SEL_SP_0906_Chpt1.qxp 10/20/2006 4:13 PM Page 1 Table of Contents Introduction Thermal Properties and Testing Interface Material Selection Guide Gap Pad Thermally Conductive Materials Gap Pad Comparison Data Frequently Asked Questions Gap Pad VO Gap Pad VO Soft Gap Pad VO Ultra Soft Gap Pad 1000SF Gap Pad HC1000 Gap Pad 1500 Gap Pad 1500R Gap Pad A2000 Gap Pad 2000S40 Gap Pad 2500S20 Gap Pad 2500 Gap Pad A3000 Gap Pad 3000S30 Gap Pad 5000S35 Gap Filler 1000 (Two-Part) Gap Filler 1100SF (Two-Part) Gap Filler Gel 1500 (One-Part) Gap Filler 2000 (Two-Part) Gap Filler 3500S35 (Two-Part) TIC Thermal Interface Compound Comparison Data and Frequently Asked Questions TIC 1000G TIC 1000A TIC 4000 Hi-Flow Phase Change Interface Materials Hi-Flow Comparison Data Frequently Asked Questions Hi-Flow 105 Hi-Flow 115-AC Hi-Flow 225F-AC Hi-Flow 225FT Hi-Flow 225UF Hi-Flow 225UT Hi-Flow 225U Hi-Flow 625 Hi-Flow 300P Hi-Flow 300G (R) (R) (R) TM (R) 2 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 (R) Sil-Pad Thermally Conductive Insulators Sil-Pad Comparison Data Frequently Asked Questions Choosing Sil-Pad Thermally Conductive Insulators Mechanical, Electrical and Thermal Properties Sil-Pad Applications Sil-Pad Selection Table Sil-Pad 400 Sil-Pad 800 Sil-Pad 900S Sil-Pad 980 Sil-Pad 1100ST Sil-Pad A1500 Sil-Pad 1500ST Sil-Pad 1750 Sil-Pad 2000 Sil-Pad A2000 Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Q-Pad II Q-Pad 3 Poly-Pad 400 Poly-Pad 1000 Poly-Pad K-4 Poly-Pad K-10 Sil-Pad Tubes Sil-Pad Shield Bond-Ply and Liqui-Bond Adhesives Bond-Ply and Liqui-Bond Comparison Data Frequently Asked Questions Bond-Ply 100 Bond-Ply 400 Bond-Ply 660B Liqui-Bond SA 1000 (One-Part) Liqui-Bond SA 2000 (One-Part) Solutions for Surface Mount Applications Ordering Information Sil-Pad Configurations - Imperial Hi-Flow Configurations - Imperial Sil-Pad Configurations - Metric Hi-Flow Configurations - Metric Sil-Pad Shield Configurations - Imperial (R) (R) (R) (R) 45 46 47 48 50 52 52 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 76 77 78 79 80 81 83 85 87 90 91 94 95 1 INTRODUCTION SEL_SP_0906_Chpt1.qxp 10/20/2006 10:18 AM Page 2 World Leader in Thermal Management Through Technology, Innovation and Service At Bergquist, developing high quality components for the electronics industry is our first priority. As a world-leading manufacturer with state-of-the-art facilities, we serve a multitude of industries worldwide including automotive, computer, consumer electronics, military, motor control, power conversion, telecommunications and more. Bergquist Takes the Heat Thermal Management Products Worldwide Locations We make it our business to know your business. We understand your problems. We also know that there will always be a better way to help you reach your goals and objectives. To that end, our company continually invests considerable time and money into research and development. The Bergquist Company is focused on a single purpose - discovering the need, then developing and delivering technologically advanced solutions backed by superior service. Bergquist's Thermal Products Group is a worldleading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Used by many of the world's largest OEMs in various industries including automotive, computer, power supply, military and motor control, these materials include: In the United States, the Thermal Products Group's 90,000 square-foot manufacturing facility is located in Cannon Falls, Minnesota. A 40,000 square-foot facility in Prescott, Wisconsin houses the Thermal Clad printed circuit board operations. A130,000 squarefoot facility in Chanhassen, Minnesota is the location for Bergquist's corporate headquarters and state-of-the-art research and development facilities.Worldwide, Bergquist has facilities in The Netherlands, Germany, the United Kingdom,Taiwan, South Korea, Hong Kong and China with sales representatives in 30 countries to support worldwide growth. 2 Sil-Pad (R) - Thermally Conductive Insulators Bond-Ply (R) and Liqui-Bond (R) - Thermally Conductive Adhesives Gap Pad (R) - Thermally Conductive Gap Filling Materials Hi-Flow (R) - Phase Change Interface Materials TICTM - Thermal Interface Compounds Thermal Clad(R) - Insulated Metal Substrates World Class Operations Around the Globe SEL_SP_0906_Chpt1.qxp 10/20/2006 10:18 AM INTRODUCTION A Legacy of IndustryLeading Technology Page 3 Research and Development at the Speed of Change GAP PAD Keeping pace in today's aggressive electronics industry demands continual anticipation of change and the ability to develop customerdriven solutions quickly and efficiently. Our Chanhassen headquarters features a state-of-the-art development laboratory and engineering department staffed with highly skilled chemical engineers, laboratory technicians and manufacturing engineers - all dedicated to researching, developing and testing new materials. From such dedication have come many industry-standard proprietary products including Thermal Clad, Sil-Pad, Gap Pad, Bond-Ply and Hi-Flow materials. SIL-PAD For over 40 years, outstanding quality, innovation and engineering have been hallmarks of The Bergquist Company.Today, developing innovative products for the electronics industry remains our first priority. Bergquist has developed over 260 materials which provide thermal solutions for a wide variety of electronic applications. Many of our products were originally developed to satisfy a customer request for a specific material designed to perform to their particular specifications.This "can do" attitude and customized technology has earned The Bergquist Company its ISO 9001:2000 certification. HI--FLOW R&D Facilities TIC New Product Innovation BOND-PLY ORDERING 3 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:18 AM Page 4 INTRODUCTION Thermal Properties and Testing Thermal Conductivity Thermal Resistance The time rate of heat flow through a unit area producing a unit temperature difference across a unit thickness. The opposition to the flow of heat through a unit area of material across an undefined thickness. Thermal conductivity is an inherent or absolute property of the material. Thermal resistance varies with thickness. Thermal Impedance Test Methods - ASTM D5470 A property of a particular assembly measured by the ratio of the temperature difference between two surfaces to the steady-state heat flow through them. Factors affecting thermal impedance include: Area: Increasing the area of thermal contact decreases thermal impedance. Thickness: Increasing the insulator thickness increases thermal impedance. Pressure: Increasing mounting pressure under ideal conditions decreases thermal impedance. Time: Thermal impedance decreases over time. Measurement: Thermal impedance is affected by the method of temperature measurement. 2 in. diameter stack (ref. 3.14 in2) - 10-500 psi, 1 hour per layer Thermal Impedance Per Bergquist TO-220 Thermal Performance (25 C Cold Plate Testing) o i 4 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:18 AM Page 5 Interface Material Selection Guide INTRODUCTION Sil-Pad A1500 T = Typical; AS = Application-Specific (contact Bergquist Sales); A = Available; * = Roll stock configurations are limited -- contact your Bergquist Sales Representative for more information. Note: For Hi-Flow 225UT, Hi-Flow 225FT, and Hi-Flow 225F-AC, the adhesive is not a pressure sensitive adhesive (PSA). 5 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 6 Gap Pad Thermally Conductive Materials (R) Solution-Driven Thermal Management Products for Electronic Devices A Complete Range of Choices for Filling Air Gaps and Enhancing Thermal Conductivity The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Bergquist application specialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement. Features Benefits Options Applications Each of the many products within the Gap Pad family is unique in its construction, properties and performance. Following is an overview of the important features offered by the Gap Pad family. Gap Pad thermal products are designed to improve an assembly's thermal performance and reliability while saving time and money. Specifically: Some Gap Pad products have special features for particular applications, including: Gap Pad products are well suited to a wide variety of electronics, automotive, medical, aerospace and military applications such as: GAP PAD The Bergquist Company, a world leader in thermal interface materials, developed the Gap Pad family to meet the electronic industry's growing need for interface materials with greater conformability, higher thermal performance and easier application. * Low-modulus polymer material * Available with fiberglass/rubber carriers or in a non-reinforced version * Special fillers to achieve specific thermal and conformability characteristics * Highly conformable to uneven and rough surfaces * Electrically isolating * Natural tack on one or both sides with protective liner * Variety of thicknesses and hardnesses * Range of thermal conductivities * Available in sheets and die-cut parts 6 * Eliminates air gaps to reduce thermal resistance * High conformability reduces interfacial resistance * Low-stress vibration dampening * Shock absorbing * Easy material handling * Simplified application * Puncture, shear and tear resistance * Improved performance for high-heat assemblies * Compatible with automated dispensing equipment * Available with or without adhesive * Rubber-coated fiberglass reinforcement * Thicknesses from 0.010" to 0.250" * Available in custom die-cut parts, sheets and rolls (converted or unconverted) * Custom thicknesses and constructions * Adhesive or natural inherent tack * Silicone-free Gap Pad available in thicknesses of 0.010" - 0.125" * Gap Fillers are well suited for automated dispensing We produce thousands of specials. Tooling charges vary depending on tolerance and complexity of the part. * Between an IC and a heat sink or chassis.Typical packages include BGA's, QFP, SMT power components and magnetics * Between a semiconductor and heat sink * CD-ROM/DVD cooling * Heat pipe assemblies * RDRAM memory modules * DDR SDRAM * Hard drive cooling * Power supply * Signal amplifiers * Between other heat-generating devices and chassis SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 7 Gap Pad Comparison Data (R) Conductivity, Hardness and General Overview GAP PAD 7 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 8 Frequently Asked Questions Q: What thermal conductivity test method was used to A: achieve the values given on the data sheets? A test fixture is utilized that meets the specifications outlined in ASTM D5470. Q: What are the upper processing temperature limits A: Q: Is Gap Pad offered with an adhesive? A: Currently, Gap Pad VO, Gap Pad VO Soft, and Gap Pad VO Ultra GAP PAD Soft are offered with or without an adhesive on the Sil-Pad 800/900 carrier-side of the material.The remaining surface has natural inherent tack. All other Gap Pads have inherent tack. Q: Is Gap Pad electrically isolating? A: Yes, all Gap Pad materials are electrically isolating. However, keep in mind that Gap Pad is designed to FILL gaps and is not recommended for applications where high mounting pressure is exerted on the Gap Pad. Q: Is the adhesive repositionable? A: Depending on the surface being applied to, if care is taken, the pad may be repositioned. Special care should be taken when removing the pad from aluminum or anodized surfaces to avoid tearing or delamination. Q: What is meant by "natural tack"? A: The characteristic of the rubber itself has a natural inherent tack, without the addition of an adhesive. As with adhesive-backed products, the surfaces with natural tack may help in the assembly process to temporarily hold the pad in place while the application is being assembled. Unlike adhesive-backed products, inherent tack does not have a thermal penalty since the rubber itself has the tack.Tack strength varies from one Gap Pad product to the next. Q: Can Gap Pad with natural tack be repositioned? A: Again, depending on the material that the pad is applied to, in most cases they are repositionable. Care should be taken when removing the pad from aluminum or anodized surfaces as to avoid tearing or delaminating the pad.The side with natural tack is always easier to reposition than an adhesive side. Q: Is Gap Pad reworkable? A: Depending on the application and the pad being used, Gap Pad has been reworked in the past. Bergquist has customers that are currently using the same pad for reassembling their applications after burn-in processes and after fieldwork repairs. However, this is left up to the design engineer's judgment as to whether or not the Gap Pad will withstand reuse. Q: Is liquid Gap Filler reworkable? A: It is highly dependent on the application and its surface topography. Liquid Gap Filler will cure with low adhesive strength to the application surfaces. Q: Will heat make the material softer? A: From -60C to 200C, there is no significant variance in hardness for silicone Gap Pads and Gap Fillers. Q: What is the shelf life of Gap Pad? A: Shelf life for Gap Pad is one (1) year after date of manufacture. For Gap Pad with adhesive, the shelf life is six (6) months after the date of manufacture. After these dates, inherent tack and adhesive properties should be recharacterized. Q: How is extraction testing performed? A: The test method used is the Bellcore Extraction method #TR-NWT-000930; refer to Bergquist Application Note #56. 8 for Gap Pad and for how long can Gap Pad be exposed to them? Gap Pad VO materials and Gap Pad A3000 are more stable at elevated temperatures. Gap Pad in general can be exposed to temporary processing temperatures of 250C for five minutes and 300C for one minute. Q: How much force will the pad place on my device? A: Refer to the Pressure vs. Deflection charts in Bergquist Application Note #116. Q: Will Gap Pad and Gap Filler work in my application? A: What size gaps will Gap Pad and Gap Filler accommodate? Gap Pad and Gap Filler can be used wherever air can be replaced, such as between a heat-generating device and a heat sink, heat spreader or housing.This can be done using one sheet of Gap Pad or individual pieces of appropriate thicknesses, or by using Gap Filler if stack-up tolerances and height variations are significant. Q: What is meant by "compliance" and "conformability," and why is this important? A: The better a Gap Pad complies and conforms to a rough or stepped surface, the less interfacial resistance will be present due to air voids and air gaps.This leads to a lower overall thermal resistance of the pad between the two interfaces. Q: Is anything given off by the material (e.g. extractables, outgassing)? A: 1) Silicone Gap Pad and Gap Fillers, like all soft silicone materials, can extract silicone fluid (refer to Bergquist Application Note #56). Also note that Gap Pad and Gap Filler have some of the lowest extraction values for silicone-based gap filling products on the market and if your application requires no silicone, see our line of Sil-Free material. 2) Primarily for aerospace applications, outgassing data is detailed in Bergquist Application Note #117, tested per ASTM E595. Q: Why does the data sheet describe the hardness rating as a bulk rubber hardness? A: A reinforcement carrier is generally utilized in Bergquist Gap Pads for ease of handling.When testing hardness, the reinforcement carrier can alter the test results and incorrectly depict thinner materials as being harder.To eliminate this error, a 250 mil rubber puck is molded with no reinforcement carrier.The puck is then tested for hardness.The Shore hardness is recorded after a 30 second delay. SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 9 Gap Pad VO (R) Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO * Thermal conductivity: 0.8 W/m-K * Enhanced puncture, shear and tear resistance * Conformable gap filling material * Electrically isolating PROPERTY Color IMPERIAL VALUE Gold/Pink Sil-Pad Sil-Pad -- Thickness (inch) / (mm) 0.020 to 0.250 0.508 to 6.350 ASTM D374 Inherent Surface Tack (1- or 2-sided) 1 1 -- Density (g/cc) 1.6 1.6 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 40 40 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 100 689 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- 250 200 >6000 ASTM D149 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 0.8 0.8 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Telecommunications * Computer and peripherals * Power conversion * Between heat-generating semiconductors and a heat sink * Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader * Between heat-generating magnetic components and a heat sink 150 Configurations Available: 100 * Sheet form and die-cut parts 50 Building a Part Number GPVO - 0.040 - AC - 0816 - Standard Options NA Section E 13 Section D 3 5 7 9 11 Thermal Resistance (C-in2/W) Section C 1 Section B 0 Section A Resultant Thickness (mils) Thickness vs. Thermal Resistance Gap Pad VO >6000 Dielectric Constant (1000 Hz) GAP PAD Note: Resultant thickness is defined as the final gap thickness of the application. TEST METHOD Visual Reinforcement Carrier ELECTRICAL Dielectric Breakdown Voltage (Vac) Gap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis. METRIC VALUE Gold/Pink NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16" or 00 = custom configuration AC = Adhesive, one side 00 = No pressure sensitive adhesive Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250" GPVO = Gap Pad VO Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 9 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 10 Gap Pad VO Soft (R) Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT GAP PAD * Thermal conductivity: 0.8 W/m-K * Conformable, low hardness * Enhanced puncture, shear and tear resistance * Electrically isolating PROPERTY Color IMPERIAL VALUE Mauve/Pink Note: Resultant thickness is defined as the final gap thickness of the application. Sil-Pad Sil-Pad -- Thickness (inch) / (mm) 0.020 to 0.200 0.508 to 5.080 ASTM D374 Inherent Surface Tack (1- or 2-sided) 1 1 -- Density (g/cc) 1.6 1.6 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 25 25 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 40 275 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- 200 180 160 140 120 100 80 60 40 20 >6000 >6000 ASTM D149 Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 0.8 0.8 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Telecommunications * Computer and peripherals * Power conversion * Between heat-generating semiconductors or magnetic components and a heat sink * Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader Configurations Available: * Sheet form and die-cut parts Building a Part Number 00 - Standard Options ACME10256 Rev. a Section E 10 - AC - Section D 3 4 5 6 7 8 9 Thermal Resistance (C-in2/W) 0.060 Section C 2 - Section B 1 GPVOS Section A Resultant Thickness (mils) Thickness vs. Thermal Resistance Gap Pad VO Soft TEST METHOD Visual Reinforcement Carrier ELECTRICAL Dielectric Breakdown Voltage (Vac) Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low-modulus, filled-silicone polymer on a rubber-coated fiberglass carrier.The material can be used as an interface where one side is in contact with a leaded device. METRIC VALUE Mauve/Pink NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration AC = Pressure sensitive adhesive, one side 00 = No pressure sensitive adhesive Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200" GPVOS = Gap Pad VO Soft Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 10 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 11 Gap Pad VO Ultra Soft (R) Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color * Thermal conductivity: 1.0 W/m-K * Highly conformable, low hardness * "Gel-like" modulus * Designed for low-stress applications * Puncture, shear and tear resistant IMPERIAL VALUE Mauve/Pink Sil-Pad Sil-Pad -- Thickness (inch) / (mm) 0.020 to 0.250 0.508 to 6.350 ASTM D374 1 1 -- Density (g/cc) 1.6 1.6 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 5 5 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 8 55 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- >6000 ASTM D149 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Telecommunications * Computer and peripherals * Power conversion * Between heat-generating semiconductors or magnetic components and a heat sink * Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader Configurations Available: Thickness vs. Thermal Resistance Gap Pad VO Ultra Soft * Sheet form and die-cut parts 250 Building a Part Number 0 1 2 3 4 5 6 7 8 9 Thermal Resistance (C-in2/W) 10 Standard Options NA Section E 50 0.100 - AC - 0816 - Section D GPVOUS 100 - Section C 150 Section B 200 Section A Resultant Thickness (mils) >6000 Dielectric Constant (1000 Hz) GAP PAD Hardness, Bulk Rubber (Shore 00) (1) ELECTRICAL Dielectric Breakdown Voltage (Vac) Note: Resultant thickness is defined as the final gap thickness of the application. TEST METHOD Visual Reinforcement Carrier Inherent Surface Tack (1- or 2-sided) Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components.The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Gap Pad VO Ultra Soft is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. METRIC VALUE Mauve/Pink NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250" GPVOUS = Gap Pad VO Ultra Soft Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 11 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 12 Gap Pad 1000SF (R) Thermally Conductive, Silicone-Free Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1000SF PROPERTY Color * Thermal conductivity: 0.9 W/m-K * No silicone outgassing * No silicone extraction * Reduced tack on one side to aid in application assembly IMPERIAL VALUE Green Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.010 to 0.125 0.254 to 3.175 ASTM D374 GAP PAD Inherent Surface Tack (1- or 2-sided) 2 2 -- Density (g/cc) 2.0 2.0 ASTM D792 Heat Capacity (J/g-K) 1.1 1.1 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 40 40 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 34 234 ASTM D575 Continuous Use Temp (F) / (C) -76 to 257 -60 to 125 -- >6000 ASTM D149 5.0 5.0 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-1 V-1 U.L. 94 THERMAL Thermal Conductivity (W/m-K) 0.9 0.9 ASTM D5470 Typical Applications Include: * Digital disk drives / CD-ROM * Automotive modules * Fiber optics modules Configurations Available: * Sheet form * Die-cut parts Note: Resultant thickness is defined as the final gap thickness of the application. Thickness vs. Thermal Resistance Gap Pad 1000SF Building a Part Number 50 25 - 02 - 0816 - 0 Standard Options NA Section E 75 0.010 Section D 100 - Section C GP1000SF Section B 125 Section A Resultant Thickness (mils) >6000 Dielectric Constant (1000 Hz) 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. The new Gap Pad 1000SF is a thermally conductive, electrically insulating, siliconefree polymer specially designed for silicone-sensitive applications.The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF is reinforced for easy material handling and added durability during assembly.The material is available with a protective liner on both sides of the material. 1 2 3 4 Thermal Resistance (C-in2/W) TEST METHOD Visual Reinforcement Carrier ELECTRICAL Dielectric Breakdown Voltage (Vac) 0 METRIC VALUE Green NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0806: = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides 5 Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GP1000SF = Gap Pad 1000SF Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 12 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 13 Gap Pad HC1000 (R) "Gel-Like" Modulus Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC1000 PROPERTY Color * Thermal conductivity: 1.0 W/m-K * Highly conformable, low hardness * "Gel-like" modulus * Fiberglass reinforced for puncture, shear and tear resistance IMPERIAL VALUE Gray Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.010 to 0.020 0.254 to 0.508 ASTM D374 2 -- 1.6 1.6 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 25 25 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 40 275 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- 20 18 16 >5000 ASTM D149 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2 and 0.020 inches thick. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Computer and peripherals * Telecommunications * Heat interfaces to frames, chassis, or other heat spreading devices * RDRAMTM memory modules / chip scale packages * CDROM / DVD cooling * Areas where irregular surfaces need to make a thermal interface to a heat sink * DDR SDRAM memory modules * FBDIMM modules 14 Configurations Available: 12 * Sheet form, die-cut parts, and roll form (converted or unconverted) Building a Part Number - 0.015 - 02 - 0816 - Standard Options NA Section E HC1000 Section D 0.55 Section C 0.30 0.35 0.40 0.45 0.50 Thermal Resistance (C-in2/W) Section B 10 0.25 Section A Resultant Thickness (mils) Thickness vs. Thermal Resistance Gap Pad HC100 >5000 Dielectric Constant (1000 Hz) GAP PAD 2 Density (g/cc) ELECTRICAL Dielectric Breakdown Voltage (Vac) Note: Resultant thickness is defined as the final gap thickness of the application. TEST METHOD Visual Reinforcement Carrier Inherent Surface Tack (1- or 2-sided) Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.The "gel-like" modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered with removable protective liners on both sides of the material. METRIC VALUE Gray NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020" HC1000 = High Compliance 1000 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 13 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 14 Gap Pad 1500 (R) Thermally Conductive, Unreinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color * Thermal conductivity: 1.5 W/m-K * Unreinforced construction for additional compliancy * Conformable, low hardness * Electrically isolating IMPERIAL VALUE Black -- -- -- Thickness (inch) / (mm) 0.020 to 0.200 0.508 to 5.080 ASTM D374 GAP PAD 2 2 -- Density (g/cc) 2.1 2.1 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 40 40 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 45 310 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) Note: Resultant thickness is defined as the final gap thickness of the application. >6000 >6000 ASTM D149 Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Telecommunications * Computer and peripherals * Power conversion * RDRAMTM memory modules / chip scale packages * Areas where heat needs to be transferred to a frame chassis or other type of heat spreader Configurations Available: 150 * Sheet form and die-cut parts 100 Building a Part Number 6 GP1500 - 0.100 - 02 - 0816 - Standard Options NA Section E 1 2 3 4 5 Thermal Resistance (C-in2/W) Section D 0 Section C 0 Section B 50 Section A Resultant Thickness (mils) Thickness vs. Thermal Resistance Gap Pad 1500 200 TEST METHOD Visual Reinforcement Carrier Inherent Surface Tack (1- or 2-sided) Gap Pad 1500 has an ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance. METRIC VALUE Black NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200" GP1500 = Gap Pad 1500 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 14 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 15 Gap Pad 1500R (R) Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color * Thermal conductivity: 1.5 W/m-K * Fiberglass reinforced for puncture, shear and tear resistance * Easy release construction * Electrically isolating IMPERIAL VALUE Black Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.010 to 0.020 0.254 to 0.508 ASTM D374 2 -- 2.1 2.1 ASTM D792 Heat Capacity (J/g-K) 1.3 1.3 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 40 40 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 45 310 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- ASTM D149 6.