BD6671FME2 - ROHM SEMICONDUCTOR

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System Motor Driver ICs for CD/DVD Players

1ch Spindle

Motor Driver ICs

BA6859AFP-Y,BA6664FM,BD6671FM

●Description

ROHM’s spindle motor drivers incorporate the 3-phase full-wave pseudo-linear drive system(BA6859AFP-Y, BA6664FM)

and 180°electrifying direct PWM drive system(BD6671FM).Smooth rotation characteristic performance is ensured.

Besides, high torque is provided in a wide output range because the output stage incorporates lo w-saturation voltage NPN

transistors (BA6859AFP-Y, BA6664FM) and low-power consumption MOSFET (BA6671FM).

●Features

1) 3-phase full-wave pseudo-linear system (BA685 9AF P -Y, BA6664FM)

2) 180° electrifying dir ect drive PWM system (BD6671FM)

3) Power saving, TSD (thermal shutdown) functions built in

4) Current limiting, Hall bias circuit built in

5) FG output built in

6) 3-phase component FG output built in (BA6664F M, BD6671FM)

7) Circuit direction detection function built in (BA6859AFP-Y, BA6664FM)

8) Reverse rotation prevention circuit built in

9) Short brake pin built in (BA6859AFP-Y, BA6664F M)

10) Brake mode selection pin built in (BA685 9AFP-Y, BD6671FM)

11) Supports DSP 3.3 V

●Applications

Used for car, CD and DVD players incorporating changer function

●Absolute maximum ratings (Ta=25℃)

Parameter Symbol Ratings Unit

BA6859AFP-Y BA6664FM BD6671FM

Applied voltage VCC 7 7 7 V

Applied voltage VM 15 15 15 V

Applied voltage VG - - 20 V

Power dissipation Pd 1450*1 2200*2 2200*2 mW

Operating temperature Topr -40～+85 -40～+85 -40～+85 ℃

Storage temperature Tstg -55～+150 -55～+150 -55～+150 ℃

Output current Iout 1300 1300 2500 mA

Junction temperature Tjmax 150 150 150 ℃

*1 Reduced by 11.6 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).

*2 Reduced by 17.6 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).

●Line up matrix

Parameter Symbol Ratings Unit

BA6859AFP-Y BA6664FM BD6671FM

Power supply voltage VCC 4.5～5.5 4.5～5.5 4.5～5.5 V

VM 3.0～14 3.0～14 4.0～13.2 V

VG pin voltage VG - - 8.5～19 V

No.10011EAT03

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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4.5 5 5.5 6 6.5 7

Supply voltage :Vcc[v ]

Circuit current :Icc2 [mA]

0.0

0.5

1.0

1.5

0 0.3 0.6 0.9 1.2 1.5

Output Current :IOH[v]

Output H voltage:V OH [V]

0.0

0.5

1.0

1.5

0 0.3 0.6 0.9 1.2 1.5

Output Current :IOL [A]

Outp u t L voltage :VOL [V]

●Electrical characteristics

1) BA6859AFP-Y (Unless otherwise specified, Ta=25℃, VCC=5.0V, VM=12V)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Circuit current 1 ICC1 － 0 0.2 mA PS=L

