (@IOUT < 60mA) 200

tR *Maximum CLK Rise Time 500 ns

tF *Maximum CLK Fall Time 500 ns

tOR Output Rise Time of VOUT (Turn Off) 100 200 ns

tOF Output Fall Time of VOUT (T urn On) 100 300 ns

tSU(D) Setup Time for SDI 5 ns

tH(D) Hold Time for SDI 5 ns

tSU(L) Setup Time for LD 5 ns

tH(L) Hold Time for LD 5 ns

tTESTING Minimum OEN Time for Error Detection 2000 ns

tSTAG Staggered Output Delay 20 40 ns

tSU(OE) Output Enable Setup Time 20 ns

tGSW(ERROR) Global Error Switching Setup Time 10 ns

tSU(ERROR) Global Error Detection Setup Time 10 ns

tP(I/O) Propagation Delay Global Error Flag 5 ns

tSW(ERROR) Switching Time Global Error Flag 10 ns

fCLK Maximum Clock Frequency

(Cascade Operation) 30 50 MHz

tP3,ON Low-Current Test Mode

Propagation Delay Time Turn ON 3 5 µs

tTP3,OFF Turn OFF 0.05 0.1 µs

tREXT2,1 External Resistor Reaction Time Change from REXT1 = 372Ω,

IOUT1 = 50.52mA to REXT2 =

37.2kΩ, IOUT2 < 1mA 0.5 1 µs

tREXT2,1 External Resistor Reaction Time Change from REXT1 = 37.2kΩ,

IOUT1 = 0.5mA to REXT2 =

372Ω, IOUT2 > 25mA 0.5 1 µs

Table 3. Electrical Characteristics (Continued)

Symbol Parameter Condition Min Typ Max Unit

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AS1109

Data Sheet - Ty p i c a l O p e r a ti n g C h a ra c t e r i st i c s

7 Typical Operating Characteristics

Figure 3. Output Current vs. REXT, Figure 4. Relative Output Current Error vs. VDD,

VDD = 5V; VOUT = 0.8V, TAMB = 25°C Iout/Iout@VDD = 5V - 1, TAMB = 25°C

Figure 5. Output Current vs. VDS; Figure 6. Output Current vs. VDS;

VDD = 5V, TAMB = 25°C VDD = 5V, TAMB = 25°C

Figure 7. Rel ative IOUT Error vs. Temperature Figure 8. Output Current vs. VDD

VDD = 5V, Iout/Iout@25°C - 1, TAMB = 25°C

100

100 1000 10000

REXT (Ohm)

IOUT (mA) .

-2

-1.5

-1

-0.5

0.5

1.5

33.544.555.5

VDD (V )

Relat iv e Out put Cur r ent Er ror ( %)

REXT = 744Ω;

VDS = 0.5V

REXT = 372Ω;

VDS = 0.6V

REXT = 186Ω;

VDS = 0.8V

100

120

140

160

02468101214

VDS (V)

IOUT (mA) .

REXT = 127Ω

REXT = 251Ω

REXT = 372Ω

REXT = 150Ω

REXT = 186Ω

REXT = 744Ω

100

120

140

160

0 0.2 0.4 0.6 0.8 1 1.2 1.4

VDS (V)

IOUT (mA) .

REXT = 127Ω

REXT = 251Ω

REXT = 372Ω

REXT = 150Ω

REXT = 186Ω

REXT = 744Ω

-1

-0.5

0.5

-50-250255075100

Temperature ( ° C)

Relat iv e Out put Cur r ent Er ror ( %)

REXT = 372Ω;

VDS = 0.6V

REXT = 744Ω;

VDS = 0.5V

REXT = 186Ω;

VDS = 0.8V

100

120

140

160

3 3.5 4 4.5 5 5.5

VDD (V )

IOUT (mA) .

VDS = 1V

VDS = 0.9V

VDS = 0.8V

VDS = 0.7V

VDS = 0.6V

VDS = 0.5V

www.austriamicrosystems.com Revision 1.18 8 - 26

AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

8 Detailed Description

The AS1109 is designed to drive up to 8 LEDs through a fast serial interface and 8 constant-current output drivers. Fur-

thermore, the AS1109 provides diagnostics for detecting open- or shorted-LEDs, as well as over-temperature condi-

tions for LED display systems, especially LED traffic sign applications.