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Telecommunications * Computer and peripherals * Power conversion * RDRAMTM memory modules / chip scale packages * Areas where heat needs to be transferred to a frame chassis or other type of heat spreader * Sheet form, die-cut parts, and roll form (converted or unconverted) 20 18 Building a Part Number 0.55 0.020 - 02 - 00 - Standard Options ACME10256 Rev. A Section E 0.30 0.35 0.40 0.45 0.50 Thermal Resistance (C-in2/W) - Section D GP1500R 12 Section C 14 Section B 16 Section A Resultant Thickness (mils) >6000 6.0 Configurations Available: Thickness vs. Thermal Resistance Gap Pad 1500R 10 0.25 >6000 Dielectric Constant (1000 Hz) GAP PAD 2 Density (g/cc) ELECTRICAL Dielectric Breakdown Voltage (Vac) Note: Resultant thickness is defined as the final gap thickness of the application. TEST METHOD Visual Reinforcement Carrier Inherent Surface Tack (1- or 2-sided) Gap Pad 1500R has the same highly conformable, low-modulus polymer as the standard Gap Pad 1500.The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance.The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance. METRIC VALUE Black NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020" GP1500R = Gap Pad 1500R Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 15 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 16 Gap Pad A2000 (R) High Performance,Thermally Conductive Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD A2000 PROPERTY Color * Thermal conductivity: 2.0 W/m-K * Fiberglass reinforced for puncture, shear and tear resistance * Electrically isolating IMPERIAL VALUE Gray Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.010 to 0.040 0.254 to 1.016 ASTM D374 GAP PAD 2 2 -- Density (g/cc) 2.9 2.9 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 80 80 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 55 379 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) Note: Resultant thickness is defined as the final gap thickness of the application. >4000 ASTM D149 6.0 6.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Computer and peripherals; between CPU and heat spreader * Telecommunications * Heat pipe assemblies * RDRAMTM memory modules * CDROM / DVD cooling * Areas where heat needs to be transferred to a frame chassis or other type of heat spreader * DDR SDRAM memory modules Configurations Available: * Sheet form, die-cut parts and roll form (converted or unconverted) Building a Part Number Standard Options - 0.010 - 02 - 0816 - NA Section E GPA2000 Section D 0.80 Section C 0.30 0.40 0.50 0.60 0.70 Thermal Resistance (C-in2/W) Section B 40 35 30 25 20 15 10 0.20 >4000 Dielectric Constant (1000 Hz) Section A Resultant Thickness (mils) Thickness vs. Thermal Resistance Gap Pad A2000 TEST METHOD Visual Reinforcement Carrier Inherent Surface Tack (1- or 2-sided) Gap Pad A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components.The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework. METRIC VALUE Gray NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020" 0.040" GPA2000 = Gap Pad A2000 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 16 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 17 Gap Pad 2000S40 (R) Highly Conformable,Thermally Conductive, Reinforced "S-Class" Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color * Thermal conductivity: 2.0 W/m-K * Low "S-Class" thermal resistance at very low pressures * Highly conformable, low hardness * Designed for low-stress applications * Fiberglass reinforced for puncture, shear and tear resistance IMPERIAL VALUE Gray METRIC VALUE Gray TEST METHOD Visual Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374 Inherent Surface Tack (1- or 2-sided) 2 -- 2.9 2.9 ASTM D792 Heat Capacity (J/g-K) 0.6 0.6 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 30 30 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 45 310 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149 Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470 GAP PAD 2 Density (g/cc) 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Configurations Available: * Sheet form and die-cut parts Building a Part Number 0.020 - 02 - 0816 - NA NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Thickness vs. Thermal Resistance Gap Pad 2000S40 Resultant Thickness (mils) Standard Options Section E - Section D GP2000S40 Section C Note: Resultant thickness is defined as the final gap thickness of the application. * Power electronics DC/DC; 1/4, 1/2, full bricks, etc. * Mass storage devices * Graphics card/processor/ASIC * Wireline/wireless communications hardware * Automotive engine/transmission controls Section B Gap Pad 2000S40 is electrically isolating, and well suited for applications requiring electrical isolation between heat sinks and high-voltage, bare-leaded devices. Gap Pad 2000S40 is a filled, thermally conductive polymer reinforced with a fiberglass carrier on one side, allowing for easy material handling and enhanced puncture, shear and tear resistance. Typical Applications Include: Section A Gap Pad 2000S40 is recommended for lowstress applications that require a mid to high thermally conductive interface material.The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" 125 100 GP2000S40 = Gap Pad 2000S40 Material 75 Note: To build a part number, visit our website at www.bergquistcompany.com. 50 Gap Pad (R): U.S. Patent 5,679,457 and others. 25 0 0 0.50 1.00 1.50 2.00 Thermal Resistance (C-in2/W) 2.50 17 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 18 Gap Pad 2500S20 (R) Highly Conformable,Thermally Conductive, Reinforced "S-Class" Gap Filling Material Features and Benefits * Thermal conductivity: 2.4 W/m-K * Low "S-Class" thermal resistance at ultra-low pressures Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.010 to 0.125 0.254 to 3.175 ASTM D374 * Ultra conformable,"gel-like" modulus Inherent Surface Tack (1- or 2-sided) * Designed for low-stress applications * Fiberglass reinforced for puncture, shear and tear resistance IMPERIAL VALUE Light Yellow METRIC VALUE Light Yellow TEST METHOD Visual 2 2 -- Density (g/cc) 3.1 3.1 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 20 20 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 5 35 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) >3000 >3000 ASTM D149 Dielectric Constant (1000 Hz) 6.6 6.6 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 2.4 2.4 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Note: Resultant thickness is defined as the final gap thickness of the application. Thickness vs. Thermal Resistance Gap Pad 2500S20 130 110 90 70 50 30 10 0.18 0.43 0.68 0.93 1.18 1.43 1.68 1.93 2.18 Thermal Resistance (C-in2/W) 18 * Between processors and heat sinks * Between graphics chips and heat sinks * DVD and CDROM electronics cooling * Areas where heat needs to be transferred to a frame, chassis or other type of heat spreader Configurations Available: * Sheet form and die-cut parts Building a Part Number - 02 - 00 - Standard Options ACME 89302 Rev a Section E 0.100 Section D - Section C GP2500S20 Section B Gap Pad 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly.The material is supplied with protective liners on both sides. Typical Applications Section A Gap Pad 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K.The material is a filled-polymer material yielding extremely soft, elastic characteristics.The material is reinforced to provide easy handling, converting, added electrical isolation and tear resistance. Gap Pad 2500S20 is well suited for low-pressure applications that typically use fixed standoff or clip mounting.The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Resultant Thickness (mils) GAP PAD TYPICAL PROPERTIES OF GAP PAD 2500S20 PROPERTY Color NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GP2500S20 = Gap Pad 2500S20 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 19 Gap Pad 2500 (R) Thermally Conductive, Unreinforced Gap Filling Material Features and Benefits * Thermal conductivity: 2.7 W/m-K * High thermal performance, cost-effective solution * Unreinforced construction for additional compliancy * Medium compliancy and conformability TYPICAL PROPERTIES OF GAP PAD 2500 PROPERTY Color IMPERIAL VALUE Light Brown -- -- -- Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374 Inherent Surface Tack (1- or 2-sided) 2 2 -- Density (g/cc) 3.1 3.1 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 80 80 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 113 779 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- >6000 ASTM D149 6.8 6.8 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 2.7 2.7 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Multiple heat-generating components to a common heat sink * Graphics chips to heat sinks * Processors to heat sinks * Mass storage drives * Wireline / wireless communications hardware Configurations Available: * Sheet form and die-cut parts Building a Part Number - 00 - ACME 89302 Rev a Resultant Thickness (mils) Thickness vs. Thermal Resistance Gap Pad 2500 120 100 80 60 40 20 0 0.20 Standard Options Section E - 02 Section D 0.100 Section C - Section B GP2500 Section A Note: Resultant thickness is defined as the final gap thickness of the application. >6000 Dielectric Constant (1000 Hz) GAP PAD Gap Pad 2500 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly.The material is supplied with protective liners on both sides. TEST METHOD Visual Reinforcement Carrier ELECTRICAL Dielectric Breakdown Voltage (Vac) Gap Pad 2500 is a thermally conductive, electrically insulating, unreinforced gap filling material. Gap Pad 2500 is a filled-polymer material yielding an elastic polymer that allows for easy handling and converting without the need for reinforcement.These properties also allow for good wet-out and interfacing characteristics to surfaces with roughness and/or topography. All these characteristics make this material ideal for applications using either clip or screw-mounted assemblies. METRIC VALUE Light Brown NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GP2500 = Gap Pad 2500 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 0.60 1.00 1.40 1.80 Thermal Resistance (C-in2/W) 19 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:20 AM Page 20 Gap Pad A3000 (R) Thermally Conductive, Reinforced Gap Filling Material Features and Benefits GAP PAD * Thermal conductivity: 2.6 W/m-K * Fiberglass reinforced for puncture, shear and tear resistance * Reduced tack on one side to aid in application assembly * Electrically isolating TYPICAL PROPERTIES OF GAP PAD A3000 PROPERTY Color IMPERIAL VALUE Gold Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.015 to 0.125 0.381 to 3.175 ASTM D374 Inherent Surface Tack (1- or 2-sided) 1 1 -- Density (g/cc) 3.2 3.2 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 80 80 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 50 344 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- ASTM D149 7.0 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 2.6 2.6 ASTM D5470 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Typical Applications Include: * Computer and peripherals * Telecommunications * Heat pipe assemblies * RDRAMTM memory modules * CDROM / DVD cooling * Between CPU and heat spreader * Area where heat needs to be transferred to a frame, chassis or other type of heat spreader Configurations Available: * Sheet form, die-cut parts and roll form (converted or unconverted) Building a Part Number 0.015 - 01 - 0816 - Standard Options NA Section E - Section D GPA3000 Section C 125 115 105 95 85 75 65 55 45 35 25 15 >5000 7.0 Section B Resultant Thickness (mils) Thickness vs. Thermal Resistance Gap Pad A3000 >5000 Dielectric Constant (1000 Hz) Section A Note: Resultant thickness is defined as the final gap thickness of the application. TEST METHOD Visual Reinforcement Carrier ELECTRICAL Dielectric Breakdown Voltage (Vac) Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in burn-in and rework processes while the light gold and soft side of the material allows for added compliance. METRIC VALUE Gold NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 01 = Natural tack, one side 0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70 Thermal Resistance (C-in2/W) Standard thicknesses available: 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GPA3000 = Gap Pad A3000 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. 20 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:20 AM Page 21 Gap Pad 3000S30 (R) Thermally Conductive, Reinforced, Soft "S-Class" Gap Filling Material Features and Benefits * Thermal conductivity: 3.0 W/m-K * Low "S-Class" thermal resistance at very low pressures * Highly conformable,"S-Class" softness * Designed for low-stress applications * Fiberglass reinforced for puncture, shear and tear resistance TYPICAL PROPERTIES OF GAP PAD 3000S30 PROPERTY Color IMPERIAL VALUE Light Blue METRIC VALUE Light Blue TEST METHOD Visual Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.010 to 0.125 0.254 to 3.175 ASTM D374 Inherent Surface Tack (1- or 2-sided) 2 2 -- Density (g/cc) 3.2 3.2 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 30 30 ASTM D2240 Young's Modulus (psi) / (kPa) (2) 26 180 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) >3000 >3000 ASTM D149 Dielectric Constant (1000 Hz) 7.0 7.0 ASTM D150 Volume Resistivity (Ohm-meter) 10 9 10 9 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 3.0 3.0 ASTM D5470 GAP PAD Hardness, Bulk Rubber (Shore 00) (1) 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Note: Resultant thickness is defined as the final gap thickness of the application. * Processors * Notebook computers * Server S-RAMs * BGA packages * Mass storage drives * Power conversion * Wireline / wireless communications hardware Configurations Available: * Sheet form and die-cut parts available Building a Part Number - 0816 - Standard Options ACME 89302 Rev a Section E 0.020 - 02 Section D - Section C GP3000S30 Section B Gap Pad 3000S30 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers.The material's natural inherent tack allows for stick-in-place characteristics during assembly. Gap Pad 3000S30 is supplied with protective liners on both sides. Typical Applications: Section A Gap Pad 3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an allnew 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. Gap Pad 3000S30 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" GP3000S30 = Gap Pad 3000S30 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. Resultant Thickness (mils) Thickness vs. Thermal Resistance Gap Pad 3000S30 130 110 90 70 50 30 10 0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70 Thermal Resistance (C-in2/W) 21 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:20 AM Page 22 Gap Pad 5000S35 (R) High thermal conductivity plus "S-Class" softness and conformability Features and Benefits * High thermal conductivity: 5 W/m-K PROPERTY * Highly conformable,"S-Class" softness Color * Natural inherent tack reduces interfacial thermal resistance GAP PAD TYPICAL PROPERTIES OF GAP PAD 5000S35 * Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads * Fiberglass reinforced for puncture, shear and tear resistance * Excellent thermal performance at low pressures IMPERIAL VALUE METRIC VALUE TEST METHOD Light Green Light Green Visual Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.02 to 0.125 0.508 to 3.175 ASTM D374 2 2 -- Density (g/cc) 3.6 3.6 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM C351 Hardness Bulk Rubber (Shore 00) (1) 35 35 ASTM D2240 Inherent Surface Tack (1or 2 sided) Young's Modulus (psi) / (kPa) (2) 17.5 121 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149 Dielectric Constant (1000 Hz) 7.5 7.5 ASTM D150 Volume Resistivity (Ohm-meter) 10 10 ASTM D257 Flame Rating V-O V-O U.L. 94 5.0 5.0 ASTM D5470 9 9 THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) (20 mil) 1.18 1.10 0.99 0.84 0.72 Thermal Impedance (C-in2/W) (3) 0.21 0.18 0.15 0.14 0.12 TO-220 Thermal Performance (C/W) (40 mil) 1.54 1.34 1.15 1.00 0.90 Thermal Impedance (C-in /W) (3) 0.30 0.28 0.25 0.22 0.13 2 Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance.The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. Gap Pad 5000S35 is ideal for high-performance applications at low mounting pressures. 1) One second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. 3) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications * CDROM / DVD ROM * Voltage Regulator Modules ( VRMs) and POLs * Thermally-enhanced BGAs Configurations Available: * Die-cut parts are available in any shape or size, separated or in sheet form * Standard material thicknesses of 20, 40, 60, 80, 100 and 125 mil * Custom thicknesses available upon request Building a Part Number Note: Resultant thickness is defined as the final gap thickness of the application. Gap Pad (R): U.S. Patent 5,679,457 and others. 22 * Memory packages / modules * PC Board to chassis * ASICs and DSPs Standard Options SEL_SP_0906_Chpt1.qxp 10/20/2006 10:20 AM Page 23 Gap Filler 1000 (Two-Part) Thermally Conductive, Liquid Gap Filling Material Features and Benefits * Thermal conductivity: 1.0 W/m-K * Ultra-conforming, designed for fragile and low-stress applications * Ambient and accelerated cure schedules * 100% solids - no cure by-products * Excellent low and high temperature mechanical and chemical stability TYPICAL PROPERTIES OF GAP FILLER 1000 PROPERTY Color / Part A IMPERIAL VALUE Gray Color / Part B White Visual 100,000 ASTM D2196 Density (g/cc) 1.6 1.6 ASTM D792 Mix Ratio 1:1 1:1 -- 6 6 -- PROPERTY AS CURED Color Gray Gray Visual Hardness (Shore 00) (2) 30 30 ASTM D2240 Shelf Life @ 25C (months) 1.0 1.0 ASTM E1269 -76 to 347 -60 to 175 -- ELECTRICAL AS CURED Dielectric Strength (V/mil) 500 500 ASTM D149 Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL AS CURED Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470 CURE SCHEDULE Pot Life @ 25C (min) (3) 15 15 -- Cure @ 25C (min) (4) 60 - 120 60 - 120 -- Cure @ 100C (min) (4) 5 5 -- GAP PAD White Continuous Use Temp (F) / (C) 1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure) Typical Applications Include: * Automotive electronics * Telecommunications * Computer and peripherals * Thermally conductive vibration dampening * Between any heat-generating semiconductor and a heat sink Configurations Available: * For smaller quantity packaging, please contact Bergquist Sales Building a Part Number - 50cc - Standard Options NA Section E - 15 Section D 00 Section C - Section B Section A GF1000 Note: Resultant thickness is defined as the final gap thickness of the application. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 50cc = 50.0cc, 400cc = 400.0cc Kits: 1200cc = 1200.0cc, or 10G = 10 gallon Pot Life: 15 = 15 minutes Thickness vs. Thermal Resistance Gap Filler 1000 Resultant Thickness (mils) TEST METHOD Visual 100,000 Viscosity as Mixed (cps) (1) Heat Capacity (J/g-K) Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a twocomponent, room or elevated temperature curing system.The material is formulated to provide a balance of cured material properties highlighted by "gel-like" modulus and good compression set (memory).The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, Gap Filler 1000 flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch. Unlike cured gap filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 1000 is intended for use in thermal interface applications when a strong structural bond is not required. METRIC VALUE Gray 00 = No spacer beads 07 = 0.007" spacer beads 300 GF1000 = Gap Filler 1000 Material 250 Note: To build a part number, visit our website at www.bergquistcompany.com. 200 150 Gap Pad (R): U.S. Patent 5,679,457 and others. 50 0 0 1 2 3 4 5 6 7 8 9 10 11 Thermal Resistance (C-in2/W) 23 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:20 AM Page 24 Gap Filler 1100SF (Two-Part) Thermally Conductive, Silicone-Free, Liquid Gap Filling Material TEMPERATURE DEPENDENCE OF VISCOSITY The viscosity of the Gap Filler 1100SF material is temperature dependent.The table below provides the multiplication factor to obtain viscosity at various temperatures.To obtain the viscosity at a given temperature, look up the multiplication factor at that temperature and multiply the corresponding viscosity at 25C. Temperature C 20 25 35 45 50 Multiplication Factor Part A Part B 1.43 1.57 1.00 1.00 0.58 0.50 0.39 0.30 0.32 0.24 Example - Viscosity of Part A @ 45: Viscosity of Part A at 25C is 450,000 cp. The multiplication factor for part A at 45C is 0.39. Therefore: (450,000) x (0.39) = 175,500 cps 24 TEST METHOD Visual Red Red Visual 450,000 ASTM D2196 Density (g/cc) 2.0 2.0 ASTM D792 Mix Ratio 1:1 1:1 -- 6 6 -- PROPERTY AS CURED Color Orange Orange Visual Hardness (Shore 00) (2) 60 60 ASTM D2240 Shelf Life @ 25C (months) Heat Capacity (J/g-K) 0.9 0.9 ASTM E1269 -76 to 257 -60 to 125 -- ELECTRICAL AS CURED Dielectric Strength (V/mil) 400 400 ASTM D149 Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL AS CURED Thermal Conductivity (W/m-K) 1.1 1.1 ASTM D5470 Continuous Use Temp (F) / (C) CURE SCHEDULE Pot Life @ 25C (min) (3) 10-15 10-15 -- Cure @ 25C (hrs) (4) 4 4 -- Cure @ 100C (min) (4) 45 45 -- 1) Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure) Typical Applications Include: * Silicone-sensitive optic components * Hard disk assemblies * Silicone-sensitive electronics * Dielectric for bare-leaded devices * Filling various gaps between heat-generating devices to heat sinks and housings * Mechanical switching relay Configurations Available: * Supplied in cartridge or kit form Building a Part Number GF1100SF - 00 - 15 - 400cc - Standard Options NA Section E Gap Filler 1100SF can be mixed and dispensed using dual-tube cartridge packs with static mixers and manual or pneumatic gun or high volume mixing and dispensing equipment (application of heat may be used to reduce viscosity). METRIC VALUE Yellow 450,000 Viscosity as Mixed (cps) (1) Section D Application Color / Part B Section C The two components are colored to assist as a mix indicator (1:1 by volume).The mixed system will cure at ambient temperature. Unlike cured thermal pad materials, the liquid approach offers infinite thickness variations with little or no stress during assembly displacement. Gap Filler 1100SF, although exhibiting some natural tack characteristics, is not intended for use in thermal interface applications requiring a mechanical structural bond. IMPERIAL VALUE Yellow Section B * Thermal conductivity: 1.1 W/m-K * No silicone outgassing or extraction * Ultra-conforming, designed for fragile and low-stress applications * Ambient and accelerated cure schedules * 100% solids - no cure by-products Gap Filler 1100SF is the thermal solution for silicone-sensitive applications.The material is supplied as a two-part component, curing at room or elevated temperatures.The material exhibits "gel-like" properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of lowstress applications. TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A Section A GAP PAD Features and Benefits NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 400cc = 400.0cc Kits: 1200cc = 1200.0cc, or 10G = 10 gallon Pot Life: 15 = 15 minutes 00 = No spacer beads 07 = 0.007" spacer beads GF1100SF = Gap Filler 1100SF Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad (R): U.S. Patent 5,679,457 and others. SEL_SP_0906_Chpt1.qxp 10/20/2006 3:50 PM Page 25 Gap Filler Gel 1500 The first in a new family of highly-conformable gels requiring no curing, mixing or refrigeration Features and Benefits TYPICAL PROPERTIES OF GAP FILLER GEL 1500 PROPERTY IMPERIAL VALUE METRIC VALUE Gray Gray Visual 1000 - 10,000 1000 - 10,000 ASTM D4473 Viscosity (Pa-sec) (2) 200 200 ASTM D5099 Density (g/cc) 1.8 1.8 ASTM D792 Color Shear Modulus (Pa) (1) Heat Capacity (J/g-K) Continuous Use Temp (F) / (C) Shelf Life at 25C (months) TEST METHOD 1.3 1.3 ASTM E1269 -76 to 347 -60 to 175 _ 12 12 _ 250 250 ASTM D149 GAP PAD * Highly conformable and requires no curing, mixing or refrigeration * Excellent high and low temperature mechanical and chemical stability * Storage stability of up to one year without filler settling issues * Reworkable * Good thermal performance: 1.4 W/mK * Stress conforming through low modulus ELECTRICAL Dielectric Strength (V/mil) Dielectric Constant (1000 Hz) 6 6 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 1.4 1.4 ASTM D5470 THERMAL Thermal Conductivity (W/m-K) 1) Parallel plate rheometer at 1 Hz and 0.1% strain. 2) Capillary rheometer at 900 sec-1. Typical Applications Include: * Automotive electronics * Telecommunications * Computer and peripherals * Thermally conductive vibration dampening * Between any heat-generating semiconductor and a heat sink Configurations Available: * 30cc, 310cc and 600cc tubes * 5-gallon containers * 7 mil spacer beads Gap Filler Gel 1500 is the first member in Bergquist's new family of pre-cured gap filling materials.The product is a highly conformable gel which requires no curing, mixing or refrigeration. It's unique formulation assures excellent thermal conductivity, stress conformance through low modulus, excellent high and low temperature chemical storage and storage stability up to one year. Gap Filler Gel 1500 is ideal for thermal interface applications where highly variable gaps and tolerances exist in electronic components, where only minimal stress on components is permissible and rework may be required. Building a Part Number Standard Options Gap Pad (R): U.S. Patent 5,679,457 and others. 