Circuit current 2 ICC2 － 5.0 7.5 mA PS=H

<Power-saving >

ON voltage range VPSON －－ 1.0 V Internal circuit OFF

OFF voltage range VPSOFF 2.5 －－ V Internal circuit ON

Hall bias voltage VHB 0.5 0.9 1.5 V IHB=10mA

Input bias current IHA － 0.7 3.0 µA

Same phase input voltage range VHAR 1.0 － 4.0 V

Mini. input level VINH 50 －－ mVpp One side input level

H3 hysteresis level VHYS 5 20 40 mV

Input voltage range EC, ECR 0 － 5 V Linear range:0.5～3.3V

Offset voltage - ECOFF- -80 -50 -20 mV ECR=1.9V

Offset voltage + ECOFF+ 20 50 80 mV ECR=1.9V

Input bias current ECIN -3 － 3 µA EC=ECR

I/O gain GEC 0.56 0.70 0.84 A/V EC=1.2, 1.7V

<FG>

FG output high-level voltage VFGH 4.5 4.8 － V IFG=-20µA

FG output low-level voltage VFGL － 0.25 0.4 V IFG=3.0mA

Duty (reference values) DU － 50 － %

FR output high-level voltage VFRH 4.1 4.4 － V IFR=-20µA

FR output low-level voltage VFRL － 0.25 0.4 V IFR=3.0mA

Output saturation high level voltage VOH － 1.0 1.4 V IO=-600mA

Output saturation low level voltage VOL － 0.4 0.7 V IO=600mA

Pre-drive current IVML － 35 70 mA EC=0V output open

Output limit current ITL 560 700 840 mA

ON voltage range VSBON 2.5 －－ V BR=0V

OFF voltage range VSBOFF －－ 1.0 V BR=0V

ON voltage range VBRON 2.5 －－ V EC>ECR, SB=Open

OFF voltage range VBROFF －－ 1.0 V EC>ECR, SB=Open

●Reference: Data

Fig.1 Circuit Current 2 Fig.2 Output Saturation Voltage

at High Level Fig.3 Output Saturation Voltage

at Low Level

85℃

25℃

-40℃

85℃

25℃

-40℃

85℃

25℃

-40℃

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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2) BA6664FM(Unless otherwise specified, Ta=25℃, VCC=5.0V, VM=12V)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Circuit current 1 ICC1 － 0 0.2 mA PS=L, GSW=Open

Circuit current 2 ICC2 － 6.2 9.1 mA PS=H, GSW=Open

<Power-saving >

ON voltage range VPSON －－ 1.0 V Internal current circuit OFF

OFF voltage range VPSOFF 2.5 －－ V Internal current circuit ON

Hall bias voltage VHB 0.5 0.9 1.5 V IHB=10mA

Input bias current IHA － 0.7 3.0 µA

Same phase input voltage range VHAR 1.0 － 4.0 V

Mini. input level VINH 50 －－ mVpp One side input level

H3 hysteresis level VHYS 5 20 40 mV

Input voltage range EC, ECR 0 － 5 V Linear range:0.5～3.3V

Offset voltage - ECOFF- -75 -45 -15 mV ECR=1.65V, GSW=L

Offset voltage + ECOFF+ 15 45 75 mV ECR=1.65V, GSW=L

Input bias current ECIN -3 － 3 µA EC=ECR

I/O gain low-level GECL 0.52 0.65 0.78 A/V GSW=L,RNF=0.5Ω

I/O gain medium-level GECM 1.04 1.3 1.56 A/V GSW=OPEN,RNF=0.5Ω

I/O gain high-level GECH 2.24 2.8 3.36 A/V GSW=H,RNF=0.5Ω

<FG>

FG output high-level voltage VFGH 4.5 4.8 － V IFG=-20µA

FG output low-level voltage VFGL － 0.2 0.4 V IFG=3.0mA

<FG2>

FG output high-level voltage VFG2H 4.6 4.9 － V

IFG2=-20µA

FG output low-level voltage VFG2L － 0.2 0.4 V IFG2=3mA

FR output high-level voltage VFRH 4.1 4.4 － V IFR=-20µA

FR output low-level voltage VFRL － 0.2 0.4 V IFR=3.0mA

Output saturation high-level voltage VOH － 1.0 1.35 V IOUT=-600mA

Output saturation low-level voltage VOL － 0.4 0.65 V IOUT=600mA

Pre-drive current IVML － 35 70 mA EC=0V output open

Output limit current ITL 560 700 840 mA

ON voltage range VSBON 2.5 －－ V BR=0V

OFF voltage range VSBOFF －－ 1.0 V BR=0V

ON voltage range VBRON 2.5 －－ V EC>ECR, SB=Open

OFF voltage range VBROFF －－ 1.0 V EC>ECR, SB=Open

Low voltage range VGSWL －－ 1.0 V

High voltage range VGSWH 3.0 －－ V

OPEN voltage VGSWOP － 2.0 － V

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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3) BD6671FM (Unless otherwise specified, Ta=25℃, VCC=5.0V, VM=12V)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Circuit current 1 ICC1 － 100 200 µA PS=L, GSW=Open

