PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Programmable System-on-Chip (PSoC)
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document Number: 002-20489 Rev. *C Revised September 24, 2018
General Description
PSoC® 4 is a scalable and reconfigurable platform architecture for a family of programmable embedded system controllers with an
Arm® Cortex®-M0+ CPU. It combines programmable and reconfigurable analog and digital blocks with flexible automatic routing. The
PSoC 4700S product family, based on this platform, is the industry’s first microcontroller with inductive sensing and capacitive sensing
technology in a single chip. The inductive sensing (MagSense™) technology enables sensing of metal objects and industry's leading
capacitive sensing (CapSense®) technology enables sensing of non-metallic objects.
Features
32-bit MCU Subsystem
■48-MHz Arm Cortex-M0+ CPU
■Up to 32 KB of flash with Read Accelerator
■Up to 4 KB of SRAM
Inductive Sensing
■Cypress MagSense provides superior noise immunity
■Reliably detects metal deflection under 190 nm
■MagSense software component automatically calibrates to
compensate for the manufacturing variations
■Up to 16 sensors
Capacitive Sensing
■Cypress CapSense Sigma-Delta (CSD) provides best-in-class
signal-to-noise ratio (SNR) (>5:1) and water tolerance
■Cypress-supplied software component makes capacitive
sensing design easy
■Automatic hardware tuning (SmartSense™)
Programmable Analog
■One single-slope 10-bit ADC function
■Two current DACs (IDACs)
■Two low-power comparators that operate in Deep Sleep
low-power mode
Programmable Digital
Two SmartIO ports allowing Boolean operations to be performed
on port inputs and outputs
Low-Power 1.71-V to 5.5-V Operation
■Deep Sleep mode with operational analog and 2.5 A digital
system current
Serial Communication
■Two independent run-time reconfigurable Serial
Communication Blocks (SCBs) with re-configurable I2C, SPI,
or UART functionality
LCD Drive Capability
■LCD segment drive capability on GPIOs
Timing and Pulse-Width Modulation
■Five 16-bit timer/counter/pulse-width modulator (TCPWM)
blocks
■Center-aligned, Edge, and Pseudo-random modes
■Comparator-based triggering of Kill signals for motor drive and
other high-reliability digital logic applications
Up to 36 Programmable GPIO Pins
■48-pin TQFP, 24-pin QFN, and 25-ball WLCSP packages
■Any GPIO pin can be capacitive sensing, analog, or digital; up
to 16 pins can be used for inductive sensing.
■Drive modes, strengths, and slew rates are programmable
PSoC Creator Design Environment
■Integrated Development Environment (IDE) provides
schematic design entry and build (with analog and digital
automatic routing)
■Applications Programming Interface (API) component for all
fixed-function and programmable peripherals
Industry-Standard Tool Compatibility
■After schematic entry, development can be done with
Arm-based industry-standard development tools
Document Number: 002-20489 Rev. *C Page 2 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right PSoC device for your design, and to help you
to quickly and effectively integrate the device into your design. For a comprehensive list of resources, see the knowledge base article
KBA86521, How to Design with PSoC 3, PSoC 4, and PSoC 5LP. Following is an abbreviated list for PSoC 4:
■Overview: PSoC Portfolio, PSoC Roadmap
■Product Selectors: PSoC 4
In addition, PSoC Creator includes a device selection tool.
■Application notes: Cypress offers a large number of PSoC
application notes covering a broad range of topics, from basic
to advanced level. Recommended application notes for getting
started with PSoC 4 are:
❐AN79953: Getting Started With PSoC 4
❐AN219207: Inductive Sensing Design Guide
❐AN88619: PSoC 4 Hardware Design Considerations
❐AN86439: Using PSoC 4 GPIO Pins
❐AN57821: Mixed Signal Circuit Board Layout
❐AN64846 - Getting Started with CapSense®
■Technical Reference Manual (TRM):
❐Architecture TRM details each PSoC 4 functional block.
❐Registers TRM describes each of the PSoC 4 registers.
■Development Kits:
❐CY8CKIT-148 PSoC® 4700S Inductive Sensing Evaluation
Kit is a low-cost hardware platform that enables design and
debug of the PSoC 4700S MCU. This kit demonstrates but-
tons and a proximity sensor using Cypress' brand new induc-
tive-sensing technology, MagSense. In addition, an FPC con-
nector is provided to evaluate various interfaces, such as a
rotary encoder.
■PSoC Creator provides example projects for different product
features and usage.
■Training Videos: Visit www.cypress.com/training for a wide
variety of video training resources on PSoC Creator
PSoC Creator
PSoC Creator is a free Windows-based Integrated Design Environment (IDE). It enables concurrent hardware and firmware design
of PSoC 3, PSoC 4, and PSoC 5LP based systems. Create designs using classic, familiar schematic capture supported by over 100
pre-verified, production-ready PSoC Components; see the list of component datasheets. With PSoC Creator, you can:
1. Drag and drop component icons to build your hardware
system design in the main design workspace
2. Codesign your application firmware with the PSoC hardware,
using the PSoC Creator IDE C compiler
3. Configure components using the configuration tools
4. Explore the library of 100+ components
5. Review component datasheets
Figure 1. Multiple-Sensor Example Project in PSoC Creator
3
1
2
4
5
Document Number: 002-20489 Rev. *C Page 3 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Contents
Block Diagram .................................................................. 4
Functional Description..................................................... 4
Functional Overview ........................................................ 5
CPU and Memory Subsystem ..................................... 5
System Resources ...................................................... 5
Analog Blocks.............................................................. 6
Programmable Digital Blocks ...................................... 6
Fixed Function Digital.................................................. 6
GPIO ........................................................................... 7
Special Function Peripherals....................................... 7
Pinouts .............................................................................. 8
Alternate Pin Functions ............................................... 9
Power............................................................................... 11
Mode 1: 1.8 V to 5.5 V External Supply .................... 11
Mode 2: 1.8 V ±5% External Supply.......................... 11
Development Support .................................................... 12
Documentation .......................................................... 12
Online ........................................................................ 12
Tools.......................................................................... 12
Electrical Specifications ................................................ 13
Absolute Maximum Ratings....................................... 13
Device Level Specifications....................................... 14
Analog Peripherals .................................................... 17
Digital Peripherals ..................................................... 21
Memory ..................................................................... 24
System Resources .................................................... 24
Ordering Information...................................................... 27
Packaging........................................................................ 29
Package Diagrams.................................................... 30
Acronyms........................................................................ 32
Document Conventions ................................................. 34
Units of Measure ....................................................... 34
Document History Page................................................. 35
Sales, Solutions, and Legal Information ...................... 36
Worldwide Sales and Design Support....................... 36
Products .................................................................... 36
PSoC® Solutions ...................................................... 36
Cypress Developer Community................................. 36
Technical Support ..................................................... 36
Document Number: 002-20489 Rev. *C Page 4 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Block Diagram
Figure 2. Block Diagram
Peripherals
CPU Subsystem
System Interconnect ( Single Layer AHB)
PSoC 4700S
Architecture
IOSS GPIO
(5x ports)
I /O S ubsystem
Peripheral Interconnect (MMIO)
PCLK
NVIC, IRQMUX
Cortex
M0+
48 MHz
FAST MUL
FLASH
32 KB
Read Accelerator
SRAM
4 KB
SRAM Controller
ROM
8 KB
ROM Controller
32- bit
AHB- Lite
2x SCB
-I2C/SPI/ UART
36x GPIOs, LCD
DeepSleep
Active/ Sleep
Power Modes
Digital DFT
Test
Analog DFT
System Resources
Lite
Power
Clock
Reset
Clock Control
IMO
Sleep Control
REFPOR
Reset Control
TestMode Entry
XRES
WDT
ILO
PWRSYS
5x TCPWM
MagSense/
CapSense
WCO
2x LP Comparator
High Speed I / O Matrix & 2x Programmable I /O
LCD
Document Number: 002-20489 Rev. *C Page 5 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Functional Overview
CPU and Memory Subsystem
CPU
The Cortex-M0+ CPU in the PSoC 4700S is part of the 32-bit
MCU subsystem, which is optimized for low-power operation
with extensive clock gating. Most instructions are 16 bits in length
and the CPU executes a subset of the Thumb-2 instruction set.
