TCD2301C TOSHIBA CCD LINEAR IMAGE SENSOR CCD (Charge Coupled Device) TCD2301C The TCD2301C which includes sample-and-hold circuit and clamp circuit is a high sensitive and low dark current 3648 elements x 3 lines CCD color image sensor. The sensor is designed for color scanner. The device contains a row of 3648 element x 3 lines photodiodes which provide a 16 lines / mm across a A4 size paper. The device is operated by 5V pulse, and 12V power supply. FEATURES Number of Image Sensing Elements : 3648 elements x 3 lines Image Sensing Element Size : 8 m by 8 m on 8 m centers Photo Sensing Region : High sensitive pn photodiode Weight: 4.8g (Typ.) Distance Between Photodiode Array : 96 m (12 Lines) Clock : 2 phase (5V) Internal Circuit : Sample & Hold circuit, Clamp circuit Package : 22 pin DIP Color Filter : Red, Green, Blue PIN CONNECTION MAXIMUM RATINGS (Note 1) CHARACTERISTIC SYMBOL RATING UNIT -0.3~8 V Clock Pulse Voltage V Shift Pulse Voltage VSH Reset Pulse Voltage VRS Sample and Hold Pulse Voltage VSP Switch Pulse Voltage Power Supply Voltage V SG V CP VOD -0.3~15 V Operating Temperature Topr 0~60 C Storage Temperature Tstg -25~85 C Clamp Pulse Voltage Note 1: All voltage are with respect to SS terminals (Ground). (TOP VIEW) 1 2001-10-15 TCD2301C CIRCUIT DIAGRAM PIN NAMES 1E Clock 1 (Phase 1) SH3 Shift Gate 3 2E Clock 2 (Phase 2) RS Reset Gate 1O Clock 1 (Phase 1) SP Sample and Hold Gate 2O Clock 2 (Phase 2) SGR R Switch 1B Final Stage Clock (Phase 1) SGG G Switch 2B Final Stage Clock (Phase 2) SGB B Switch SS Ground CP Clamp Gate OD Power OS Signal Output SH1 Shift Gate 1 DOS SH2 Shift Gate 2 NC Compensation Output Non Connection 2 2001-10-15 TCD2301C OPTICAL / ELECTRICAL CHARACTERISTICS (Ta = 25C, VOD = 12 V, V= V RS = VSH = V CP = 5 V (Pulse), f = 0.51 MHz, f RS = 1.0 MHz, Load Resistance = 100 k, tINT (Integration Time) = 10 ms, Light Source = A Light Source + CM500 Filter (t = 1.0 mm) ) CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT NOTE Sensitivity (Red) RR 1.1 V / lx*s (Note 2) Sensitivity (Green) RG 1.4 V / lx*s (Note 2) Sensitivity (Blue) RB 0.5 V / lx*s (Note 2) PRNU (1) 10 20 % (Note 3) PRNU (3) 3 12 mV (Note 4) Rl 3 % (Note 5) VSAT 1.0 1.5 V (Note 6) Saturation Exposure SE 1.07 lx*s (Note 7) Dark Signal Voltage VDRK 2.0 mV (Note 8) Dark Signal Non Uniformity DSNU 3.0 mV (Note 9) TTE 92 % ZO 0.5 1.0 k Photo Response Non Uniformity Register Imbalance Saturation Output Voltage Total Transfer Efficiency Output Impedance DC Power Dissipation PD 500 750 mW VOS 6.0 V (Note 10) VDOS 6.0 V (Note 10) |VDOS-VDOS| 100 300 mV (Note 10) DC Offset Voltage DC Compensation Output Voltage DC Mismach Voltage Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. PRNU(1) = x100(%) When is average of total signal output and is the maximum deviation from . light is shown below. 1 Red = SE 2 1 Green = SE 2 1 Bule = SE 4 3 The amount of incident 2001-10-15 TCD2301C Note 4: PRNU (3) is defined as maximum voltage with next pixel, where measured 5% of SE (TYP.). Note 5: RI is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. 3647 n - n+1 Rl = n =1 x 100(%) 3647x Where n and n+1 are signal outputs of each pixel. is average of total signal outputs. Note 6: VSAT is defined as minimum saturation output of all effective pixels. V Note 7: Definition of SE: SE = SAT RG Note 8: VDRK is defined as average dark signal voltage of all effective pixels. Note 9: DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark voltage. Note 10: DC Signal Output Voltage and DC Compensation Output Voltage are defined as follows: 4 2001-10-15 TCD2301C OPERATING CONDITION CHARACTERISTIC Clock Pulse Voltage Final Stage Clock Pulse Voltage Shift Pulse Voltage Reset Pulse Voltage