Circuit current 2 ICC2 8 14 20 mA PS=H, GSW=Open

<Power-saving >

ON voltage range VPSON －－ 1.0 V Internal current circuit OFF

OFF voltage range VPSOFF 2.5 －－ V Internal current circuit ON

Hall bias voltage VHB 0.7 1.0 1.3 V IHB=10mA

Same phase input voltage range VHAR 1.4 － 3.6 V

Mini. input level VINH 100 －－ mVpp Both side input level

Hall hysteresis level + VHYS+ 5 20 40 mV

Hall hysteresis level - VHYS- -40 -20 -5 mV

Low voltage range VGSWL －－ 0.6 V

High voltage range VGSWH 2.0 －－ V

OPEN voltage range VGSWOP － 1.3 － V

Input voltage range EC, ECR 0 － 5 V Linear range: 0.5～3.0V

Offset voltage + ECOFF+ 5 50 100 mV GSW=M

Offset voltage - ECOFF- -100 -50 5 mV GSW=M

Input current ECIN -11 -2.5 0 µA EC=ECR=1.65V

I/O gain low-level GECL 0.28 0.35 0.42 A/V GSW=L

I/O gain medium-level GECM 0.56 0.70 0.84 A/V GSW=M

I/O gain high-level GECH 1.12 1.40 1.68 A/V GSW=H

Output ON resistance RON － 1.0 1.35 Ω IOUT=±600mA

(upper + lower side)

Output limit current low-level ITLL 340 400 460 mA GSW=L

Output limit current medium-level ITLM 680 800 920 mA GSW=M

Output limit current high-level ITLH 1020 1200 1380 mA GSW=H

High level voltage VFGH 4.6 －－ V IFG=-100µA

Low level voltage VFGL －－ 0.4 V IFG=+100µA

Charge pump output voltage VPUMP 12.5 17 19 V

VCC= 5V,VM=12V

CP1=CP2=0.1µF

Upper side saturation voltage VCP1H 0.25 0.45 0.65 V ICP1=-4mA

Lower side saturation voltage VCP1L 0.2 0.4 0.6 V ICP1=+4mA

Upper side saturation voltage VCP2H 0.4 0.6 0.8 V ICP2=-4mA

Lower side saturation voltage VCP2L 0.15 0.35 0.55 V ICP2=+4mA

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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●Block Diagram, application Circuit Diagram and Pin Function

1) BA6859AFP-Y

Fig.4 BA6859AFP-Y Block Diagram

BA6859AFP-Y Pin Function Table

Pin No. Pin name Function

1 N.C. N.C.

2 N.C. N.C.

3 N.C. N.C.

4 A3 Output pin

5 A2 Output pin

6 A1 Output pin

7 GND GND pin

8 H1+ Hall signal input pin

9 H1- Hall signal input pin

10 H2+ Hall signal input pin

11 H2- Hall signal input pin

12 H3+ Hall signal input pin

13 H3- Hall signal inpu t pin

14 VH Hall bias input pin

15 BR Brake mode selection pin

16 CNF

Capacitor connection pin for phase

compensation

17 SB Short brake pin

18 FR Rotation detection p in

19 ECR Output voltage control reference pin

20 EC Output voltage control pin

21 PS Power-saving pin

22 FG FG signal output pin

23 VCC Power supply pin

24 VM Motor power supply pin

25 RNF

Resistance connection pin for output

current detection

FIN FIN GND

Pd (W)

2.0

1.0

1.45

100 50 75 150

Ta(℃)

125

0 25 85

Fig.5 Power Dissipation Reduction (BA6859AFP-Y)

* Reduced by 11.6 mW/℃ over 25℃, when mounted on a glass epoxy

board (70 mm x 70 mm x 1.6 mm).

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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0 25 50 75 100 125 150

1.0

2.0

2.2

Pd[W]

Ta(℃)

Fig.7 Power Dissipation Reduction (BA6664FM、BD6671FM)

* Reduced by 11.6 mW/℃ over 25℃, when mounted on a glass epoxy board

(70 mm x 70 mm x 1.6 mm).