It includes a nested vectored interrupt controller (NVIC) block
with eight interrupt inputs and also includes a Wakeup Interrupt
Controller (WIC). The WIC can wake the processor from Deep
Sleep mode, allowing power to be switched off to the main
processor when the chip is in Deep Sleep mode.
The CPU also includes a debug interface, the serial wire debug
(SWD) interface, which is a two-wire form of JTAG. The debug
configuration used for PSoC 4700S has four breakpoint
(address) comparators and two watchpoint (data) comparators.
Flash
The PSoC 4700S device has a flash module with a flash
accelerator, tightly coupled to the CPU to improve average
access times from the flash block. The low-power flash block is
designed to deliver two wait-state (WS) access time at 48 MHz.
The flash accelerator delivers 85% of single-cycle SRAM access
performance on average. A small section of the Flash memory
is used to implement a supervisory Flash for storage or
configuration data.
SRAM
4KB of SRAM are provided with zero wait-state access at
48 MHz.
SROM
A supervisory ROM that contains boot and configuration routines
is provided.
System Resources
Power System
The power system is described in detail in the section Power on
page 11. It provides assurance that voltage levels are as required
for each respective mode and either delays mode entry (for
example, on power-on reset (POR)) until voltage levels are as
required for proper functionality, or generates resets (for
example, on brown-out detection). The PSoC 4700S operates
with a single external supply over the range of either 1.8 V ±5%
(externally regulated) or 1.8 to 5.5 V (internally regulated) and
has three different power modes, transitions between which are
managed by the power system. The PSoC 4700S provides
Active, Sleep, and Deep Sleep low-power modes.
All subsystems are operational in Active mode. The CPU
subsystem (CPU, flash, and SRAM) is clock-gated off in Sleep
mode, while all peripherals and interrupts are active with
instantaneous wake-up on a wake-up event. In Deep Sleep
mode, the high-speed clock and associated circuitry is switched
off; wake-up from this mode takes 35 µs.
Clock System
The PSoC 4700S clock system is responsible for providing
clocks to all subsystems that require clocks and for switching
between different clock sources without glitching. In addition, the
clock system ensures that there are no metastable conditions.
The clock system for the PSoC 4700S consists of the internal
main oscillator (IMO), internal low-frequency oscillator (ILO), a
32 kHz Watch Crystal Oscillator (WCO) and provision for an
external clock. Clock dividers are provided to generate clocks for
peripherals on a fine-grained basis. Fractional dividers are also
provided to enable granular frequency selections in clocking for
use with blocks such as UART.
The HFCLK signal can be divided down to generate
synchronous clocks for the analog and digital peripherals. There
are eight clock dividers for the PSoC 4700S, two of those are
fractional dividers. The 16-bit capability allows flexible
generation of fine-grained frequency values, The system clock
(SYSCLK) which is used to clock the CPU, is derived from the
HFCLK through a prescaler. All low-frequency operational blocks
like watchdog timer (WDT) is clocked by the LFCLK.
Figure 3. PSoC 4700S MCU Clocking Architecture
IMO Clock Source
The IMO is the primary source of internal clocking in the
PSoC 4700S. It is trimmed during testing to achieve the specified
accuracy.The IMO default frequency is 24 MHz and it can be
adjusted from 24 to 48 MHz in steps of 4 MHz. The IMO tolerance
with Cypress-provided calibration settings is ±2%. The IMO has
a mode where it can be trimmed using the WCO to achieve a
higher precision.
ILO Clock Source
The ILO is a very low power, nominally 40-kHz oscillator, which
is primarily used to generate clocks for the watchdog timer
(WDT) and peripheral operation in Deep Sleep mode. ILO-driven
counters can be calibrated to the IMO to improve accuracy.
Cypress provides a software component, which does the
calibration.
IMO
External Clock
HFCLK
LFCLK
Divide By
2,4,8
ILO
Integer
Dividers
Fractional
Dividers
SYSCLK
PrescalerHFCLK
5X 16-bit
2X 16.5-bit
WCO
Trim
Document Number: 002-20489 Rev. *C Page 6 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Watch Crystal Oscillator (WCO)
The PSoC 4700S clock subsystem also implements a
low-frequency (32-kHz watch crystal) oscillator that can be used
for precision timing applications.
Watchdog Timer (WDT)
A watchdog timer is implemented in the clock block running from
the LFCLK; this allows watchdog operation during Deep Sleep
and generates a watchdog reset if not serviced before the set
timeout occurs. The watchdog reset is recorded in a Reset
Cause register, which is firmware readable.
Reset
The PSoC 4700S can be reset from a variety of sources
including a software reset. Reset events are asynchronous and
guarantee reversion to a known state. The reset cause is
recorded in a register, which is sticky through reset and allows
software to determine the cause of the reset. An XRES pin is
reserved for external reset by asserting it active low. The XRES
pin has an internal pull-up resistor that is always enabled.
V oltage Reference
The PSoC 4700S reference system generates all internally
required references. A 1.2-V voltage reference is provided for the
comparator. The IDACs are based on a ±5% reference.
Analog Blocks
Low-power Comparators (LPC)
The PSoC 4700S has a pair of low-power comparators, which
can also operate in Deep Sleep modes. This allows the analog
system blocks to be disabled while retaining the ability to monitor
external voltage levels during low-power modes. The
comparator outputs are normally synchronized to avoid
metastability unless operating in an asynchronous power mode
where the system wake-up circuit is activated by a comparator
switch event. The LPC outputs can be routed to pins.
Current DACs
The PSoC 4700S has two IDACs, which can drive any of the pins
on the chip. These IDACs have programmable current ranges.
The current DACs are also used for implementation of the
MagSense and CapSense. So these DACs are not available if
the design implements MagSense or CapSense.
Analog Multiplexed Buses
The PSoC 4700S has two concentric independent buses that go
around the periphery of the chip. These buses (called amux
buses) are connected to firmware-programmable analog
switches that allow the chip's internal resources (IDACs,
comparator, ADC, LPC, CapSense, MagSense) to connect to
any pin on the I/O Ports.
Programmable Digital Blocks
The programmable I/O (Smart I/O) block is a fabric of switches
and LUTs that allows Boolean functions to be performed in
signals being routed to the pins of a GPIO port. The Smart I/O
can perform logical operations on input pins to the chip and on
signals going out as outputs.
Fixed Function Digital
Timer/Counter/PWM (TCPWM) Block
The five TCPWM blocks consist of a 16-bit counter with
user-programmable period length. There is a capture register to
record the count value at the time of an event (which may be an
I/O event), a period register that is used to either stop or
auto-reload the counter when its count is equal to the period
register, and compare registers to generate compare value
signals that are used as PWM duty cycle outputs. The block also
provides true and complementary outputs with programmable
offset between them to allow use as dead-band programmable
complementary PWM outputs. It also has a Kill input to force
outputs to a predetermined state; for example, this is used in
motor drive systems when an over-current state is indicated and
the PWM driving the FETs needs to be shut off immediately with
no time for software intervention.
Serial Communication Block (SCB)
The PSoC 4700S has two serial communication blocks, which
can be programmed to have SPI, I2C, or UART functionality.