The AS1109 contains an 8-bit shift register and an 8-bit data register , which convert serial input data into parallel output

format. At AS1109 output stages, eight regulated current sinks are designed to provide uniform and constant current

with excellent matching between ports for driving LEDs within a wide range of forward voltage variations. External out-

put current is adjustable from 0.5 to 100mA using an external resistor for flexibility in controlling the brightness intensity

of LEDs. The AS1109 guarantees to endure 15V maximum at the outputs.

The serial interface is capable of operating at a minimum of 30 MHz, satisfying the requireme nts of high-volume data

transmission.

Using a multiplexed input/output technique, the AS1109 adds additional functionality to pins SDO, LD and OEN. These

pins provide highly useful functions (open- and shorted-LED detection, over-temperature detection), thus reducing pin

count. Over-temperature detection will work on-the-run, whereas the open- and shorted-LED detectio n can be used

on-the-run or in low-current di agnostic mode (see page 15).

Figure 9. Block Diagram

AS1109

REXT

OEN

CLK

SDI

Current

Generators

Detailed

Error

Detection

8-Bit Data

8-Bit Shift

Temperature

Detection 8-Bit Open

Detection &

Error Register

8-Bit Short

Detection &

Error Register

Global

Error

Detection

SDO

Indicates 8 Bit Path

Control Logic

+VLED

OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 OUTN5 OUTN6 OUTN7

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AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

Serial Interface

Data accesses are made serially via pins SDI and SDO. At each CLK rising edge, th e signal present at pin SDI is

shifted into the first bit of the internal shift register and the other bits are shifted ahead of the first bit. The MSB is the

first bit to be clocked in. In error-detection mode the shift register will latch-in the corresponding error data of tempera-

ture-, open-, and short-error register with each falling edge of LD.

The 8-bit data register will latch the data of the shift register at each rising edge of LD. This data is then used to drive

the current generator output drivers to switch on the corresponding LEDs as OEN goes low.

Timing Diagrams

This section contains timing diagrams referenced in other sections of this data sheet.

Figure 10. Normal Mode Timing Diagram

Figure 11. Output Delay Timing Diagram

OEN

OUTNx

SDO

SDI

CLK

tSU(L) tH(L)

tW(L)

tW(CLK)

tP1

tH(D)

50% 50% 50%

50% 50%

50%

tSU(D)

OEN Low = Output Enabled

tP2

OUTNx High = Output Off

OUTNx Low = Output On

50%

50% 50%

tW(OE)

7XtSTAG

tP3

OEN

OUTN0

OUTN1

OUTN7

50% 50%

50%50%

tOF tOR

tSTAG

90% 90%

10% 10%

7XtSTAG

tSTAG

tP3

50% 50%

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AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

Figure 12. Data Input Timing Diagram

Figure 13. Data Input Example Timing Diagram

SDI0

CLK

OEN

SDO0

8 CLK Pulses

tSU(OE)

tW(L)

tSU(L

tW(OE)

tH(D)

tP1

Data Bit

7Data Bit

6Data Bit

5Data Bit

4Data Bit

3Data Bit

2Data Bit

1Data Bit

Old Data

Bit 7 Old Data

Bit 6 Old Data

Bit 5 Old Data

Bit 4 Old Data

Bit 3 Old Data

Bit 2 Old Data

Bit 1 Old Data

Bit 0

Don’t Care

tSU(D)

SDI

OEN

OUTN0

OUTN1

OUTN7

OUTN2

OUTN3

OUTN4

OUTN5

OUTN6

Off

D6D7 D5 D4 D3 D2 D1 D0

1234567

Time = 0

CLK

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AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

Figure 14. Switching Global Error Mode Timing Diagram

Error-Detection Mode

Acquisition of the error status occurs at the rising edge of OEN. Error-detection mode is started on the rising edge of

LD when OEN is high. The CLK signal must be low when entering error detection mode. Error detection for open- and

shorted-LEDs can only be performed for LEDs that are switched on during test time. To switch between error-detection

modes clock pulses are needed (see Table 5).

Note: To test all LEDs, a test pattern that turns on all LEDs must be input to the AS1109 .

Global Error Mode

Global error mode is entered when error-detection mode is star ted. Clock pulses during this period are used to select

between temperature, open-LED, and shorted-LED tests, as well as low-current diagnostic mode and shutdown mode

(see Table 5). In global error mode, an error flag (TFLAG, OFLAG, SFLAG) is delivered to pin SDO if any errors are

encountered.

Note: For a valid result SDI must be 1 for the first device.