2) BA6664FM

Fig.6 BA6664FM Block Diagra m

BA6664FM Pin Function Table

Pin No. Pin name Function

1 N.C. N.C.

2 A3 Output pin

3 N.C. N.C.

4 A2 Output pin

5 N.C N.C.

6 N.C. N.C.

7 A1 Output pin

8 GND GND pin

9 H1+ Hall signal input pin

10 H1- Hall signal input pin

11 H2+ Hall signal input pin

12 H2- Hall signal input pin

13 H3+ Hall signal input pin

14 H3- Hall bias i nput pin

15 VH Hall bias input pin

16 BR Brake mode pin

17 CNF

Capacitor connection pin for phase

compensation

18 SB Short brake pin

19 FG2 FG 3-phase component output pin

20 FR Rotation detection pin

21 ECR Output voltage control reference pin

22 EC Output voltage control pin

23 PS Power-saving pin

24 FG FG signal output pin

25 VCC Power supply pin

26 GSW Gain switching pin

27 VM Motor power supply pin

28 RNF

Resistance connection pin fo

output

current detection

FIN FIN GND

TSD

GAIN

CONTROL

DRIVER

FIN

HALL AMP

VCC

TORQUE

SENSE AMP

FG2

ECR

VCC

GSW

RNF

CURRENT

SENSE AMP

15Hall Bias

BRAKE MODE

VCC

H3+

H2-

H2+

H1+

GND

VCC

D Q

－

Hall1

1µF

SERVO

SIGNAL

0.5Ω

The power saving mode is turned ON by low-level voltage,

and the circuit current and motor output will stop.

If the ECR voltage is set between 1.6 and 2.2V, the

maximum torque limit current will be obtained.

The detection of motor rotation direction is possible.

The short brake is operated regardless of brake mode settings.

Connect a capacitor for phase compensation.

The recommended value is 0.1µF.

Short brake and reversed brake settings are possible.

The motor torque current is controllable.

500Ω

0.1µF

500Ω

Capacitor for noise level mitigation.

The recommended value is 0.47 µF to 10 µF.

Speed detection is attained by FG signal output.

Resistor for setting Hall input level .

The recommended value is 200 Ωto 1k Ω.

Output will be open when the reverse rotation of the motor is

detected.

Output to the motor will be opened at a chip tempe

175°C (Typ.). Do not use the IC in excess of a chip

rature of temperature of 150°C.

Torque limit current and I/O gain settings are made by

the RNF resistance value.

Resistance of 0.4 to 1.0Ωis recommended.

CNF

Q SHORT BRAKE

GAIN

SWITCH

I/O gain

1µF

RNF

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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3)BD6671FM

Fig.8 BD6671FM Block Diagram

BD6671FM Pin Function

Pin No Pin name Function Pin No Pin name Function

1 H1+ Hall signal input pin 15 VM Motor power supply pin

2 H1- Hall signal input pin 16 ECR Output voltage control reference pin

3 H2+ Hall signal input pin 17 EC Output voltage control p in

4 H2- Hall signal input pin 18 PS Power-saving pin

5 H3+ Hall signal input pin 19 RNF2 Resistance connection pin for output

current detection

6 H3- Hall signal input pin 20 A3 Output pin

7 GSW Gain s witching pin 21 RNF1 Resistance connection pin for output

current detection

8 GND GND 22 A2 Output pin

9 CP1

Charge pump capacity connection

pin 1 23 RNF1

Resistance connection for output

current

10 CP2

Charge pump capacity connection

pin 2 24 A1 Output pin

11 VG Charge pump output pin 25 VM Motor power supply pin

12 CNF

Capacitor connection pin for phase

compensation 26 VH Hall bias pin

13 MODE Brake mode switching pin 27 FG FG Output pin

14 VCC Po wer supply pin 28 FG3 FG3 Output pin

FIN FIN GND

*Heat radiation FIN: GND

※ 1 Set capacitor between VM and GND, close as possible to the IC.

※2 To prevent from concentration of current routes, make the wiring

impedance values from the power supply equal as possible.