I2C Mode: The hardware I2C block implements a full
multi-master and slave interface (it is capable of multi-master
arbitration). This block is capable of operating at speeds of up to
400 kbps (Fast Mode) and has flexible buffering options to
reduce interrupt overhead and latency for the CPU. It also
supports EZI2C that creates a mailbox address range in the
memory of the PSoC 4700S and effectively reduces I2C
communication to reading from and writing to an array in
memory. In addition, the block supports an 8-deep FIFO for
receive and transmit which, by increasing the time given for the
CPU to read data, greatly reduces the need for clock stretching
caused by the CPU not having read data on time.
The I2C peripheral is compatible with the I2C Standard-mode and
Fast-mode devices as defined in the NXP I2C-bus specification
and user manual (UM10204). The I2C bus I/O is implemented
with GPIO in open-drain modes.
The PSoC 4700S is not completely compliant with the I2C spec
in the following respect:
■GPIO cells are not overvoltage tolerant and, therefore, cannot
be hot-swapped or powered up independently of the rest of the
I2C system.
UART Mode: This is a full-feature UART operating at up to
1 Mbps. It supports automotive single-wire interface (LIN),
infrared interface (IrDA), and SmartCard (ISO7816) protocols, all
of which are minor variants of the basic UART protocol. In
addition, it supports the 9-bit multiprocessor mode that allows
addressing of peripherals connected over common RX and TX
lines. Common UART functions such as parity error, break
detect, and frame error are supported. An 8-deep FIFO allows
much greater CPU service latencies to be tolerated.
SPI Mode: The SPI mode supports full Motorola SPI, TI SSP
(adds a start pulse used to synchronize SPI Codecs), and
National Microwire (half-duplex form of SPI). The SPI block can
use the FIFO.
Document Number: 002-20489 Rev. *C Page 7 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
GPIO
The PSoC 4700S has up to 36 GPIOs. The GPIO block
implements the following:
■Eight drive modes:
❐Analog input mode (input and output buffers disabled)
❐Input only
❐Weak pull-up with strong pull-down
❐Strong pull-up with weak pull-down
❐Open drain with strong pull-down
❐Open drain with strong pull-up
❐Strong pull-up with strong pull-down
❐Weak pull-up with weak pull-down
■Input threshold select (CMOS or LVTTL).
■Individual control of input and output buffer enabling/disabling
in addition to the drive strength modes
■Selectable slew rates for dV/dt related noise control to improve
EMI
The pins are organized in logical entities called ports, which are
8-bit in width (less for Port 4). During power-on and reset, the
blocks are forced to the disable state so as not to crowbar any
inputs and/or cause excess turn-on current. A multiplexing
network known as a high-speed I/O matrix is used to multiplex
between various signals that may connect to an I/O pin.
Data output and pin state registers store, respectively, the values
to be driven on the pins and the states of the pins themselves.
Every I/O pin can generate an interrupt if so enabled and each
I/O port has an interrupt request (IRQ) and interrupt service
routine (ISR) vector associated with it (5 for PSoC 4700S).
Special Function Peripherals
MagSense (Inductive Sensing)
The MagSense block in the PSoC 4700S device provides
reliable contact-less metal-sensing for applications such as
buttons (touch-over-metal), proximity detection and
measurement, rotary and linear encoders, spring-based position
detection, and other applications based on detecting position or
distance of the metal object.
This block can sense small deflections and can work off a small
coin-cell battery enabling battery-powered applications such as
mobile devices and smart watches. Cypress provides the
component that automatically calibrates the design and
compensates for the manufacturing variations, thereby reducing
time-to-market, while providing a reliable solution that
Just WorksTM in harsh environments.
CapSense
CapSense is supported in the PSoC 4700S through a CapSense
Sigma-Delta (CSD) block that can be connected to any pins
through an analog multiplex bus via analog switches. CapSense
function can thus be provided on any available pin or group of
pins in a system under software control. A PSoC Creator
component is provided for the CapSense block to make it easy
for the user.
Shield voltage can be driven on another analog multiplex bus to
provide water-tolerance capability. Water tolerance is provided
by driving the shield electrode in phase with the sense electrode
to keep the shield capacitance from attenuating the sensed
input. Proximity sensing can also be implemented.
The CapSense block provides a 10-bit Slope ADC function,
which can be used in conjunction with the CapSense function.
The CapSense block has two IDACs, which can be used for
general purposes if CapSense is not being used (both IDACs are
available in that case) or if CapSense is used without water
tolerance (one IDAC is available).
The CapSense block is an advanced, low-noise, programmable
block with programmable voltage references and current source
ranges for improved sensitivity and flexibility. It can also use an
external reference voltage. It has a full-wave CSD mode that
alternates sensing to VDDA and Ground to null out power-supply
related noise.
LCD Segment Drive
The PSoC 4700S has an LCD controller, which can drive up to
8 commons and up to 28 segments. It uses full digital methods
to drive the LCD segments requiring no generation of internal
LCD voltages. The two methods used are referred to as Digital
Correlation and PWM. Digital Correlation pertains to modulating
the frequency and drive levels of the common and segment
signals to generate the highest RMS voltage across a segment
to light it up or to keep the RMS signal to zero. This method is
good for STN displays but may result in reduced contrast with TN
(cheaper) displays. PWM pertains to driving the panel with PWM
signals to effectively use the capacitance of the panel to provide
the integration of the modulated pulse-width to generate the
desired LCD voltage. This method results in higher power
consumption but can result in better results when driving TN
displays. LCD operation is supported during Deep Sleep
refreshing a small display buffer (4 bits; 1 32-bit register per port).
Document Number: 002-20489 Rev. *C Page 8 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Pinouts
The following table provides the pin list for PSoC 4700S for the 48-pin TQFP, 24-pin QFN, and 25-ball CSP packages. All port pins
support GPIO. Pin 11 is a No-Connect in the 48-TQFP.
Table 1. PSoC 4700S Pin List
48-TQFP 24-QFN 25-WLCSP
Pin Name Pin Name Pin Name
28 P0.0 13 P0.0 D1 P0.0
29 P0.1 14 P0.1 C3 P0.1
30 P0.2 – – – –
31 P0.3 – – – –
32 P0.4 15 P0.4 C2 P0.4
33 P0.5 16 P0.5 C1 P0.5
34 P0.6 17 P0.6 B1 P0.6
35 P0.7 – – B2 P0.7
36 XRES 18 XRES B3 XRES
37 VCCD 19 VCCD A1 VCCD
38 VSSD 20 VSSD A2 VSS
39 VDDD 21 VDD A3 VDD
40 VDDA 21 VDD A3 VDD
41 VSSA 22 VSSA A2 VSS
42 P1.0 – – – –
43 P1.1 – – – –
44 P1.2 23 P1.2 A4 P1.2
45 P1.3 24 P1.3 B4 P1.3
46 P1.4 – – – –
47 P1.5 – – – –
48 P1.6 – – – –
1 P1.7 1 P1.7 A5 P1.7
2 P2.0 2 P2.0 B5 P2.0
3 P2.1 3 P2.1 C5 P2.1
4P2.2––––
5P2.3––––
6P2.4––––
7P2.5––––
8 P2.6 4 P2.6 D5 P2.6
9 P2.7 5 P2.7 C4 P2.7
10 VSSD – – A2 VSS
12 P3.0 6 P3.0 E5 P3.0
13 P3.1 – – D4 P3.1
14 P3.2 7 P3.2 E4 P3.2
16 P3.3 8 P3.3 D3 P3.3
Document Number: 002-20489 Rev. *C Page 9 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Descriptions of the Pin functions are as follows:
VDDD: Power supply for the digital section.
VDDA: Power supply for the analog section.