Table 5. Global Error Mode Selections

Clock

Pulses Output Port Error-Detection Mode Global Error Flag/Shutdown Condition

0 Don't Care Over-Temperature

Detection TFLAG = SDO = 1: No over-temperature warning.

TFLAG = SDO = 0: Over-temperature warning.

1 Enabled Open-LED Detection OFLAG = SDO = 1: No open-LED error.

OFLAG = SDO = 0: Open-LED error.

2 Enabled Shorted-LED Detection SFLAG = SDO = 1: No shorted-LED error.

SFLAG = SDO = 0: Shorted-LED error.

3 Don't Care Low-Current Di agnostic

Mode

4 Don't Care Shutdown Mode SDI = 1: Wakeup

SDI = 0: Shutdown

tTESTING

tSU(ERROR)

OFLAG(IN) SFLAG(IN)TFLAG(IN)

TFLAG OFLAG SFLAG

tSW(ERROR)

SDI

OEN

CLK

SDO

Acquisition of

Error Status

Don’t

Care Don’t

Care

tGSW(ERROR)

tP(I/O)

tP4

tP(I/O) tP(I/O)

tSW(ERROR)

tGSW(ERROR)

Don’t

Care

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AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

If there are multiple AS1109s in a chain, the error flag will be gated through all devices. To get a valid result at the end

of the chain, a logic 1 must be applied to the SDI input of the first device of the chain. If one device produces an error

this error will show up after n*tP(I/O) + tSW(ERROR) at pin SDO of the last device in the chain. This means it is not possi-

ble to identify which device in the chain produced the error. Therefore, if a global error occurs, the detailed error report

can be run to identify which AS1109, or LED produced the error.

Note: When no error has occurred, the detailed error report can be skipped, setting LD and sub se quently OEN low.

Error Detection Functions

Open-LED Detection

The AS1109 open-LED detection is based on the comparison between VDS and VTHL. The open LED status is aquired

at the rising edge of OEN and stored internally. While detecting open-LEDs the output port must be turned on. Open

LED detection can be started with 1 clock pulse during error detection mode while the output port is turned on.

Note: LEDs which are turned off at test time cannot be tested.

Shorted-LED

The AS1109 shorted-LED detection is based on the comparison between VDS and VTHH. The shortened LED status is

aquired at the rising edge of OEN and stored internally. While detecting shorte d-LEDs the output port must be turned

on. Shorted-LED detection can be started with 2 clock pulses during error detection mode while the output port is

turned on.

For valid results, the voltage at OUTN0:OUTN7 must be lower then VTHH under low-current diagnostic mode operating

conditions. This can be achieved by reducing the VLED voltage or by adding additional diodes, resisto r s or LED’s.

Note: LEDs which are turned off at test time cannot be tested.

Overtemperature

Thermal protection for the AS1109 is provided by continuously monitoring the device’s core temperature. The overtem-

perature status is aquired at the rising edge of OEN and stored internally.

Table 6. Open LED Detection Modes

Output Port State Effective Output

Point Conditions Detected Open-LED

Error Status Code Meaning

On VDS < VTHL 0 Open Circuit

On VDS > VTHL 1 Normal

Table 7. Shorted LED Detection Modes

Output Port State Effective Output

Point Conditions Detected Shorted-LED

Error St atus Code Meaning

On VDS > VTHH 0 Short Circuit

On VDS < VTHH 1 Normal

Table 8. Overtemperature Modes

Output Port State Effective Output

Point Conditions Detected Overtemperature

Status Co de Meaning

Don’t Care Temperature > TOV1 0Overtemperature

Condition

Don’t Care Temperature < TOV1 1 Normal

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AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

Detailed Error Reports

The detailed error report can be read out after global error mode has been run. On the falling edge of LD, the detailed

error report of the selected test is latched into the shift register and can be clocked out with n*8 clock cycles (n is the

number of AS1109s in a chain) via pin SDO. At the same time new data can be written into the shift register, which will

load on the next rising edge of pin LD. This data will show at the output drivers, at the falli ng edge of OEN.

Detailed Temperature Warning Report

The detailed temperature warning report can be read out immediately after global error mode has been run. Bit0 of the

8bit data word represents the temperature flag of the chip.

