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DS031-1 (v1.7) October 2, 2001 www.xilinx.com Module 1 of 4

Advance Product Specification 1-800-255-7778 1

Summary of Virtex®-II Features

• Industry First Platform FPGA Solution

• IP-Immersion™ Architecture

- Densities from 40K to 8M system gates

- 420 MHz internal clock speed (Advance Data)

- 840+ Mb/s I/O (Advance Data)

• SelectRAM™ Memory Hierarchy

- 3 Mb of True Dual-Port™ RAM in 18-Kbit block

SelectRAM resources

- Up to 1.5 Mb of distributed SelectRAM resources

- High-performance interfaces to external memory

·DDR-SDRAM interface

·FCRAM interface

·QDR™-SRAM interface

·Sigma RAM interface

•Arithmetic Functions

- Dedicated 18-bit x 18-bit multiplier blocks

- Fast look-ahead carry logic chains

•Flexible Logic Resources

- Up to 93,184 internal registers / latches with Clock

Enable

- Up to 93,184 look-up tables (LUTs) or cascadable

16-bit shift registers

- Wide multiplexers and wide-input function support

- Horizontal cascade chain and Sum-of-Products

support

- Internal 3-state bussing

•High-Performance Clock Management Circuitry

- Up to 12 DCM (Digital Clock Manager) modules

·Precise clock de-skew

·Flexible frequency synthesis

·High-resolution phase shifting

- 16 global clock multiplexer buffers

•Active Interconnect™ Technology

- Fourth generation segmented routing structure

- Predictable, fast routing delay, independent of

fanout

•SelectI/O-Ultra™ Technology

- Up to 1,108 user I/Os

- 19 single-ended standards and six differential

standards

- Programmable sink current (2 mA to 24 mA) per I/O

- Digitally Controlled Impedance (DCI) I/O: on-chip

termination resistors for single-ended I/O standards

- PCI-X @ 133 MHz, PCI @ 66 MHz and 33 MHz

compliance, and CardBus compliant

- Differential Signaling

·840 Mb/s Low-Voltage Differential Signaling I/O

(LVDS) with current mode drivers

·Bus LVDS I/O

·Lightning Data Transport (LDT) I/O with current

driver buffers

·Low-Voltage Positive Emitter-Coupled Logic

(LVPECL) I/O

·Built-in DDR Input and Output registers

- Proprietary high-performance SelectLink™

Technology

·High-bandwidth data path

·Double Data Rate (DDR) link

·Web-based HDL generation methodology

•Supported by Xilinx Foundation™ and Alliance™

Series Development Systems

- Integrated VHDL and Verilog design flows

- Compilation of 10M system gates designs

- Internet Team Design (ITD) tool

•SRAM-Based In-System Configuration

-Fast SelectMAP™ configuration

- Triple Data Encryption Standard (DES) security

option (Bitstream Encryption)

- IEEE1532 support

- Partial reconfiguration

- Unlimited re-programmability

- Readback capability

•0.15 µm 8-Layer Metal process with 0.12 µm

high-speed transistors

•1.5 V (VCCINT) core power supply, dedicated 3.3 V

VCCAUX auxiliary and VCCO I/O power supplies

•IEEE 1149.1 compatible boundary-scan logic support

•Flip-Chip and Wire-Bond Ball Grid Array (BGA)

packages in three standard fine pitches (0.80mm,

1.00mm, and 1.27mm)

•100% factory tested

Virtex-II 1.5V

Field-Programmable Gate Arrays

DS031-1 (v1.7) October 2, 2001 00Advance Product Specification

Virtex-II 1.5V Field-Programmable Gate Arrays R

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General Description

The Virtex-II family is a platform FPGA developed for high

performance from low-density to high-density designs that

are based on IP cores and customized modules. The family

delivers complete solutions for telecommunication, wire-

less, networking, video, and DSP applications, including

PCI, LVDS, and DDR interfaces.

The leading-edge 0.15µm / 0.12µm CMOS 8-layer metal

process and the Virtex-II architecture are optimized for high

speed with low power consumption. Combining a wide vari-

ety of flexible features and a large range of densities up to

10 million system gates, the Virtex-II family enhances pro-

grammable logic design capabilities and is a powerful alter-

native to mask-programmed gates arrays. As shown in

Table 1, the Virtex-II family comprises 12 members, ranging

from 40K to 10M system gates.

Packaging

Offerings include ball grid array (BGA) packages with

0.80mm, 1.00mm, and 1.27mm pitches. In addition to tradi-

tional wire-bond interconnects, flip-chip interconnect is used

in some of the BGA offerings. The use of flip-chip intercon-

nect offers more I/Os than is possible in wire-bond versions

of the similar packages. Flip-Chip construction offers the

combination of high pin count with high thermal capacity.