VSSD, VSSA: Ground pins for the digital and analog sections
respectively.
VCCD: Regulated digital supply (1.8 V ±5%)
VDD: Power supply to all sections of the chip
VSS: Ground for all sections of the chip
Alternate Pin Functions
Each port pin can be assigned to one of multiple functions; it can,
for instance, be an analog I/O, a digital peripheral function, an
LCD pin, or a CapSense pin. The pin assignments are shown in
the following table.
17 P3.4 – – – –
18 P3.5 – – – –
19 P3.6 – – – –
20 P3.7 – – – –
21 VDDD – – – –
22 P4.0 9 P4.0 E3 P4.0
23 P4.1 10 P4.1 D2 P4.1
24 P4.2 11 P4.2 E2 P4.2
25 P4.3 12 P4.3 E1 P4.3
Table 1. PSoC 4700S Pin List (continued)
48-TQFP 24-QFN 25-WLCSP
Pin Name Pin Name Pin Name
Table 2. Pin Assignments
Port/
Pin Analog Smart I/O Alternate
Function 1
Alternate
Function 2
Alternate
Function 3 Deep Sleep 1 Deep Sleep 2
P0.0 lpcomp.in_p[0] –––tcpwm.tr_in[0] –scb[0].spi_select1:0
P0.1 lpcomp.in_n[0] –––tcpwm.tr_in[1] –scb[0].spi_select2:0
P0.2 lpcomp.in_p[1] –––––scb[0].spi_select3:0
P0.3 lpcomp.in_n[1] ––––––
P0.4 wco.wco_in ––scb[1].uart_rx:0 scb[2].uart_rx:0 scb[1].i2c_scl:0 scb[1].spi_mosi:1
P0.5 wco.wco_out ––scb[1].uart_tx:0 scb[2].uart_tx:0 scb[1].i2c_sda:0 scb[1].spi_miso:1
P0.6 ––srss.ext_clk scb[1].uart_cts:0 scb[2].uart_tx:1 –scb[1].spi_clk:1
P0.7 –––scb[1].uart_rts:0 –scb[1].spi_select0:1
P1.0 ––tcpwm.line[2]:1 scb[0].uart_rx:1 –scb[0].i2c_scl:0 scb[0].spi_mosi:1
P1.1 ––tcpwm.line_-
compl[2]:1
scb[0].uart_tx:1 –scb[0].i2c_sda:0 scb[0].spi_miso:1
P1.2 ––tcpwm.line[3]:1 scb[0].uart_cts:1 tcpwm.tr_in[2] scb[2].i2c_scl:0 scb[0].spi_clk:1
P1.3 ––tcpwm.line_-
compl[3]:1
scb[0].uart_rts:1 tcpwm.tr_in[3] scb[2].i2c_sda:0 scb[0].spi_select0:1
P1.4 ––––––scb[0].spi_select1:1
P1.5 ––––––scb[0].spi_select2:1
P1.6 ––––––scb[0].spi_select3:1
Document Number: 002-20489 Rev. *C Page 10 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
P1.7 –––––––
P2.0 –SmartIO[0].io[0] tcpwm.line[4]:0 csd.comp tcpwm.tr_in[4] scb[1].i2c_scl:1 scb[1].spi_mosi:2
P2.1 –SmartIO[0].io[1] tcpwm.line_-
compl[4]:0
–tcpwm.tr_in[5] scb[1].i2c_sda:1 scb[1].spi_miso:2
P2.2 –SmartIO[0].io[2] ––––scb[1].spi_clk:2
P2.3 –SmartIO[0].io[3] ––– –scb[1].spi_select0:2
P2.4 –SmartIO[0].io[4] tcpwm.line[0]:1 –– –scb[1].spi_select1:1
P2.5 –SmartIO[0].io[5] tcpwm.line_-
compl[0]:1
–––scb[1].spi_select2:1
P2.6 –SmartIO[0].io[6] tcpwm.line[1]:1 –– –scb[1].spi_select3:1
P2.7 –SmartIO[0].io[7] tcpwm.line_-
compl[1]:1
––lpcomp.comp[0]:1 –
P3.0 –SmartIO[1].io[0] tcpwm.line[0]:0 scb[1].uart_rx:1 –scb[1].i2c_scl:2 scb[1].spi_mosi:0
P3.1 –SmartIO[1].io[1] tcpwm.line_-
compl[0]:0
scb[1].uart_tx:1 –scb[1].i2c_sda:2 scb[1].spi_miso:0
P3.2 –SmartIO[1].io[2] tcpwm.line[1]:0 scb[1].uart_cts:1 –cpuss.swd_data scb[1].spi_clk:0
P3.3 –SmartIO[1].io[3] tcpwm.line_-
compl[1]:0
scb[1].uart_rts:1 –cpuss.swd_clk scb[1].spi_select0:0
P3.4 –SmartIO[1].io[4] tcpwm.line[2]:0 –tcpwm.tr_in[6] –scb[1].spi_select1:0
P3.5 –SmartIO[1].io[5] tcpwm.line_-
compl[2]:0
–tcpwm.tr_in[7] –scb[1].spi_select2:0
P3.6 –SmartIO[1].io[6] tcpwm.line[3]:0 –tcpwm.tr_in[8] –scb[1].spi_select3:0
P3.7 –SmartIO[1].io[7] tcpwm.line_-
compl[3]:0
–tcpwm.tr_in[9] lpcomp.comp[1]:1 –
P4.0 csd.vref_ext ––scb[0].uart_rx:0 tcpwm.tr_in[10] scb[0].i2c_scl:1 scb[0].spi_mosi:0
P4.1 csd.cshieldpads ––scb[0].uart_tx:0 tcpwm.tr_in[11] scb[0].i2c_sda:1 scb[0].spi_miso:0
P4.2 csd.cmodpad ––scb[0].uart_cts:0 –lpcomp.comp[0]:0 scb[0].spi_clk:0
P4.3 csd.csh_tank ––scb[0].uart_rts:0 –lpcomp.comp[1]:0 scb[0].spi_select0:0
Table 2. Pin Assignments (continued)
Port/
Pin Analog Smart I/O Alternate
Function 1
Alternate
Function 2
Alternate
Function 3 Deep Sleep 1 Deep Sleep 2
Document Number: 002-20489 Rev. *C Page 11 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Power
The following power system diagram shows the set of power
supply pins as implemented for the PSoC 4700S. The system
has one regulator in Active mode for the digital circuitry. There is
no analog regulator; the analog circuits run directly from the VDD
input.
Figure 4. Power Supply Connections
There are two distinct modes of operation. In Mode 1, the supply
voltage range is 1.8 V to 5.5 V (unregulated externally; internal
regulator operational). In Mode 2, the supply range is1.8 V ±5%
(externally regulated; 1.71 V to 1.89 V, internal regulator
bypassed).
Mode 1: 1.8 V to 5.5 V External Supply
In this mode, the PSoC 4700S is powered by an external power
supply that can be anywhere in the range of 1.8 to 5.5 V. This
range is also designed for battery-powered operation. For
example, the chip can be powered from a battery system that
starts at 3.5 V and works down to 1.8 V. In this mode, the internal
regulator of the PSoC 4700S supplies the internal logic and its
output is connected to the VCCD pin. The VCCD pin must be
bypassed to ground via an external capacitor (0.1 µF; X5R
ceramic or better) and must not be connected to anything else.
Mode 2: 1.8 V ±5% External Supply
In this mode, the PSoC 4700S is powered by an external power
supply that must be within the range of 1.71 to 1.89 V; note that
this range needs to include the power supply ripple too. In this
mode, the VDD and VCCD pins are shorted together and
bypassed. The internal regulator can be disabled in the firmware.