25 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:20 AM Page 26 Gap Filler 2000 (Two-Part) High Thermally Conductive, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 2000 PROPERTY Color / Part A * Thermal conductivity: 2.0 W/m-K * Ultra-conforming, designed for fragile and low-stress applications * Ambient and accelerated cure schedules * 100% solids - no cure by-products * Excellent low and high temperature mechanical and chemical stability IMPERIAL VALUE Pink Color / Part B White White Visual 300,000 ASTM D2196 Density (g/cc) 2.9 2.9 ASTM D792 Mix Ratio 1:1 1:1 -- 6 6 -- PROPERTY AS CURED Color Pink Pink Visual Hardness (Shore 00) (2) 70 70 ASTM D2240 GAP PAD Shelf Life @ 25C (months) Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 -76 to 392 -60 to 200 -- ELECTRICAL AS CURED Dielectric Strength (V/mil) 500 500 ASTM D149 Dielectric Constant (1000 Hz) 7.0 7.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL AS CURED Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470 Continuous Use Temp (F) / (C) 15 15 -- Cure @ 25C (min) (4) 60 - 120 60 - 120 -- Cure @ 100C (min) (4) 5 5 -- 1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure) Typical Applications Include: * Automotive electronics * Telecommunications * Computer and peripherals * Thermally conductive vibration dampening * Between any heat-generating semiconductor and a heat sink Configurations Available: * For smaller quantity packaging, please contact Bergquist Sales Building a Part Number - 60 - 10G - Note: Resultant thickness is defined as the final gap thickness of the application. Resultant Thickness (mils) NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 50cc = 50.0cc, 400cc = 400.0cc Kits: 1200cc = 1200.0cc, or 10G = 10 gallon Pot Life: 15 = 15 minutes, 60 = 60 minutes Thickness vs. Thermal Resistance Gap Filler 2000 00 = No spacer beads 07 = 0.007" spacer beads 300 GF2000 = Gap Filler 2000 Material 250 Note: To build a part number, visit our website at www.bergquistcompany.com. 200 150 Gap Pad (R): U.S. Patent 5,679,457 and others. 50 0 0 26 Standard Options NA Section E 00 Section D - Section C GF2000 Section B Gap Filler 2000 is intended for use in thermal interface applications when a strong structural bond is not required. Gap Filler 2000 is formulated for low-modulus,"gel-like" properties. CURE SCHEDULE Pot Life @ 25C (min) (3) Section A Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. TEST METHOD Visual 300,000 Viscosity as Mixed (cps) (1) Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch. METRIC VALUE Pink 1 2 3 4 5 Thermal Resistance (C-in2/W) 6 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:20 AM Page 27 Gap Filler 3500S35 (Two-Part) Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 * Thermal Conductivity: 3.6 W/m-K * Thixotropic nature makes it easy to dispense * Two-part formulation for easy storage * Ultra-conforming - designed for fragile and low stress applications * Ambient or accelerated cure schedules PROPERTY Color / Part A IMPERIAL VALUE White Color / Part B TEST METHOD Visual Blue Visual 150,000 ASTM D2196 Density (g/cc) 1.0 1.0 ASTM D792 Mix Ratio 1:1 1:1 -- 5 5 -- PROPERTY AS CURED Color Blue Blue Visual Hardness (Shore 00) (2) 32 32 ASTM D2240 Shelf Life @ 25C (months) -76 to 392 -60 to 200 -- ELECTRICAL AS CURED Dielectric Strength (V/mil) 275 275 ASTM D149 Dielectric Constant (1000 Hz) 8.0 8.0 ASTM D150 Volume Resistivity (Ohm-meter) 109 109 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL AS CURED Thermal Conductivity (W/m-K) 3.6 3.6 ASTM D5470 CURE SCHEDULE Pot Life @ 25C (min) (3) 60 60 -- Cure @ 25C (min) (4) 15 15 -- Cure @ 100C (min) (4) 30 30 -- 1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure) Typical Applications Include: * Automotive electronics * Discrete components to housing * PCBA to housing * Fiber optic telecommunications equipment Configurations Available: * Supplied in cartridge or kit form Building a Part Number Standard Options Thickness vs.Thermal Resistance Gap Filler 3500S35 Thickness (inch) 0.25 0.20 0.15 Gap Pad (R): U.S. Patent 5,679,457 and others. 0.10 0.05 0.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Thermal Resistance (C-in2/W) 27 GAP PAD Blue 150,000 Viscosity as Mixed (cps) (1) Continuous Use Temp (F) / (C) Gap Filler 3500S35 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness.The material is twocomponent, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity.The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process).The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a low modulus elastomer designed to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface. Gap Filler 3500S35 will lightly adhere to surfaces, thus improving surface area contact. Gap Filler 3500S35 is not designed to be a structural adhesive. METRIC VALUE White SEL_SP_0906_Chpt1.qxp 10/23/2006 10:00 AM Page 28 TIC - Thermal Interface Compound TM TIC Thermally Conductive Grease Compounds Bergquist's line of thermally conductive thermal interface compounds will flow under assembly pressure to wet-out the thermal interface surfaces and produce very low thermal impedance. TIC products are designed for use between a high-end computer processor and a heat sink or other high watt density applications. Features Benefits Options Applications The TIC portfolio has diverse thermal and electrical characteristics. Key criteria when selecting TIC products include: TIC products are ideal for high watt density applications. Primary benefits include: TIC products can be obtained with application-specific options such as: TIC has a variety of applications such as: * Low interfacial resistance * Low thermal impedance * Resists dripping * Ideally suited to screen printing applications * No post "cure" conditioning required * Containers * Viscosity * Volume resistivity * Thermal conductivity * Thermal performance * Filler size * CPU * GPU * IGBT * High power density applications Comparison Data and FAQ's Q: What is the best fastening method for a TIC interface? A: A constant-pressure fastener is preferred when using TIC for high performance applications.The constant pressure from a clip or spring washer will ensure adequate pressure is being applied with varying bond line thickness. Q: How should the TIC be applied? A: Screenprinting the TIC is a fast, low-cost method that delivers a consistent and accurate amount of material on each application. Alternate methods include stenciling, pin transfer and needle dispensing. Q: Will the grease stay in the interface? A: All the TIC materials were specifically designed to resist pump-out of the interface, even after many hours of thermal and power cycling. 28 SEL_SP_0906_Chpt1.qxp 10/20/2006 10:20 AM Page 29 TIC 1000G TM High Performance,Value Compound for High-End Computer Processors Features and Benefits * Thermal performance: 0.29C/W (@ 50 psi) * Excellent screenability * No post "cure" required * Cost vs. performance leader TYPICAL PROPERTIES OF TIC 1000G PROPERTY Color IMPERIAL VALUE Black METRIC VALUE Black TEST METHOD Visual Density (g/cc) 1.2 1.2 ASTM D792 Continuous Use Temp (F) / (C) 302 150 -- ELECTRICAL Electrical Resistivity (Ohm-meter) (1) N/A N/A ASTM D257 THERMAL Thermal Conductivity (W/m-K) 0.7 0.7 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) (2) 10 25 50 100 200 0.32 0.30 0.29 0.27 0.26 1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin. 2) TO-220 performance data is provided as a reference to compare material thermal performance. Application Cleanliness Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair. Be sure heat sink is dry before applying TIC 1000G. TIC 1000G compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance.The compound requires pressure of the assembly to cause flow.The compound will resist dripping. Application Methods 1. Dispense and/or screenprint TIC 1000G compound onto the processor or heat sink surface like thermal grease (see a Bergquist Representative for application information). 2. Assemble the processor and heat sink with spring clips or constant-pressure fasteners. Typical Applications Include: * High performance CPU's * High performance GPU's Building a Part Number Standard Options For microprocessor applications, traditional screw fastening or spring clamping methods will provide adequate force to optimize the thermal performance of TIC 1000G. An optimized application would utilize the minimum volume of TIC 1000G compound necessary to ensure complete wet-out of both mechanical interfaces. TICTM: U.S. Patents 6,797,758; 6,624,224; 6,339,120. Note: TIC 1000G is ideally suited for screenprinting applications. Please contact Bergquist Sales for application notes related to screenprinting. Assembly - No Post Screen Cure TIC 1000G has excellent screenability. No solvent is used to reduce the viscosity, so no post "cure" conditioning is required. 29 TIC TIC 1000G is a high performance, thermally conductive compound intended for use as a thermal interface material between a highend computer processor and a heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of TIC 1000G. SEL_SP_0906_Chpt1.qxp 10/23/2006 9:45 AM Page 30 TIC 1000A TM High Performance,Value Compound for High-End Computer Processors Features and Benefits * High thermal performance: 0.32C/W (@ 50 psi) * Good screenability * Room temperature storage * No post "cure" required * Exceptional value TYPICAL PROPERTIES OF TIC 1000A PROPERTY Color IMPERIAL VALUE Gray METRIC VALUE Gray TEST METHOD Visual Density (g/cc) 2.1 2.1 ASTM D792 Continuous Use Temp (F) / (C) 302 150 -- ELECTRICAL Electrical Resistivity (Ohm-meter) (1) N/A N/A ASTM D257 THERMAL Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) (2) 10 25 50 100 200 0.32 0.32 0.32 0.31 0.28 1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin. 2) TO-220 performance data is provided as a reference to compare material thermal performance. Application Cleanliness TIC 1. Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair. Ensure heat sink is dry before applying TIC 1000A. Application Methods TIC 1000A is a high performance, thermally conductive compound intended for use as a thermal interface material between a highend computer processor and a heat sink. Other high watt density applications will also benefit from the extremely low thermal impedance of TIC 1000A. TIC 1000A compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance.The compound requires pressure of the assembly to cause flow.The TIC 1000A compound will resist dripping. 1. Dispense and/or screenprint TIC 1000A compound onto the processor or heat sink surface like thermal grease (see a Bergquist Representative for application information). 2. Assemble the processor and heat sink with spring clips or constant-pressure fasteners. Typical Applications Include: * High performance CPUs * High performance GPUs Building a Part Number For microprocessor applications, traditional screw fastening or spring clamping methods will provide adequate force to optimize the thermal performance of TIC 1000A. An optimized application would utilize the minimum volume of TIC 1000A material necessary to ensure complete wet-out of both mechanical interfaces. Assembly - No Post Screen Cure TIC 1000A has good screenability. No solvent is used to reduce the viscosity, so no post "cure" conditioning is required. 30 TICTM: U.S. Patents 6,797,758; 6,624,224; 6,339,120. Standard Options SPDG_Chapter2_10.06.qxp 10/20/2006 11:24 AM Page 29 TIC 4000 TM High Performance Thermal Interface Compound for Copper-Based Heat Sinks Features and Benefits * Thermal conductivity: 4.0 W/m-K * Exceptional thermal performance: 0.19C/W @ 50 psi TYPICAL PROPERTIES OF TIC 4000 PROPERTY Color IMPERIAL VALUE Gray METRIC VALUE Gray TEST METHOD Visual Density (g/cc) 4.0 4.0 ASTM D792 Continuous Use Temp (F) / (C) 302 150 -- ELECTRICAL Electrical Resistivity (Ohm-meter) (1) N/A N/A ASTM D257 THERMAL Thermal Conductivity (W/m-K) 4.0 4.0 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) (2) 10 25 50 100 200 0.21 0.20 0.19 0.19 0.18 1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin. 2) TO-220 performance data is provided as a reference to compare material thermal performance. Application Methods 1. Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair. Ensure heat sink is dry before applying TIC 4000. 2. Dispense TIC 4000 compound onto the processor or heat sink surface like thermal grease. 3. Assemble the processor and heat sink with clip or constant-pressure fasteners. TIC 4000 compound wets-out the thermal interface surfaces and flows to produce low thermal impedance.The compound requires pressure of the assembly to cause flow. TIC 4000 compound will not drip. * High performance computer processors (traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of TIC 4000) * High watt density applications where the lowest thermal resistance interface is required Typical Applications Include: Building a Part Number Standard Options For a typical 0.5" x 0.5" application at 0.005" thick, Bergquist estimates approximately 0.02 ml (cc) of TIC 4000. Although Bergquist estimates a 0.02 ml (cc) volumetric requirement for a 0.5" x 0.5" component interface, dispensed at a thickness of 0.005", Bergquist also recognizes that an optimized application would utilize the minimum volume of TIC 4000 material necessary to ensure complete wet-out of both mechanical interfaces. TICTM: U.S. Patents 6,797,758; 6,624,224; 6,339,120. 31 TIC TIC 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of TIC 4000. SPDG_Chapter2_10.06.qxp 10/20/2006 11:24 AM Page 30 Hi-Flow Phase Change Interface Materials (R) Solutions-Driven Thermal Management Products for Electronic Devices HI-FLOW Use phase change materials for excellent thermal performance without the mess of grease. Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink.The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow.The result is a thermal interface comparable to grease, without the mess, contamination and hassle. The Hi-Flow family of phase change thermal interface materials covers a wide range of applications.The Bergquist Company is a leader in thermal management solutions and works closely with customers to ensure that the proper Hi-Flow material is specified. Features Benefits Options Applications Hi-Flow handles like Bergquist's famed Sil-Pad materials at room temperature, but flows like grease at its designed phase change temperature.The following is an overview of the important features shared by the Hi-Flow family: Using Hi-Flow materials instead of grease can save time and money without sacrificing thermal performance. Here are some other benefits: The broad Hi-Flow family offers a variety of choices to meet the customer's performance, handling and process needs. Some of the choices include: Hi-Flow materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications applications such as: * No mess - thixotropic characteristics of the materials keep it from flowing out of the interface * Easier handling - tackified or tack-free at room temperature * Does not require protective liner * High thermal performance helps ensure CPU reliability * Does not attract contaminants * Easier material handling and shipping * Simplified application process * Some Hi-Flows are available with or without adhesive * Aluminum carrier for applications not requiring electrical isolation * Film or fiberglass carrier for electrical isolation * Dry, non-reinforced material * Tackified or tack-free at room temperature * Tabbed parts, die-cut parts, sheets or bulk rolls * Adhesive specifically for cold application without preheating heat sink We produce thousands of specials. Tooling charges vary depending on the complexity of the part. * UPS and SMPS AC/DC, DC/DC or linear power supplies * Between a CPU and heat sink * Power conversion devices * Fractional and integral motor control * Leaded, surface mount and power module assemblies * Comparable thermal performance to grease in most applications * Thermally conductive phase change compound * Aluminum, film or fiberglass carriers and non-reinforced versions * Low volatility * Easy to handle and apply in the manufacturing environment * Tackified or tack-free at room temperature U.S. Patent 5,679,457 and others. 32 SPDG_Chapter2_10.06.qxp 10/20/2006 11:24 AM Page 31 Hi-Flow Comparison Data (R) TO-220 Thermal Performance HI-FLOW 33 SPDG_Chapter2_10.06.qxp 10/20/2006 4:20 PM Page 32 Frequently Asked Questions Q: How is the ASTM D5470 test modified to characterA: ize phase change thermal performance? ASTM classifies a phase change as a Type 1, viscous liquid that exhibits unlimited deformation when a stress is applied. Bergquist utilizes test equipment that is designed to meet ASTM D5470 specifications for Type 1, which requires a shim or mechanical stop to precisely control the thickness.The phase change material is conditioned at 5oC over the stated phase change temperature. Understanding that time is also a key variable for material flow, the over-temperature condition is limited to 10 minutes and then allowed to cool, prior to initiating the actual test at the given pressure.The 10 minute time has been demonstrated to be an acceptable time period for the thermal mass inherent in the test setup. Note: Actual application testing may require more or less time to condition, depending upon the heat transfer and associated thermal mass.The performance values are recorded and published at 10, 25, 50, 100 and 200 psi to give the designer a broad-based understanding of Hi-Flow's performance. Q: What is the minimum pressure required to optimize the thermal performance of the Hi-Flow material? A: Upon achieving phase change temperature (e.g. pre-conditioning), HI-FLOW Bergquist has demonstrated that 10 psi provides adequate pressure to achieve exceptional thermal performance. Bergquist continues to research lower pressure wet-out characteristics in an effort to minimize interfacial losses associated with ultra-thin material interfaces. Q: Will the Hi-Flow replace a mechanical fastener? A: Mechanical fasteners are required. Bergquist recommends the use of spring clips to maintain consistent pressure over time. Q: Can I use screw-mount devices with Hi-Flow material? A: Hi-Flow works best with a clip or spring washer-mounted assembly.The continuous force applied by these devices allows the Hi-Flow material to flow and reduce the cross sectional gap. Bergquist suggests that design engineers evaluate whether a screw-mount assembly will have acceptable performance. See TO-220 Technical Note. Q: Is the adhesive in Hi-Flow 225F-AC repositionable? A: The adhesive in the current construction does adhere more to the heat sink aluminum than to the Hi-Flow material.There is the potential that the adhesive will be removed by the heat sink surface when it is removed to reposition on the heat sink.Time and/or pressure will increase the bond to the aluminum increasing the potential for the adhesive to adhere to the heat sink. Q: Is there any surface preparation required before A: 34 applying the adhesive-backed Hi-Flow to the heat sink? Standard electronics industry cleaning procedures apply. Remove dirt or other debris. Best results are attained when the Hi-Flow material is applied to a heat sink at a temperature of 25 +/- 10C. If the heat sink has been surface treated (e.g. anodized or chromated), it is typically ready for assembly. For bare aluminum, mild soap and water wash cleaning processes are typically used to eliminate machine oils and debris. Q: Is Hi-Flow material reworkable? A: If the material has not gone through phase change, the material will readily release from the device surface. For this situation, the Hi-Flow material will not likely have to be replaced. If the material has gone through the phase change, it will adhere very well to both surfaces. In this case, Bergquist suggests warming the heat sink to soften the Hi-Flow compound for easier removal from the processor. Replace with a new piece of Hi-Flow material. Q: What is meant by "easy to handle" in manufacturing? A: Insulated Hi-Flow products are manufactured with inner film support.This film stiffens the material, allowing parts to be more readily die-cut as well as making the material easier to handle in manual or automated assembly. Q: What is meant by "tack free" and why is this important? A: Many Hi-Flow materials have no surface tack at room temperature. The softer materials will pick up dirt more readily. Softer resins are more difficult to clean if any dirt is on the surface. If you try to rub the dirt away, the dirt is easily pushed into the soft phase change materials. Hi-Flow coatings are typically hard at room temperature rendering them easier to clean off without embedding dirt. Q: What does "more scratch resistance" mean on Hi-Flow 625? A: Hi-Flow 625 does not require a protective film during shipment. There are two issues with competitors' materials: 1) Melt point of the material is low enough that it can go through phase change in shipment and be very tacky. Hi-Flow has a higher phase change temperature and remains hard to a higher temperature. 2) The Hi-Flow material is harder and is not as easy to scratch or dent in shipping and handling. Q: Why is Hi-Flow phase change temperature 65oC? A: The 65oC phase change temperature was selected for two reasons. First, it was a low enough temperature for the phase change to occur in applications. Second, it would not phase change in transport. Bergquist studies show that shipping containers can reach 60oC in domestic and international shipments.The higher phase change temperature eliminates the possibility of a product being ruined in shipment.We offer a standard line of Hi-Flow 225 and 300 series products with 55oC phase change for those customers wanting the lower phase change temperature. Q: In which applications should I avoid using Hi-Flow? A: Avoid using Hi-Flow in applications in which the device will not reach operation at or above phase change temperature. Also avoid applications in which the operating temperature exceeds the maximum recommended operating temperature of the compound. SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 33 Hi-Flow 105 (R) Phase Change Coated Aluminum Features and Benefits * Thermal impedance: 0.37C-in2/W (@25 psi) * Used where electrical isolation is not required * Low volatility - less than 1% * Easy to handle in the manufacturing environment * Flows but doesn't run like grease TYPICAL PROPERTIES OF HI-FLOW 105 PROPERTY Color IMPERIAL VALUE Dark Gray METRIC VALUE Dark Gray TEST METHOD Visual Reinforcement Carrier Aluminum Aluminum -- Thickness (inch) / (mm) 0.0055 0.139 ASTM D374 Continuous Use Temp (F) / (C) 266 130 -- Phase Change Temp (F) / (C) 149 65 ASTM D3418 ELECTRICAL Dielectric Constant (1000 (Hz) 3.2 3.2 ASTM D150 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) (1) 0.9 0.9 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.95 0.80 0.74 0.69 0.64 Thermal Impedance (C-in2/W) (2) 0.39 0.37 0.36 0.33 0.30 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number Standard Options NA Section E Section D - 0.0055 - AC - 12/250 - Section C HF105 Section B Hi-Flow 105 has thermal performance equal to grease with 0.10C-in2/W contact thermal resistance. * Power semiconductors * Microprocessors mounted on a heat sink * Power conversion modules * Spring or clip mount applications where thermal grease is used Section A At 65C (phase change temperature), Hi-Flow 105 changes from a solid and flows, thereby assuring total wet-out of the interface. The thixotropic characteristics of Hi-Flow 105 reduce the pump-out from the interface. Typical Applications Include: HI-FLOW Hi-Flow 105 is a phase change material coated on both sides of an aluminum substrate. It is designed specifically to replace grease as a thermal interface, eliminating the mess, contamination and difficult handling associated with grease. Hi-Flow 105 is tack-free and scratch resistant at room temperature and does not require a protective liner in shipment when attached to a heat sink. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.0055" HF105 = Hi-Flow 105 Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patents 6,197,859 and 5,950,066. 35 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 34 Hi-Flow 115-AC (R) Fiberglass-Reinforced, Phase Change Thermal Interface Material Features and Benefits * Thermal impedance: 0.37C-in2/W (@25 psi) * Can be applied directly to a cold heat sink * One side adhesive-coated to aid in positioning * Fiberglass reinforced TYPICAL PROPERTIES OF HI-FLOW 115-AC PROPERTY Color IMPERIAL VALUE Gray METRIC VALUE Gray Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.0055 0.139 ASTM D374 Elongation (%45 to Warp and Fill) 40 40 ASTM D882A Tensile Strength (psi) / (MPa) 900 6 ASTM D882A Continuous Use Temp (F) / (C) 302 150 -- Phase Change Temp (F) / (C) 149 65 ASTM D3418 ELECTRICAL Dielectric Breakdown Voltage (Vac) 300 300 ASTM D149 Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) (1) 0.8 0.8 ASTM D5470 Bergquist Hi-Flow 115-AC is a thermally conductive fiber reinforced phase change material.The product consists of a thermally conductive 65C phase change compound coated on a fiberglass web, and an adhesive coating on one side for attachment to a cold heat sink.There is no need to preheat the heat sink to apply the Hi-Flow 115-AC. 10 25 50 100 200 TO-220 Thermal Performance (C/W) 1.28 1.16 1.04 0.94 0.85 Thermal Impedance (C-in2/W) (2) 0.44 0.37 0.35 0.27 0.15 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: Hi-Flow 115-AC is designed as a thermal interface material between a computer processor and a heat sink.The pressure sensitive adhesive makes it simple to apply in high volume to heat sinks and the 65C phase change temperature eliminates shipping and handling problems. * Computer and peripherals * As a thermal interface where bare die is exposed and needs to be heat sinked Hi-Flow 115-AC requires no protective liner for shipping or handling.The Hi-Flow coating has excellent handling characteristics at room temperature, and can withstand the handling and shipping process without protection. Building a Part Number Configurations Available: * Sheet form, die-cut parts and roll form * With pressure sensitive adhesive Standard Options NA Section E Section D Section C - 0.0055 - AC - 12/250 - Section B HF115AC Section A HI-FLOW THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TEST METHOD Visual Hi-Flow 115-AC handles like a Sil-Pad at room temperature and flows like high-quality grease at elevated temperatures. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.0055" HF115AC = Hi-Flow 115-AC Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patents 6,197,859 and 5,950,066. 36 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 35 Hi-Flow 225F-AC (R) Reinforced, Phase Change Thermal Interface Material Features and Benefits * Thermal impedance: 0.10C-in2/W (@25 psi) * Can be manually or automatically applied to the surfaces of room-temperature heat sinks * Foil reinforced, adhesive-coated * Soft, thermally conductive 55C phase change compound TYPICAL PROPERTIES OF HI-FLOW 225F-AC PROPERTY Color IMPERIAL VALUE Black METRIC VALUE Black TEST METHOD Visual Reinforcement Carrier Aluminum Aluminum -- Thickness (inch) / (mm) 0.004 0.102 ASTM D374 Carrier Thickness (inch) / (mm) ASTM D374 0.0015 0.038 Continuous Use Temp (F) / (C) 248 120 -- Phase Change Temp (F) / (C) 131 55 ASTM D3418 ELECTRICAL Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) (1) 1.0 1.0 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.87 0.68 0.57 0.50 0.45 Thermal Impedance (C-in2/W) (2) 0.12 0.10 0.09 0.08 0.07 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact Bergquist Product Management for applications that are less than 0.07" square. Configurations Available: * Roll form, kiss-cut parts, and sheet form Building a Part Number - AC - 11/250 - Standard Options NA Section E 0.004 Section D - Section C HF225FAC Section B Hi-Flow 225F-AC requires pressure from the assembly to cause material flow.The Hi-Flow coatings resist dripping in vertical orientation. * Computer and peripherals * Power conversion * High performance computer processors * Power semiconductors * Power modules Section A Above the 55C phase change temperature, Hi-Flow 225F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance. Typical Applications Include: HI-FLOW Hi-Flow 225F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. Hi-Flow 225F-AC consists of a soft, thermally conductive 55C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side Standard thicknesses available: 0.004" HF225FAC = Hi-Flow 225F-AC Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patent 6,197,859 and others 37 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 36 Hi-Flow 225FT (R) Reworkable, Pressure Sensitive Phase Change Material Features and Benefits * Thermal impedance: 0.10C-in2/W (@25 psi) * Reworkable pressure sensitive * Tabbed parts for easy application * Compliant foil allows easy release and rework TYPICAL PROPERTIES OF HI-FLOW 225FT PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Black Black Visual Reinforcement Carrier Aluminum Aluminum -- Thickness (inch) / (mm) 0.004 0.102 ASTM D374 Carrier Thickness (inch) / (mm) ASTM D374 Color 0.001 0.025 Continuous Use Temp (F) / (C) 248 120 -- Phase Change Temp (F) / (C) 131 55 ASTM D3418 V-O V-O U.L. 94 0.7 0.7 ASTM D5470 ELECTRICAL Flame Rating THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE 200 0.52 0.42 Thermal Impedance (C-in2/W) (2) 0.13 0.10 0.09 0.07 0.06 Typical Applications Include: * Computer and peripherals * High performance computer processors * Burn-in testing * Heat pipes * Mobile processors HF 225FT Roll Form, Kiss-Cut Parts Compliant Foil Protects Hi-Flow Low Adhesion to the Liner for Ease of Removal Clear Polyester Carrier Liner Configurations Available: * Roll form with tabs and kiss-cut parts - no holes * Custom thicknesses available Hi-Flow 225FT is limited to a square or rectangular part design. Dimensional tolerance is +/- 0.020 inch (0.5mm). Building a Part Number - 0.004 - 01 - 1112 - Standard Options NA Section E HF225FT Section D 1. Hi-Flow 225FT pads are easily removed from the carrier liner and can be handapplied to a room temperature heat sink, foil-side exposed.To reposition the heat sink assembly, simply lift gently to remove and reapply. 100 0.63 Section C Application Methods 50 0.74 Section B Above the 55C phase change temperature, Hi-Flow 225FT wets-out the heat sink interface and flows to produce exceptional thermal performance.The thixotropic design of Hi-Flow 225FT requires pressure of the assembly to cause displacement and/or flow. 25 0.93 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A HI-FLOW Pressure (psi) Bergquist reworkable Hi-Flow 225FT thermal interface material provides a low thermal resistance path between hot components such as high performance processors and heat sinks.The material consists of a 55C phase change compound bonded to one side of a conformable metal foil.This pressure sensitive material is easily applied to the heat sink and securely conforms to many mounting surfaces. Its compliant foil allows for easy release and reworking without leaving residue on CPU surfaces. 10 TO-220 Thermal Performance (C/W) NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard Hi-Flow 225FT configuration, 11/250 = 11" x 250' rolls, or 00 = custom configuration 01 = Reworkable adhesive, one side Standard thicknesses available: 0.004" HF225FT = Hi-Flow 225FT Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patent 6,197,859 and others 38 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 37 Hi-Flow 225UF (R) Unsupported,Thermally Conductive Phase Change Material Features and Benefits * Thermal impedance: 0.08C-in2/W (@25 psi) * Reworkable * Easy release from CPU * Easy to handle / assemble TYPICAL PROPERTIES OF HI-FLOW 225UF PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Black Black Visual Reinforcement Carrier Aluminum Aluminum -- Thickness (inch) / (mm) 0.0045 0.114 ASTM D374 Carrier Thickness (inch) / (mm) ASTM D374 Color 0.001 0.025 Continuous Use Temp (F) / (C) 248 120 -- Phase Change Temp (F) / (C) 131 55 ASTM D3418 1.0 1.0 ASTM D5470 THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE 10 25 50 100 200 TO-220 Thermal Performance (C/W) Pressure (psi) 0.70 0.58 0.52 0.43 0.37 Thermal Impedance (C-in2/W) (2) 0.10 0.08 0.07 0.06 0.05 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Configurations Available: * Sheet form, kiss-cut or bulk - Preferred form: squares / rectangles * Singulated die-cut parts - Preferred form: squares / rectangles * Bulk roll form Building a Part Number Standard Options NA Section E - 11/250 - Section D - 0.0045 - 00 Section C HF225UF Section B Above the 55C phase change temperature, Hi-Flow 225UF wets-out the heat sink interface and flows to produce exceptional thermal performance. Hi-Flow 225UF's thixotropic design requires pressure of the assembly to cause displacement and/or flow. * Spring / clip mounted: - Digital / high power CPU's - Power modules HI-FLOW Hi-Flow 225UF consists of a 55C phase change compound bonded to one side of a conformable aluminum foil.This phase change material is easily applied to a nominal 45C heat sink and securely conforms to many mounting surfaces.The compliant foil allows for easy release from the CPU/socket assembly, leaving the surface clean and residue-free. Hi-Flow 225UF is supplied in kiss-cut form with a carrier liner protecting the phase change material from contaminants. Typical Applications Include: Section A Bergquist's reworkable Hi-Flow 225UF thermal interface material provides a low thermal resistance path between hot components such as high-performance processors and heat sinks. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration 00 = No adhesive Standard thicknesses available: 0.0045" HF225UF = Hi-Flow 225UF Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patent 6,197,859 and others 39 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 38 Hi-Flow 225UT (R) Non-Reinforced, Pressure Sensitive Phase Change Thermal Interface Material Features and Benefits * Thermal impedance: 0.08C-in2/W (@25 psi) * 55C phase change composite with inherent tack characteristics * High-visibility protective tabs * Pressure sensitive phase change thermal interface material TYPICAL PROPERTIES OF HI-FLOW 225UT PROPERTY Color IMPERIAL VALUE Black METRIC VALUE Black Reinforcement Carrier None None -- Thickness (inch) / (mm) 0.003 0.077 ASTM D374 Continuous Use Temp (F) / (C) 248 120 -- Phase Change Temp (F) / (C) 131 55 ASTM D3418 ELECTRICAL Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) (1) 0.7 0.7 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) TEST METHOD Visual 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.60 0.53 0.46 0.40 0.35 Thermal Impedance (C-in2/W) (2) 0.09 0.08 0.07 0.06 0.05 HI-FLOW 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Hi-Flow 225UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. Hi-Flow 225UT is a thermally conductive 55C phase change composite with inherent tack.The material is supplied on a polyester carrier liner and is available with high-visibility protective tabs. Above its phase change temperature, Hi-Flow 225UT wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance.The material requires pressure of the assembly to cause flow. Hi-Flow 225UT coatings will resist dripping. Typical Applications Include: * Computer and peripherals * High performance computer processors * Graphic cards * Power modules Configurations Available: Clear/Colored Protective Tab "Quick-Snap" High Visibility Tab for Removal Adhesive Strip Clear Polyester Carrier Liner * Roll form with tabs and kiss-cut parts - no holes Hi-Flow 225UT is limited to a square or rectangular part design. Dimensional tolerance is +/- 0.020 inch (0.5mm). Building a Part Number Application Methods: 1. Hand-apply Hi-Flow 225UT to a roomtemperature heat sink.The Hi-Flow 225UT pad exhibits inherent tack and can be hand-applied similar to an adhesive pad. The tab liner can remain on the heat sink and pad throughout shipping and handling until is it is ready for final assembly. Hi- Flow(R): U.S. Patent 6,197,859 and others 40 HF 225UT Roll Form, Kiss-Cut Parts Standard Options SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 39 Hi-Flow 225U (R) Non-Reinforced Phase Change Thermal Interface Material Features and Benefits * Thermal impedance: 0.07C-in /W (@25 psi) * Hi-Flow coating will resist dripping * Thermally conductive 55C phase change compound * Available in roll form with kiss-cut parts 2 TYPICAL PROPERTIES OF HI-FLOW 225U PROPERTY Color IMPERIAL VALUE Black METRIC VALUE Black Reinforcement Carrier None None -- Thickness (inch) / (mm) 0.0015 0.036 ASTM D374 Continuous Use Temp (F) / (C) 302 150 -- Phase Change Temp (F) / (C) 131 55 ASTM D3418 ELECTRICAL Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) (1) 1.0 1.0 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 100 200 0.39 0.34 0.32 Thermal Impedance (C-in2/W) (2) 0.08 0.07 0.06 0.05 0.04 Typical Applications Include: * Computer and peripherals * High performance computer processors * Graphic cards * Power modules Configurations Available: * Roll form with tabs and kiss-cut parts - no holes Hi-Flow 225U is limited to a square or rectangular part design. Dimensional tolerance is +/- 0.020 inch (0.5mm). Building a Part Number - 11/500 - Standard Options NA Section E - 0.0015 - 00 Section D HF225U Section C 1. Hand-apply to 35- 45C heat sink.The heat sink is heated in an oven or via heat gun to between 35- 45C.The Hi-Flow 225U part is then applied like an adhesive pad.The heat sink is cooled to room temperature and packaged. A protective tab liner remains in place until the unit is ready for final assembly. The protective tab can be readily removed from the applied Hi-Flow 225U pad at a maximum temperature of 28C. 2. Automated equipment with 30-psi pressure. A pick-and-place automated dispensing unit can be used to apply the Hi-Flow 225U pad to a room-temperature heat sink.The placement head should have a silicone rubber pad, and should apply approximately 30-psi pressure to the pad on transfer to the 25 - 35C heat sink. Once applied, the protective tab can be readily removed from the Hi-Flow 225U pad at a maximum temperature of 28C. 50 0.47 Section B Application Methods: 25 0.53 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A Above its phase change temperature, Hi-Flow 225U wets-out the thermal interface surfaces and flows to produce low thermal impedance. Hi-Flow 225U requires pressure of the assembly to cause flow. 10 TO-220 Thermal Performance (C/W) HI-FLOW Hi-Flow 225U is designed for use as a thermal interface material between a computer processor and a heat sink.The product consists of a thermally conductive 55C phase change compound coated on a release liner and supplied on a carrier. TEST METHOD Visual NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard Hi-Flow 225U configuration, 11/500 = 11" x 500' rolls, or 00 = custom configuration 00 = No adhesive Standard thicknesses available: 0.0015" HF225U = Hi-Flow 225U Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patent 6,197,859 and others 41 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 40 Hi-Flow 625 (R) Electrically Insulating,Thermally Conductive Phase Change Material Features and Benefits * Thermal impedance: 0.71C-in2/W (@25 psi) * Electrically isolating * 65C phase change compound coated on PEN film * Tack-free and scratch-resistant TYPICAL PROPERTIES OF HI-FLOW 625 PROPERTY Color IMPERIAL VALUE Green METRIC VALUE Green Reinforcement Carrier PEN Film PEN Film -- Thickness (inch) / (mm) 0.005 0.127 ASTM D374 Elongation (%45 to Warp and Fill) TEST METHOD Visual 60 60 ASTM D882A 30,000 206 ASTM D882A Continuous Use Temp (F) / (C) 302 150 -- Phase Change Temp (F) / (C) 149 65 ASTM D3418 ELECTRICAL Dielectric Breakdown Voltage (Vac) Tensile Strength (psi) / (MPa) 4000 4000 ASTM D149 Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L. 94 0.5 0.5 ASTM D5470 THERMAL Thermal Conductivity (W/m-K) (1) 25 50 100 200 2.26 2.10 2.00 1.93 1.87 Thermal Impedance (C-in2/W) (2) 0.79 0.71 0.70 0.67 0.61 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Spring / clip mounted * Power semiconductors * Power modules Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number 0.005 Standard Options - AC - 1212 - NA Section E - Section D HF625 Section C Hi-Flow 625 is tack-free and scratch-resistant at production temperature and does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies. 10 TO-220 Thermal Performance (C/W) Section B Hi-Flow 625 is a film-reinforced phase change material.The product consists of a thermally conductive 65C phase change compound coated on PEN film. Hi-Flow 625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.The reinforcement makes Hi-Flow 625 easy to handle, and the 65C phase change temperature of the coating material eliminates shipping and handling problems.The PEN film has a continuous use temperature of 150C. Section A HI-FLOW THERMAL PERFORMANCE vs PRESSURE Pressure (psi) NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" HF625 = Hi-Flow 625 Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patents 6,197,859 and 5,950,066. 42 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 41 Hi-Flow 300P (R) Electrically Insulating,Thermally Conductive Phase Change Material Features and Benefits * Thermal impedance: 0.13C-in2/W (@25 psi) * Field-proven polyimide film - excellent dielectric performance - excellent cut-through resistance * Outstanding thermal performance in an insulated pad TYPICAL PROPERTIES OF HI-FLOW 300P PROPERTY Color IMPERIAL VALUE Green METRIC VALUE Green TEST METHOD Visual Reinforcement Carrier Polyimide Polyimide -- Thickness (inch) / (mm) 0.004 - 0.005 0.102 - 0.127 ASTM D374 Film Thickness (inch) / (mm) 0.001 - 0.002 0.025 - 0.050 ASTM D374 40 40 ASTM D882A Tensile Strength (psi) / (MPa) 7000 48 ASTM D882A Continuous Use Temp (F) / (C) 302 150 -- Phase Change Temp (F) / (C) 131 55 ASTM D3418 ELECTRICAL Dielectric Breakdown Voltage (Vac) Elongation (%45 to Warp and Fill) 5000 5000 ASTM D149 Dielectric Constant (1000 Hz) 4.5 4.5 ASTM D150 Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257 Flame Rating V-O V-O U.L. 94 1.6 1.6 ASTM D5470 THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 100 200 0.92 0.91 0.90 TO-220 Thermal Performance (C/W) 0.0015" 1.19 1.17 1.16 1.14 1.12 TO-220 Thermal Performance (C/W) 0.0020" 1.38 1.37 1.35 1.33 1.32 Thermal Impedance (C-in2/W) 0.0010" (2) 0.13 0.13 0.12 0.12 0.12 Thermal Impedance (C-in2/W) 0.0015" (2) 0.17 0.16 0.16 0.16 0.15 Thermal Impedance (C-in2/W) 0.0020" (2) 0.19 0.19 0.19 0.18 0.18 Typical Applications Include: * Spring / clip mounted * Discrete power semiconductors and modules Configurations Available: * Roll form, die-cut parts and sheet form, with or without pressure sensitive adhesive Building a Part Number - 00 - 00 - Standard Options ACME10256 Rev a Section E 0.001 Section D - Section C HF300P Section B Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application. 50 0.94 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A Hi-Flow 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition.The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink. 25 0.95 NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard polyimide thicknesses available: 0.001", 0.0015", 0.002" HF300P = Hi-Flow 300P Phase Change Material We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patent 6,197,859 and others 43 HI-FLOW Hi-Flow 300P consists of a thermally conductive 55C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle and the 55C phase change temperature minimizes shipping and handling problems. 10 TO-220 Thermal Performance (C/W) 0.0010" SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 42 Hi-Flow 300G (R) Fiberglass-Reinforced, Phase Change Thermal Interface Material Features and Benefits * Thermal impedance: 0.20C-in2/W (@25 psi) * Will not drip or run like grease * Phase change compound coated on a fiberglass carrier TYPICAL PROPERTIES OF HI-FLOW 300G PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Green Green Visual Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.005 0.127 ASTM D374 Elongation (%45 to Warp and Fill) 40 40 ASTM D882A Tensile Strength (psi) / (MPa) 400 3 ASTM D882A Continuous Use Temp (F) / (C) 212 100 -- Phase Change Temp (F) / (C) 131 55 ASTM 3418 Dielectric Breakdown Voltage (Vac) 300 300 ASTM D149 Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150 Volume Resistivity (Ohm-meter) 108 108 ASTM D257 Flame Rating V-O V-O U.L. 94 1.6 1.6 ASTM D5470 Color ELECTRICAL THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) Above the phase change temperature, Hi-Flow 300G wets-out the thermal interface surfaces and flows to produce low thermal impedance.The material requires pressure of the assembly to cause flow. Hi-Flow 300G will not drip or run like grease. 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.96 0.92 0.88 0.85 0.84 Thermal Impedance (C-in2/W) (2) 0.27 0.20 0.16 0.15 0.14 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Computer and peripherals * As a thermal interface where bare die is exposed and needs to be heat sinked Application Methods 44 Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number - 00 - 1012 - Standard Options NA Section E 0.005 Section D - Section C HF300G Section B 1. Hand-apply to 40- 50C heat sink.The heat sink is heated in an oven or by a heat gun to between 40- 50C allowing the Hi-Flow 300G pad to be applied like an adhesive pad.The heat sink is then cooled to room temperature and packaged. 2. Hand-apply to 20- 35C heat sink. Hi-Flow 300G can be applied to a room temperature heat sink with the assistance of a foam roller.The pad is positioned on the heat sink and a hand roller is used to apply pressure of 30 psi. 3. Automated equipment with 30 psi pressure. A pick-and-place automated dispensing unit can be used to apply Hi-Flow 300G to a room temperature heat sink.The placement head should have a soft silicone rubber pad, and apply 30 psi pressure to the pad on transfer to the 20- 35C heat sink. Section A HI-FLOW Hi-Flow 300G consists of a thermally conductive 55C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and a heat sink. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" HF300G = Hi-Flow 300G Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow(R): U.S. Patent 6,197,859 and others SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 43 Sil-Pad Thermally Conductive Insulators (R) Solutions-Driven Thermal Management Products for Electronic Devices Comprehensive choices for a cleaner and more efficient thermal interface More than 25 years ago, Bergquist set the standard for elastomeric thermal interface materials with the introduction of Sil-Pad.Today, Bergquist is a world leader with a complete family of Sil-Pad materials to meet the critical needs of a rapidly changing electronics industry. Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. Bergquist application specialists work closely with customers to specify the proper Sil-Pad material for each unique thermal management requirement. Features Benefits Options Applications The Sil-Pad family encompasses dozens of products, each with its own unique construction, properties and performance. Here are some of the important features offered by the Sil-Pad family: Choosing Sil-Pad thermal products saves time and money while maximizing an assembly's performance and reliability. Specifically: Some Sil-Pad products have special features for particular applications. Options include: The large family of Sil-Pad thermally conductive insulators is extremely versatile. In today's marketplace, Sil-Pads are used in virtually every component of the electronics industry, including: * Available with or without adhesive * Some configurations are well suited for automated dispensing and/or placement * Aluminum foil or imbedded graphite construction for applications not requiring electrical insulation * Copper shield layer * Polyester binder material for silicone-sensitive applications * Polyimide film carrier for increased voltage breakdown * Materials with reduced moisture sensitivity * Available in rolls, sheets, tubes and custom die-cut parts * Custom thicknesses and constructions We produce thousands of specials. Tooling charges vary depending on the complexity of the part. * Interface between a power transistor, CPU or other heatgenerating component and a heat sink or rail * Isolate electrical components and power sources from heat sink and/or mounting bracket * Interface for discrete semiconductors requiring low-pressure spring-clamp mounting * Consumer electronics * Automotive systems * Telecommunications * Aerospace * Military * Medical devices * Industrial controls 45 SIL-PAD * Proven silicone rubber binders * Fiberglass, dielectric film or polyester film carriers * Special fillers to achieve specific performance characteristics * Flexible and conformable * Reinforcements to resist cut-through * Variety of thicknesses * Wide range of thermal conductivities and dielectric strengths * Excellent thermal performance * Eliminates the mess of grease * More durable than mica * Less costly than ceramic * Resistant to electrical shorting * Easier and cleaner to apply * Under time and pressure, thermal resistance will decrease * Better performance for today's high-heat compacted assemblies * A specific interfacial performance that matches the need * Efficient "total applied cost" that compares favorably with other alternatives SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 44 Sil-Pad Comparison Data (R) TO-220 Thermal Performance Q-Pad Materials Non-Electrically Isolating Sil-Pad High Value Materials 2.75 9.25 Q-Pad 3 Q-Pad II 2.50 Sil-Pad 400, 9 mil Sil-Pad 400, 7 mil Sil-Pad 980 Sil-Pad 900S Sil-Pad 800 Sil-Pad 1100ST 8.25 Thermal Performance (C/W) Thermal Performance (C/W) 2.25 2.00 1.75 1.50 1.25 1.00 0.75 7.25 6.25 5.25 4.25 3.25 0.50 2.25 0.25 0.00 1.25 0 50 100 150 200 0 50 Interface Pressure (psi) Sil-Pad High Performance Materials Sil-Pad Polyimide-Based Materials Sil-Pad 1750 Sil-Pad A1500, 10 mil Sil-Pad 2000, 10 mil Sil-Pad A2000, 20 mil Sil-Pad 1500ST, 12 mil Sil-Pad A2000, 15 mil Sil-Pad 1500ST, 8 mil 2.65 Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 4.00 3.75 Thermal Performance (C/W) 2.85 Thermal Performance (C/W) 200 4.25 3.05 SIL-PAD 150 Interface Pressure (psi) 3.25 2.45 2.25 2.05 1.85 1.65 3.50 3.25 3.00 2.75 2.50 2.25 2.00 1.75 1.45 1.50 1.25 1.25 0 50 100 150 Interface Pressure (psi) 46 100 200 0 50 100 150 Interface Pressure (psi) 200 SPDG_Chapter2_10.06.qxp 10/20/2006 4:34 PM Page 45 Frequently Asked Questions Q: What is the primary difference between A: Sil-Pad A2000 and Sil-Pad 2000 products? Sil-Pad A2000 utilizes a different filler package than Sil-Pad 2000. This change results in a more compliant Sil-Pad A2000 material that inherently lowers interfacial resistance losses.This reduction in interfacial resistance results in improved overall thermal performance when measured at lower pressures in standard ASTM D5470 and TO-220 testing. Q: When should I choose Sil-Pad 980 versus Sil-Pad 900S for my application? A: Sil-Pad 980 is specifically formulated to provide superior cutthrough and crush resistance in combination with excellent heat transfer and dielectric properties. Sil-Pad 980 has a proven history of reliability in high-pressure applications where surface imperfections such as burrs and dents are inherently common. These applications often include heavily machined metal surfaces manufactured from extrusions or castings. Sil-Pad 900S carries a high level of crush resistance and is more likely to be used in burr-free or controlled-surface finish applications. Q: When should I choose Sil-Pad A2000 versus Sil-Pad 2000 for my application? A: The answer is based on the assumption that the primary design intent is to increase thermal performance. If your application utilizes lower clamping pressures (e.g. 10 to 75 psi) you will find the Sil-Pad A2000 to provide excellent thermal performance. In contrast, if you are designing for higher clamping pressures (e.g. 100 psi or greater), it is likely that you will require the thermal performance characteristics of the Sil-Pad 2000. Q: Is there an adhesive available for Sil-Pad 1500ST and Sil-Pad 1100ST? A: Sil-Pad 1500ST and Sil-Pad 1100ST have an inherent tack on both sides of the material.This inherent tack is used instead of an adhesive.The tack provides sufficient adhesive for dispensing from the carrier liner and placement on the component. Sil-Pad 1500ST and Sil-Pad 1100ST can be repositioned after the initial placement. Q: Are there differences in electrical characteristics between Sil-Pad A2000 and Sil-Pad 2000? A: Yes. Bergquist evaluates and publishes voltage breakdown, dielectric constant and volume resistivity data per ASTM standards for these materials. Due to differences between ASTM lab testing and actual application performance, for best results, these characteristics should be evaluated within the actual customer system. Q: Can I get Sil-Pad A2000 in roll form? A: Yes.With the new environmentally "green" process improvements added with the introduction of Sil-Pad A2000 products, the materials are now available in roll form.The original Sil-Pad 2000 material cannot be produced in continuous roll form. Q: When should I choose Sil-Pad 800 versus Sil-Pad 900S for my application? performance for discrete semiconductor applications that utilize low clamping pressures (e.g. spring clips at 10 to 50 psi). In contrast, if you are designing for higher clamping pressure applications using discrete semi-conductors (e.g. 50 to 100 psi), it is likely that you will prefer the combination of high thermal performance and cut-through resistance inherent in Sil-Pad 900S material. A: 1500ST and Sil-Pad 1100ST so flat when compared to other Sil-Pads? Sil-Pad 1500ST and Sil-Pad 1100ST wet-out the application surfaces at a very low pressures. Optimal thermal performance is achieved at pressures as low as 50 psi. Q: How do I know which Sil-Pad is right for my specific application? A: Each application has specific characteristics (e.g. surface finish, flatness tolerances, high pressure requirements, potential burrs, etc.) that determine which Sil-Pad will optimize thermal performance. Select a minimum of two pads that best fit the application, then conduct testing to determine which material performs the best. SIL-PAD A: Sil-Pad 800 is specifically formulated to provide excellent thermal Q: Why is the thermal performance curves of Sil-Pad Q: What is IS09001:2000? A: The ISO certification is the adoption of a quality management system that is a strategic decision of the organization.This International Standard specifies requirements for a quality management system where an organization: a) needs to demonstrate its ability to consistently provide product that meets customer and applicable regulatory requirements, and b) aims to enhance customer satisfaction through the effective application of the system, including processes for continual improvement of the system and the assurance of conformity to customer and regulatory requirements. 