PBB190STR - IXYS Integrated Circuits Division

INTEGRATED CIRCUITS DIVISION

PBB190

Dual Single-Pole, Normally Closed

OptoMOS® Relay

www.ixysic.com

DS-PBB190-R03 1

Part # Description

PBB190 8-Lead DIP (50/Tube)

PBB190S 8-Lead Surface Mount (50/Tube)

PBB190STR 8-Lead Surface Mount (1,000/Reel)

Parameter Ratings Units

Blocking Voltage 400 VP

Load Current 130 mArms / mADC

On-Resistance (max) 25 

Applications

Features

Description

Ordering Information

Pin Configuration

• 5000Vrms Input/Output Isolation

• Low Drive Power Requirements

• High Reliability

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Small 8-Pin Package

• Flammability Rating UL 94 V-0

• Surface Mount, Tape & Reel Versions Available

• Telecommunications

• Telecom Switching

• Tip/Ring Circuits

• Modem Switching (Laptop, Notebook, Pocket Size)

• Hook Switch

• Dial Pulsing

• Ground Start

• Ringing Injection

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Medical Equipment-Patient/Equipment Isolation

• Security

• Aerospace

• Industrial Controls

Switching Characteristics

of Normally Closed Devices

Form-B

10% 90%

LOAD

off

+ Control - Switch #1

- Control - Switch #1

+ Control - Switch #2

- Control - Switch #2

Load - Switch #1

Load - Switch #2

Approvals

• UL Recognized Component: File E76270

• CSA Certified Component: Certificate 1175739

• EN/IEC 60950-1 Certified Component:

Certificate available on our website

PBB190 is a dual single-pole, normally closed

(1-Form-B) solid state relay with two independently

controlled switches that use optically coupled

MOSFET technology to provide 5000Vrms of input to

output isolation.

Its optically coupled outputs, which use the patented

OptoMOS architecture, are controlled by a highly

efficient infrared LED.

Dual single-pole OptoMOS relays provide a more

compact design solution than discrete single-pole

relays in a variety of applications by incorporating

both relays in a single 8-pin package.

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

2R03

PBB190

Absolute Maximum Ratings @ 25ºC

Electrical Characteristics @ 25ºC

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Typical values are characteristic of the device at +25°C,

and are the result of engineering evaluations. They are

provided for information purposes only, and are not part of

the manufacturing testing requirements.

Parameter Ratings Units

Blocking Voltage 400 VP

Reverse Input Voltage 5 V

LED Forward Current 50 mA

Peak (10ms) 1 A

Input Power Dissipation 1150 mW

Total Power Dissipation 2800 mW

Isolation Voltage, Input to Output

(60 Seconds) 5000 Vrms

ESD Rating, Human Body Model 8 kV

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

1 Derate linearly 1.33 mW / ºC

2 Derate linearly 6.67 mW / ºC

Parameter Conditions Symbol Min Typ Max Units

Output Characteristics

Load Current 1

Continuous IF=0mA IL

- - 130 mArms / mADC

Peak IF=0mA, t=10ms - - ±400 mAP

On-Resistance 2IF=0mA, IL=130mA RON --25 

Off-State Leakage Current IF=2mA, VL=400VPILEAK -- 1 A

Switching Speeds

Turn-On IF=5 mA, VL=10V ton -- 1 ms

Turn-Off toff - - 2.5

Output Capacitance IF=5mA, VL=50V, f=1MHz COUT -11 - pF

Input Characteristics

LED Forward Current

To Activate 3IL=130mA IF

- 0.38 2 mA

To Deactivate - 0.2 0.35 -

Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V

Reverse Input Current VR=5V IR- - 10 µA

Common Characteristics

Input to Output Capacitance VIO=0V, f=1MHz CIO -3 - pF

1 If both poles operate simultaneously, then the load current must be derated so that the package power dissipation value is not exceeded.

2 Measurement taken within 1 second of on-time.

3 For high temperature operation (>60ºC), a minimum LED drive current of 4mA is recommended.

INTEGRATED CIRCUITS DIVISION

PBB190

www.ixysic.com 3

R03

LED Forward Voltage (V)

1.235 1.240 1.245 1.250 1.255 1.260 1.265

Device Count (N)

Typical LED Forward Voltage Drop

(N=50, IF=5mA)

Turn-On Time (ms)

0.714 0.716 0.718 0.720 0.722 0.724 0.726 0.728

Device Count (N)

Typical Turn-On Time

(N=50, IF=5mA, IL=100mA)

Turn-Off Time (ms)

0.838 0.920 1.002 1.084 1.166 1.248 1.330 1.412

Device Count (N)

Typical Turn-Off Time

(N=50, IF=5mA, IL=100mA)

LED Forward Current (mA)

0.29 0.32 0.35 0.38 0.41 0.44 0.47 0.50

Device Count (N)

Typical LED Forward Current

to Activate

(N=50, IL=100mA)

On-Resistance (:)

13.0 13.3 13.5 13.8 14.0 14.3 14.5

Device Count (N)

Typical On-Resistance Distribution

(N=50, IF=0mA, IL=100mA)

Blocking Voltage (VP)

460 465 470 475 480 485 490 495

Device Count (N)

Typical Blocking Voltage Distribution

(N=50, IF=2mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Voltage Drop (V)