Table 2 shows the maximum number of user I/Os available.

The Virtex-II device/package combination table (Table 6 at

the end of this section) details the maximum number of I/Os

for each device and package using wire-bond or flip-chip

technology.

Table 1: Virtex-II Field-Programmable Gate Array Family Members

Device

System

Gates

CLB

(1 CLB = 4 slices = Max 128 bits)

Multiplier

Blocks

SelectRAM Blocks

DCMs

Max I/O

Pads(1)

Array

Row x Col. Slices

Maximum

Distributed

RAM Kbits

18-Kbit

Blocks

Max RAM

(Kbits)

XC2V40 40K 8 x 8 256 8 4 4 72 4 88

XC2V80 80K 16 x 8 512 16 8 8 144 4 120

XC2V250 250K 24 x 16 1,536 48 24 24 432 8 200

XC2V500 500K 32 x 24 3,072 96 32 32 576 8 264

XC2V1000 1M 40 x 32 5,120 160 40 40 720 8 432

XC2V1500 1.5M 48 x 40 7,680 240 48 48 864 8 528

XC2V2000 2M 56 x 48 10,752 336 56 56 1,008 8 624

XC2V3000 3M 64 x 56 14,336 448 96 96 1,728 12 720

XC2V4000 4M 80 x 72 23,040 720 120 120 2,160 12 912

XC2V6000 6M 96 x 88 33,792 1,056 144 144 2,592 12 1,104

XC2V8000 8M 112 x 104 46,592 1,456 168 168 3,024 12 1,108

Notes:

1. See details in Table 2, “Maximum Number of User I/O Pads”.

Table 2: Maximum Number of User I/O Pads

Device Wire-Bond Flip-Chip

XC2V40 88

XC2V80 120

XC2V250 200

XC2V500 264

XC2V1000 328 432

XC2V1500 392 528

XC2V2000 456 624

XC2V3000 516 720

XC2V4000 912

XC2V6000 1,104

XC2V8000 1,108

Virtex-II 1.5V Field-Programmable Gate Arrays

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Advance Product Specification 1-800-255-7778 3

Architecture

Virtex-II Array Overview

Virtex-II devices are user-programmable gate arrays with various configurable elements. The Virtex-II architecture is

optimized for high-density and high-performance logic designs. As shown in Figure 1, the programmable device is

comprised of input/output blocks (IOBs) and internal configurable logic blocks (CLBs).

Programmable I/O blocks provide the interface between

package pins and the internal configurable logic. Most

popular and leading-edge I/O standards are supported by

the programmable IOBs.

The internal configurable logic includes four major elements

organized in a regular array.

•Configurable Logic Blocks (CLBs) provide functional

elements for combinatorial and synchronous logic,

including basic storage elements. BUFTs (3-state

buffers) associated with each CLB element drive

dedicated segmentable horizontal routing resources.

•Block SelectRAM memory modules provide large

18-Kbit storage elements of True Dual-Port RAM.

•Multiplier blocks are 18-bit x 18-bit dedicated

multipliers.

•DCM (Digital Clock Manager) blocks provide

self-calibrating, fully digital solutions for clock

distribution delay compensation, clock multiplication

and division, coarse and fine-grained clock phase

shifting.

A new generation of programmable routing resources called

Active Interconnect Technology interconnects all of these

elements. The general routing matrix (GRM) is an array of

routing switches. Each programmable element is tied to a

switch matrix, allowing multiple connections to the general

routing matrix. The overall programmable interconnection is

hierarchical and designed to support high-speed designs.

All programmable elements, including the routing

resources, are controlled by values stored in static memory

cells. These values are loaded in the memory cells during

configuration and can be reloaded to change the functions

of the programmable elements.

Virtex-II Features

This section briefly describes Virtex-II features.

Input/Output Blocks (IOBs)

IOBs are programmable and can be categorized as follows:

•Input block with an optional single-data-rate or

double-data-rate (DDR) register

•Output block with an optional single-data-rate or DDR

directly or through a single or DDR register

•Bi-directional block (any combination of input and

output configurations)

These registers are either edge-triggered D-type flip-flops

or level-sensitive latches.