47 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 46 Why Choose Sil-Pad Thermally Conductive Insulators? Overview Polyimide Films The Bergquist Company established the standard for elastomeric, thermally conductive insulation materials with the development of Sil-Pad over 25 years ago. Sil-Pad was developed as a clean, greasefree alternative to mica and grease. Now, a complete family of materials is available to meet the diverse and changing requirements of today's design engineer. Polyimide films can also be used as insulators and are often combined with wax or grease to achieve a low thermal impedance. These polyimide films are especially tough and have high dielectric strength. Sil-Pad K-4, K-6 and K-10 incorporate polyimide film as the carrier material. Mica and Grease SIL-PAD Mica insulators have been in use for over 35 years and are still commonly used as an insulator. Mica is inexpensive and has excellent dielectric strength, but it is brittle and is easily cracked or broken. Because mica used by itself has high thermal impedance, thermal grease is commonly applied to it.The grease flows easily and excludes air from the interface to reduce the interfacial thermal resistance. If the mica is also thin (2-3 mils [50-80 m]), a low thermal impedance can be achieved. However, thermal grease introduces a number of problems to the assembly process. It is time-consuming to apply, messy and difficult to clean. Once thermal grease has been applied to an electronic assembly, solder processes must be avoided to prevent contamination of the solder. Cleaning baths must also be avoided to prevent wash-out of the interface grease, causing a dry joint and contamination of the bath. Assembly, soldering and cleaning processes must be performed in one process while the greased insulators are installed off-line in a secondary process. If the grease is silicone-based, migration of silicone molecules occurs over time, drying out the grease and contaminating the assembly. Silicone migration onto electrical contacts can result in the loss of electrical conductance. For this reason, silicone-based thermal grease has not been used in telecommunications systems. 48 Ceramic Insulators Other insulation materials include ceramic wafer insulators which have a higher thermal conductivity than mica.They are often used thicker (20-60 mils), (.5 to 1.5 mm) to reduce capacitive coupling while maintaining a low thermal impedance. Drawbacks to ceramic insulators are their high cost and, like mica, they are rigid and crack easily. Also, ceramic beryllia use requires careful handling since inhalation of beryllia dust can cause lung inflammation (berylliosis). SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 47 Sil-Pad Materials Carriers Sil-Pad thermally conductive insulators are designed to be clean, grease-free and flexible.The combination of a tough carrier material such as fiberglass and silicone rubber which is conformable, provides the engineer with a more versatile material than mica or ceramics and grease. Sil-Pad products minimize the thermal resistance from the case of a power semiconductor to the heat sink. Sil-Pad materials electrically isolate the semiconductor from the heat sink and have suffiicient dielectric strength to withstand high voltage.They are also strong enough to resist puncture by the facing metal surface.With more than 30 different Sil-Pad materials available, there is a Sil-Pad matched to almost any application. The carrier provides physical reinforcement and contributes to dielectric strength. High dielectric and physical strength are obtained by using a heavy, tight mesh, but thermal resistance will suffer. A light, open mesh reduces thermal resistance, dielectric strength and cut-through resistance. The carrier materials used in Sil-Pad materials include fiberglass and dielectric film. Sil-Pad Construction Sil-Pad products are constructed with a variety of different materials including fiberglass, silicone rubber, polyimide film, polyester film and fillers used to enhance performance. Sil-Pad materials are typically constructed with an elastomeric binder compounded with a thermally conductive filler coated on a carrier.The characteristics of your application often determine which Sil-Pad construction will produce the best performance. Binders Most Sil-Pad products use silicone rubber as the binder. Silicone rubber has a low dielectric constant, high dielectric strength, good chemical resistance and high thermal stability. Fillers The thermal conductivity of Sil-Pad products is improved by filling them with ingredients of high thermal conductivity.The fillers change the characteristics of the silicone rubber to enhance thermal and/or physical characteristics. For instance, some fillers make the silicone rubber hard and tough while still retaining the ability to flow under pressure. A harder silicone helps the material resist cut-through. In other applications a filler is used to make the silicone rubber softer and more conformable to rough surfaces.While the range in thermal resistance of greased mica is quite large, the average is comparable to elastomeric insulators filled with a blend of the appropriate ingredients. Fiberglass-based insulators (Sil-Pad 400 and Sil-Pad 1500) have a rough surface texture and will show a 15-20% decrease in thermal resistance over a 24-hour period. Film-based insulators (Sil-Pad K-4, Sil-Pad K-6 and Sil-Pad K-10) are smoother initially and show a 5% decrease over the same period of time. SIL-PAD Silicone rubber also exhibits cold flow, which excludes air from the interface as it conforms to the mating surfaces.This flow eliminates the need for thermal grease. A rough-surface-textured insulator needs to flow more to exclude air than a smooth one.The smoother pads also need less pressure to wet-out the surfaces and obtain optimum thermal contact. 49 SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 48 Mechanical, Electrical and Thermal Properties Mechanical Properties Woven fiberglass and films are used in Sil-Pad products to provide mechanical reinforcement.The most important mechanical property in Sil-Pad applications is resistance to cut-through to avoid electrical shorting from the device to the heat sink. Devices with larger surface areas need more pressure to get the insulator to conform to the interface than smaller devices. In most screw-mount applications, the torque required to tighten the fastener is sufficient to generate the pressure needed for optimum thermal resistance.There are exceptions where the specified torque on the fastener does not yield the optimum thermal resistance for the insulator being used and either a different insulator or a different mounting scheme should be used. Interfacial thermal resistance decreases as time under pressure increases. In applications where high clamping forces cannot be used, time can be substituted for pressure to achieve lower thermal resistance.The only way to know precisely what the thermal resistance of an insulator will be in an application is to measure it in that application. Electrical Properties Cut-Through Resistance - Bergquist introduced its TO-220 cut-through test to help customers better understand typical application performance. SIL-PAD Mounting Techniques and Mounting Pressure Typical mounting techniques include: * A spring clip, which exerts a centralized clamping force on the body of the transistor.The greater the mounting force of the spring, the lower the thermal resistance of the insulator. * A screw in the mounting tab.With a screw-mounted TO-220, the force on the transistor is determined by the torque applied to the fastener. In extremely low-pressure applications, an insulator with pressure sensitive adhesive on each side may give the lowest thermal resistance since the adhesive wets-out the interface easier than the dry rubber. This decreases the interfacial thermal resistance. If your application does not require electrical insulation, Q-Pad II or Q-Pad 3 are ideal grease replacement materials.These materials do not provide electrical isolation but have excellent thermal properties. Hi-Flow phase change materials should also be considered for these applications. (Reference pages 32-44 of this guide.) The most important electrical property in a typical assembly where a Sil-Pad insulator is used is dielectric strength. In many cases the dielectric strength of a Sil-Pad will be the determining factor in the design of the apparatus in which it is to be used. Here are some general guidelines regarding electrical properties to consider when selecting a Sil-Pad material: * Q-Pad II and Q-Pad 3 are used when electrical isolation is not required. * Dielectric breakdown voltage is the total voltage that a dielectric material can withstand.When insulating electrical components from each other and ground, it is desirable to use an insulator with a high breakdown voltage. SIL-PAD TYPICAL ELECTRICAL PROPERTIES Material Sil-Pad 400 - 0.007 Sil-Pad 400 - 0.009 Sil-Pad 900S Sil-Pad A1500 Sil-Pad 2000 Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Test Method 50 BREAKDOWN VOLTAGE DIELECTRIC STRENGTH DIELECTRIC CONSTANT VOLUME RESISTIVITY (kV) 3.5 4.5 5.5 6.0 4.0 6.0 6.0 6.0 (Volts/mil) (kV/mm) 500 20 500 20 600 24 600 24 400 16 1000 39 1000 39 1000 39 (1000 Hz) 5.5 5.5 6.0 7.0 4.0 5.0 4.0 3.7 (Ohm-Meter) 1011 1011 1010 1011 1011 1012 1012 1012 ASTM D149* ASTM D149* ASTM D150 ASTM D257 * Method A,Type 3 Electrodes * Method A,Type 3 Electrodes SPDG_Chapter2_10.06.qxp 10/20/2006 11:25 AM Page 49 * Breakdown voltage decreases as the area of the electrodes increases.This area effect is more pronounced as the thickness of the insulator decreases. * Breakdown voltage decreases as temperature increases. * Breakdown voltage decreases as humidity increases (Sil-Pad 1750 is less sensitive to moisture). * Breakdown voltage decreases in the presence of partial discharge. * Breakdown voltage decreases as the size of the voltage source (kVA rating) increases. * Breakdown voltage can be decreased by excessive mechanical stress on the insulator. Dielectric strength, dielectric constant and volume resistivity should all be taken into consideration when selecting a Sil-Pad material. If your application requires specific electrical performance, please contact a Bergquist Sales Representative for more detailed testing information. Thermal Properties The thermal properties of a Sil-Pad material and your requirements for thermal performance probably have more to do with your selection of a Sil-Pad than any other factor. Discrete semiconductors, under normal operating conditions, dissipate waste power which raises the junction temperature of the device. Unless sufficient heat is conducted out of the device, its electrical performance and parameters are changed. A 10C rise in junction temperature can reduce the mean-time-to-failure of a device by a factor of two. Also, above 25C, the semiconductor's total power handling capability will be reduced by a derating factor inherent to the device. The thermal properties of Sil-Pad products are thermal impedance, thermal conductivity and thermal resistance. The thermal resistance and conductivity of Sil-Pad products are inherent to the material and do not change.Thermal resistance and thermal conductivity are measured per ASTM D5470 and do not include the interfacial thermal resistance effects.Thermal impedance applies to the thermal transfer in an application and includes the effects of interfacial thermal resistance. As the material is applied in different ways, the thermal impedance values will vary from application to application. * The original Sil-Pad material, Sil-Pad 400, continues to be Bergquist's most popular material for many applications. * Sil-Pad A1500 is chosen when greater thermal performance is required. Sil-Pad A2000 is ideal for high performance, high reliability applications. Beyond these standard materials, many things can contribute to the selection of the correct material for a particular application. Questions regarding the amount of torque and clamping pressure are often asked when selecting a Sil-Pad material. Here are some guidelines: * Interfacial thermal resistance decreases as clamping pressure increases. * The clamping pressure required to minimize interfacial thermal resistance can vary with each type of insulator. * Sil-Pad products with smooth surface finishes (Sil-Pad A1500, Sil-Pad A2000, Sil-Pad K-4, Sil-Pad K-6 and Sil-Pad K-10) are less sensitive to clamping pressure than Sil-Pads with rough surface finishes (Sil-Pad 400) or smooth and tacky finishes (Sil-Pad 1500ST). SIL-PAD 5.14 3.13 2.9 2.45 2.76 2.21 2.0 1.51 1.86 2.01 1.76 1.51 1.23 (0.008) (0.010) 51 SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 50 Sil-Pad Thermally Conductive (R) Sil-Pad 400 .007 in. Sil-Pad 400 .009 in. Sil-Pad 800 Sil-Pad 900S Sil-Pad 980 Sil-Pad A1500 Sil-Pad 1100ST Gray Gray Gold Pink Mauve Green Yellow .007 .001 (.18 .025) .009 .001 (.23 .025) .005 .001 (.13 .025) .009 .001 (.23 .025) .009 .001 (.23 .025) .010 .001 (.25 .025) .012 .001 (.30 .025) Thermal Performance TO-220 Test @ 50 psi C/W 5.14 6.61 2.45 2.90 4.52 2.21 1.51 Thermal Impedance (C-in2/W) 1.13 1.45 0.45 0.61 1.07 0.42 0.66 Thermal Conductivity (W/m-K nominal) 0.9 0.9 1.6 1.6 1.2 2.0 1.1 3500 4500 3000 5500 4000 6000 5000 Continuous Use Temperature (C) -60 to 180 -60 to 180 -60 to 180 -60 to 180 -40 to 150 -60 to 180 -60 to 180 Construction Silicone/ Fiberglass Silicone/ Fiberglass Silicone/ Fiberglass Silicone/ Fiberglass Silicone/ Fiberglass Silicone/ Fiberglass Silicone/ Fiberglass Color Thickness (in/mm) Voltage Breakdown (Vac) SIL-PAD Sil-Pad Applications Here, Sil-Pad 900S enhances the thermal transfer from this FR-4 circuit board with thermal vias to the metal base plate. Sil-Pad is available in over 100 standard configurations for common JEDEC package outlines. The circuit board above shows punched parts interfacing screwmounted transistors to a finned heat sink. This application uses Sil-Pad to isolate the mounting brackets from the assembly frame. A common Sil-Pad application includes TO-220 transistors mounted in a row on a heat rail. These Sil-Pad applications show clip mounting of transistors on the left and screw mounting to an aluminum bracket on the right. Choose a Sil-Pad that optimizes thermal performance for your mounting method -- screw, clip, spring, bar, etc. Sil-Pad 980 is used extensively in industrial applications having excellent cut-through and abrasion resistance. 52 Insu tive SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 51 Insulator Selection Table Sil-Pad 1500ST Sil-Pad A2000 Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Poly-Pad 1000 Poly-Pad K-4 Poly-Pad K-10 Test Method Blue White Gray Bluegreen Beige Yellow Tan Yellow Visual .008 .001 (.20 .025) .015 .001 (.38 .025) .006 .001 (.15 .025) .006 .001 (.15 .025) .006 .001 (.15 .025) .009 .001 (.23 .025) .006 .001 (.15 .025) .006 .001 (.15 .025) ASTM D374 1.51 1.86 3.13 2.76 2.01 3.74 4.34 2.75 ASTM D5470 0.23 0.32 0.48 0.49 0.41 0.82 0.95 0.60 ASTM D5470 1.8 3.0 0.9 1.1 1.3 1.2 0.9 1.3 ASTM D5470 3000 4000 6000 6000 6000 2500 6000 6000 ASTM D149 -60 to 180 -60 to 200 -60 to 180 -60 to 180 -60 to 180 -20 to 150 -20 to 150 -20 to 150 -- Silicone/ Fiberglass Silicone/ Fiberglass Silicone/ Film Silicone/ Film Silicone/ Film Polyester/ Fiberglass Polyester/ Film Polyester/ Film -- Sil-Pad Comparison Made Simple! Comparing thermally conductive interface materials has never been easier. The materials comparison tool can be used for most Bergquist thermal materials, including Sil-Pad, Hi-Flow, Gap Pad, Q-Pad, Bond-Ply and Liqui-Bond products. 53 SIL-PAD Simply go to the "Thermal Materials" section of the Bergquist website (www.bergquistcompany.com) and select "Compare Material Properties." Then select up to three separate products and this handy comparison tool will automatically chart thermal resistance values and display a material properties table of the selected materials. SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 52 Sil-Pad 400 (R) The Original Sil-Pad Material Features and Benefits * Thermal impedance: 1.13C-in2/W (@50 psi) * Original Sil-Pad material * Excellent mechanical and physical characteristics * Flame retardant TYPICAL PROPERTIES OF SIL-PAD 400 PROPERTY Color IMPERIAL VALUE Gray Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.007, 0.009 0.178, 0.229 ASTM D374 Hardness (Shore A) 85 85 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458 Elongation (%45 to Warp and Fill) 54 54 ASTM D412 3000 20 ASTM D412 Continuous Use Temp (F) / (C) -76 to 356 -60 to 180 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) 3500, 4500 3500, 4500 ASTM D149 Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 0.9 0.9 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.007" 6.62 5.93 5.14 4.38 3.61 TO-220 Thermal Performance (C/W) 0.009" 8.51 7.62 6.61 5.63 4.64 Thermal Impedance (C-in2/W) 0.007" (1) 1.82 1.42 1.13 0.82 0.54 Thermal Impedance (C-in2/W) 0.009" (1) 2.34 1.83 1.45 1.05 0.69 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Power supplies * Power semiconductors * Automotive electronics * U.L. File Number E59150 * Motor controls * CAGE Number 55285 Configurations Available: * Sheet form, die-cut parts and roll form; with or without pressure sensitive adhesive Building a Part Number Standard Options NA Section E - AC - 12/250 - Section D 0.007 Section C - Section B SP400 Section A SIL-PAD Sil-Pad 400 has excellent mechanical and physical characteristics. Surfaces are pliable and allow complete surface contact with excellent heat dissipation. Sil-Pad 400 actually improves its thermal resistance with age. The reinforcing fiberglass provides excellent cut-through resistance. In addition, Sil-Pad 400 is non-toxic and resists damage from cleaning agents. TEST METHOD Visual Reinforcement Carrier Tensile Strength (psi) / (MPa) Sil-Pad 400 is a composite of silicone rubber and fiberglass.The material is flame retardant and is specially formulated for use as a thermally conductive insulator.The primary use for Sil-Pad 400 is to electrically isolate power sources from heat sinks. METRIC VALUE Gray NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side; AC2 = Adhesive, two sides; or 00 = no adhesive Standard thicknesses available: 0.007", 0.009" SP400 = Sil-Pad 400 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R) U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 54 SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 53 Sil-Pad 800 (R) High Performance Insulator for Low-Pressure Applications Features and Benefits * Thermal impedance: 0.45C-in2/W (@50 psi) * High value material * Smooth and highly compliant surface * Electrically isolating TYPICAL PROPERTIES OF SIL-PAD 800 PROPERTY Color IMPERIAL VALUE Gold METRIC VALUE Gold Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.005 0.127 ASTM D374 Hardness (Shore A) 91 91 ASTM D2240 Elongation (%45 to Warp and Fill) 20 20 ASTM D412 1700 12 ASTM D412 -76 to 356 -60 to 180 -- 1700 1700 ASTM D149 3000 3000 ASTM D149 Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 1.6 1.6 ASTM D5470 Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Type 3 Electrodes 25 50 100 200 3.56 3.01 2.45 2.05 1.74 Thermal Impedance (C-in2/W) (1) 0.92 0.60 0.45 0.36 0.29 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Power supplies * Automotive electronics * Motor controls * Power semiconductors Configurations Available: SIL-PAD * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number 0.005 - AC - 1212 - Standard Options NA Section E - Section D SP800 Section C Applications requiring low component clamping forces include discrete semiconductors (TO-220,TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor.The smooth surface texture of Sil-Pad 800 minimizes interfacial thermal resistance and maximizes thermal performance. 10 TO-220 Thermal Performance (C/W) Section B Sil-Pad 800 material combines a smooth and highly compliant surface characteristic with high thermal conductivity.These features optimize the thermal resistance properties at low pressure. THERMAL PERFORMANCE vs PRESSURE Pressure (psi) Section A The Sil-Pad 800 family of thermally conductive insulation materials is designed for applications requiring high thermal performance and electrical isolation.These applications also typically have low mounting pressures for component clamping. TEST METHOD Visual NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" SP800 = Sil-Pad 800 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 55 SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 54 Sil-Pad 900S (R) High Performance Insulator for Low-Pressure Applications Features and Benefits * Thermal impedance: 0.61C-in2/W (@50 psi) * Electrically isolating * Low mounting pressures * Smooth and highly compliant surface * General-purpose thermal interface material solution TYPICAL PROPERTIES OF SIL-PAD 900S PROPERTY Color IMPERIAL VALUE Pink METRIC VALUE Pink Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.009 0.229 ASTM D374 Hardness (Shore A) 92 92 ASTM D2240 Elongation (%45 to Warp and Fill) 20 20 ASTM D412 1300 9 ASTM D412 -76 to 356 -60 to 180 -- 5500 5500 ASTM D149 8300 8300 ASTM D149 Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 1.6 1.6 ASTM D5470 Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) Type 3 Electrodes THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 50 100 200 3.41 2.90 2.53 2.32 Thermal Impedance (C-in2/W) (1) 0.95 0.75 0.61 0.47 0.41 Typical Applications Include: * Power supplies * Automotive electronics * Motor controls * Power semiconductors Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number 00 Standard Options - ACME 951753 Rev B Section E 0.009 - AC - Section D SP900S - Section C Applications requiring low component clamping forces include discrete semiconductors (TO-220,TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor.The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance. 25 3.96 Section B Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity.These features optimize the thermal resistance properties at low pressures. 10 TO-220 Thermal Performance (C/W) 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A SIL-PAD The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation.These applications also typically have low mounting pressures for component clamping. TEST METHOD Visual NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009" SP900S = Sil-Pad 900S Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 56 SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 55 Sil-Pad 980 (R) High Cut-Through Resistant, Electrically Insulating,Thermally Conductive Material Features and Benefits * Thermal impedance: 1.07C-in2/W (@50 psi) * Excellent cut-through resistance * Use in screw-mounted applications with cut-through problems TYPICAL PROPERTIES OF SIL-PAD 980 PROPERTY Color IMPERIAL VALUE Mauve METRIC VALUE Mauve Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.009 0.229 ASTM D374 Hardness (Shore A) 95 95 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 140 26 ASTM D1458 Elongation (%45 to Warp and Fill) 10 10 ASTM D412 Cut-Through (lbs) / (kg) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) 750 340 ASTM D412 -40 to 302 -40 to 150 -- ASTM D149 4000 4000 Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 THERMAL Thermal Conductivity (W/m-K) 1.2 1.2 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 25 50 100 200 5.48 5.07 4.52 4.04 3.56 Thermal Impedance (C-in2/W) (1) 1.51 1.22 1.07 0.89 0.53 Typical Applications Include: * Silicone-sensitive assemblies * Telecommunications * Automotive electronics Configurations Available: Building a Part Number - AC - 00 Standard Options - ACME 951753 Rev B Section E 0.009 Section D - Section C SP980 SIL-PAD * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Section B With a field-proven history of reliability, Sil-Pad 980 is Bergquist's best material for cut-through resistance in screw-mounted and other applications with cut-through problems. 