Bypass capacitors must be used from VDDD to ground. The
typical practice for systems in this frequency range is to use a
capacitor in the 1-µF range, in parallel with a smaller capacitor
(0.1 µF, for example). Note that these are simply rules of thumb
and that, for critical applications, the PCB layout, lead
inductance, and the bypass capacitor parasitic should be
simulated to design and obtain optimal bypassing.
An example of a bypass scheme is shown in the following
diagram.
Figure 5. External Supply Range from 1.8 V to 5.5 V with Internal Regulator Active
Analog
Domain
VDDA
VSSA
VDDA
1.8 Volt
Regulator
Digital
Domain
VDDD
VSSD
VDDD
VCCD
PSoC 4700S
V
DDD
V
SSD
1.8V to 5.5V
0.1 F
V
CCD
0.1 F
Power supply bypass connections example
1.8 V to 5.5 V
0.1 F
F
V
DDA
1 F
Document Number: 002-20489 Rev. *C Page 12 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Development Support
The PSoC 4700S family has a rich set of documentation,
development tools, and online resources to assist you during
your development process. Visit www.cypress.com/go/psoc4 to
find out more.
Documentation
A suite of documentation supports the PSoC 4700S family to
ensure that you can find answers to your questions quickly. This
section contains a list of some of the key documents.
Inductive Sensing Design Guide:
A guide to designing reliable Inductive Solutions.
Software User Guide: A step-by-step guide for using
PSoC Creator. The software user guide shows you how the
PSoC Creator build process works in detail, how to use source
control with PSoC Creator, and much more.
Component Datasheets: The flexibility of PSoC allows the
creation of new peripherals (components) long after the device
has gone into production. Component data sheets provide all of
the information needed to select and use a particular component,
including a functional description, API documentation, example
code, and AC/DC specifications.
Application Notes: PSoC application notes discuss a particular
application of PSoC in depth; examples include brushless DC
motor control and on-chip filtering. Application notes often
include example projects in addition to the application note
document.
Technical Reference Manual: The Technical Reference Manual
(TRM) contains all the technical detail you need to use a PSoC
device, including a complete description of all PSoC registers.
The TRM is available in the Documentation section at
www.cypress.com/psoc4.
Online
In addition to print documentation, the Cypress PSoC forums
connect you with fellow PSoC users and experts in PSoC from
around the world, 24 hours a day, 7 days a week.
Tools
With industry standard cores, programming, and debugging
interfaces, the PSoC 4700S family is part of a development tool
ecosystem. Visit us at www.cypress.com/go/psoccreator for the
latest information on the revolutionary, easy to use PSoC Creator
IDE, supported third party compilers, programmers, debuggers,
and development kits.
Document Number: 002-20489 Rev. *C Page 13 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Electrical Specifications
Absolute Maximum Ratings
Table 3. Absolute Maximum Ratings[1]
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID1 VDDD_ABS Digital supply relative to VSS –0.5 – 6 V –
SID2 VCCD_ABS Direct digital core voltage input relative
to VSS
–0.5 – 1.95 –
SID3 VGPIO_ABS GPIO voltage –0.5 – VDD+0.5 –
SID4 IGPIO_ABS Maximum current per GPIO –25 – 25 mA –
SID5 IGPIO_injection GPIO injection current, Max for VIH >
VDDD, and Min for VIL < VSS
–0.5 – 0.5 Current injected
per pin
BID44 ESD_HBM Electrostatic discharge human body
model
2200 – – V –
BID45 ESD_CDM Electrostatic discharge charged device
model
500 – – –
BID46 LU Pin current for latch-up –140 – 140 mA –
Note
1. Usage above the absolute maximum conditions listed in Table 3 may cause permanent damage to the device. Exposure to Absolute Maximum conditions for extended
periods of time may affect device reliability. The Maximum Storage Temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High Temperature
Storage Life. When used below Absolute Maximum conditions but above normal operating conditions, the device may not operate to specification.
Document Number: 002-20489 Rev. *C Page 14 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Device Level Specifications
All specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
except where noted.
Table 4. DC Specifications
Typical values measured at VDD = 3.3 V and 25 °C.
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID53 VDD Power supply input voltage 1.8 – 5.5 V Internally
regulated supply
SID255 VDD Power supply input voltage (VCCD =
VDD= VDDA)
1.71 – 1.89 Internally
unregulated
supply
SID54 VCCD Output voltage (for core logic) – 1.8 – –
SID55 CEFC External regulator voltage bypass – 0.1 – µFX5R ceramic or
better
SID56 CEXC Power supply bypass capacitor – 1 – X5R ceramic or
better
Active Mode, VDD = 1.8 V to 5.5 V. Typical values measured at VDD = 3.3 V and 25 °C.
SID10 IDD5 Execute from flash; CPU at 6 MHz – 1.2 2.0 mA –
SID16 IDD8 Execute from flash; CPU at 24 MHz – 2.4 4.0 –
SID19 IDD11 Execute from flash; CPU at 48 MHz – 4.6 5.9 –
Sleep Mode, VDDD = 1.8 V to 5.5 V (Regulator on)
SID22 IDD17 I2C wakeup WDT, and Comparators on – 1.1 1.6 mA 6 MHz
SID25 IDD20 I2C wakeup, WDT, and Comparators on – 1.4 1.9 12 MHz
Sleep Mode, VDDD = 1.71 V to 1.89 V (Regulator bypassed)
SID28 IDD23 I2C wakeup, WDT, and Comparators on – 0.7 0.9 mA 6 MHz
SID28A IDD23A I2C wakeup, WDT, and Comparators on – 0.9 1.1 mA 12 MHz
Deep Sleep Mode, VDD = 1.8 V to 3.6 V (Regulator on)
SID31 IDD26 I2C wakeup and WDT on – 2.5 60 µA–
Deep Sleep Mode, VDD = 3.6 V to 5.5 V (Regulator on)
SID34 IDD29 I2C wakeup and WDT on – 2.5 60 µA–
Deep Sleep Mode, VDD = VCCD = 1.71 V to 1.89 V (Regulator bypassed)
SID37 IDD32 I2C wakeup and WDT on – 2.5 60 µA–
XRES Current
SID307 IDD_XR Supply current while XRES asserted – 2 5 mA –
Table 5. AC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID48 FCPU CPU frequency DC –48 MHz 1.71 VDD 5.5
SID49[3] TSLEEP Wakeup from Sleep mode – 0 – µs –
SID50[3] TDEEPSLEEP Wakeup from Deep Sleep mode –35 – –
Notes
2. Guaranteed by characterization.
3. VIH must not exceed VDDD + 0.2 V.
Document Number: 002-20489 Rev. *C Page 15 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
GPIO
Table 6. GPIO DC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID57 VIH[4] Input voltage high threshold 0.7 VDDD – – V CMOS Input
SID58 VIL Input voltage low threshold – – 0.3
VDDD
CMOS Input
SID241 VIH[4] LVTTL input, VDDD < 2.7 V 0.7 VDDD –– –
SID242 VIL LVTTL input, VDDD < 2.7 V – – 0.3
VDDD
–
SID243 VIH[4] LVTTL input, VDDD 2.7 V 2.0 – – –
SID244 VIL LVTTL input, VDDD 2.7 V – – 0.8 –
SID59 VOH Output voltage high level VDDD –0.6 – – IOH = 4 mA at 3 V VDDD
SID60 VOH Output voltage high level VDDD –0.5 – – IOH = 1 mA at 3 V VDDD
SID61 VOL Output voltage low level – – 0.6 IOL = 4 mA at 1.8 V
VDDD
SID62 VOL Output voltage low level – – 0.6 IOL = 10 mA at 3 V VDDD
SID62A VOL Output voltage low level – – 0.4 IOL = 3 mA at 3 V VDDD
SID63 RPULLUP Pull-up resistor 3.5 5.6 8.5 kΩ –
SID64 RPULLDOWN Pull-down resistor 3.5 5.6 8.5 –
SID65 IIL Input leakage current (absolute
value)