Figure 15. Detailed Temperature Warning Report Timing Diagram

Detailed Temperature Warning Report Example

Consider a case where five AS1109s are cascaded in one chain. The detailed error report lists the temperatures for

each device in the chain: IC1:[70°] IC2:[85°] IC3:[66°] IC4:[160°] IC5:[76°]

In this case, IC4 is overheated and will generate a global error, and therefore 5*8 clock cycles are ne eded to write out

the detailed temperature warning report, and optionally read in new data. The detailed temperature warning report

would look like this: XXXXXXX1 XXXXXXX1 XXXXXXX1 XXXXXXX0 XXXXXXX1

The 0 in the detailed temperature warning report indicates that IC4 is the device with the over-temperature condition.

Note: In an actual report there are no spaces in the output.

Global Flag Readout Detailed Error Report Readout

tH(L)

tP4

SDI

OEN

CLK

SDO

New Data Input

TFLAG

DBit7

Undefined

Don’t

Care

Don’t

Care

Temperature Error Report Output

DBit6 DBit5 DBit4 DBit3 DBit2 DBit1 DBit0

TBit0

t(SU)ERROR

tP1

For detailed timing information see Timing Diagrams on page 9.

tGSW(ERROR)

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AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

Detailed Open-LED Error Report

The detailed open-LED error report can be read out immediately after global error mode has been run.

Figure 16. Detailed Open-LED Error Report Timing Diagram

Detailed Open-LED Error Report Example

Consider a case where five AS1109s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off,

and an X indicates an open LED. Th e open-LED test is only applied to LEDs that are turned on. This test is used with

a test pattern where all LEDs are on at test time.

IC1:[11111111] IC2:[111XX111] IC3:[11111111] IC4:[1X111111] IC5:[11111111]

IC2 has two open LEDs and IC4 has one open LED switched on due to input. 5*8 clock cycles are needed to write the

entire error code out. The detailed error report would look like this:

Comparing this report with the input data indicates that IC2 is the device with two open LEDs at position 4 and 5 and

IC4 with an open LED at second position. For such a test it is recommended to enter low-current diagnostic mode first

(see Low-Current Diagnostic Mode on page 15) to reduce on screen flickering.

Note: In an actual report there are no spaces in the output.

LEDs turned off during test time cannot be tested.

Input Data:11111111 11111111 11111111 11111111 11111111

LED Status:11111111 111XX111 11111111 1X111111 11111111

Failure Code: 1 1 1 1 1111 11100111 11111111 10111111 11111111

Acquisition of

Error Status

Global Flag Readout Detailed Error Re port Readout

SDI

OEN

CLK

SDO

tH(L)

Open Error Report Output

New Data Input

tP4

tP1

tP4

tSW(ERROR)

tSU(ERROR)

tTESTING

DBit0DBit1DBit2DBit3DBit4DBit5DBit6

OBit0OBit1OBit2OBit3OBit4OBit5OBit6

Don’t

Care

Don’t

Care

OBit7

TFlag OFlag

DBit7

For detailed timing information see T iming Diagrams on page 9.

tGSW(ERROR)

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AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

Detailed Shorted-LED Error Report

The detailed shorted-LED error report can be read out immediately after global error mode has been run (see Global

Error Mode on page 11).

Figure 17. Detailed Shorted-LED Error Report Timing Diagram

Detailed Shorted-LED Error Report Example

Consider a case where five AS1109s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off,

and an X indicates a shorted LED. This test is used with a test pattern where all LEDs are on at test time. Additionally,

this test should be run after starting low-current diagnostic mode (see Low-Current Diagnostic Mode on page 15).

IC1:[11111XX1] IC2:[11111111] IC3:[11111111] IC4:[111X1111] IC5:[11111111]

IC2 has two shorted LEDs and IC4 has one shorted LED switched on due to input. 5*8 clock cycles are needed to write

the entire error code out. The detailed error report would look like this:

Showing IC1 as the device with two shorted LEDs at position 6 and 7, and IC4 with one shorted LED at position 4.

Note: In an actual report there are no spaces in the output. LEDs turned off during test time cannot be tested.

Low-Current Diagnostic Mode

To run the open- or shorted-LED test, a test pattern must be used that will turn on each LED to be tested. This test pat-

tern will cause a short flicker on the screen while the test is being performed. The low-current diagnostic mode can be

initiated prior to running a detailed error report to reduce this on-screen flickeri ng.

Note: Normally, displays using such a diagnosis mode require additional cables, resistors, and other components to

reduce the current. The AS1109 has this current-reduction capability built-in, thereby minimizing the number of

external components required.