10 TO-220 Thermal Performance (C/W) 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A In addition to excellent heat transfer and dielectric properties, Sil-Pad 980 is specially formulated for high resistance to crushing and cut-through typically found in high-pressure applications where surface imperfections such as burrs and dents are inherently common (e.g. heavily-machined metal surfaces manufactured from extrusions or castings). TEST METHOD Visual NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009" SP980 = Sil-Pad 980 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 57 SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 56 Sil-Pad 1100ST (R) Affordable, Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material Features and Benefits * Inherent tack on both sides for exceptional thermal performance and easy placement * Re-positionable for higher utilization, ease of use and assembly error reduction TYPICAL PROPERTIES OF SIL-PAD 1100ST PROPERTY Color IMPERIAL VALUE Yellow METRIC VALUE Yellow TEST METHOD Visual Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.012 0.305 ASTM D374 Inherent Surface Tack (1or 2 sided) 2 2 -- * Lined on both sides for ease of handling prior to placement in high volume assemblies Hardness (Shore 00) (1) 85 85 ASTM D2240 Breaking Strength (lb/inch) / (kN/m) 2.6 0.5 ASTM D1458 Elongation (% - 45 to Warp and Fill) 16 16 ASTM D412 * Exhibits exceptional thermal performance even at a low mounting pressure Tensile Strength (psi) / (MPa) 220 1.5 ASTM D412 -76 to 356 -60 to 180 -- * Fiberglass reinforced ELECTRICAL Dielectric Breakdown Voltage (Vac) 5000 5000 ASTM D149 * Valve alternative to Sil-Pad 1500ST Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150 Volume Resistivity (Ohm-meter) 10 10 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 1.1 1.1 ASTM D5470 Continuous Use Temp (F) / (C) THERMAL PERFORMANCE VS. 10 10 PRESSURE Pressure (psi) TO-220 Thermal Performance (C/W) 10 2.72 25 2.71 50 2.68 100 2.62 200 2.23 Thermal Impedance (C-in2/W) (2) 0.75 0.71 0.66 0.61 0.57 SIL-PAD 1) Thirty second delay value Shore 00 hardness scale. 2) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Sil-Pad 1100ST (Soft Tack) is a fiberglassreinforced thermal interface material featuring inherent tack on both sides.The material exhibits excellent thermal performance at low mounting pressures.The material is supplied on two liners for exceptionally easy handling prior to auto-placement in high-volume assemblies.The material is ideal for placement between an electronic power device and its heat sink. Typical Applications Include: * Automotive ECMs * Motor controls * Power supplies * Between an electronic power device and its heat sink Configurations Available: * Sheet form, die-cut parts and roll form * Top and bottom liners Building a Part Number Standard Options Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 58 SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 57 Sil-Pad A1500 (R) Electrically Insulating,Thermally Conductive Elastomeric Material Features and Benefits * Thermal impedance: 0.42C-in2/W (@50 psi) * Elastomeric compound coated on both sides TYPICAL PROPERTIES OF SIL-PAD A1500 PROPERTY Color IMPERIAL VALUE Green METRIC VALUE Green Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.010 0.254 ASTM D374 Hardness (Shore A) 80 80 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 65 12 ASTM D1458 Elongation (% - 45 to Warp and Fill) 40 40 ASTM D412 -76 to 356 -60 to 180 -- Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) 6000 ASTM D149 7.0 7.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 3.03 2.62 2.21 1.92 1.78 Thermal Impedance (C-in2/W) (1) 0.59 0.50 0.42 0.34 0.31 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Power supplies * Automotive electronics * Motor controls * Power semiconductors Configurations Available: SIL-PAD * Sheet form, die-cut parts, and roll form * With or without pressure sensitive adhesive Building a Part Number - AC - 12/250 - Standard Options NA Section E 0.010 Section D - Section C SPA1500 Section B Sil-Pad A1500 performs well under clamping pressure up to 200 psi and is an excellent choice for high performance applications requiring electrical isolation and cut-through resistance. 6000 Dielectric Constant (1000 Hz) Section A Bergquist Sil-Pad A1500 is a silicone-based, thermally conductive and electrically insulating material. It consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer. TEST METHOD Visual NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.010" SPA1500 = Sil-Pad A1500 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 59 SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 58 Sil-Pad 1500ST (R) Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material Features and Benefits * Thermal impedance: 0.23C-in2/W (@50 psi) * Naturally tacky on both sides * Pad is repositionable * Excellent thermal performance * Auto-placement and dispensable TYPICAL PROPERTIES OF SIL-PAD 1500ST PROPERTY Color IMPERIAL VALUE Blue METRIC VALUE Blue Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.008 0.203 ASTM D374 Hardness (Shore 00) 75 75 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 1.9 0.34 ASTM D1458 Elongation (% - 45 to Warp and Fill) 22 22 ASTM D412 Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) 238 1.6 ASTM D412 -76 to 356 -60 to 180 -- ASTM D149 ELECTRICAL Dielectric Breakdown Voltage (Vac) Bergquist Sil-Pad 1500ST (Soft Tack) is a fiberglass reinforced thermal interface material that is naturally tacky on both sides. Sil-Pad 1500ST exhibits superior thermal performance when compared to the competitors' thermal interface materials. Sil-Pad 1500ST is supplied in sheet or roll form for exceptional auto-dispensing and auto-placement in high volume assemblies. Sil-Pad 1500ST is intended for placement between an electronic power device and its heat sink. TEST METHOD Visual 3000 3000 Dielectric Constant (1000 Hz) 6.1 6.1 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 1.8 1.8 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 1.54 1.52 1.51 1.49 1.46 Thermal Impedance (C-in2/W) (1) 0.37 0.28 0.23 0.21 0.20 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Power supplies * Automotive electronics * Motor controls Configurations Available: SIL-PAD * Sheet form, die-cut parts and slit-to-width roll form * Also available in 12 mil thickness Building a Part Number Standard Options NA Section E - 1012 - Section D - 02 Section C 0.008 Section B Section A SP1500ST - NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls (8 mil only), or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.008", 0.012" SP1500ST = Sil-Pad 1500ST Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 60 SPDG_Chapter2_10.06.qxp 10/20/2006 11:26 AM Page 59 Sil-Pad 1750 (R) For High Humidity, High Dielectric (U.L. 94 1950, IEC 950) Requirements Features and Benefits * Thermal impedance: 0.53C-in2/W (@50 psi) * Excellent dielectric strength retention after humidity exposure * Elastomeric pad TYPICAL PROPERTIES OF SIL-PAD 1750 PROPERTY Color IMPERIAL VALUE Green METRIC VALUE Green Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.012 0.305 ASTM D374 Hardness (Shore A) 85 85 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 65 12 ASTM D1458 Elongation (% - 45 to Warp and Fill) 23 23 ASTM D412 1500 10 ASTM D412 -76 to 356 -60 to 180 -- ASTM D149 Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) 6000 4.0 4.0 ASTM D150 Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 2.2 2.2 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 3.11 2.87 2.42 2.08 1.90 Thermal Impedance (C-in2/W) (1) 0.86 0.68 0.53 0.39 0.28 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * High-voltage power supplies * Motor controls * High "hi-pot" requirements Configurations Available: Building a Part Number - AC - 1212 - Standard Options NA Section E 0.012 Section D - Section C SP1750 SIL-PAD * Sheet form and die-cut parts * With or without pressure sensitive adhesive Section B Sil-Pad 1750 relies on processes that minimize the effect of high humidity on the electrical properties of finished material.Therefore, exposure to humid environments during assembly, or over long-term operating conditions, will not severely affect the ability of the material to perform. 6000 Dielectric Constant (1000 Hz) Section A The combination of high thermal conductivity and excellent dielectric strength retention after humidity exposure is formulated into the Sil-Pad 1750 elastomeric pad. TEST METHOD Visual NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.012" SP1750 = Sil-Pad 1750 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 61 SPDG_Chapter3_10.06.qxp 10/20/2006 4:43 PM Page 59 Sil-Pad 2000 (R) Higher Performance, High Reliability Insulator Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 2000 * Thermal impedance: 0.33C-in2/W (@50 psi) * Optimal heat transfer * High thermal conductivity: 3.5 W/m-K PROPERTY Color IMPERIAL VALUE White Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.010 to 0.015 0.254 to 0.381 ASTM D374 Hardness (Shore A) 90 90 ASTM D2240 -76 to 392 -60 to 200 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) 4000 4000 ASTM D149 Dielectric Constant (1000 Hz) 4.0 4.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 3.5 3.5 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 0.07 0.26 0.03 0.10 1.37 Thermal Impedance (C-in2/W) (1) 0.57 0.43 0.33 0.25 0.20 * Power supplies * Power semiconductors * CAGE Number 55285 * Aerospace * Motor controls * U.L. File Number E59150 * Military Electronics * Avionics Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive - 0.010 - AC - 00 - NA Section E 24 hrs. @ 175C No Post Cure 200 1.65 Section D %CVCM (0.1% Max. Acceptable) 100 2.02 Section C % TML (1.0% Max. Acceptable) 50 2.32 Typical Applications Include: SP2000 Post Cure Conditions 25 2.61 Section B Outgassing Data for Spacecraft Materials 10 TO-220 Thermal Performance (C/W) 1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A SIL-PAD Sil-Pad 2000 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix.The result is a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications. TEST METHOD Visual Reinforcement Carrier Continuous Use Temp (F) / (C) Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and commercial applications. In these applications, Sil-Pad 2000 complies with military standards. METRIC VALUE White NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.010", 0.015" SP2000 = Sil-Pad 2000 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Building a Part Number Standard Options Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 62 SPDG_Chapter3_10.06.qxp 10/23/2006 10:26 AM Page 60 Sil-Pad A2000 (R) Higher Performance, High Reliability Insulator Features and Benefits * Thermal impedance: 0.32C-in2/W (@50 psi) * Optimal heat transfer * High thermal conductivity: 3.0 W/m-K TYPICAL PROPERTIES OF SIL-PAD A2000 PROPERTY Color IMPERIAL VALUE White METRIC VALUE White TEST METHOD Visual Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.015 to 0.020 0.381 to 0.508 ASTM D374 90 90 ASTM D2240 Hardness (Shore A) Heat Capacity (J/g-K) Continuous Use Temp (F) / (C) 1.0 1.0 ASTM E1269 -76 to 392 -60 to 200 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) 4000 4000 ASTM D149 Dielectric Constant (1000 Hz) 7.0 7.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 3.0 3.0 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 25 50 100 200 2.05 1.94 1.86 1.79 1.72 Thermal Impedance (C-in2/W) 0.015" (1) 0.53 0.40 0.32 0.28 0.26 Typical Applications Include: * Motor drive controls * Avionics * High-voltage power supplies * Power transistor / heat sink interface Configurations Available: Building a Part Number - 00 - 1012 - Standard Options NA Section E 0.015 Section D - Section C SPA2000 SIL-PAD * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Section B This thermally conductive silicone elastomer is formulated to maximize the thermal and dielectric performance of the filler/binder matrix.The result is a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high reliability electronic packaging applications. 10 TO-220 Thermal Performance (C/W) 0.015" 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A Sil-Pad A2000 is a conformable elastomer with very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks. Sil-Pad A2000 is for applications where optimal heat transfer is a requirement. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.015", 0.020" SPA2000 = Sil-Pad A2000 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 63 SPDG_Chapter3_10.06.qxp 10/20/2006 1:38 PM Page 61 Sil-Pad K-4 (R) The Original Kapton(R)-Based Insulator Features and Benefits * Thermal impedance: 0.48C-in2/W (@50 psi) * Withstands high voltages * High dielectric strength * Very durable TYPICAL PROPERTIES OF SIL-PAD K-4 PROPERTY Color IMPERIAL VALUE Gray METRIC VALUE Gray Reinforcement Carrier Kapton Kapton -- Thickness (inch) / (mm) 0.006 0.152 ASTM D374 Hardness (Shore A) 90 90 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458 Elongation (%) 40 40 ASTM D412 Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) 5000 34 ASTM D412 -76 to 356 -60 to 180 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149 Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150 Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257 VTM-O VTM-O U.L.94 0.9 0.9 ASTM D5470 Flame Rating THERMAL Thermal Conductivity (W/m-K) Sil-Pad K-4 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. Sil-Pad K-4 combines the thermal transfer properties of well-known Sil-Pad rubber with the physical properties of a film. Sil-Pad K-4 is a durable insulator that withstands high voltages and requires no thermal grease to transfer heat. Sil-Pad K-4 is available in customized shapes and sizes. TEST METHOD Visual THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 3.66 3.43 3.13 2.74 2.42 Thermal Impedance (C-in2/W) (1) 1.07 0.68 0.48 0.42 0.38 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Power supplies * Power semiconductors * Motor controls * CAGE Number 55285 Configurations Available: SIL-PAD * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number - 12/250 - Standard Options NA Section E - 00 Section D 0.006 Section C - Section B Section A SPK4 NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.006" SPK4 = Sil-Pad K4 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others. Kapton(R) is a registered trademark of DuPont. 64 SPDG_Chapter3_10.06.qxp 10/20/2006 1:38 PM Page 62 Sil-Pad K-6 (R) The Medium Performance Kapton(R)-Based Insulator Features and Benefits * Thermal impedance: 0.49C-in2/W (@50 psi) * Physically strong dielectric barrier against cut-through * Medium performance film TYPICAL PROPERTIES OF SIL-PAD K-6 PROPERTY Color IMPERIAL VALUE Bluegreen METRIC VALUE Bluegreen TEST METHOD Visual Reinforcement Carrier Kapton Kapton -- Thickness (inch) / (mm) 0.006 0.152 ASTM D374 Hardness (Shore A) 90 90 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458 Elongation (%) 40 40 ASTM D412 5000 34 ASTM D412 -76 to 356 -60 to 180 -- Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149 Dielectric Constant (1000 Hz) 4.0 4.0 ASTM D150 Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257 VTM-O VTM-O U.L.94 1.1 1.1 ASTM D5470 Flame Rating THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 3.24 3.03 2.76 2.45 2.24 Thermal Impedance (C-in2/W) (1) 0.82 0.62 0.49 0.41 0.36 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Power supplies * Power semiconductors * Motor controls * CAGE Number 55285 Configurations Available: Building a Part Number Standard Options NA Section E - AC - 12/250 - Section D 0.006 Section C - Section B SPK6 SIL-PAD * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Section A Sil-Pad K-6 is a medium performance, filmbased thermally conductive insulator.The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier against "cut-through" and resultant assembly failures. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.006" SPK6 = Sil-Pad K6 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others Kapton(R) is a registered trademark of DuPont. 65 SPDG_Chapter3_10.06.qxp 10/20/2006 1:38 PM Page 63 Sil-Pad K-10 (R) The High Performance Kapton(R)-Based Insulator Features and Benefits * Thermal impedance: 0.41C-in2/W (@50 psi) * Tough dielectric barrier against cut-through * High performance film * Designed to replace ceramic insulators TYPICAL PROPERTIES OF SIL-PAD K-10 PROPERTY Color IMPERIAL VALUE Beige METRIC VALUE Beige Reinforcement Carrier Kapton Kapton -- Thickness (inch) / (mm) 0.006 0.152 ASTM D374 Hardness (Shore A) 90 90 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458 Elongation (%) 40 40 ASTM D412 Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) 5000 34 ASTM D412 -76 to 356 -60 to 180 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149 Dielectric Constant (1000 Hz) 3.7 3.7 ASTM D150 Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257 VTM-O VTM-O U.L.94 1.3 1.3 ASTM D5470 Flame Rating THERMAL Thermal Conductivity (W/m-K) Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as Beryllium Oxide, Boron Nitride and Alumina. Ceramic insulators are expensive and they break easily. Sil-Pad K-10 eliminates breakage and costs much less than ceramics. TEST METHOD Visual THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 2.35 2.19 2.01 1.87 1.76 Thermal Impedance (C-in2/W) (1) 0.86 0.56 0.41 0.29 0.24 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Power supplies * Power semiconductors * Motor controls * CAGE Number 55285 Configurations Available: SIL-PAD * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number Standard Options NA Section E - AC - 1212 - Section D 0.006 Section C - Section B Section A SPK10 NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.006" SPK10 = Sil-Pad K10 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others. Kapton(R) is a registered trademark of DuPont. 66 SPDG_Chapter3_10.06.qxp 10/20/2006 1:38 PM Page 64 Q-Pad II (R) Foil-Format Grease Replacement for Maximum Heat Transfer Features and Benefits * Thermal impedance: 0.22C-in2/W (@50 psi) * Maximum heat transfer * Aluminum foil coated both sides * Designed to replace thermal grease TYPICAL PROPERTIES OF Q-PAD II PROPERTY Color IMPERIAL VALUE Black METRIC VALUE Black Reinforcement Carrier Aluminum Aluminum -- Thickness (inch) / (mm) 0.006 0.152 ASTM D374 Hardness (Shore A) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) 93 93 ASTM D2240 -76 to 356 -60 to 180 -- Non-Insulating Non-Insulating ASTM D149 Dielectric Constant (1000 Hz) NA NA ASTM D150 Volume Resistivity (Ohm-meter) 10 2 10 2 ASTM D257 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 2.5 2.5 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) Q-Pad II is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber.The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. Q-Pad II is the ideal thermal interface material to replace messy thermal grease compounds. 10 25 50 100 200 TO-220 Thermal Performance (C/W) 2.44 1.73 1.23 1.05 0.92 Thermal Impedance (C-in2/W) (1) 0.52 0.30 0.22 0.15 0.12 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: * Between a transistor and a heat sink * Between two large surfaces such as an L-bracket and the chassis of an assembly * Between a heat sink and a chassis * Under electrically isolated power modules or devices such as resistors, transformers and solid state relays Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number SIL-PAD Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, Q-Pad II can be used prior to these operations. Q-Pad II also eliminates dust collection which can cause possible surface shorting or heat buildup. TEST METHOD Visual Standard Options Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 67 SPDG_Chapter3_10.06.qxp 10/20/2006 1:38 PM Page 65 Q-Pad 3 (R) Glass-Reinforced Grease Replacement Thermal Interface Features and Benefits * Thermal impedance: 0.35C-in2/W (@50 psi) * Eliminates processing constraints typically associated with grease * Conforms to surface textures * Easy handling * May be installed prior to soldering and cleaning without worry TYPICAL PROPERTIES OF Q-PAD 3 PROPERTY Color IMPERIAL VALUE Black METRIC VALUE Black Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.005 0.127 ASTM D374 Hardness (Shore A) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) TEST METHOD Visual 86 86 ASTM D2240 -76 to 356 -60 to 180 -- Non-Insulating Non-Insulating ASTM D149 Dielectric Constant (1000 Hz) NA NA ASTM D150 Volume Resistivity (Ohm-meter) 10 2 10 2 ASTM D257 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 2.26 1.99 1.76 1.53 1.30 Thermal Impedance (C-in2/W) (1) 0.65 0.48 0.35 0.24 0.16 Bergquist Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. Q-Pad 3 may be installed prior to soldering and cleaning without worry.When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Typical Applications Include: Fiberglass reinforcement enables Q-Pad 3 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application. * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive * Between a transistor and a heat sink * Between two large surfaces such as an L-bracket and the chassis of an assembly * Between a heat sink and a chassis * Under electrically isolated power modules or devices such as resistors, transformers and solid state relays Configurations Available: Building a Part Number Standard Options NA Section E - AC - 12/250 - Section D 0.005 Section C - Section B Q3 Section A SIL-PAD 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.005" Q3 = Q-Pad 3 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 68 SPDG_Chapter3_10.06.qxp 10/20/2006 1:38 PM Page 66 Poly-Pad 400 (R) Polyester-Based,Thermally Conductive Insulation Material Features and Benefits * Thermal impedance: 1.13C-in2/W (@50 psi) * Polyester based * For applications requiring conformal coatings * Designed for silicone-sensitive standard applications TYPICAL PROPERTIES OF POLY-PAD 400 PROPERTY Color IMPERIAL VALUE Tan METRIC VALUE Tan Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.009 0.229 ASTM D374 Hardness (Shore A) 90 90 ASTM D2240 Breaking Strength (lbs/inch)/(kN/m) 100 18 ASTM D1458 Elongation(% - 45 to Warp and Fill) 10 10 ASTM D412 7000 48 ASTM D412 Continuous Use Temp (F) / (C) -4 to 302 -20 to 150 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) Tensile Strength (psi) / (MPa) 2500 2500 ASTM D149 Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 THERMAL Thermal Conductivity (W/m-K) 0.9 0.9 ASTM D5470 Flame Rating V-O V-O U.L. 94 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 25 50 100 200 5.85 5.61 5.13 4.59 4.12 Thermal Impedance (C-in2/W) (1) 1.62 1.35 1.13 086 0.61 Typical Applications Include: * Power supplies * Automotive electronics * Motor controls * Power semiconductors Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive * We produce thousands of specials.Tooling charges vary depending on tolerances and the complexity of the part. Building a Part Number - 1212 - Standard Options NA Section E - 00 Section D 0.009 Section C - Section B PP400 NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009" PP400 = Poly-Pad 400 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 69 SIL-PAD Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm and certain aerospace applications). Poly-Pads are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad family offers a complete range of performance characteristics to match individual applications. 10 TO-220 Thermal Performance (C/W) 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A Poly-Pad 400 is a fiberglass-reinforced insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. TEST METHOD Visual SPDG_Chapter3_10.06.qxp 10/20/2006 1:38 PM Page 67 Poly-Pad 1000 (R) Polyester-Based,Thermally Conductive Insulation Material Features and Benefits * Thermal impedance: 0.82C-in2/W (@50 psi) * Polyester based * For applications requiring non-silicone conformal coatings * Designed for silicone-sensitive applications requiring high performance TYPICAL PROPERTIES OF POLY-PAD 1000 PROPERTY Color IMPERIAL VALUE Yellow METRIC VALUE Yellow Reinforcement Carrier Fiberglass Fiberglass -- Thickness (inch) / (mm) 0.009 0.229 ASTM D374 Hardness (Shore A) 90 90 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 100 18 ASTM D1458 Elongation (%) 10 10 ASTM D412 7000 48 ASTM D412 -4 to 302 -20 to 150 -- Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) 2500 2500 ASTM D149 Dielectric Constant (1000 Hz) 4.5 4.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 THERMAL Thermal Conductivity (W/m-K) 1.2 1.2 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 25 50 100 200 4.70 4.25 3.74 3.27 2.89 Thermal Impedance (C-in2/W) (1) 1.30 1.02 0.82 0.61 0.43 Typical Applications Include: * Power supplies * Automotive electronics * Motor controls * Power semiconductors Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number - 00 - 1212 - Standard Options NA Section E 0.009 Section D - Section C PP1000 Section B Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm and certain aerospace applications). Poly-Pads are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad family offers a complete range of performance characteristics to match individual applications. 10 TO-220 Thermal Performance (C/W) 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A SIL-PAD Poly-Pad 1000 is a fiberglass-reinforced insulator coated with a filled polyester resin. The material offers superior thermal resistance for high performance applications. TEST METHOD Visual NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.009" PP1000 = Poly-Pad 1000 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others 70 SPDG_Chapter3_10.06.qxp 10/20/2006 1:38 PM Page 68 Poly-Pad K-4 (R) Polyester-Based,Thermally Conductive Insulation Material Features and Benefits * Thermal impedance: 0.95C-in2/W (@50 psi) * Polyester based * For applications requiring non-silicone conformal coatings * Designed for silicone-sensitive applications * Excellent dielectric and physical strength TYPICAL PROPERTIES OF POLY-PAD K-4 PROPERTY Color IMPERIAL VALUE Tan METRIC VALUE Tan TEST METHOD Visual Reinforcement Carrier Kapton Kapton -- Thickness (inch) / (mm) 0.006 0.152 ASTM D374 Hardness (Shore A) 90 90 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458 Elongation (%) 40 40 ASTM D412 5000 34 ASTM D412 -4 to 302 -20 to 150 -- Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149 Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150 Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257 Flame Rating V-O V-O U.L.94 0.9 0.9 ASTM D5470 THERMAL Thermal Conductivity (W/m-K) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 50 100 200 5.04 4.34 3.69 3.12 Thermal Impedance (C-in2/W) (1) 1.55 1.21 0.95 0.70 0.46 Typical Applications Include: * Power supplies * Motor controls * Power semiconductors Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number - 12/250 - Standard Options NA Section E - 00 Section D 0.006 Section C - Section B PPK4 SIL-PAD Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm and certain aerospace applications). Poly-Pads are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad family offers a complete range of performance characteristics to match individual applications. 