1.0

1.1

1.2

1.3

1.4

1.5

1.6

Typical LED Forward Voltage Drop

vs. Temperature

IF=50mA

IF=20mA

IF=10mA

IF=5mA

IF=2mA

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-On Time (Ps)

300

400

500

600

700

800

900

Turn-On Time vs. Temperature

(IL=75mA)

IF=5mA

IF=2mA

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-Off Time (Ps)

1000

1500

2000

2500

3000

3500

4000

4500

5000

Turn-Off Time vs. Temperature

(IL=75mA)

IF=2mA

IF=5mA

LED Forward Voltage (V)

1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55

LED Forward Current (mA)

LED Forward Voltage

vs. LED Forward Current

LED Forward Current (mA)

0 1020304050

Turn-On Time (Ps)

710

715

720

725

730

735

Typical Turn-On Time

vs. LED Forward Current

(IL=100mA)

LED Forward Current (mA)

01020304050

Turn-Off Time (Ps)

1000

2000

3000

4000

5000

6000

Typical Turn-Off Time

vs. LED Forward Current

(IL=100mA)

PERFORMANCE DATA*

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

4R03

PBB190

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Current (mA)

0.35

0.40

0.45

0.50

0.55

0.60

0.65

LED Forward Current to Activate

vs. Temperature

(IL=75mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

On Resistance (:)

On-Resistance

vs. Temperature

(IF=0mA, IL=75mA)

Load Voltage (V)

-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0

Load Current (A)

-0.15

-0.10

-0.05

0.00

0.05

0.10

0.15

Typical Load Current

vs. Load Voltage

(IF=0mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Load Current (A)

0.08

0.09

0.10

0.11

0.12

0.13

0.14

Maximum Load Current

vs. Temperature

(IF=0mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Blocking Voltage (VP)

440

445

450

455

460

465

470

475

480

Typical Blocking Voltage

vs. Temperature

(IF=5mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Leakage (nA)

100

150

200

250

300

350

Typical Leakage vs. Temperature

Measured Across Pins 5&6, 7&8

(IF=5mA, VL=400V)

Load Voltage (V)

0 50 100 150 200

Output Capacitance (pF)

100

120

140

Output Capacitance

vs. Load Voltage

(IF=5mA, f=1MHz)

Time

10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s

Load Current (A)

0.0

0.2

0.4

0.6

0.8

1.0

Energy Rating Curve

PERFORMANCE DATA*

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

PBB190

www.ixysic.com 5

R03

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of

the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of

our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices

when handled according to the limitations and information in that standard as well as to any limitations set forth in the

information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Classiﬁ cation

PBB190 / PBB190S MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the

body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum

Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other

processes, the guidelines of J-STD-020 must be observed.

Device Classiﬁ cation Temperature (Tc) Dwell Time (tp) Max Reﬂ ow Cycles

PBB190 250ºC 30 seconds 1

PBB190S 250ºC 30 seconds 3

Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux

residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage

to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow

up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the

variability of the wash parameters used to clean the board, determination of the bake temperature and duration

necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning

or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the

device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

6R03

PBB190

PBB190S

Dimensions

(inches)

PCB Hole Pattern

2.540 ± 0.127

(0.100 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

9.144 ± 0.508

(0.360 ± 0.020)

0.457 ± 0.076

(0.018 ± 0.003)

9.652 ± 0.381

(0.380 ± 0.015)

7.239 TYP.

(0.285)

7.620 ± 0.254

(0.300 ± 0.010)

4.064 TYP

(0.160)

0.813 ± 0.102

(0.032 ± 0.004)

8-0.800 DIA.

(8-0.031 DIA.) 2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

3.302 ± 0.051

(0.130 ± 0.002)

Pin 1

0.254 ± 0.0127

(0.010 ± 0.0005)

Dimensions

(inches)

PCB Land Pattern

2.540 ± 0.127

(0.100 ± 0.005)

9.652 ± 0.381

(0.380 ± 0.015)

6.350 ± 0.127

(0.250 ± 0.005)

9.525 ± 0.254

(0.375 ± 0.010)

0.457 ± 0.076

(0.018 ± 0.003)

0.813 ± 0.102

(0.032 ± 0.004)

4.445 ± 0.127

(0.175 ± 0.005)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.127

(0.025 ± 0.005)

0.254 ± 0.0127

(0.010 ± 0.0005)

2.54

(0.10)

8.90

(0.3503)

1.65

(0.0649)

0.65

(0.0255)

3.302 ± 0.051

(0.130 ± 0.002)

Pin 1

Mechanical Dimensions

INTEGRATED CIRCUITS DIVISION

Specification: DS-PBB190-R03

OptoMOS® is a registered trademark of IXYS Integrated Circuits

6/29/2018

For additional information please visit our website at: www.ixysic.com

PBB190

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes

to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'

Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but

not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property

or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.

Dimensions

(inches)

User Direction of Feed

NOTES:

1. Dimensions carry tolerances of EIA Standard 481-2

2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

=4.20

(0.165)

K =4.90

(0.193)

P1=12.00

(0.472)

W=16.00

(0.63)

Bo=10.30

(0.406)

Ao=10.30

(0.406)

PBB190STR Tape & Reel