Sample and Hold Pulse Voltage RGB Switch Pulse Voltage Clamp Pulse Voltage SYMBOL "H" Level V0, E "L" Level "H" Level VB "L" Level "H" Level VSH "L" Level "H" Level VRS "L" Level "H" Level VSP "L" Level "H" Level VSG "L" Level "H" Level VCP "L" Level Power Supply Voltage VDD MIN TYP. MAX 4.5 5.0 5.5 0.0 0.2 0.5 4.5 5.0 5.5 0.0 0.2 0.5 V0,E"H"-1 V0,E"H" V0,E"H" 0.0 0.2 0.5 4.5 5.0 5.5 0.0 0.2 0.5 4.5 5.0 5.5 0.0 0.2 0.5 4.5 5.0 5.5 0.0 0.2 0.5 4.5 5.0 5.5 0.0 0.2 0.5 11.4 12.0 13.0 UNIT NOTE V V V (Note 11) V V (Note 12) V V (Note 13) V Note 11: V0, E "H" means the high level voltage of V0 and VE when SH pulse is high level. Note 12: Supply "L" level to SP terminal when sample-and-hold circuit is not used. Note 13: Supply SH (inversed pulse of SH) to CP terminal when clamp circuit is not used. CLOCK CHARACTERISTICS (Ta = 25C) CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT Clock Pulse Frequency f 0.5 2.0 MHz Reset Pulse Frequency fRS 1.0 4.0 MHz Sample and Hold Pulse Frequency f SP fCP 1.0 4.0 MHz 1.0 4.0 MHz Clamp Pulse Frequency Clock Capacitance C0, E 500 pF Final Stage Clock Capacitance CB 10 pF Shift Gate Capacitance CSH 200 pF Reset Gate Capacitance CRS 10 pF Sample and Hold Gate Capacitance C SP C SG CCP 10 pF 10 pF 10 pF RGB Switch Pulse Capacitance Clamp Gate Capacitance 5 2001-10-15 TCD2301C APPLICATION NOTE a) You drive TCD2301C by above timing, so you can get the three output signal of nearly equal level. b) In switching " SGR , " SGG " and " SGB ", asynchronous switching operation with clock pulse, shift pulse or any other input pulses timing, is possible. (It is not necessary to switch above timing shown in figure.) But care should be taken not to make more than two switches to "L" level at the same time. 6 2001-10-15 TIMING CHART 1 TCD2301C 7 2001-10-15 TIMING CHART 2 TCD2301C 8 2001-10-15 TIMING CHART 3 TCD2301C 9 2001-10-15 TCD2301C TIMING REQUIREMENTS 10 2001-10-15 TCD2301C TIMING REQUIREMENTS (Cont.) SYMBOL MIN TYP. (Note 14) MAX UNIT Pulse Timing of SH and 1,0 t1, t5 0 1000 ns SH Pulse Rise Time, Fall Time t2, t4 0 50 ns t3 500 1000 ns 1, 2 Pulse Rise Time, Fall Time t6, t7 0 50 ns RS Pulse Rise Time, Fall Time t8, t10 0 20 ns RS Pulse Width t9 40 250 ns Pulse Timing of 1B, 2B and RS t11 120 300 ns t12, t14 0 20 ns t13 70 100 ns CHARACTERISTIC SH Pulse Width SP Pulse Rise Time, Fall Time SP Pulse Width Pulse Timing of SP and RS t15 0 50 ns t16, t17 70 ns t18, t20 0 20 ns CP Pulse Width t19 100 200 ns Pulse Timing of 1B, 2B and CP t21 20 50 ns Pulse Timing of RS and CP t22 0 50 ns Video Data Delay Time (Note 15) CP Pulse Rise Time, Fall Time Note 14: TYP. is the case of f RS =1.0MHz Note 15: Load resistance is 100k 11 2001-10-15 TCD2301C TYPICAL SPECTRAL RESPONSE 12 2001-10-15 TCD2301C TYPICAL DRIVE CIRCUIT 13 2001-10-15 TCD2301C CAUTION 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C. 14 2001-10-15 TCD2301C EVEN-ODD UNBALANCE When High-speed draiving standard level of odd-even bits is often unbalanced. For that reason when high-speed draiving CCD you should put a damping resistance in input pin. 1. WAVEFORM (Sample and Hold ON) 2. MEASUREMENT CONDITION Ta=25C, VAD=VDD=12V, V1E=V10=V1B=V2E=V20=V2B=V RS =V CP =V SP =VSH1=VSH2=VSH3=5V (Pulse), Light Source=Daylight Fluorescent Lamp. Ocilloscope Probe Tektoronix P6136 2465A (400MHz) 10.8pF 15 2001-10-15 TCD2301C 3. DRIVE CIRCUIT (with a damping resistance) Please put a damping resistance in input 20 (22). 16 2001-10-15 TCD2301C PACKAGE DIMENSIONS Note 1: No.1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNESS (n=1.5) Weight: 4.8g (Typ.) 17 2001-10-15 TCD2301C RESTRICTIONS ON PRODUCT USE 000707EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 18 2001-10-15