H3+

H3-

H2+

H2-

＋

Hall comp

Hall Amp

H1+

H1-

200Ω

Hall

bias

Vcc

10µF

MODE Matrix

CNF

CP2

CP1

0.1 µF

GND

RNF1

RNF

0.5Ω

RNF2 10kΩ

0.01 µF

PS Vcc

FG3

100µF

Torque

AMP EC

ECR servo

signal

1.65V

GSW

Charge

Pump

Driver

U-Pre

Driver

L-Pre

Driver

Matrix

TSD

EXOR

Current

Sense AMP

D Q

CK QB REVERSE

DETECT

PWM

Comp

Gain

control

Vcc

1000pF

＋

－

OSC

Current Limit Comp

UVLO

－

＋

－

＋

－

＋

0.1 µF

0.047µF

Vcc ＋

－

＋

－

※2

※1

1000pF

FIN FIN

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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●I/O logic

1) BA6859AFP-Y

Input conditions Output conditions

Forward rotation Reverse rotation

Pin. No 8 9 10 11 12 13 6 5 4 6 5 4

+ H1

- H2

+ H2

- H3

+ H3

- A1 A2 A3 A1 A2 A3

Input voltage

Hi=2.6V

Mid=2.5V

Low=2.4V

1 L M H M M M H L L L H H

2 H M L M M M L H H H L L

3 M M L M H M L H L H L H

4 M M H M L M H L H L H L

5 H M M M L M L L H H H L

6 L M M M H M H H L L L H

Note: Forward rotation EC<ECR

Reverse rotation EC>ECR

2) BA6664FM

Input conditions Output conditions

Forward rotation Reverse rotation

Pin. No 9 10 11 12 13 14 7 4 2 7 4 2

+ H1

- H2

+ H2

- H3

+ H3

- A1 A2 A3 A1 A2 A3

Input voltage

Hi=2.6V

Mid=2.5V

Low=2.4V

1 L M H M M M H L L L H H

2 H M L M M M L H H H L L

3 M M L M H M L H L H L H

4 M M H M L M H L H L H L

5 H M M M L M L L H H H L

6 L M M M H M H H L L L H

Note: Forward rotation EC<ECR

Reverse rotation EC>ECR

3)BD6671FM

Input conditions Output conditions

Forward rotation Reverse rotation

(MODE=L) Reverse rotation

(MODE=H)

Pin. No 1 2 3 4 5 6 24 22 20 24 22 20 24 22 20

+ H1

- H2

+ H2

- H3

+ H3

- A1 A2 A3 A1 A2 A3 A1 A2 A3

Input voltage

Hi=2.6V

Mid=2.5V

Low=2.4V

1 L M H M M M H L L L H H L L L

2 H M L M M M L H H H L L L L L

3 M M L M H M L H L H L H L L L

4 M M H M L M H L H L H L L L L

5 H M M M L M L L H H H L L L L

6 L M M M H M H H L L L H L L L

Note: Forward rotation EC<ECR

Reverse rotation EC>ECR

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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A1 Output current

H1 - + H2+

H3+

H2+

H1+

30°

Output current

H2 - + H3+

Output current

H3 - + H1+

Output current

●I/O Timing Chart

1) BA6859AFP-Y, BA6664FM

Fig. 9

2) BD6671FM

Fig. 10

30°

H1+

H2+

H3+

A1 Output current

A1 Output voltage

A2 Output voltage

A2 Output current

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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●I/O Circuit

1) BA6859AFP-Y

(1) Power saving (pin 21) (6) FG output (pin 22)

(2) Torque command input (pin 19, pin 20)

(7) FR output (pin 18)

(3) Coil output (A1: pin 6, A2: pin 5, A3: pin 4)

(8) Short brake (17 pin)

(4) Hall input (H1+ : 8 pin, H1- : 9 pin, H2+ : 10 pin,

H2- : 11 pin, H3+ : 12 pin, H3- : 13 pin)

(9) Brake mode (15 pin)

(5) Hall bias(14 pin)

External RNF Register

6 5

RNF

GND

1KΩ 1KΩ

100KΩ

21 15KΩ

10KΩ

30kΩ

12kΩ 5kΩ 1kΩ

13kΩ 500Ω 500Ω 10kΩ

10kΩ

15kΩ

10kΩ

VCC

20 19

1kΩ

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

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2) BA6664FM

(1) Power saving (23 pin) (7) FG output (19 pin)

(2) Torque command input (21 pin, 22 pin)