– – 2 nA 25 °C, VDDD = 3.0 V
SID66 CIN Input capacitance – – 7 pF –
SID67[5] VHYSTTL Input hysteresis LVTTL 25 40 – mV VDDD 2.7 V
SID68[5] VHYSCMOS Input hysteresis CMOS 0.05 × VDDD –– V
DD < 4.5 V
SID68A[5] VHYSCMOS5V5 Input hysteresis CMOS 200 – – VDD > 4.5 V
SID69[5] IDIODE Current through protection diode to
VDD/VSS
– – 100 µA–
SID69A[5] ITOT_GPIO Maximum total source or sink chip
current
– – 200 mA –
Notes
4. VIH must not exceed VDDD + 0.2 V.
5. Guaranteed by characterization.
Document Number: 002-20489 Rev. *C Page 16 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
XRES
Table 7. GPIO AC Specifications
(Guaranteed by Characterization)
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID70 TRISEF Rise time in fast strong mode 2 – 12 ns 3.3 V VDDD, Cload = 25 pF
SID71 TFALLF Fall time in fast strong mode 2 – 12 3.3 V VDDD, Cload = 25 pF
SID72 TRISES Rise time in slow strong mode 10 –60 –3.3 V VDDD, Cload = 25 pF
SID73 TFALLS Fall time in slow strong mode 10 –60 –3.3 V VDDD, Cload = 25 pF
SID74 FGPIOUT1 GPIO FOUT;
3.3 V VDDD 5.5 V
Fast strong mode
– – 33 MHz 90/10%, 25 pF load,
60/40 duty cycle
SID75 FGPIOUT2 GPIO FOUT;
1.71 VVDDD3.3 V
Fast strong mode
– – 16.7 90/10%, 25 pF load,
60/40 duty cycle
SID76 FGPIOUT3 GPIO FOUT;
3.3 V VDDD 5.5 V
Slow strong mode
– – 7 90/10%, 25 pF load,
60/40 duty cycle
SID245 FGPIOUT4 GPIO FOUT;
1.71 V VDDD 3.3 V
Slow strong mode.
– – 3.5 90/10%, 25 pF load,
60/40 duty cycle
SID246 FGPIOIN GPIO input operating
frequency;
1.71 V VDDD 5.5 V
– – 48 90/10% VIO
Table 8. XRES DC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID77 VIH Input voltage high threshold 0.7 × VDDD – – V CMOS Input
SID78 VIL Input voltage low threshold – – 0.3 VDDD
SID79 RPULLUP Pull-up resistor – 60 – kΩ –
SID80 CIN Input capacitance – – 7 pF –
SID81[6] VHYSXRES Input voltage hysteresis – 100 – mV Typical hysteresis is
200 mV for VDD > 4.5 V
SID82 IDIODE Current through protection
diode to VDD/VSS
––100µA –
Table 9. XRES AC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID83[6] TRESETWIDTH Reset pulse width 1 – – µs –
BID194[6] TRESETWAKE Wake-up time from reset
release
– – 2.7 ms –
Note
6. Guaranteed by characterization.
Document Number: 002-20489 Rev. *C Page 17 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Analog Peripherals
Table 10. Low Power Comparator DC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID84 VOFFSET1 Input offset voltage, Factory trim ––±10mV –
SID85 VOFFSET2 Input offset voltage, Custom trim ––±4 –
SID86 VHYST Hysteresis when enabled –10 35 –
SID87 VICM1 Input common mode voltage in normal mode 0 –V
DDD – 0.1 V Modes 1 and 2
SID247 VICM2 Input common mode voltage in low power mode 0 –V
DDD –
SID247A VICM3 Input common mode voltage in ultra low power
mode
0–V
DDD – 1.15 VDDD ≥ 2.2 V at
–40 °C
SID88 CMRR Common mode rejection ratio 50 ––dBV
DDD ≥ 2.7V
SID88A CMRR Common mode rejection ratio 42 ––V
DDD ≤ 2.7V
SID89 ICMP1 Block current, normal mode ––400µA –
SID248 ICMP2 Block current, low power mode ––100 –
SID259 ICMP3 Block current in ultra low-power mode –628 VDDD ≥ 2.2 V at
–40 °C
SID90 ZCMP DC Input impedance of comparator 35 ––MΩ –
Table 11. Comparator AC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/
Conditions
SID91 TRESP1 Response time, normal mode, 50 mV overdrive –38 110 ns –
SID258 TRESP2 Response time, low power mode, 50 mV overdrive –70 200 –
SID92 TRESP3 Response time, ultra-low power mode, 200 mV
overdrive
–2.3 15 µs VDDD ≥ 2.2 V
at –40 °C
Document Number: 002-20489 Rev. *C Page 18 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
CSD (Capacitive Sensing and IDAC block)
Table 12. CSD and IDAC Specifications
SPEC ID# Parameter Description Min Typ Max Units Details / Conditions
SYS.PER#3 VDD_RIPPLE Max allowed ripple on power supply,
DC to 10 MHz –– ±50 mV VDD > 2 V (with ripple),
25 °C TA, Sensitivity =
0.1 pF
SYS.PER#16 VDD_RIPPLE_1.8 Max allowed ripple on power supply,
DC to 10 MHz –– ±25 mV VDD > 1.75V (with ripple),
25 °C TA, Parasitic Capaci-
tance (CP) < 20 pF,
Sensitivity ≥ 0.4 pF
SID.CSD.BLK ICSD Maximum block current ––4000 µA Maximum block current for
both IDACs in dynamic
(switching) mode including
comparators, buffer, and
reference generator.
SID.CSD#15 VREF Voltage reference for CSD and
Comparator
0.6 1.2 VDDA - 0.6 VVDDA - 0.06 or 4.4,
whichever is lower
SID.CSD#15A VREF_EXT External Voltage reference for CSD
and Comparator
0.6 –VDDA - 0.6 VVDDA - 0.06 or 4.4,
whichever is lower
SID.CSD#16 IDAC1IDD IDAC1 (7-bits) block current ––1750 µA –
SID.CSD#17 IDAC2IDD IDAC2 (7-bits) block current ––1750 µA –
SID308 VCSD Voltage range of operation 1.71 –5.5 V1.8 V ±5% or 1.8 V to 5.5 V
SID308A VCOMPIDAC Voltage compliance range of IDAC 0.6 –VDDA –0.6 VVDDA - 0.06 or 4.4,
whichever is lower
SID309 IDAC1DNL DNL –1 –1LSB –
SID310 IDAC1INL INL –2 –2LSB INL is ±5.5 LSB for VDDA <
2V
SID311 IDAC2DNL DNL –1 –1LSB –
SID312 IDAC2INL INL –2 –2LSB INL is ±5.5 LSB for VDDA <
2V
SID313 SNR Ratio of counts of finger to noise.
Guaranteed by characterization
5––
Ratio Capacitance range of 5 to
35 pF, 0.1-pF sensitivity. All
use cases. VDDA > 2 V.
SID314 IDAC1CRT1 Output current of IDAC1 (7 bits) in
low range
4.2 –5.4 µA LSB = 37.5-nA typ.
SID314A IDAC1CRT2 Output current of IDAC1(7 bits) in
medium range
34 –41 µA LSB = 300-nA typ.
SID314B IDAC1CRT3 Output current of IDAC1(7 bits) in
high range
275 –330 µA LSB = 2.4-µA typ.