Low-current diagnostic mode can be initiated via 3 clock pulses during error-detection mode. After the falling edge of

LD, a test pattern displaying all 1s can be written to the shift register which will be used for the next error-detection test.

On the next falling edge of OEN, current is reduced to ILC. With the next rising edge of OEN the current will immedi-

ately increase to normal levels and the detailed error report can be read out entering error-detection mode.

Input Data: 11111111 11111111 11111111 11111111 11111111

LED Status: 11111XX1 11111111 11111111 111X1111 11111111

Failure Code: 11111001 11111111 11111111 11101111 11111111

Global Flag Readout Detailed Error Report Readout

SDI

OEN

CLK

SDO

tH(L)

tSU(ERROR)

tP1

tSW(ERROR)

tP4

TFLAG SFLAG

Acquisition of

Error Status

DBit6 DBit5 DBit4 DBit3 DBit2 DBit1 DBit0 Don’t

Care

Don’t

Care

SBit6 SBit5 SBit4 SBit3 SBit2 SBit1 SBit0SBit7

New Data Input

Shorted-LED Error Report Output

OFLAG

TFLAG

tP4

tTESTING

Global Flag Readout

DBit7

For detailed timin g information see Timing Diagrams on page 9.

tGSW(ERROR)

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AS1109

Data Sheet - D e t ai l e d D es c r i p t io n

Figure 18. Switching into Low-Current Diagnosti c Mode Timing Diagram

Shutdown Mode

The AS1109 features a shutdown mode which can be entered via 4 clock pulses during error-detection mo de. To

enable the shutdown mode a 0 must be placed at SDI after the rising edge of the 3rd clock pulse.

To disable shutdown mode a 1 must be placed at SDI after the 3rd clock pulse. The shutdown/wakeup information will

be latched through if multiple AS1109 devices are in a chain. At the rising edge of the 4th clock pulse the shutdown bit

will be read out and the AS1109 wil l shutdown or wakeup.

Note: In shutdown mode the supply current drops down to typically 3µA.

Figure 19. Shutdown Mode Timing Diagram

OFLAGTFLAG SFLAG Don’t

Care

Re-entering Error

Detection Mode

tTESTING

Global Flag Readout

SDI

OEN

CLK

SDO

Load Internal all 1s

Test Pattern

(optional)

tH(L)

tP4

tSW(ERROR)

tP1

tSU(ERROR)

Normal Operation Current

For detailed timing information see T iming Diagrams on page 9.

tGSW(ERROR)

2µs Low-Current

Diagnosis Mode

tH(L)

SDI

OEN

CLK

SDO

1 = Wakeup

0 = Shutdown

1 = Wakeup

0 = Shutdown

OFLAGTFLAG SFLAG

tP4

tSU(ERROR)

tSU(D)

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AS1109

Data Sheet - A p p l ic a t i o n In f o r m a ti o n

9 Application Information

Error Detection

The AS1109 features two types of error detection. The error detection can be used on-the-fly, for active LEDs, without

any delay, or by entering into low-current diagnosis mode.

Error Detection On- T he-F l y

Error detection on-the-fly will output the status of active LEDs during operation. Without choosing an error mode this

will output the temperature flag at every input/output cycle. Triggering one clock pulse for open or two clock pulses for

short detection during error detection mode outputs the detailed open- or short-error report with the next input/output

cycle (see Figure 20). LEDs that are turned off cannot be tested and their digits at the error output must be ignored.

Figure 20. Normal Operation with Error Detection During Operation – 128 Cascaded AS1109s

Error Detection with Low-Current Diagnosis Mode

This unique feature of the AS1109 uses an internal all 1s test pattern for a flicker free diagnosis of all LEDs. This error

detection mode can be started anytime, and does not require any SDI input (see Figure 21 ).