IOBs support the following single-ended I/O standards:

•LVTTL, LVCMOS (3.3 V, 2.5 V, 1.8 V, and 1.5 V)

•PCI-X at 133 MHz, PCI (3.3 V at 33 MHz and 66 MHz)

•GTL and GTLP

•HSTL (Class I, II, III, and IV)

Figure 1: Virtex-II Architecture Overview

Global Clock Mux

DCM DCM IOB

CLB

Programmable I/Os

Block SelectRAM Multiplier

Configurable Logic

DS031_28_100900

Virtex-II 1.5V Field-Programmable Gate Arrays R

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•SSTL (3.3 V and 2.5 V, Class I and II)

•AGP-2X

The digitally controlled impedance (DCI) I/O feature auto-

matically provides on-chip termination for each I/O element.

The IOB elements also support the following differential sig-

naling I/O standards:

•LVDS

•BLVDS (Bus LVDS)

•ULVDS

•LDT

•LVPECL

Two adjacent pads are used for each differential pair. Two or

four IOB blocks connect to one switch matrix to access the

routing resources.

Configurable Logic Blocks (CLBs)

CLB resources include four slices and two 3-state buffers.

Each slice is equivalent and contains:

•Two function generators (F & G)

•Two storage elements

•Arithmetic logic gates

•Large multiplexers

•Wide function capability

•Fast carry look-ahead chain

•Horizontal cascade chain (OR gate)

The function generators F & G are configurable as 4-input

look-up tables (LUTs), as 16-bit shift registers, or as 16-bit

distributed SelectRAM memory.

In addition, the two storage elements are either edge-trig-

gered D-type flip-flops or level-sensitive latches.

Each CLB has internal fast interconnect and connects to a

switch matrix to access general routing resources.

Block SelectRAM Memory

The block SelectRAM memory resources are 18 Kb of True

Dual-Port RAM, programmable from 16K x 1 bit to 512 x 36

bits, in various depth and width configurations. Each port is

totally synchronous and independent, offering three

"read-during-write" modes. Block SelectRAM memory is

cascadable to implement large embedded storage blocks.

Supported memory configurations for dual-port and sin-

gle-port modes are shown in Table 3.

A multiplier block is associated with each SelectRAM mem-

ory block. The multiplier block is a dedicated 18 x 18-bit

multiplier and is optimized for operations based on the block

SelectRAM content on one port. The 18 x 18 multiplier can

be used independently of the block SelectRAM resource.

Read/multiply/accumulate operations and DSP filter struc-

tures are extremely efficient.

Both the SelectRAM memory and the multiplier resource

are connected to four switch matrices to access the general

routing resources.

Global Clocking

The DCM and global clock multiplexer buffers provide a

complete solution for designing high-speed clocking

schemes.

Up to 12 DCM blocks are available. To generate de-skewed

internal or external clocks, each DCM can be used to elimi-

nate clock distribution delay. The DCM also provides 90-,

180-, and 270-degree phase-shifted versions of its output

clocks. Fine-grained phase shifting offers high-resolution

phase adjustments in increments of 1/256 of the clock

period. Very flexible frequency synthesis provides a clock

output frequency equal to any M/D ratio of the input clock

frequency, where M and D are two integers. For the exact

timing parameters, see Virtex™-II Electrical Characteris-

tics.

Virtex-II devices have 16 global clock MUX buffers, with up

to eight clock nets per quadrant. Each global clock MUX

buffer can select one of the two clock inputs and switch

glitch-free from one clock to the other. Each DCM block is

able to drive up to four of the 16 global clock MUX buffers.

Routing Resources

The IOB, CLB, block SelectRAM, multiplier, and DCM ele-

ments all use the same interconnect scheme and the same

access to the global routing matrix. Timing models are

shared, greatly improving the predictability of the perfor-

mance of high-speed designs.

There are a total of 16 global clock lines, with eight available

per quadrant. In addition, 24 vertical and horizontal long

lines per row or column as well as massive secondary and

local routing resources provide fast interconnect. Virtex-II

buffered interconnects are relatively unaffected by net

fanout and the interconnect layout is designed to minimize

crosstalk.

Horizontal and vertical routing resources for each row or

column include:

•24 long lines

•120 hex lines

•40 double lines

•16 direct connect lines (total in all four directions)

Table 3: Dual-Port And Single-Port Configurations

16K x 1 bit 2K x 9 bits

8K x 2 bits 1K x 18 bits

4K x 4 bits 512 x 36 bits

Virtex-II 1.5V Field-Programmable Gate Arrays

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Boundary Scan

Boundary scan instructions and associated data registers

support a standard methodology for accessing and config-

uring Virtex-II devices that complies with IEEE standards

1149.1 - 1993 and 1532. A system mode and a test mode

are implemented. In system mode, a Virtex-II device per-

forms its intended mission even while executing non-test

boundary-scan instructions. In test mode, boundary-scan

test instructions control the I/O pins for testing purposes.