SID314C IDAC1CRT12 Output current of IDAC1 (7 bits) in
low range, 2X mode
8–10.5 µA LSB = 75-nA typ.
SID314D IDAC1CRT22 Output current of IDAC1(7 bits) in
medium range, 2X mode
69 –82 µA LSB = 600-nA typ.
SID314E IDAC1CRT32 Output current of IDAC1(7 bits) in
high range, 2X mode
540 –660 µA LSB = 4.8-µA typ.
SID315 IDAC2CRT1 Output current of IDAC2 (7 bits) in
low range
4.2 –5.4 µA LSB = 37.5-nA typ.
SID315A IDAC2CRT2 Output current of IDAC2 (7 bits) in
medium range
34 –41 µA LSB = 300-nA typ.
SID315B IDAC2CRT3 Output current of IDAC2 (7 bits) in
high range
275 –330 µA LSB = 2.4-µA typ.
SID315C IDAC2CRT12 Output current of IDAC2 (7 bits) in
low range, 2X mode
8–10.5 µA LSB = 75-nA typ.
SID315D IDAC2CRT22 Output current of IDAC2(7 bits) in
medium range, 2X mode
69 –82 µA LSB = 600-nA typ.
Document Number: 002-20489 Rev. *C Page 19 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Inductive Sen si ng (MagSense )
SID315E IDAC2CRT32 Output current of IDAC2(7 bits) in
high range, 2X mode
540 –660 µA LSB = 4.8-µA typ.
SID315F IDAC3CRT13 Output current of IDAC in 8-bit mode
in low range
8–10.5 µA LSB = 37.5-nA typ.
SID315G IDAC3CRT23 Output current of IDAC in 8-bit mode
in medium range
69 –82 µA LSB = 300-nA typ.
SID315H IDAC3CRT33 Output current of IDAC in 8-bit mode
in high range
540 –660 µA LSB = 2.4-µA typ.
SID320 IDACOFFSET All zeroes input –– 1LSB Polarity set by Source or
Sink. Offset is 2 LSBs for
37.5 nA/LSB mode
SID321 IDACGAIN Full-scale error less offset –– ±10 %–
SID322 IDACMISMATCH1 Mismatch between IDAC1 and
IDAC2 in Low mode
–– 9.2 LSB LSB = 37.5-nA typ.
SID322A IDACMISMATCH2 Mismatch between IDAC1 and
IDAC2 in Medium mode
–– 5.6 LSB LSB = 300-nA typ.
SID322B IDACMISMATCH3 Mismatch between IDAC1 and
IDAC2 in High mode
–– 6.8 LSB LSB = 2.4-µA typ.
SID323 IDACSET8 Settling time to 0.5 LSB for 8-bit IDAC –– 10 µs Full-scale transition. No
external load.
SID324 IDACSET7 Settling time to 0.5 LSB for 7-bit IDAC –– 10 µs Full-scale transition. No
external load.
SID325 CMOD External modulator capacitor. –2.2 –nF 5-V rating, X7R or NP0 cap.
Table 12. CSD and IDAC Specifications (continued)
SPEC ID# Parameter Description Min Typ Max Units Details / Conditions
Table 13. MagSense Specifications
Spec ID# Parameter Description Min Typ Max Units Details/Conditions
SID500 Nsense Number of Sensors – – 16 – –
SID501 Lsamp Sample Rate – – 10 ksps –
SID502 Lres Resolution – – 16 bits –
SID503 Lfreq Sensor excitation frequency 45 –3000 kHz –
SID505 Lval Inductance Range 1 – 10000 µH –
SID506 Lprox Proximity detection range –0.75 ×
coil
diameter
– – –
Document Number: 002-20489 Rev. *C Page 20 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
CapSense
Table 14. 10-bit CapSense ADC Specifications
Spec ID# Parameter Description Min Typ Max Units Details/Conditions
SIDA94 A_RES Resolution – – 10 bits Auto-zeroing is required
every millisecond
SIDA95 A_CHNLS_S Number of channels - single ended – – 16 –Defined by AMUX Bus.
SIDA97 A-MONO Monotonicity – – – Yes –
SIDA98 A_GAINERR Gain error – – ±2 %In VREF (2.4 V) mode with
VDDA bypass capacitance of
10 µF
SIDA99 A_OFFSET Input offset voltage – – 3 mV In VREF (2.4 V) mode with
VDDA bypass capacitance of
10 µF
SIDA100 A_ISAR Current consumption – – 0.25 mA –
SIDA101 A_VINS Input voltage range - single ended VSSA – VDDA V –
SIDA103 A_INRES Input resistance –2.2 –KΩ –
SIDA104 A_INCAP Input capacitance –20 –pF –
SIDA106 A_PSRR Power supply rejection ratio –60 –dB In VREF (2.4 V) mode with
VDDA bypass capacitance of
10 µF
SIDA107 A_TACQ Sample acquisition time – 1 – µs –
SIDA108 A_CONV8 Conversion time for 8-bit resolution
at conversion rate =
Fhclk/(2^(N+2)). Clock frequency =
48 MHz.
– – 21.3 µs Does not include acquisition
time. Equivalent to 44.8 ksps
including acquisition time.
SIDA108A A_CONV10 Conversion time for 10-bit
resolution at conversion rate =
Fhclk/(2^(N+2)). Clock frequency =
48 MHz.
– – 85.3 µs Does not include acquisition
time. Equivalent to 11.6 ksps
including acquisition time.
SIDA109 A_SND Signal-to-noise and Distortion ratio
(SINAD)
–61 –dB With 10-Hz input sine wave,
external 2.4-V reference,
VREF (2.4 V) mode
SIDA110 A_BW Input bandwidth without aliasing – – 22.4 kHz 8-bit resolution
SIDA111 A_INL Integral Non Linearity. 1 ksps – – 2 LSB VREF = 2.4 V or greater
SIDA112 A_DNL Differential Non Linearity. 1 ksps – – 1 LSB –
Document Number: 002-20489 Rev. *C Page 21 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Digital Peripherals
Timer Counter Pulse-Width Modulator (TCPWM)
I2C
Table 15. TCPWM Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID.TCPWM.1 ITCPWM1 Block current consumption at 3 MHz – – 45 μAAll modes (TCPWM)
SID.TCPWM.2 ITCPWM2 Block current consumption at 12 MHz – – 155 All modes (TCPWM)
SID.TCPWM.2A ITCPWM3 Block current consumption at 48 MHz – – 650 All modes (TCPWM)
SID.TCPWM.3 TCPWMFREQ Operating frequency – – Fc MHz Fc max = CLK_SYS
Maximum = 48 MHz
SID.TCPWM.4 TPWMENEXT Input trigger pulse width 2/Fc – – ns For all trigger events[7]
SID.TCPWM.5 TPWMEXT Output trigger pulse widths 2/Fc – – Minimum possible width
of Overflow, Underflow,
and CC (Counter equals
Compare value) outputs
SID.TCPWM.5A TCRES Resolution of counter 1/Fc – – Minimum time between
successive counts
SID.TCPWM.5B PWMRES PWM resolution 1/Fc – – Minimum pulse width of
PWM Output
SID.TCPWM.5C QRES Quadrature inputs resolution 1/Fc – – Minimum pulse width
between Quadrature
phase inputs
Table 16. Fixed I2C DC Specifications[8]
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID149 II2C1 Block current consumption at 100 kHz – – 50 µA –
SID150 II2C2 Block current consumption at 400 kHz – – 135 –
SID151 II2C3 Block current consumption at 1 Mbps – – 310 –
SID152 II2C4 I2C enabled in Deep Sleep mode – – 1.4 –
Table 17. Fixed I2C AC Specifications[8]
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID153 FI2C1 Bit rate – – 1 Msps –