25 5.64 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A Poly-Pad K-4 is a composite of film coated with a polyester resin.The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. 10 TO-220 Thermal Performance (C/W) NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.006" PPK4 = Poly-Pad K-4 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others Kapton(R) is a registered trademark of DuPont. 71 SPDG_Chapter3_10.06.qxp 10/20/2006 1:39 PM Page 69 Poly-Pad K-10 (R) Polyester-Based,Thermally Conductive Insulation Material Features and Benefits * Thermal impedance: 0.60C-in2/W (@50 psi) * Polyester based * For applications requiring non-silicone conformal coatings * Designed for silicone-sensitive applications * Excellent dielectric strength and thermal performance TYPICAL PROPERTIES OF POLY-PAD K-10 PROPERTY Color IMPERIAL VALUE Yellow METRIC VALUE Yellow Reinforcement Carrier Kapton Kapton -- Thickness (inch) / (mm) 0.006 0.152 ASTM D374 Hardness (Shore A) 90 90 ASTM D2240 Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458 Elongation (%) 40 40 ASTM D412 Tensile Strength (psi) / (MPa) Continuous Use Temp (F) / (C) 5000 34 ASTM D412 -4 to 302 -20 to 150 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149 Dielectric Constant (1000 Hz) 3.7 3.7 ASTM D150 Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 1.3 1.3 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 25 50 100 200 3.76 3.35 2.75 2.30 2.03 Thermal Impedance (C-in2/W) (1) 1.04 0.80 0.60 0.43 0.30 Typical Applications Include: * Power supplies * Motor controls * Power semiconductors Configurations Available: * Sheet form, die-cut parts and roll form * With or without pressure sensitive adhesive Building a Part Number - AC - 1212 - Standard Options NA Section E 0.006 Section D - Section C PPK10 Section B Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. Poly-Pads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm and certain aerospace applications). Poly-Pads are constructed with ceramic-filled polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad family offers a complete range of performance characteristics to match individual applications. 10 TO-220 Thermal Performance (C/W) 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A SIL-PAD Poly-Pad K-10 is a composite of film coated with a polyester resin.The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2C-in2/W as well as excellent dielectric strength. TEST METHOD Visual NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.006" PPK10 = Poly-Pad K-10 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others Kapton(R) is a registered trademark of DuPont. 72 SPDG_Chapter3_10.06.qxp 10/20/2006 1:39 PM Page 70 Sil-Pad Tubes (R) Silicone-Based,Thermally Conductive Tubes Features and Benefits * Thermal conductivity: SPT 400 - 0.9 W/m-K SPT 1000 - 1.2 W/m-K * For clip-mounted plastic power packages TYPICAL PROPERTIES OF SIL-PAD TUBE 400 PROPERTY Color IMPERIAL VALUE Gray/Green METRIC VALUE Gray/Green 0.012 0.30 ASTM D374 80 80 ASTM D2240 Thickness / Wall (inch) / (mm) Hardness (Shore A) Breaking Strength (lbs/inch) / (kN/m) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) TEST METHOD Visual 6 1 ASTM D1458 -76 to 356 -60 to 180 -- 5000 5000 ASTM D149 Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 0.9 0.9 ASTM D5470 Thermal Impedance (C-in2/W) (1) 0.6 0.6 ASTM D5470 TYPICAL PROPERTIES OF SIL-PAD TUBE 1000 SPT 400 and SPT 1000 (Sil-Pad Tubes) provide thermally conductive insulation for clipmounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube 1000 is best suited for higher thermal performance. Sil-Pad Tube 400 is ideal for applications requiring average thermal conductivity and economy. Sil-Pad Tube 400 and Sil-Pad Tube 1000 are designed to meet VDE, U.L. and TUV agency requirements. * Clip-mounted power semiconductors * TO-220,TO-218,TO-247 and TO-3P Configurations Available: * TO-220,TO-218,TO-247 and TO-3P Special thickness and diameters can also be ordered. Please contact Bergquist Sales. IMPERIAL VALUE Brown METRIC VALUE Brown 0.012 0.30 ASTM D374 80 80 ASTM D2240 Thickness / Wall (inch) / (mm) Hardness (Shore A) TEST METHOD Visual Breaking Strength (lbs/inch) / (kN/m) 6 1 ASTM D1458 Continuous Use Temp (F) / (C) -76 to 356 -60 to 180 -- ELECTRICAL Dielectric Breakdown Voltage (Vac) 5000 5000 ASTM D149 Dielectric Constant (1000 Hz) 4.5 4.5 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 1.2 1.2 ASTM D5470 Thermal Impedance (C-in2/W) (1) 0.4 0.4 ASTM D5470 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. SIL-PAD Typical Applications Include: PROPERTY Color Standard Dimensions A = Wall Thickness: .30 mm (.012") + .10 mm/ -0.0 mm (+.004" / -0.0") B = Inner Diameter: 11 mm (.433") or 13.5 mm (.532") 1.0 mm ( .039") C = Length: 25 mm (.985") or 30 mm (1.18") +3.18 mm / -0.0 mm (+ .125" / - 0.0") Special lengths are available. For more information, contact a Bergquist Sales Representative. B Ordering Procedure: Sample: SPT 400 ___ - ___ - ___ "A" - "B" - "C" C A Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others. 73 SPDG_Chapter3_10.06.qxp 10/20/2006 1:39 PM Page 71 Sil-Pad Shield (R) Bonded Laminate of Sil-Pad with a Copper Shield Features and Benefits * Bonded laminate * Electrically isolating * Copper shield between layers of Sil-Pad * Pre-tinned 60/40 solder point for easy grounding PROBLEM: Radio Frequency Interference (RFI) is produced by heat sink current.The capacitance between a TO-3 encapsulated transistor and its heat sink is typically 100pf when a mica or other insulating washer is used. A power supply constructed with a standard insulator and a grounded heat sink can be expected to produce about 10 times more interference than is permitted. SIL-PAD SOLUTION: 1.The use of chokes, filters and LC networks which have to be designed into the circuitry. OR 2. Constructing a shield between the transistor and its heat sink by replacing the mica insulator with a Sil-Pad Shield (see illustration). 74 TYPICAL PROPERTIES OF SIL-PAD SHIELD PROPERTY Thickness / Total (inches) Shield / Copper Thickness (inches) Approx.Thermal Resistance (TO-3) (C/W) Min. Breakdown Voltage Between Device and Copper (Volts) Capacitance @ 1000 Hz and 5 Volts (pF) Dissipation Factor @ 1000 Hz and 5 Volts (Power Factor) Dielectric Constant @ 1000 Hz and 5 Volts Continuous Use Temp. (C) Recommended Torque (TO-3) (inch-pounds) VALUE 0.019 0.0015 0.85 - 1.0 4500 50 0.0155 5.5 -60 to 180 6-8 TEST METHOD *** *** *** ASTM D149 *** ASTM D150 ASTM D150 *** *** Typical Applications Include: * Switch mode power supplies * EMI / RFI shield between PCB's Configurations Available: Sil-Pad Shield is available in many custom configurations to meet special requirements.Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad Shield is a laminate of copper with Sil-Pad thermally conductive insulators. Sil-Pad Shield provides: * Shielding effectiveness of 50dB or higher * Good thermal transfer * Reduced labor costs due to the elimination of having to apply thermal grease Sil-Pad (R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others SPDG_Chapter3_10.06.qxp 10/20/2006 1:39 PM Page 72 Bond-Ply and Liqui-Bond Adhesives (R) (R) Bond-Ply Adhesive Tapes Liqui-Bond Liquid Adhesives Available in a pressure sensitive adhesive or laminating format, the Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion. Bergquist Liqui-Bond liquid adhesives are high performance, thermally conductive, liquid gap filling materials.These soft, form-in-place elastomers are ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Typical Bond-Ply Applications Typical Liqui-Bond Applications Features Features * High performance, thermally conductive, pressure sensitive adhesive * Excellent low and high temperature mechanical and chemical stability * Material immediately bonds to the target surface Benefits * Bond strength increases over time when repeatedly exposed to high continuous-use temperatures Before cure, Liqui-Bond flows under pressure like a grease. After cure, it bonds the components, eliminating the need for mechanical fasteners. Additional benefits include: Benefits * Provide an excellent dielectric barrier * Excellent wet-out to most types of component surfaces including plastic * Bond-Ply 400 is unreinforced to increase conformance and wet-out on low surface energy materials * Low modulus provides stress-absorbing flexibility * Supplied as a one-part material with an elevated temperature curing system * Offers infinite thickness with little or no stress during displacement * Eliminates need for specific pad thickness and die-cut shapes for individual applications * Eliminates need for screws, clip mounts or fasteners Options Options * Supplied in sheet, die-cut, roll and tabulated forms The growing Liqui-Bond family offers a variety of choices to meet the customer's performance, handling and process needs. Applications * Custom coated thickness Liqui-Bond products are intended for use in thermal interface applications where a structural bond is a requirement.This material is formulated for high cohesive and adhesive strength and cures to a low modulus.Typical applications include: Applications * Attach a heat sink to a graphics processing unit * Attach a heat spreader to a motor control PCB * Attach a heat sink to a power converter PCB * Attach a heat sink to a drive processor * Automotive electronics * Telecommunications * Computer and peripherals * Between any heat-generating semiconductor and a heat sink 75 BOND-PLY * Available in thickness range of 3 to 11 mil SPDG_Chapter3_10.06.qxp 10/20/2006 1:39 PM Page 73 Frequently Asked Questions Q: What is the primary difference between the A: Bond-Ply 660B and Bond-Ply 100 products? Bond-Ply 660B utilizes a dielectric film, replacing the fiberglass inherent in our Bond-Ply 100 series products.The addition of the film allows for high dielectric performance without additional product thickness. Q: How should I size my interface dimensions for Bond-Ply? A: Bond-Ply product testing has been completed on various interface materials.These tests have demonstrated that improper surface wet-out is the single largest variable associated with maximizing bond strength and heat transfer. Bergquist has found that reducing the size of the interface pad to roughly 80% of the total interface area actually improves the overall bonding performance while offering significant improvements in total package cooling. Bergquist offers three standard thicknesses for Bond-Ply 100 allowing each application to be optimized in three dimensions. Q: What application pressure is required to optimize bond strength with Bond-Ply? A: The answer to this varies from application to application, depending upon surface roughness and flatness. In general, pressure, temperature, and time are the primary variables associated with increasing surface contact or wet-out. Increasing the application time and/or pressure will significantly increase surface contact. Natural wet-out will continue to occur with Bond-Ply materials.This inherent action often increases bond strength by more than 2x within the first 24 hours. Q: Will Bond-Ply adhere to plastic packages? A: Adhesive performance on plastic packages is primarily a function of surface contact or wet-out. If surface contaminants such as plastic mold release oils are present, this will prevent contact and/or bonding to the surface. Make sure all surfaces are clean and dry prior to applying Bond-Ply materials. Q: How are one-part Liqui-Bond adhesives cured? A: Liqui-Bond SA 2000 and Liqui-Bond SA 1000 require heat to cure and bond in theapplication. Altering the bond line temperature and time can control the cure schedule.The components should not be moved during the curing process. Bond-Ply Comparison Data BOND-PLY (R) 76 SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 73 Bond-Ply 100 (R) Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape Features and Benefits Fiberglass Fiberglass -- 0.005, 0.008, 0.011 0.127, 0.203, 0.279 ASTM D374 Temp. Resistance, 30 sec. (F) / (C) 392 200 -- Elongation (%45 to Warp & Fill) 70 70 ASTM D412 Tensile Strength (psi) / (MPa) 900 6 ASTM D412 CTE (ppm) 325 325 ASTM D3386 Glass Transition (F) / (C) -22 -30 ASTM 1356 -22 to 248 -30 to 120 -- ADHESION Lap Shear @ RT (psi) / (MPa) 100 0.7 ASTM D1002 Lap Shear after 5 hr @ 100C 200 1.4 ASTM D1002 Lap Shear after 2 min @ 200C 200 1.4 ASTM D1002 Static Dead Weight Shear (F) / (C) 302 150 PSTC#7 ELECTRICAL Dielectric Breakdown Voltage - 0.005" (Vac) VALUE 3000 TEST METHOD ASTM D149 Dielectric Breakdown Voltage - 0.008" (Vac) 6000 ASTM D149 Dielectric Breakdown Voltage - 0.011" (Vac) 8500 ASTM D149 Flame Rating V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 0.8 ASTM D5470 Continuous Use Temp (F) / (C) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.005" 4.39 4.02 3.48 3.15 3.05 TO-220 Thermal Performance (C/W) 0.008" 5.11 4.69 4.53 4.45 4.38 TO-220 Thermal Performance (C/W) 0.011" 6.26 5.92 5.73 5.63 5.53 Thermal Impedance (C-in2/W) 0.005" (1) 0.78 0.61 0.58 0.55 0.54 Thermal Impedance (C-in2/W) 0.008" (1) 1.28 0.94 0.90 0.86 0.84 Thermal Impedance (C-in2/W) 0.011" (1) 2.47 1.22 1.19 1.14 1.11 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Building a Part Number - 0.008 - 00 - 1112 - Standard Options NA Section E Section A BP100 NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1112 = 11" x 12" sheets,11250 = 11" x 250' rolls or 00 = custom configuration 00 = No adhesive Standard thicknesses available: 0.005", 0.008", 0.011" BP100 = Bond-Ply 100 Material Note: To build a part number, visit our website at www.bergquistcompany.com. Bond-Ply (R): U.S. Patent 5,090,484 and others. 77 BOND-PLY Shelf Life: The double-sided, pressure sensitive adhesive used in Bond-Ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35C or 3-month shelf life at a maximum continuous storage temperature of 45C, for maintenance of controlled adhesion to the liner.The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60C. TEST METHOD Visual Thickness (inch) / (mm) Configurations Available: * Sheet form, roll form and die-cut parts METRIC VALUE White Reinforcement Carrier Section D * Mount heat sink onto BGA graphic processor or drive processor * Mount heat spreader onto power converter PCB or onto motor control PCB IMPERIAL VALUE White Section C Typical Applications Include: TYPICAL PROPERTIES OF BOND-PLY 100 PROPERTY Color Section B * Thermal impedance: 0.86C-in2/W (@100 psi) * High bond strength to a variety of surfaces * Double-sided, pressure sensitive adhesive tape * High performance, thermally conductive acrylic adhesive * Can be used instead of heat-cure adhesive, screw mounting or clip mounting SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 74 Bond-Ply 400 (R) Thermally Conductive, Unreinforced, Pressure Sensitive Adhesive Tape Features and Benefits * Thermal impedance: 0.87C-in2/W (@50 psi) * Easy application * Eliminates need for external hardware (screws, clips, etc.) * Available with easy release tabs TYPICAL PROPERTIES OF BOND-PLY 400 PROPERTY Color IMPERIAL VALUE White METRIC VALUE White 0.005 0.127 ASTM D374 -22 -30 ASTM E1356 -22 to 248 -30 to 120 -- ADHESION Lap Shear @ RT (psi) / (MPa) 100 0.7 ASTM D1002 Lap Shear after 5 hr @ 100C 200 1.4 ASTM D1002 Lap Shear after 2 min @ 200C 200 1.4 ASTM D1002 VALUE 3000 TEST METHOD ASTM D149 Flame Rating V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 0.4 ASTM D5470 Thickness (inch) / (mm) Glass Transition (F) / (C) Continuous Use Temp (F) / (C) ELECTRICAL Dielectric Breakdown Voltage (Vac) THERMAL PERFORMANCE vs PRESSURE Initial Assembly Pressure (psi for 5 seconds) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.005" 5.4 5.4 5.4 5.4 5.4 Thermal Impedance (C-in2/W) (1) BOND-PLY Building a Part Number 0.005 - 00 - 11/250 - Standard Options NA Section E - Section D BP400 Section C Secure: * Heat sink onto BGA graphic processor * Heat sink to computer processor * Heat sink onto drive processor * Heat spreader onto power converter PCB * Heat spreader onto motor control PCB Shelf Life: The double-sided pressure sensitive adhesive used in Bond-Ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35C, or 3-month shelf life at a maximum continuous storage temperature of 45C, for maintenance of controlled adhesion to the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60C. Section B Typical Applications Include: 0.87 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Section A Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape.The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain high bond strength to a variety of "low energy" surfaces, including many plastics, while maintaining high bond strength with long term exposure to heat and high humidity. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 11/250 = 11" x 250' rolls or 00 = custom configuration 00 = No adhesive Standard thicknesses available: 0.005" BP400 = Bond-Ply 400 Material Configurations Available: Note: To build a part number, visit our website at www.bergquistcompany.com. * Die-cut parts (supplied on rolls with easy release, protective tabs) Bond-Ply (R): U.S. Patent 5,090,484 and others. 78 TEST METHOD Visual SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 75 Bond-Ply 660B (R) Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape Features and Benefits * Designed to replace mechanical fasteners or screws * For applications that require electrical isolation * Double-sided pressure sensitive adhesive tape TYPICAL PROPERTIES OF BOND-PLY 660B PROPERTY Color IMPERIAL VALUE White METRIC VALUE White Reinforcement Carrier PEN Film PEN Film -- Thickness (inch) / (mm) 0.0055 0.14 ASTM D374 Temp. Resistance, 30 sec. (F) / (C) 392 200 -- Elongation (%) 40 40 ASTM D412 30000 210 ASTM D412 250 250 ASTM D3386 Tensile Strength (psi) / (MPa) CTE (ppm) FR-4 or Flex Circuit Bond-Ply 660B Metal Heat Spreader Bond-Ply 660B is a thermally conductive, electrically insulating, double-sided pressure sensitive adhesive tape.The tape consists of a high performance, thermally conductive acrylic adhesive coated on both sides of a PEN film. Use Bond-Ply 660B in applications to replace mechanical fasteners or screws. Typical Applications Include: Glass Transition (F) / (C) TEST METHOD Visual -22 -30 ASTM E1356 -22 to 248 -30 to 120 -- ADHESION Lap Shear @ RT (psi) / (MPa) 100 0.7 ASTM D1002 Lap Shear after 5 hr @ 100C 200 1.4 ASTM D1002 Lap Shear after 2 min @ 200C 200 1.4 ASTM D1002 Static Dead Weight Shear (F) / (C) 302 150 PSTC#7 ELECTRICAL Dielectric Breakdown Voltage (Vac) 7000 7000 ASTM D149 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 0.4 0.4 ASTM D5470 Continuous Use Temp (F) / (C) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 5.30 4.94 4.38 4.02 3.88 Thermal Impedance (C-in2/W) (1) 1.15 0.79 0.74 0.72 0.70 1) The ASTM D5470 (Bergquist modified) test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. * Mount heat sink onto BGA graphic processor * Mount heat sink onto drive processor * Mount heat spreader onto power converter PCB * Mount heat spreader onto motor control PCB Shelf Life: The double-sided pressure sensitive adhesive used in Bond-Ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35C, or 3-month shelf life at a maximum continuous storage temperature of 45C, for maintenance of controlled adhesion to the liner.The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60C. Configurations Available: Building a Part Number (R) NA Section E - 1112 - Section D Section C - 0.0055 - 00 Section B Section A BP660B Standard OptionsBond-Ply : NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration 00 = No adhesive Standard thicknesses available: 0.0055" BP660B = Bond-Ply 660B Material Note: To build a part number, visit our website at www.bergquistcompany.com. U.S. Patent 5,090,484 and others. 79 BOND-PLY * Roll form and die-cut parts The material as delivered will include a continuous base liner with differential release properties to allow simplicity in roll packaging and application assembly. SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 76 Liqui-Bond SA 1000 (One-Part) TM Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits * High thermal performance * Eliminates need for mechanical fasteners * Low viscosity for ease of screening or stenciling * Can achieve a very thin bond line * Mechanical and chemical stability * Maintains structural bond in severe-environment applications * Heat cure TYPICAL PROPERTIES OF LIQUI-BOND SA 1000 PROPERTY AS SUPPLIED Color IMPERIAL VALUE Black METRIC VALUE Black TEST METHOD Visual 125,000 125,000 ASTM B2196 2.4 2.4 ASTM D792 6 6 -- ASTM D2240 Viscosity (cps) (1) Density (g/cc) Shelf Life @ 10C (months) PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 75 75 -76 to 392 -60 to 200 -- Shear Strength (psi) / (MPa) 200 1.4 ASTM D1002 PROPERTY AS CURED - ELECTRICAL Dielectric Strength (V/mil) / (V/mm) 250 10,000 ASTM D149 Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L.94 PROPERTY AS CURED - THERMAL Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470 CURE SCHEDULE Pot Life @ 25C (hours) (2) 10 10 -- Cure @ 125C (minutes) (3) 20 20 -- Cure @ 150C (minutes) (3) 10 10 -- Continuous Use Temp (F) / (C) 1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25C. 2) Based on 1/8" diameter bead. 3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent. BOND-PLY * PCBA to housing * Discrete component to heat spreader Configurations Available: * With or without glass beads Building a Part Number - 00 - 30cc - Standard Options NA Section E 00 Section D - Section C LBSA1000 Section B Liqui-Bond SA 1000 features excellent low and high-temperature mechanical and chemical stability.The material's mild elastic properties assist in relieving CTE stresses during thermal cycling. Liqui-Bond SA 1000 contains no cure by-products, cures at elevated temperatures and requires refrigeration storage at 10C.The material is available in both tube and mid-sized container forms. Typical Applications Include: Section A Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it's structure even in severeenvironment applications. NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 30cc = 30.0cc, 600cc = 600.0cc (ml) Pail: 1G = 1-gallon, 5G = 5-gallon 00 = No adhesive 00 = No spacer beads 07 = 0.007" spacer beads LBSA1000 = Liqui-Bond SA 1000 Liquid Adhesive Material Note: To build a part number, visit our website at www.bergquistcompany.com. 80 SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 77 Liqui-Bond SA 2000 TM Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits METRIC VALUE Yellow TEST METHOD Visual 200,000 200,000 ASTM B2196 2.4 2.4 ASTM D792 6 6 -- ASTM D2240 Density (g/cc) Shelf Life @ 10C (months) PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 -76 to 392 -60 to 200 -- Shear Strength (psi) / (MPa) 200 1.4 ASTM D1002 PROPERTY AS CURED - ELECTRICAL Dielectric Strength (V/mil) / (V/mm) 250 10,000 ASTM D149 Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L.94 PROPERTY AS CURED - THERMAL Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470 CURE SCHEDULE Pot Life @ 25C (hours) (2) 24 24 -- Cure @ 125C (minutes) (3) 20 20 -- Cure @ 150C (minutes) (3) 10 10 -- Continuous Use Temp (F) / (C) 1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25C. 2) Based on 1/8" diameter bead. 3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent. Typical Applications Include: * PCBA to housing * Discrete component to heat spreader Configurations Available: * With or without glass beads Building a Part Number 00 - 00 - 30cc - Standard Options NA Section E - Section D LBSA2000 Section C Liqui-Bond SA 2000 features excellent low and high-temperature mechanical and chemical stability.The material's mild elastic properties assist in relieving CTE stresses during thermal cycling. Liqui-Bond SA 2000 cures at elevated temperatures and requires refrigeration storage at 10C. IMPERIAL VALUE Yellow Viscosity (cps) (1) Section B Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either tube or mid-sized container form. TYPICAL PROPERTIES OF LIQUI-BOND SA 2000 PROPERTY AS SUPPLIED Color Section A * High thermal conductivity: 2.0 W/m-K * Eliminates need for mechanical fasteners * One-part formulation for easy dispensing * Mechanical and chemical stability * Maintains structural bond in severe-environment applications * Heat cure NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 30cc = 30.0cc, 600cc = 600.0cc (ml) Pail: 1G = 1-gallon, 5G = 5-gallon 00 = No spacer beads 07 = 0.007" spacer beads LBSA2000 = Liqui-Bond SA 2000 Liquid Adhesive Material Note: To build a part number, visit our website at www.bergquistcompany.com. 81 BOND-PLY 00 = No adhesive SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 78 Assistance is Just a Click Away "TechChat" Online Technical Support Real-Time Response to Important Issues Facing Design Engineers, Engineering Managers and Product Specifiers. Need help selecting the right Bergquist thermal management product for your specific application needs? The Bergquist Company website features a service for designers, engineers and specifiers -- "TechChat," an online technical support service for anyone who desires immediate support via the web."TechChat" can be found at: www.bergquistcompany.com "TechChat" provides real-time answers to technical issues faced when designing and specifying thermal management materials, touch screens, membrane switches or electronic components. TechChat is available Monday Friday, 8am-5pm, CST. ORDERING From the simplest of questions to the most complex, Bergquist's seasoned professionals draw on the company's extensive experience with thermal management as well as membrane switch, touch screen and electronic component applications. 