The Virtex-II Test Access Port (TAP) supports BYPASS,

PRELOAD, SAMPLE, IDCODE, and USERCODE non-test

instructions. The EXTEST, INTEST, and HIGHZ test instruc-

tions are also supported.

Configuration

Virtex-II devices are configured by loading data into internal

configuration memory, using the following five modes:

•Slave-serial mode

•Master-serial mode

•Slave SelectMAP mode

•Master SelectMAP mode

•Boundary-Scan mode (IEEE 1532)

A Data Encryption Standard (DES) decryptor is available

on-chip to secure the bitstreams. One or two triple-DES key

sets can be used to optionally encrypt the configuration

information.

Readback and Integrated Logic Analyzer

Configuration data stored in Virtex-II configuration memory

can be read back for verification. Along with the configura-

tion data, the contents of all flip-flops/latches, distributed

SelectRAM, and block SelectRAM memory resources can

be read back. This capability is useful for real-time debug-

ging.

The Integrated Logic Analyzer (ILA) core and software pro-

vides a complete solution for accessing and verifying

Virtex-II devices.

Virtex-II Device/Package Combinations

and Maximum I/O

Wire-bond and flip-chip packages are available. Table 4 and

Table 5 show the maximum possible number of user I/Os in

wire-bond and flip-chip packages, respectively. Table 6

shows the number of available user I/Os for all device/pack-

age combinations.

•CS denotes wire-bond chip-scale ball grid array (BGA)

(0.80 mm pitch).

•FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).

•FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).

•BG denotes standard BGA (1.27 mm pitch).

•BF denotes flip-chip BGA (1.27 mm pitch).

The number of I/Os per package include all user I/Os except

the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,

PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,

DXP, AND RSVD) and VBATT.

Table 4: Wire-Bond Packages Information

Package CS144 FG256 FG456 FG676 BG575 BG728

Pitch (mm) 0.80 1.00 1.00 1.00 1.27 1.27

Size (mm) 12 x 12 17 x 17 23 x 23 27 x 27 31 x 31 35 x 35

I/Os 92 172 324 484 408 516

Table 5: Flip-Chip Packages Information

Package FF896 FF1152 FF1517 BF957

Pitch (mm) 1.00 1.00 1.00 1.27

Size (mm) 31 x 31 35 x 35 40 x 40 40 x 40

I/Os 624 824 1,108 684

Virtex-II 1.5V Field-Programmable Gate Arrays R

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Virtex-II Ordering Information

Virtex-II ordering information is shown in Figure 2

Table 6: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance Information)

Package

Available I/Os

XC2V

250

XC2V

500

XC2V

1000

XC2V

1500

XC2V

2000

XC2V

3000

XC2V

4000

XC2V

6000

XC2V

8000

CS144 88 92 92

FG256 88 120 172 172 172

FG456 200 264 324

FG676 392 456 484

FF896 432 528 624

FF1152 720 824 824 824

FF1517 912 1,104 1,108

BG575 328 392 408

BG728 456 516

BF957 624 684 684 684 684

Notes:

1. All devices in a particular package are pin-out (footprint) compatible. In addition, the FG456 and FG676 packages are compatible, as

are the FF896 and FF1152 packages.

Figure 2: Virtex-II Ordering Information

Example: XC2V1000-5FG456C

Device Type Temperature Range

C = Commercial (Tj = 0˚C to +85˚C)

I = Industrial (Tj = -40˚C to +100˚C)

Number of Pins

Package Type

Speed Grade

(-4, -5, -6)

DS031_35_033001

Virtex-II 1.5V Field-Programmable Gate Arrays

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Advance Product Specification 1-800-255-7778 7

Revision History

This section records the change history for this module of the data sheet.

Virtex-II Data Sheet

The Virtex-II Data Sheet contains the following modules:

•DS031-1, Virtex-II 1.5V FPGAs: Introduction and

Ordering Information (Module 1)

•DS031-2, Virtex-II 1.5V FPGAs: Functional Description

(Module 2)

•DS031-3, Virtex-II 1.5V FPGAs: DC and Switching

Characteristics (Module 3)

•DS031-4, Virtex-II 1.5V FPGAs: Pinout Tables

(Module 4)

Date Version Revision

11/07/00 1.0 Early access draft.

12/06/00 1.1 Initial release.

01/15/01 1.2 Added values to the tables in the Virtex-II Performance Characteristics and Virtex-II

Switching Characteristics sections.

01/25/01 1.3 The data sheet was divided into four modules (per the current style standard).

04/02/01 1.5 Skipped v1.4 to sync up modules. Reverted to traditional double-column format.

07/30/01 1.6 Made minor changes to items listed under Summary of Virtex®-II Features.

10/02/01 1.7 Minor edits.