Figure 21. Low-Current Diagnosis Mode with Inter nal All 1s Test Pattern – 128 Cascaded AS1109s

Display

SDI

SDO

CLK

OEN

Current

Data1 Data2 Data3

T/O or S Error Code

Data1

T/O or S Error Code

Data0 T/O or S Error Co de

Data2

1024x 1024x 1024x

Clock for Error

Mode 0x/1x/2x

Rising Edge of OEN

Acquisition of Error Status

Falling Edge of LD; Error Register is

copied into Shift Register

≤ 100mA

GEFGEF

GEF = Global Error Flag

Falling Edge of LD; Error Register is

copied into Shift Register

Clock for Error

Mode 0x/1x/2x

Rising Edge of OEN

Acquisition of Error Status

Data2 Data3 Data4

GEF

1024x1024x

Data0 Data1

Rising Edge of OEN

Acquisition of Error Status

Falling Edge of LD; Error Register

is copied into Shift Register

GEF

O or S Error Code of

All 1s Test Patern Temperature Error Code

Load Internal All 1s Test Pattern

≤ 100mA ≤ 100mA

2µs Low-Current Diagn osis Mode

3x Clocks Low-

Current Mode Clock for Error

Mode 1x/2x

Display

SDI

SDO

CLK

OEN

Current

≤ 0.8mA GEF = Global Error Flag

Data1 Data2

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AS1109

Data Sheet - A p p l ic a t i o n In f o r m a ti o n

Low-current diagnosis mode is started with 3 clock pulses during error detection mode. After the three pulses of CLK,

a pulse of LD loads the internal all 1s test pattern. Then OEN should be enabled for 2µs for testing. With the rising

edge of OEN the test of the LEDs is stopped and while LD is high the desired error mode can be selected with the cor-

responding clock pulses.

With the next data input the detailed error code will be clocked out at SDO.

Note: See Figure 22 for the use of an external test pattern.

Figure 22. Low-Current Diagnosis Mode with Ex ternal Test Pattern – 128 Cascaded AS1109s

Cascading Devices

To cascade multi ple AS1109 devices, pin SDO must be connected to pin SDI of th e next AS1109 (see Fi gure 23). At

each rising edge of CLK the LSB of the shift register will be written into the shift register SDI of the next AS1109 in the

chain. Data at the SDI pin is clocked in at the rising edge of the CLK pulse and is clocked out at the SDO pin 8.5 clock

cycles later at the falling edge of the CLK pulse.

Note: When n*AS1109 devices are in one chain, n*8 clock pulses are needed to latch-in the inp ut data.

Figure 23. Cascading AS1109 Devices

Temperature Error Code

Data2

Data1

GEF GEF

T/O or S Err o r C o de

Data0

Rising Edge of OEN

Acquisition of Error Status

Display

SDI

SDO

CLK

OEN

1024x

3x Clocks

Low-Current

Mode Clock for Error

Mode 1x/2x

Falling Edge of LD; Error Register

is copied into Shift Register

O or S Error Code

from Test Pattern

1024x

GEF = Global Error Flag

2µs Low-Current Diagnosis Mode

≤ 100mA ≤ 100mA

Current

≤ 0.8mA

Data2 Data3

External all 1s Test Pattern

AS1109 #n-1

SDI SDO

CLK LD OEN

SDI

CLK

OEN

AS1109 #1

SDI SDO

CLK LD OEN

AS1109 #2

SDI SDO

CLK LD OEN

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AS1109

Data Sheet - A p p l ic a t i o n In f o r m a ti o n

Constant Current

In LED display applications, the AS1109 provides virtu ally no current variations from chan nel-to-channel and from

AS1109-to-AS1109. This is mostly due to 2 factors:

! While IOUT ≥ 50mA, the maximum current skew is less than ±2% between channels and less than ±2% between

AS1109 devices.

! In the saturation region, the characteristics curve of the output stage is flat (see Figure 5 on page 7). Thus, the out-

put current can be kept constant regardless of the variations of LED forward voltages (VF).

Adjusting Output Current

The AS1109 scales up the reference current (IREF) set by external resistor (REXT) to sink a current (IOUT) at each out-

put port. As shown in Figure 3 on page 7 the output cur ren t i n th e sa tu ration region is extre me ly fl a t so th at it is po ssi -

ble to define it as target current (IOUT TARGET). IOUT TARGET can be calculated by:

VREXT = 1.253V (EQ 1)

IREF = VREXT/REXT (if the other end of REXT is connected to ground) (EQ 2)

IOUT TARGET = IREF*15 = (1.253V/REXT)*15 (EQ 3)

Where:

REXT is the resistance of the external resistor connected to pin REXT.

VREXT is the voltage on pin REXT.

The magnitude of current (as a function of REXT) is around 100mA at 186Ω, 50.52mA at 372Ω and 25.26mA at 744Ω.

Figure 3 on page 7 shows the relati onship curve between the IOUT TARGET of each channel and the corresponding

external resistor (REXT).