(8) FR output (20 pin)

(3) Coil output (A1 : 7 pin, A2 : 4 pin, A3 : 2 pin)

(9) Short Brake mode (18 pin)

(4) Hall input (H1+ : 9 pin, H1- : 10 pin, H2+ : 11 pin,

H2- : 12 pin, H3+ : 13 pin, H3- : 14 pin)

(10)Brake mode (16 pin)

(5) Hall bias (15 pin)

(11) Gain switch (26 pin)

(6) FG output (24 pin)

1KΩ 1KΩ

100KΩ

23 15KΩ

10KΩ

VCC

5kΩ

10kΩ

VCC

22 21

1kΩ

10kΩ

15kΩ

VCC

30kΩ

13kΩ 500Ω 500Ω 10kΩ 18

12kΩ 5kΩ 1kΩ

26 1KΩ

30KΩ

5KΩ

56KΩ

100KΩ

7 4

External RNFRegister

RNF

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

12/17

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VCC VCC

50Ω 9

VM 50Ω 11

50Ω 10 24 22 20

RNF1

VCC

12 50Ω

2KΩ

VCC

100KΩ

VCC VCC

50Ω 27,28

3) BD6671FM

(1) Hall input (H1 : 1 pin, H1-: 2 pin, H2+ : 3 pin, (6) Brake mode selection pin (13 pin)

H2- : 4 pin, H3+ : 5 pin, H3- : 6 pin)

(2) Gain switch (7pin) (7) Torque amp (ECR : 16 pin, EC : 17 pin)

(3)CP1 output (9pin) (8) Power saving (18 pin) (9)RNF2(19 pin)

(4) CP2 / VG output (CP2 : 10 pin, VG : 11 pin) (10) Output pin (A1 : 24 pin, A2 : 22 pin, A3 : 20 pin)

(5) CNF pin (12 pin) (11) Hall bias (26 pin) (12) FG / FG3 output (FG : 27 pin, FG3 : 28 pin)

VCC

Hn+

VCC

Hn-

1KΩ

1KΩ 1KΩ

25KΩ

VCC

13 30KΩ

20KΩ

VCC

7 1KΩ 75KΩ

VCC

100KΩ

10KΩ

25KΩ

VCC

16,17 1KΩ

VCC

18 30KΩ

20KΩ

710Ω

1KΩ

VCC

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

13/17

www.rohm.com 2010.06 - Rev.

●Operation Explanation

●Torqu e Command Rotation direction

EC<ECR Forward

EC>ECR Reverse*

*Stops after detecting reverse rotation

The I/O gain GEC from the EC pin to the RNF pin (output current) is determined

by the RNF detection resistor.

①(BA6859AFP-Y)

GEC=0.35/RNF [A/V] ･････(1)

②(BA6664FM)

GECL=0.325/RNF [A/V] (GSW=L)

GECM=0.60/RNF [A/V] (GSW=OPEN)

GECH=1.4/RNF [A/V] (GSW=H)

③(BD6671FM)

GECL=0.175/RNF [A/V] (GSW=L)

GECM=0.35/RNF [A/V] (GSW=M)

GECH=0.70/RNF [A/V] (GSW=H)

④The following torque limit current ITL is obtained (BA6859AFP-Y, BA6664FM)

ITL=0.35/RNF [A]･･･････････････････(2)

⑤(BD6671FM)

ITLL=0.2/RNF [A] (GSW=L)

ITLM=0.4/RNF [A] (GSW=M)

ITLH=0.6/RNF [A] (GSW=H)

The value will become smaller than the computed value due to the wiring

capacity and other factors, if the RNF resistance is 0.5Ω or below.

●Set-up of Motor Rotation Direction and Voltage Range of Torque Control Refer ence Terminal.

The motor rotation direction determined by t he torque control terminal vo ltage EC and the torque control reference term inal

voltage ECR

Torque control input voltage Rotation direction

EC<ECR Forward torque

EC>ECR Reverse torque

The relation between the input gain and torque limit current expressed as (1) and (2) discussed previously is only valid

when EC and ECR are within a range from 0.5V to 3.3V. Depend ing on how the torque control reference terminal voltage,

ECR is specified, there may be a case when the output current for the motor does not go up to the torque limit value.

