IS25LP064A/032A
Integrated Silicon Solution, Inc.- www.issi.com 5
Rev. A
11/06/2015
8.20 ENTER QUAD PERIPHERAL INTERFACE (QPI) MODE OPERATION (QPIEN, 35h; QPIDI, F5h) 52
8.21 PROGRAM/ERASE SUSPEND & RESUME ...................................................................................... 53
8.22 ENTER DEEP POWER DOWN (DP, B9h) ......................................................................................... 55
8.23 RELEASE DEEP POWER DOWN (RDPD, ABh) ............................................................................... 56
8.24 SET READ PARAMETERS OPERATION (SRP, C0h) ...................................................................... 57
8.25 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................ 59
8.26 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh; RDJDIDQ, AFh) 61
8.27 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) ........................ 62
8.28 READ UNIQUE ID NUMBER (RDUID, 4Bh) ...................................................................................... 63
8.29 READ SFDP OPERATION (RDSFDP, 5Ah) ...................................................................................... 64
8.30 NO OPERATION (NOP, 00h) ............................................................................................................. 64
8.31 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h)) AND HARDWARE
RESET ........................................................................................................................................................ 65
8.32 SECURITY INFORMATION ROW ...................................................................................................... 66
8.33 INFORMATION ROW ERASE OPERATION (IRER, 64h) ................................................................. 67
8.34 INFORMATION ROW PROGRAM OPERATION (IRP, 62h) ............................................................. 68
8.35 INFORMATION ROW READ OPERATION (IRRD, 68h) ................................................................... 69
8.36 FAST READ DTR MODE OPERATION (FRDTR, 0Dh) ..................................................................... 70
8.37 FAST READ DUAL IO DTR MODE OPERATION (FRDDTR, BDh) .................................................. 72
8.38 FAST READ QUAD IO DTR MODE OPERATION (FRQDTR, EDh) ................................................. 75
8.39 SECTOR LOCK/UNLOCK FUNCTIONS ............................................................................................ 79
9. ELECTRICAL CHARACTERISTICS ........................................................................................................... 81
9.1 ABSOLUTE MAXIMUM RATINGS (1) ................................................................................................... 81
9.2 OPERATING RANGE ........................................................................................................................... 81
9.3 DC CHARACTERISTICS ...................................................................................................................... 82
9.4 AC MEASUREMENT CONDITIONS .................................................................................................... 83
9.5 PIN CAPACITANCE ............................................................................................................................. 83
9.6 AC CHARACTERISTICS ...................................................................................................................... 84
9.7 SERIAL INPUT/OUTPUT TIMING ........................................................................................................ 86
9.8 POWER-UP AND POWER-DOWN ...................................................................................................... 88
9.9 PROGRAM/ERASE PERFORMANCE ................................................................................................. 89
9.10 RELIABILITY CHARACTERISTICS ................................................................................................... 89
10. PACKAGE TYPE INFORMATION ......................................................................................................... 90
10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (B) ............................ 90
10.2 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (K)...................................... 91
10.3 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 8x6mm (L) ...................................... 92
10.4 8-Pin 208mil VSOP Package (F) ........................................................................................................ 93
10.5 16-lead Plastic Small Outline package (300 mils body width) (M) ..................................................... 94