Package Power Dissipation

The maximum allowable package power dissipation (PD) is determined as:

PD(MAX) = (TJ-TAMB)/RTH(J-A) (EQ 4)

When 8 output channels are turned on simultaneously, the actual package power dissipation is:

PD(ACT) = (IDD*VDD) + (I OUT*Duty*VDS*8) (EQ 5)

Therefore, to keep PD(ACT) ≤ PD(MAX), the allowable maximum output current as a function of duty cycle is:

IOUT = {[(TJ-TAMB)/RTH(J-A)]-(IDD*VDD)}/VDS/Duty/8 (EQ 6)

Where:

TJ = 150ºC

Delayed Outputs

The AS1109 has graduated delay circuits between outputs. These delay circuits can be found between OUTNn and

constant current block.

The fixed delay time is 20 ns (typ) where OUTN0 has no delay, OUTN1 has 20ns delay, OUTN2 has 40ns delay ...

OUTN7 has 140ns delay. This delay prevents large inrush currents, which reduce power supply bypass capacitor

requirements when the outputs turn on (see Figure 12 on page 10)

Switching-Noise Reduction

LED drivers are frequently used in switch-mode applications which normally exhibit switching noise due to parasitic

inductance on the PCB.

Load Supply Voltage

Considering the package power dissipation limits (see EQ 4:6), the AS1109 should be operated within the range of

VDS = 0.4 to 1.0V.

For example, if VLED is higher than 5V, VDS may be so high that PD(ACT) > PD(MAX) where VDS = VLED - VF. In this case,

the lowest possible supply voltage or a voltage reducer (VDROP) should be used. The voltage reducer allows

VDS = (VLED -VF) - VDROP.

Note: Resistors or zener diodes can be used as a voltage reducer as shown in Figure 24.

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AS1109

Data Sheet - A p p l ic a t i o n In f o r m a ti o n

Figure 24. Voltage Reducer using Resistor (Left) and Zener Diode (Right)

AS1109

VDS

Voltage Supply

}

VLED VDROP

AS1109

VDS

VLED

VDROP

Voltage Supply

{

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AS1109

Data Sheet - P a c k age Drawings and Markings

10 Package Drawings and Markings

The device is available in an 16-pin SOIC-150 package.

Figure 25. 16-pin SOIC-150 Package

Notes:

1. Lead coplanarity should be 0 to 0.10mm (.004”) max.

2. Package surfacing:

a. Top: matte (charmilles #18- 30).

b. All sides: matte (charmilles #18- 30).

c. Bottom: smooth or matte (charmilles #18- 30).

3. All dimensions excluding mold flashes and end flash from the

package body shall not exceed 0.25mm (.010”) per side (D).

4. Detail of pin #1 identifier are optional but must be located

within the zone indicated.

5. Dimensions are in millimeters.

Symbol Min Max

A1 0.10 0.25

B 0.36 0.46

C 0.19 0.25

D 9.80 9.98

E 3.81 3.99

e 1.27 BSC

H 5.80 6.20

h 0.25 0.50

L 0.41 1.27

A 1.52 1.72

α0º 8º

ZD 0.51 REF

A2 1.37 1.57

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AS1109

Data Sheet - P a c k age Drawings and Markings

Figure 26. 16-pin SSOP-150 Package

Symbol Min Max

A1.351.75

A1 0.10 0.25

A2 1.37 1.57

b0.200.30

C0.190.25

D4.804.98

E5.796.20

E1 3.81 3.99

e 0.635 BSC

h0.220.49

L0.401.27

θ0º 8º

ZD 0.230 REF

N 16 pins

Notes:

1. Lead coplanarity should be 0 to 0.10mm (.004”) max.

2. Package surfacing:

a. Top: matte (charmilles #18- 30).

b. All sides: matte (charmilles #18- 30).

c. Bottom: smooth or matte (charmilles #18- 30).

3. All dimensions excluding mold flashes and end flash from the

package body shall not exceed 0.25mm (.010”) per side (D).

4. Dimensions “b” does not include damb ar protrusion/intrusion

but solder coverage.