Please be aware of this voltage range when specifying the ECR voltage.

For BA6859AFP-Y, BA6664FM and BD6671FM, 1.6V～2.2V is recommended.

If above conditions are understood, the voltage input range to the EC and ECR terminals can be from 0V to VCC.

●Power Saving

The input circuit specified in I/O circuit 1) BA6859AFP-Y (1) is used for power saving input.

The power saving pin has a temperature characteristic of approximately –5 mV/℃ and also the built-in resistors has a dispersion of 3 0%.

Keep the input voltage range in mind.

ITL

2.5 EC[V]

Forward torque Reverse torque

0.5 3.3 5.0

Fig.12

Forward

RNF

[V]

EC[V]

1.65(ECR)

3mV

Offset voltage -

Offset voltage +

Fig.11

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

14/17

www.rohm.com 2010.06 - Rev.

●Reverse Rotation Detection Function Actual motor rotation at reverse detection

Fig. 13 shows the construction of the reverse rotation detection circuit.

・Forward rotation (EC<ECR)

Fig. 9 shows the phase relation of the H2+ and H3+ Hall input signals,

in which case the reverse rotation detection circuit will not work.

・Reverse rotation (EC>ECR)

The phase relation of the H2+ and H3+ signals are opposite to t hat when the motor is rotating in the forward direction.

Therefore, the reverse rotation detection circuit operates, and the output i s turned off and open.

●FR Signal Output (BA685 9AF P-Y, BA6664FM)

FR output signal pin outputs the FR signal of low(L) or high(H) after detecting the motor rotation direction.

Motor rotation direction FR signal output

Forward “H”

Reverse “L”

●Brake Mode Change (BA6664FM, BD6671FM)

By applying high-level voltage to the BR pin, the brake mode for the follo wing condition can be changed: EC > ECR.

EC<ECR EC>ECR

BR L Forward rotation Reverse rotation brake

H Forward rotation Short brake

When the BR pin is set to high level and used in short-brake mode, open the SB pin.

The BR pin has a temperature charac teristics of approximatel y -5 mV/℃. Use the BR pin within the permissible input range.

●Short Brake (BA6859AFP-Y, BA6664FM)

When the short-brake pin is set to high level, as shown in Fig.18, the output

transistor (3-phase) on the high side will be turned off and the output transistor

(3-phase) on the low side will be turned on. The short brake pin has a

temperature characteristic of approximately -5 mV/℃. Keep the input voltage

range (see Fig12) in mind.

●Hall Input

The Hall element allows both serial and parallel connections.

Set the Hall input voltage between 1.0 and 4.0 V. Compute the

resistance between the VH and VCC pins in consideration of the

flowing current of the Hall device.

D-FF

Fig.14

EC < ECR: Forward torque (forward rotation)

EC > ECR: Deceleration (forward rotation)

When the motor rotates in the reverse direction, the reverse rotation

detection function will operate and the output will be in an open state.

The motor rotates in a reverse direction with inertial force.

Stop

MOTOR

ON ON ON

OFF OFF OFF

15-pin (Hall Bias)

Parallel Connection

15-pin (Hall Bias)

Serial Connection

VCC

H2 H1

Fig.15

Fig.13

H2+

H2- Q

H:OUTPUT.OPEN

(HIGH-IMPEDANCE)

H3+

H3-

ECR

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

15/17

www.rohm.com 2010.06 - Rev.

Fig. 16

Fig. 17

H1+

H1- +

H2+

H2-

H3+

H3-

FG2

●FG Signal Output / F G 2 Signal Output

The FG signal output/F G2 signal output terminals are for detecting the mot or rotation sp eed. The output frequency of FG 2

signal is three times higher than the FG frequency signal output. So, it is suitable for the slow speed rotation detection.

However, due to the Hall devi ce variation and other reasons, the duty cycle may not reach 50% in some instances.

●Notes for use

(1) Absolute maximum ratings

This product is subject to a strict quality management regime during its manufacture. However, damage may result if

absolute maximum ratings such as ap plied voltage and operating tempe rature range are exceeded. Assumptions should

not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety

measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum

ratings may be exceeded is anticipated.