82 SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 79 Solutions for Surface Mount Applications Hi-Flow The Hi-Flow family of phase change materials offers an easy-to-apply thermal interface for many surface mount packages. At the phase change temperature, Hi-Flow materials change from a solid and flow with minimal applied pressure.This characteristic optimizes heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to replace messy thermal grease. Bergquist phase change materials are specially compounded to prevent pump-out of the interface area, which is often associated with thermal grease. Typical applications for Hi-Flow materials include: * Pentium(R), Athlon(R), Core 2 Duo and other high performance CPUs * DC/DC converters * Power modules Hi-Flow materials are manufactured with or without film or foil carriers. Custom shapes and sizes for non-standard applications are also available. Power Device Thermal Clad Hi-Flow High Power Application Hi-Flow with Thermal Clad Heat Spreader Heat Spreader Hi-Flow Processor FR-4 Board High Power Application Hi-Flow without Thermal Clad Sil-Pad Sil-Pad is the benchmark in thermal interface materials.The Sil-Pad family of materials are thermally conductive and electrically insulating. Available in custom shapes, sheets, and rolls, Sil-Pad materials come in a variety of thicknesses and are frequently used in SMT applications such as: * Interface between thermal vias in a PCB, and a heat sink or casting * Heat sink interface to many surface mount packages Power Device Sil-Pad or Bond-Ply FR-4 Heat Spreader ORDERING Mid Power Application with Bond-Ply or Sil-Pad Pentium(R) is a registered trademark of Intel Corporation. Athlon(R) is a registered trademark of Advanced Micro Devices, Inc. 83 SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 80 Where Thermal Solutions Come Together Bond-Ply and Liqui-Bond The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is available in a pressure sensitive adhesive or laminating format. Liqui-Bond is a high thermal performance liquid silicone adhesive that cures to a solid bonding elastomer. Bond-Ply provides for the mechanical decoupling of bonded materials with mismatched thermal coefficients of expansion.Typical applications include: * Bonding bus bars in a variety of electronic modules and sub assemblies * Attaching a metal-based component to a heat sink * Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages * Bonding flexible circuits to a rigid heat spreader or thermal plane * Assembly tapes for BGA heat spreader * Attaching PCB assemblies to housings Gap Pad and Gap Filler The Gap Pad product family offers a line of thermally conductive materials which are highly conformable.Varying degrees of thermal conductivity and compression deflection characteristics are available.Typical applications include: * On top of a semiconductor package such as a QFP or BGA. Often times, several packages with varying heights can use a common heat sink when utilizing Gap Pad * Between a PCB or substrate and a chassis, frame, or other heat spreader * Areas where heat needs to be transferred to any type of heat spreader * For interfacing pressure sensitive devices * Filling various gaps between heat-generating devices and heat sinks or housings Gap Pads are available in thickness of 0.010" to 0.250", and in custom shapes, with or without adhesive. Gap Fillers are available in cartridge or kit form. Power Device Gap Pad Heat Spreader FR-4 Board Lower Power Application with Gap Pad Top Efficiency In Thermal Materials For Today's Changing Technology. ORDERING Contact Bergquist for additional information regarding our Thermal Solutions.We are constantly innovating to offer you the greatest selection of options and flexibility to meet today's changing technology. 84 SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 81 Ordering Information Ordering Procedure: Rolls: The last 2 or 3 digits define the part number selected.The "foot print" and dimensions are shown on pages 87-95. Sil-Pad materials are available in roll form, with or without adhesive, with the exception of Sil-Pad 1750 and Sil-Pad 2000. Hi-Flow materials are available in roll form. Certain Gap Pad materials are available in roll form. Please contact Bergquist Sales for more information. Special Shapes: For applications requiring non-standard or custom Sil-Pad configurations, contact your Bergquist Sales Representative.We produce thousands of custom die shapes and designs. Bergquist adhesives include: SILICONE: Tolerances: Typical converting tolerances are held on length (L), width (W), hole diameter and hole location for most materials as noted below: TYPICAL SIL-PAD / HI-FLOW TOLERANCES <6" Length and Width Tolerance 0.010" Hole Location and Diameter 0.005" 6" - 12" 0.015" 0.010" >12" 0.020" TBD Part Dimension Adhesives: TYPICAL GAP PAD TOLERANCES Material Thickness Length and Width Tolerance Hole Location and Diameter 10 mil 0.015" 0.015" 15 mil 0.015" 0.015" 20 mil 0.020" 0.020" 40 mil 0.035" 0.035" 60 mil 0.050" 0.050" 80 mil 0.050" 0.050" 100 mil 0.060" 0.060" 125 mil 0.075" 0.075" 160 mil 0.100" 0.100" 200 mil 0.125" 0.125" 250 mil 0.160" 0.160" Note: Dependent upon material and application requirements, tighter tolerances may be feasible and available. Please contact Bergquist Sales for these requests and additional information regarding tolerances. (AC) - Unloaded (ACA) - Unloaded, Low Tack (TAC) - Loaded (Thermally Enhanced) ACRYLIC: (AAC) - Unloaded (TAAC) - Thermally Loaded (EAAC) - Thermally Enhanced THICKNESS: 0.0005" - 0.001", (12-25m) (adhesive only) Note: For non-symmetrical parts, please indicate on print which side the adhesive is on. Peel Strength: See data below. POL = Peel-Off Liner (force per unit width of the liner to the adhesive). QS = Quick Stick (simulated force per unit width of the adhesive to the heat sink). g/in = Grams per inch. TYPICAL ADHESIVE PROPERTIES ADHESIVE Silicone AC Silicone ACA Silicone TAC Acrylic AAC Acrylic TAAC Acrylic EAAC POL 50-150 g/in 5-70 g/in 50-150 g/in 5-70 g/in 5-70 g/in 5-60 g/in QS 50-150 g/in 5-150 g/in 50-150 g/in 100-800 g/in 100-400 g/in 100-200 g/in Note: These values are typical after the material has aged for 2-3 weeks and are significantly different immediately after coating. Upon completion of coating, QS is 250-500 g/in and POL is 3-20 g/in for all silicone adhesives. Shelf Life: Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70F (21C) and 50% relative humidity. Standard sheet size for most materials is 12" x 12", with or without adhesive as specified on the individual data sheet.When ordering sheets, please specify material type, thickness and include all dimensions. Contact Bergquist Sales if other sizes are required. Acrylic Adhesives: One (1) year from date of manufacture when stored in original packaging at 70F (21C) and 50% relative humidity. Note: Sil-Pad A2000 maximum sheet size is 10" x 12". Gap Pad standard sheet size is 8" x 16". Peel adhesion data is available upon request. Please contact Bergquist Sales for more information. 85 ORDERING Sheets: SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 82 Ordering Information Ordering Procedure: The last 2 or 3 digits define the part number selected.The "foot print" and dimensions are shown on pages 87-95. Special Shapes: Shelf Life: For applications requiring non-standard or custom Sil-Pad configurations, contact your Bergquist Sales Representative.We produce thousands of custom die shapes and designs. Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70F (21C) and 50% relative humidity. Tolerances: Typical converting tolerances are held on length (L), width (W), hole diameter and hole location for most materials as noted below: Sheets: Standard sheet size for most materials is 12" x 12", with or without adhesive as specified on the individual data sheet.When ordering sheets, please specify material type, thickness and include all dimensions. Contact Bergquist Sales if other sizes are required. Note: Sil-Pad A2000 maximum sheet size is 10" x 12". Gap Pad standard sheet size is 8" x 16". Acrylic Adhesives: One (1) year from date of manufacture when stored in original packaging at 70F (21C) and 50% relative humidity. Peel adhesion data is available upon request. Please contact Bergquist Sales for more information. PSA Characteristics: Standard pressure sensitive adhesive (AC) coated on one side of a Sil-Pad will increase the thermal resistance (per ASTM D5470) by 0.2C-in 2/W. Standard pressure sensitive adhesive on 2 sides increases the thermal impedance by 0.4C-in 2/W. Rolls: Thermally conductive pressure sensitive adhesive (TAC) on one side increases the thermal resistance by 0.05C-in 2/W and on two sides by 0.1C-in 2/W. Sil-Pad materials are available in roll form, with or without adhesive, with the exception of Sil-Pad 1750 and Sil-Pad 2000. Hi-Flow materials are available in roll form. Certain Gap Pad materials are available in roll form. Please contact Bergquist Sales for more information. The effect of AC and TAC on the thermal impedance in an application will vary. In low-pressure applications, the pressure sensitive adhesive will wet-out the interface easier and eliminate the interfacial thermal resistance. Adhesives: Bergquist adhesives include: SILICONE: (AC) - Unloaded (ACA) - Unloaded, Low Tack (TAC) - Loaded (Thermally Enhanced) ACRYLIC: (AAC) - Unloaded (TAAC) - Thermally Loaded (EAAC) - Thermally Enhanced THICKNESS: 0.0005" - 0.001", (12-25m) (adhesive only) Note: For non-symmetrical parts, please indicate on print which side the adhesive is on. Peel Strength: See data below. POL = Peel-Off Liner (force per unit width of the liner to the adhesive). ORDERING Note: These values are typical after the material has aged for 2-3 weeks and are significantly different immediately after coating. Upon completion of coating, QS is 250-500 g/in and POL is 3-20 g/in for all silicone adhesives. QS = Quick Stick (simulated force per unit width of the adhesive to the heat sink). g/in = Grams per inch. 86 Note: Bergquist adhesives are designed for ease of application during assembly. If an automated dispensing method is preferred, Bergquist will recommend manufacturers of automated dispensing equipment upon request. Please contact Bergquist Sales for more information on this subject. Note: Bergquist cannot be responsible for dispensing equipment selection and/or performance of specific materials on said equipment. It is the customer's responsibility to determine the suitability and compatibility of the specific Bergquist material with the selected equipment. SPDG_Chapt4_10.06.qxp 10/23/2006 12:47 PM Page 83 Sil-Pad Configurations (R) Imperial Measurements 4 Lead TO-66 Part Number Suffix "A" "B" "C" "D" "E" "F" "G" 1.312 .762 .140 .062 .960 .200 .100 Part Number Suffix "A" "B" -84 Plastic Power TO-220 Various -35 (Clip Mount) -43 TO-126 -50 Various -51 Various -52 TO-220 -54 TO-202 -55 Various -56 TO-220 -58 TO-126 -60 Various -61 TO-220 -62 Various -63 Various -64 TO-218 -68 Various -70 Various -90 Various -102 Various -103 Dimensions "C" .500 .500 .312 .562 .630 .500 .560 .562 .500 .312 .410 .600 .600 .385 .625 .810 .740 .650 .800 .160 .141 .140 .218 .230 .187 .245 .218 .187 .140 .225 .240 .240 .170 .200 .355 .200 .217 .150 093 .125 .093 .147 .125 .125 .125 .122 .156 .150 .115 .120 .145 .147 .160 .142 .160 Part Number Suffix "A" "B" "C" 1.500 2.500 .900 2.000 .150 .344 Part Number Suffix "A" "B" "C" .910 .983 .500 .750 .200 .432 Part Number Suffix "A" "B" "C" 1.000 .500 .200 Power Part Number Resistors Suffix "A" "B" "C" 1.187 2.093 .725 .805 1.150 1.965 1.205 1.265 .771 .890 1.180 1.236 .234 .265 .140 .127 .231 .198 TO-220 Part Number Multiples Suffix "A" "B" "C" 1.000 1.500 2.000 2.500 3.000 3.500 4.000 .750 .750 .750 .750 .750 .750 .750 .187 .187 .187 .187 .187 .187 .187 Part Number Suffix "A" "B" "C" 2.400 2.402 2.402 1.450 2.125 2.098 2.102 1.270 -67 -101 Plastic Power -57 -89 Plastic Power -66 RH-25 RH-50 RH-5 RH-10 RH-25 RH-50 2 Parts 3 Parts Power Module -94 -95 -96 -97 -98 -99 -34 -36 -37 -38 -39 -40 -41 -108 -140 -141 -142 4.600 4.598 2.279 2.280 Dimensions "D" 1.200 1.812 Dimensions "D" .125 .156 Dimensions "D" .141 Dimensions "D" .469 .530 .280 .250 .425 .404 Dimensions "D" .125 .125 .125 .125 .125 .125 .125 Dimensions "D" .500 0.500 0.488 0.490 "A" Various Various Various Various Various Various Various Various Various TO-3P Various Various Various Various Various Various Various Various Various -104 -107 -110 -114 -116 -117 -118 -119 -120 -122 -126 -128 -131 -132 -133 -134 -136 -137 -138 1.000 .810 .984 .827 .855 .827 .748 .437 .728 1.140 .945 .984 .709 .472 .866 .945 1.250 1.250 1.250 "E" "F" .450 1.000 .075 .156 "E" "F" "G" .580 .665 .046 .101 .265 .217 Dimensions "B" "C" .750 .910 .787 .945 .630 .709 .551 .311 .472 .810 .748 1.654 .512 .315 .709 .709 1.000 1.000 1.000 "E" "F" "G" "H" .626 .046 .219 .032 "D" .300 .170 .140 .147 .197 .228 .256 .217 .142 .157 .355 .256 .315 .177 .157 .256 .228 .150 .122 .126 .126 .110 .098 .147 .162 .157 .122 .126 .126 .126 .258 .258 .127 .148 "E" "F" "G" "H" "I" .212 .210 .140 .130 .190 .132 .156 .255 .156 .190 .270 .263 .719 1.563 .445 .551 .688 1.569 .781 .845 .491 .630 .800 .972 .140 .140 .093 .121 .147 .130 "E" "F" # of Holes .250 .250 .250 .250 .250 .250 .250 .500 .500 .500 .500 .500 .500 .500 2 3 4 5 6 7 8 "E" "F" 1.800 1.799 0.650 0.650 .125 0.150 0.150 0.130 ORDERING .710 .750 .437 .687 .855 .750 .610 .855 .750 .437 .750 .750 .750 .500 1.125 1.410 .860 .866 .750 Power Module Part Number Suffix "D" 87 SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 84 Sil-Pad Configurations (R) Imperial Measurements C D-DIA Multiwatt E Part Number Suffix "A" "B" -124 -125 .872 .866 .790 .787 .160 .157 .148 .118 x 45 .154 .079 x 45 Part Number Suffix "A" "B" "C" "D" "E" "F" 1.350 .800 .140 .400 .960 .480 B Dimensions "C" "D" "E" A Multi-Lead TO-66 -93 Diode Washer Part Number Suffix Various DO-4 DO-5 DO-4 (oversized) DO-5 (oversized) Various Various Various Various Part Number TO-36 -19 -20 -21 -22 -25 -26 -27 -28 -32 Suffix -08 Small Power Devices TO-5, 3 Holes TO-18, 3 Holes TO-18, 4 Holes TO-5, 4 Holes TO-5, 3 Holes TO-5, 4 Holes Rectifier Clip Mount TIP-36 Plastic Tip TO-3P Plastic Clip Power Module "A" 1.063 .140 .200 .260 .200 .260 .145 .115 .140 .500 Various Various Various DO-8 Various Various Various Various Various .360 .750 .800 .875 1.180 1.250 1.500 .512 .591 Dimensions "C" "D" "E" Dimensions "B" "C" .690 .190 Dimensions "B" "C" -09 -12 -13 -33 -44 -45 .360 .250 .250 .360 .390 .390 .200 .100 .100 .200 .200 .200 .040 .036 .036 .040 .040 .040 Part Number Suffix "A" Dimensions "B" "C" 1.250 1.125 1.000 1.250 1.125 1.000 Part Number Suffix "A" "B" -42 .984 .787 -53 -65 -73 .865 1.260 .984 .650 .787 .787 .650 .984 .708 "A" "B" "C" 2.510 1.614 1.260 1.102 .630 .551 "A" "B" "C" 1.450 .838 .612 .245 Dimensions "B" "C" "D" Part Number Suffix Part Number Suffix Dimensions "A" "B" -75 -76 -77 -78 -79 -80 -81 -82 -111 "A" -100 -123 SIP Package .510 .510 .800 .625 1.000 .812 .812 1.000 1.500 Part Number Suffix Part Number Suffix -46 -47 -48 TIP Packages Dimensions "A" "B" .260 .125 .190 .313 .515 .380 .200 .161 .217 .200 .140 .187 .205 .140 .142 .142 Dimensions "D" .305 .157 Dimensions "D" .205 .205 .205 "E" "F" "G" 1.900 1.220 .205 .118 .205 .118 "E" "F" "G" .960 .170 .120 "E" "F" "G" .960 .060 .125 C -105 D ORDERING B A E Part Number Suffix "A" -115 .472 Power Module Part Number Suffix F RAD (TYP) B C D Quarz (2) G Dia .197 "A" "B" 1.350 .642 .193 .031 Dimensions "C" "D" A -109 88 .321 .195 SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 85 Sil-Pad Configurations (R) TO-3 & TO-66 Part Number Style Suffix "A" "B" "C" 1.780 1.563 1.650 1.650 1.650 1.780 1.440 1.312 1.780 2.070 1.650 1.563 1.593 1.700 1.650 1.250 1.375 1.650 1.780 1.563 1.307 1.654 1.650 1.250 1.050 1.140 1.140 1.140 1.250 1.000 .762 1.250 1.560 1.140 1.050 1.100 1.187 1.065 .700 .825 1.140 1.248 1.051 .819 1.063 1.142 .140 .140 .122 .140 .165 .165 .140 .140 .140 .122 .140 .140 .156 .156 .140 .140 .140 .165 .165 .165 .165 .138 .165 Part Number Suffix "A" "B" 1.650 "F" "G" .430 .430 .430 .430 .430 .430 .200 .200 .430 .430 .430 .430 .430 .430 .430 .200 .200 .072 .072 .072 .072 .072 .072 .100 .100 .072 .072 .072 .072 .072 .072 .072 .100 .100 .063 .079 .063 .059 .142 1.187 1.187 1.187 1.187 1.187 1.187 .960 .960 1.187 1.187 1.187 1.187 1.187 1.187 1.187 .960 .960 1.187 1.185 1.185 .909 1.181 1.187 .429 .429 .236 .433 .429 .073 .073 .061 .071 ..072 "C" "D" Dimensions "E" "F" "G" "H" "I" 1.140 .140 .093 1.187 .430 .400 .155 .718 "B" "C" 1.560 1.563 1.050 1.050 .156 .156 Part Number Suffix "A" "B" "C" 1.655 1.187 .156 10 Lead Part Number TO-3 Suffix "A" "B" "C" 1.650 1.140 .165 Part Number Suffix "A" "B" "C" 1.275 .750 .156 Part Number Suffix "A" "B" "C" 1.440 1.000 .140 Part Number Suffix "A" "B" "C" .480 .165 3 Lead TO-3 Part Number Suffix "A" -92 4 Lead TO-3 F DIA. A D DIA. (4) -86 -87 B C DIA. (2) .093 .080 .062 .093 .062 .094 .075 .062 .046 .062 .046 .140 .062 .062 .046 .062 .062 Dimensions "D" .080 .063 "E" "F" "G" 1.170 1.187 .470 .470 72 72 "E" "F" "G" 1.187 40 .500 "E" "F" "G" "H" 1.187 .593 .500 32.7 "E" "F" "G" "H" .960 .200 .100 .200 "E" "F" "G" "H" .960 .480 .325 36 18 G E 8 Lead TO-3 -88 -91 3 Lead TO-66 -85 9 Lead TO-66 -83 E B Power Module -130 1.600 Dimensions "D" .060 Dimensions "D" .040 Dimensions "D" .100 Dimensions "D" .055 Dimensions "D" 1.197 ORDERING D C - DIA. (2) Dimensions "D" "E" -02 -03 -04 -05 -06 -07 -10 -11 -15 -16 -17 -18 -23 -24 -29 -30 -31 -59 Leadless -112 -113 -127 -129 -135 I Imperial Measurements "E" .240 A 89 SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 86 Hi-Flow 225 Configurations (R) Imperial Measurements Hi-Flow 225U Tab Configurations ("B") MATERIAL LINER -.500+.030 PSA STRIP .080+.000 .040 LINER ("B") ("A") Part Number Suffix "A" Dimensions ( .015) "B" "C" -143 1.500 1.500 2.500 5000 -144 1.378 1.378 2.378 5000 -145 1.250 1.250 2.250 5000 -146 1.000 1.000 2.000 7500 -147 .700 .700 1.700 10000 -148 .500 .500 1.500 15000 -149 .300 1.000 2.000 22500 Min. Pcs/Roll ("A") ("C") Hi-Flow 225UT/225FT Tab Configurations .750+.063 COLORED PSA TAPE LINER .500+.030 PSA STRIP MATERIAL ("B") .250+.125 CLEAR PSA TAPE .750+.063 LINER ("B") ("A") ("A") ORDERING ("C") 90 Part Number Suffix "A" Dimensions ( .015) "B" "C" -150 1.650 1.650 2.650 3000 -151 1.500 1.500 2.500 5000 -152 1.375 1.375 2.375 5000 -153 1.250 1.250 2.250 5000 -154 1.000 1.000 2.000 7500 -155 .700 .700 1.700 10000 -156 .500 .500 1.500 15000 Min. Pcs/Roll SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 87 Sil-Pad Configurations (R) Metric Measurements 4 Lead TO-66 Part Number Suffix "A" "B" "C" Dimensions "D" 33.32 19.35 3.56 1.57 Part Number Suffix "A" "B" -84 Plastic Power Various -35 (Clip Mount) -43 TO-126 -50 TO-220 Various -51 Various -52 TO-220 -54 TO-202 -55 Various -56 TO-220 -58 TO-126 -60 Various -61 TO-220 -62 Various -63 Various -64 TO-218 -68 Various -70 Various -90 Various -102 Various -103 Dimensions "C" 12.70 12.70 7.92 14.27 16.00 12.70 14.22 14.27 12.70 7.92 10.41 15.24 15.24 9.78 15.88 20.57 18.80 16.51 20.32 "A" "B" 38.10 63.50 22.86 50.80 3.81 8.74 30.48 46.02 Part Number Suffix "A" "B" "C" Dimensions "D" 23.11 24.97 12.70 19.05 5.08 10.97 Part Number Suffix "A" "B" 25.40 Power Part Number Resistors Suffix "A" Number Suffix -67 -101 Plastic Power "F" "G" 24.38 5.08 2.54 Part Number Suffix "D" 18.03 19.05 11.10 17.45 21.72 19.05 15.49 21.72 19.05 11.10 19.05 19.05 19.05 12.70 28.58 35.81 21.84 22.00 19.05 Power Module "E" 4.06 3.58 3.56 5.54 5.84 4.75 6.22 5.54 4.75 3.56 5.72 6.10 6.10 4.32 5.08 9.02 5.08 5.51 3.81 2.36 3.18 2.36 3.73 3.18 3.18 3.18 3.10 3.96 3.81 2.92 3.05 3.68 3.73 4.06 3.61 4.06 Dimensions "C" "D" Various Various Various Various Various Various Various Various Various TO-3P Various Various Various Various Various Various Various Various Various -104 -107 -110 -114 -116 -117 -118 -119 -120 -122 -126 -128 -131 -132 -133 -134 -136 -137 -138 "E" "F" 11.43 25.40 1.90 3.96 "A" 25.40 20.57 24.99 21.01 21.72 21.01 19.00 11.10 18.49 28.96 24.00 24.99 18.01 11.99 22.00 24.00 31.75 31.75 31.75 Dimensions "B" "C" 19.05 23.11 19.99 24.00 16.00 18.01 14.00 7.90 11.99 20.57 19.00 42.01 13.00 8.00 18.01 18.01 25.40 25.40 25.40 3.56 3.73 5.00 5.79 6.50 5.51 3.61 3.99 9.02 6.50 8.00 4.50 3.99 6.50 5.79 3.81 3.10 3.20 3.20 2.79 2.49 3.73 4.11 3.99 3.10 3.20 3.20 3.20 6.55 6.55 3.23 3.76 "F" "G" 1.17 2.57 6.73 5.51 "C" Dimensions "D" "E" "F" "G" "H" 12.70 5.08 3.58 1.17 5.56 0.81 "B" "C" "D" Dimensions "E" "F" "G" "H" "I" 30.15 53.16 18.42 20.45 29.21 49.91 30.61 32.13 19.58 22.61 29.97 31.39 5.94 6.73 3.56 3.23 5.87 5.03 11.91 13.46 7.11 6.35 10.80 10.26 5.38 5.33 3.56 3.30 4.83 3.35 3.96 6.48 3.96 4.83 6.86 6.68 18.26 39.70 11.30 14.00 17.48 39.85 19.84 21.46 12.47 16.00 20.32 24.69 3.56 3.56 2.36 3.07 3.73 3.30 TO-220 Part Number Multiples Suffix "A" "B" Dimensions "C" "D" "E" "F" # of Holes 3.18 3.18 3.18 3.18 3.18 3.18 3.18 6.35 6.35 6.35 6.35 6.35 6.35 6.35 12.70 12.70 12.70 12.70 12.70 12.70 12.70 2 3 4 5 6 7 8 Dimensions "C" "D" "E" "F" 45.72 45.70 16.50 16.50 3.18 3.80 3.80 3.30 Plastic Power -66 RH-25 RH-50 RH-5 RH-10 RH-25 RH-50 2 Parts 3 Parts Power Module -94 -95 -96 -97 -98 -99 -34 -36 -37 -38 -39 -40 -41 25.40 38.10 50.80 63.50 76.20 88.90 101.60 19.05 19.05 19.05 19.05 19.05 19.05 19.05 Part Number Suffix "A" "B" -108 -140 -141 -142 116.84 116.8 57.90 57.91 60.96 61.00 61.00 36.83 4.75 4.75 4.75 4.75 4.75 4.75 4.75 53.97 53.30 53.40 32.26 3.18 3.96 12.70 12.70 12.40 12.45 15.90 ORDERING "E" 14.73 16.89 -57 -89 "D" 7.62 4.32 91 SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 88 Sil-Pad Configurations (R) Metric Measurements C D-DIA E Multiwatt Part Number Suffix "A" -124 -125 MultiLead TO-66 " E" 3.0 x 45 2.0 x 45 4.06 3.99 3.76 3.91 Part Number Suffix "A" "B" "C" Dimensions "D" 20.32 3.56 10.16 Diode Washer 34.29 Part Number Suffix Various DO-4 DO-5 DO-4 (oversized) DO-5 (oversized) Various Various Various Various -19 -20 -21 -22 -25 -26 -27 -28 -32 Part Number Suffix TO-36 -08 Small Power Devices Part Number Suffix TO-5, 3 Holes TO-18, 3 Holes TO-18, 4 Holes TO-5, 4 Holes TO-5, 3 Holes TO-5, 4 Holes -09 -12 -13 -33 -44 -45 Part Number Suffix Rectifier -46 -47 -48 "A" 12.95 12.95 20.32 15.88 25.40 20.62 20.62 25.40 38.10 "A" 27.00 4.83 "A" Dimensions "B" "C" 9.14 6.35 6.35 9.14 9.91 9.91 5.08 2.54 2.54 5.08 5.08 5.08 1.02 0.91 0.91 1.02 1.02 1.02 Dimensions "A" "B" -42 -53 -65 -73 24.99 21.97 32.00 24.99 19.99 16.51 19.99 19.99 Part Number Suffix "A" "B" "C" 63.75 41.00 32.00 27.99 16.00 14.00 Part Number Suffix "A" "B" "C" 36.83 21.29 15.54 Part Number Suffix "A" "B" "C" 11.99 5.00 4.90 Part Number Suffix "A" "B" "C" 16.31 8.15 -105 12.19 -75 -76 -77 -78 -79 -80 -81 -82 -111 "A" Dimensions "B" 9.14 19.05 20.32 22.23 29.97 31.75 38.10 13.00 15.01 6.60 3.18 4.83 7.95 13.08 9.65 5.08 4.09 5.51 "C" 17.53 "B" -100 -123 24.38 Various Various Various DO-8 Various Various Various Various Dimensions "B" "A" Clip Mount TIP-36 Plastic Tip TO-3P Plastic Clip "F" Part Number Suffix 3.56 5.08 6.60 5.08 6.60 3.68 2.92 3.56 12.70 31.75 28.58 25.40 Part Number Suffix "E" Dimensions "B" 31.75 28.58 25.40 TIP Packages SIP Package "D" 20.07 19.99 -93 Power Module Dimensions "C" 22.15 22.00 B A "B" "C" 5.08 3.56 4.75 Dimensions "C" 16.51 24.99 17.98 Dimensions "D" 7.75 3.99 Dimensions "D" 6.22 "D" "E" 3.56 3.61 3.61 5.21 5.21 5.21 5.21 "E" "F" "G" 48.26 30.99 5.21 3.00 5.21 3.00 "E" "F" "G" 24.38 4.32 3.05 "E" "F" "G" 24.38 1.52 3.18 C Power Module ORDERING D Dimensions "D" B -115 0.79 A E F RAD (TYP) Power Module Dimensions "D" B C -109 D A 92 (2) G Dia 34.29 4.95 SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 89 Sil-Pad Configurations (R) TO-3 Style Part Number Suffix "A" "B" "C" Dimensions "D" -02 -03 -04 -05 -06 -07 -10 -11 -15 -16 -17 -18 -23 -24 -29 -30 -31 -59 Leadless -112 -113 -127 -129 -135 45.21 39.70 41.91 41.91 41.91 45.21 36.58 33.32 45.21 52.58 41.91 39.70 40.46 43.18 41.91 31.75 34.92 41.91 45.21 39.70 33.20 42.01 41.91 31.75 26.67 28.96 28.96 28.96 31.75 25.40 19.35 31.75 39.62 28.96 26.67 27.94 30.15 27.05 17.78 20.96 28.96 31.70 26.70 20.80 27.00 29.01 3.56 3.56 3.10 3.56 4.19 4.19 3.56 3.56 3.56 3.10 3.56 3.56 3.96 3.96 3.56 3.56 3.56 4.19 4.19 4.19 4.19 3.51 4.19 1.60 2.01 1.60 1.50 3.61 Part Number Suffix "A" "B" 41.91 Part Number Suffix "A" Metric Measurements "E" "F" "G" 30.15 30.15 30.15 30.15 30.15 30.15 24.38 24.38 30.15 30.15 30.15 30.15 30.15 30.15 30.15 24.38 24.38 30.15 30.10 30.10 23.09 30.00 30.15 10.92 10.92 10.92 10.92 10.92 10.92 5.08 5.08 10.92 10.92 10.92 10.92 10.92 10.92 10.92 5.08 5.08 1.83 1.83 1.83 1.83 1.83 1.83 2.54 2.54 1.83 1.83 1.83 1.83 1.83 1.83 1.83 2.54 2.54 10.90 10.90 5.99 11.00 10.90 1.85 1.85 1.55 1.80 1.83 "C" Dimensions "D" "E" "F" "G" "H" "I" 28.96 3.56 2.36 30.15 10.92 10.16 3.94 18.24 "B" "C" Dimensions "D" "E" "F" "G" 39.62 39.70 26.67 26.67 3.96 3.96 2.03 1.60 29.72 30.15 11.94 11.94 72 72 Part Number Suffix "A" "B" "C" Dimensions "D" "E" "F" "G" 42.04 30.15 3.96 1.52 30.15 40 12.70 10 Lead Part Number TO-3 Suffix "A" "B" "C" Dimensions "D" "E" "F" "G" "H" 41.91 28.96 4.19 1.02 15.06 12.70 32.7 Part Number Suffix "A" "B" "C" Dimensions "D" "E" 32.38 19.05 3.96 2.54 Part Number Suffix "A" "B" "C" Dimensions "D" "E" 36.58 25.40 3.56 1.40 Part Number Suffix "A" "B" "C" Dimensions "D" "E" 12.19 4.19 2.36 2.03 1.57 2.36 1.57 2.39 1.90 1.57 1.17 1.57 1.17 3.56 1.57 1.57 1.17 1.57 1.57 I 3 Lead TO-3 -92 F DIA. A 4 Lead TO-3 D DIA. (4) B C DIA. (2) -86 -87 18 G E 8 Lead TO-3 -88 -91 3 Lead TO-66 -85 9 Lead TO-66 -83 E Power Module 24.38 24.38 "F" "G" "H" 5.08 2.54 5.08 "F" "G" "H" 12.19 8.26 36 ORDERING D 30.15 B -130 C - DIA. (2) 40.64 30.40 6.10 A 93 SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 90 Hi-Flow 225 Configurations (R) Metric Measurements Hi-Flow 225U Tab Configurations ("B") MATERIAL LINER -.500+.030 PSA STRIP .080+.000 .040 LINER ("B") ("A") ("A") Part Number Suffix "A" Dimensions ( .015) "B" "C" Min. Pcs/Roll -143 38.10 38.10 63.50 5000 -144 35.00 35.00 60.40 5000 -145 31.75 31.75 57.15 5000 -146 25.40 25.40 50.80 7500 -147 17.78 17.78 43.18 10000 -148 12.70 12.70 38.10 15000 -149 7.62 7.62 50.80 22500 ("C") Hi-Flow 225UT/225FT Tab Configurations .750+.063 COLORED PSA TAPE LINER .500+.030 PSA STRIP MATERIAL ("B") CLEAR PSA TAPE .750+.063 .250+.125 LINER ("B") ("A") ("A") ORDERING ("C") 94 Part Number Suffix "A" Dimensions ( .015) "B" "C" Min. Pcs/Roll -150 41.91 41.91 67.31 3000 -151 38.10 38.10 63.50 5000 -152 34.93 34.93 60.33 5000 -153 31.75 31.75 57.15 5000 -154 25.40 25.40 50.80 7500 -155 17.78 17.78 43.18 10000 -156 12.70 12.70 38.10 15000 SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 91 Sil-Pad Shield (R) Standard Configurations P/N 09SPS01-002 (TO-220) P/N 09SPS01-011 (TO-5) P/N 09SPS01-020 (DO-5) P/N 09SPS01-001 (TO-3) P/N 09SPS01-016 (TO-3) P/N 09SPS01-023 (TO-3) P/N 09SPS01-009 P/N 09SPS01-017 (TO-66) P/N 09SPS01-019 (DO-4) 95 ORDERING Contact the factory for other configurations. SPDG_Chapt4_10.06.qxp 10/23/2006 12:48 PM Page 92