5. Dimensions are in millimeters.

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AS1109

Data Sheet - P a c k age Drawings and Markings

Figure 27. 16-pin QFN 4x4mm Packages

D/2

Index Area

aaa C

Top View

(D/2 xE/2)

E/2

-B-

-A-

-C-

Side View

Plane

ccc C

0.08 C

11 NX Seating

NXL

NXb

D2/2

E2/2

bbb C A B

ddd C

-B-

-A-

NN-1

Bottom View

(D/2 xE/2)

Index Area

See

Detail B

SEE

Detail B

Pin 1

Marker

Datum A or B

Even Terminal Side Detail B

Terminal Tip

e/2

Datum A or B

Odd Terminal Side

Terminal Tip

16-pin QFN 4x4mm Dimensions

Symbol Min Nom Max Notes

aaa 0.15 1, 2

bbb 0.10 1, 2

ccc 0.10 1, 2

ddd 0.05 1, 2

b 0.25 0 .30 0.35 1, 2

e0.65

A 0.70 0.75 0.80 1, 2

A1 0.00 0.02 0.05 1, 2

A3 0.20

REF 1, 2

L1 0.03 0.15 1, 2

D BSC 4.00 1, 2, 10

E BSC 4.00 1, 2, 10

D2 2.00 2.15 2.25 1, 2, 10

E2 2.00 2.15 2.25 1, 2, 10

L 0.45 0.55 0.65 1, 2, 10

N 16 1, 2, 10

ND 4 1, 2, 10

NE 4 1, 2, 10

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AS1109

Data Sheet - P a c k age Drawings and Markings

Notes:

1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.

2. All dimensions are in millimeters; angles in degrees.

3. N is the total number of terminals.

4. The terminal #1 identifier and terminal numbering convention shall conform to JEDEC 95 SPP-012. Details of termi-

nal #1 identifier are optional but must be located within the zone indicated. The terminal #1 identifier may be either

a mold or marked feature.

5. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. If one end

of the terminal has the optional radius, the b dimen sion should not be measured in that radius area.

6. Dimensions ND and NE refer to the number of terminals on each D and E side, respectively.

7. Depopulation is possible in a symmetrical fashion.

8. Figure 27 is shown for illustration only and does not represent any specific variation.

9. All variations may be constructed per Figure 27, however variations may alternately be constructed between square

or rectangle shape per dimensions D and E.

10. Refer to the Dimensions Table for a complete set of dimensio ns.

11. Bilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.

12. Depending on the method of lead termination at the edge of the package, pullback (L1) may be present. L minus

L1 to be ≥ 0.33mm.

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AS1109

Data Sheet - O r d e ri n g I n fo r m a t i o n

11 Ordering Information

The device is available as the standard products shown in Table 9.

All devices are RoHS compliant and free of halogene substances.

Table 9. Ordering Information

Type Description Delivery Form Package

AS1109-BSOU Constant-Current, 8-Bit LED Driver with Diagnostics Tubes 16-pin SOIC-150

AS1109-BSOT Constant-Current, 8-Bit LED Driver with Diagnostics Tape and Reel 16-pin SOIC-150

AS1109-BSSU Constant-Current, 8-Bit LED Driver with Diagnostics Tubes 16-pin SSOP-150

AS1109-BSST Constant-Current, 8-Bit LED Driver with Diagnostics Tape an d Reel 16-pin SSOP-150

AS1109-BQFR Constant-Current, 8-Bit LED Driver with Diagnostics Tray 16-pin QFN (4x4mm)

AS1109-BQFT Constant-Current, 8-Bit LED Driver with Diagnostics Tape an d Reel 16-pin QFN (4x4mm)

www.austriamicrosystems.com Revision 1.18 26 - 26

AS1109

Data Sheet

Copyrights

lated, stored, or used without the prior written consent of the copyright owner.

All products and companies mentioned are trademarks or registered trademarks of their respective companies.

Disclaimer

Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing

in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding

the information set forth herein or regardi ng th e fre e do m of the described devices from patent infringement. austria-

microsystems AG reserves the right to change specificatio ns and prices at any time and without notice. Therefore,

prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current informa-

tion. This product is intended for use in normal commercial applications. Applications requiring extended temperature

range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-

sustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for

each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard

production flow, such as test flow or test location.

The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,

austriamicrosystems AG shall not be liable to reci pient or any third party for any damages, including but not limited to

personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or

consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the tech-

nical data herein. No obligation or liability to recipient or any third party shall arise or flow out of

austriamicrosystems AG rendering of technical or other services.

Cont act Information

Headquarters

austriamicrosystems AG

A-8141 Schloss Premstaetten, Austria

Tel: +43 (0) 3136 500 0

Fax: +43 (0) 3136 525 01

For Sales Offices, Distributors and Representatives, please visit:

http://www.austriamicrosystems.com/contact-us