(2) Connecting the power supply connector backward

Connecting the power supply connector backwards may result in damage to the IC. Insert external diodes between the

power supply and the IC's power supply pins as well as the motor coil to protect against damage from backward

connections.

(3) Power supply lines

As return of current regenerated by back electromotive force of motor happens, take steps such as putting capacitor

between power source and GND as an electric pathway for the regenerated current. Be sure that there is no problem with

each property such as em ptied capac ity at lower temperature regardi ng electrolytic capacitor to decide capacity value. If

the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the

voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the

absolute maximum ratings. It is recommended to imp lement a physical s afety measure such as th e insertion of a voltage

clamp diode bet ween the power supply and GND pins.

(4) GND potential

Ensure a minimum GND pin potential i n all operating conditions.

(5) Setting of heat

Take the power dissipation Pd) into account for practical application and make thermal design with sufficiently margined.

(6) Pin short and mistake fitting

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result

in damage to the IC. Shorts between output pins or bet ween output pins and the po wer supply and GND pins caused by

the presence of a foreign object may result in damage to the IC.

(7) Actions in strong magnetic field

Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.

H1 wavef orm

H2 wavef orm

H3 wavef orm

FG waveform

FG2 waveform

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

16/17

www.rohm.com 2010.06 - Rev.

(8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(9) Thermal shutdown circuit (TSD)

This IC incorporates a TSD circuit. If the chip becomes the following temperature, coil output to the motor will be open.

The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect th e

IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment

where the operation of the TSD circuit is assumed.

TSD ON temperature [℃] (typ.) Hysteresis temperature [℃] (typ.)

BA6859AFP-Y 175 25

BA6664FM 175 15

BD6671FM 170 25

(10) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers bet ween adjac ent e lemen ts in order to keep t hem is ol ated.

P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of

parasitic elements.

For example, when the resistors and transistors are connected to the pins as sho wn in Fig. 18,

○the P/N junction functions as a parasitic diode

when GND > (Pin A) for the resistor or GND > (Pin B) for the transistor (NPN).

○Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines

with the N layer of other adjacent elements to operate as a parasitic NPN transistor.

The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result

of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC

malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will

trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate)

voltage to input pins.

Fig.18 Example of IC structure

(11) Testing on application boards

When testing the IC on an applicati on bo ard, conn ecting a c apacit or to a pi n with low impedance subjects the IC to stress.

Always discharge ca pacitors after each process or step. Gr ound the IC during assembly steps as an antistatic measure,

and use similar caution when transporting or storing the IC. Always turn the IC's po wer supply off before connecting it to

or removing it from a jig or fixture during the inspection proc ess.

(12) Ground Wiring Pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern of any external parts, either.

Resistor Transistor (NPN)

N N N P+ P

P substrate

GND

Parasitic element

Pin A

N P+ P+

P substrate

GND

Parasitic element

Pin B

C B

GND

Pin A

aras

iti

element

Pin B

Other adjacent

elements

B C

GND

Parasitic

element

BA6859AFP-Y,BA6664FM,BD6671FM

Technical Note

17/17

www.rohm.com 2010.06 - Rev.

●Ordering part number

B A 6 6 6 4 F M - E 2

Part No.

6859A

6664

6671

Package

FP-Y : HSOP25

FM : HSOP-M28

Packaging and forming specification

E2: Embossed tape and reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

1500pcs

()

Direction of feed

Reel 1pin

(Unit : mm)

HSOP-M28

(MAX 18.85 include BURR)

0.8

7.5±0.2

5.15±0.1

0.11

1.25

2.2±0.1

18.5±0.2

0.5±0.2

0.37±0.1

9.9±0.3

4°+6°

−4°

1.2±0.15

0.27+0.1

−0.05

0.1 S

(Unit : mm)

HSOP25

7.8 ± 0.3

5.4 ± 0.2

2.75 ± 0.1

1.95 ± 0.1

25 14

113

0.11

1.9 ± 0.1

0.36 ± 0.1

12.0 ± 0.2

0.3Min.

0.25 ± 0.1

13.6 ± 0.2

0.8

(MAX 13.95 include BURR)

0.1 S

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

()

Direction of feed

Reel 1pin

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.