Notes
7. Trigger events can be Stop, Start, Reload, Count, Capture, or Kill depending on which mode of operation is selected.
8. Guaranteed by characterization.
Document Number: 002-20489 Rev. *C Page 22 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
SPI
Table 18. SPI DC Specifications[9]
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID163 ISPI1 Block current consumption at 1 Mbps – – 360 µA –
SID164 ISPI2 Block current consumption at 4 Mbps – – 560 –
SID165 ISPI3 Block current consumption at 8 Mbps – – 600 –
Table 19. SPI AC Specifications[9]
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID166 FSPI SPI operating frequency (Master; 6X
Oversampling)
– – 8 MHz –
Fixed SPI Master Mode AC Specifications
SID167 TDMO MOSI Valid after SClock driving edge – – 15 ns –
SID168 TDSI MISO Valid before SClock capturing
edge
20 – – Full clock, late MISO
sampling
SID169 THMO Previous MOSI data hold time 0 – – Referred to Slave
capturing edge
Fixed SPI Slave Mode AC Specifications
SID170 TDMI MOSI Valid before Sclock Capturing
edge
40 – – ns –
SID171 TDSO MISO Valid after Sclock driving edge – – 42 +
3*Tcpu
TCPU = 1/FCPU
SID171A TDSO_EXT MISO Valid after Sclock driving edge in
Ext. Clk mode
– – 48 –
SID172 THSO Previous MISO data hold time 0 – – –
SID172A TSSELSSCK SSEL Valid to first SCK Valid edge – – 100 ns –
Note
9. Guaranteed by characterization.
Document Number: 002-20489 Rev. *C Page 23 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
UART
LCD
Table 20. UART DC Specifications[10]
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID160 IUART1 Block current consumption at 100 Kbps – – 55 µA –
SID161 IUART2 Block current consumption at 1000 Kbps – – 312 µA –
Table 21. UART AC Specifications[10]
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID162 FUART Bit rate – – 1 Mbps –
Table 22. LCD Direct Drive DC Specifications[10]
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID154 ILCDLOW Operating current in low power mode – 5 – µA 16 4 small segment
disp. at 50 Hz
SID155 CLCDCAP LCD capacitance per segment/common
driver
– 500 5000 pF –
SID156 LCDOFFSET Long-term segment offset – 20 – mV –
SID157 ILCDOP1 LCD system operating current Vbias =
5V
–2 –mA32 4 segments. 50 Hz.
25 °C
SID158 ILCDOP2 LCD system operating current Vbias =
3.3 V
–2 – 32 4 segments. 50 Hz.
25 °C
Table 23. LCD Direct Drive AC Specifications[10]
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID159 FLCD LCD frame rate 10 50 150 Hz –
Note
10. Guaranteed by characterization.
Document Number: 002-20489 Rev. *C Page 24 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Memory
System Resources
Power-on Reset (POR)
Brown-out Detect
Table 24. Flash DC Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID173 VPE Erase and program voltage 1.71 – 5.5 V –
Table 25. Flash AC Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID174 TROWWRITE[11] Row (block) write time (erase and
program)
– – 20 ms Row (block) = 128 bytes
SID175 TROWERASE[11] Row erase time – – 16 –
SID176 TROWPROGRAM[11] Row program time after erase – – 4 –
SID178 TBULKERASE[11] Bulk erase time (32 KB) – – 35 –
SID180[12] TDEVPROG[11] Total device program time – – 7 Seconds –
SID181[12] FEND Flash endurance 100 K – – Cycles –
SID182[12] FRET Flash retention. TA 55 °C, 100 K
P/E cycles
20 – – Years –
SID182A[12] – Flash retention. TA 85 °C, 10 K
P/E cycles
10 – – –
SID256 TWS48 Number of Wait states at 48 MHz 2 – – CPU execution from
Flash
SID257 TWS24 Number of Wait states at 24 MHz 1 – – CPU execution from
Flash
Table 26. Power On Reset (PRES)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID.CLK#6 SR_POWER_UP Power supply slew rate 1 – 67 V/ms At power-up
SID185[12] VRISEIPOR Rising trip voltage 0.80 – 1.5 V –
SID186[12] VFALLIPOR Falling trip voltage 0.70 – 1.4 –
Table 27. Brown-out Detect (BOD) for VCCD
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID190[12] VFALLPPOR BOD trip voltage in active and
sleep modes
1.48 – 1.62 V –
SID192[12] VFALLDPSLP BOD trip voltage in Deep Sleep 1.11 – 1.5 –
Notes
11. It can take as much as 20 milliseconds to write to Flash. During this time the device should not be Reset, or Flash operations will be interrupted and cannot be relied
on to have completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs.
Make certain that these are not inadvertently activated.
12. Guaranteed by characterization.
Document Number: 002-20489 Rev. *C Page 25 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
SWD Interface
Internal Main Oscillator
Internal Low-Speed Oscillator
Table 28. SWD Interface Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID213 F_SWDCLK1 3.3 V VDD 5.5 V – – 14 MHz SWDCLK ≤ 1/3 CPU
clock frequency
SID214 F_SWDCLK2 1.71 V VDD 3.3 V – – 7 SWDCLK ≤ 1/3 CPU
clock frequency
SID215[13] T_SWDI_SETUP T = 1/f SWDCLK 0.25*T – – ns –
SID216[13] T_SWDI_HOLD T = 1/f SWDCLK 0.25*T – – –
SID217[13] T_SWDO_VALID T = 1/f SWDCLK – – 0.5*T –
SID217A[13] T_SWDO_HOLD T = 1/f SWDCLK 1 – – –
Table 29. IMO DC Specifications
(Guaranteed by Design)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID218 IIMO1 IMO operating current at 48 MHz – – 250 µA–
SID219 IIMO2 IMO operating current at 24 MHz – – 180 µA–
Table 30. IMO AC Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID223 FIMOTOL1 Frequency variation at 24, 32, and
48 MHz (trimmed)
– – ±2 % –
SID226 TSTARTIMO IMO startup time – – 7 µs –
SID228 TJITRMSIMO2 RMS jitter at 24 MHz –145 –ps –
Table 31. ILO DC Specifications
(Guaranteed by Design)
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID231[13] IILO1 ILO operating current – 0.3 1.05 µA –
Table 32. ILO AC Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID234[13] TSTARTILO1 ILO startup time – – 2 ms –
SID236[13] TILODUTY ILO duty cycle 40 50 60 % –
SID237 FILOTRIM1 ILO frequency range 20 40 80 kHz –
Note
13. Guaranteed by characterization.
Document Number: 002-20489 Rev. *C Page 26 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Watch Crystal Oscillator
External Clock
Block
Smart I/O
Table 33. Watch Crystal Oscillator (WCO) Specifications
Spec ID# Parameter Description Min Typ Max Units Details / Conditions
SID398 FWCO Crystal Frequency – 32.768 – kHz –
SID399 FTOL Frequency tolerance – 50 250 ppm With 20-ppm crystal
SID400 ESR Equivalent series resistance – 50 – kΩ –
SID401 PD Drive Level – – 1 µW –
SID402 TSTART Startup time – – 500 ms –
SID403 CL Crystal Load Capacitance 6 – 12.5 pF –
SID404 C0 Crystal Shunt Capacitance – 1.35 – pF –
SID405 IWCO1 Operating Current (high power mode) – – 8 µA –
SID406 IWCO2 Operating Current (low power mode) – – 1 µA –
Table 34. External Clock Specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID305[14] ExtClkFreq External clock input frequency 0 – 48 MHz –
SID306[14] ExtClkDuty Duty cycle; measured at VDD/2 45 –55 % –
Table 35. Block Specs
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID262[14] TCLKSWITCH System clock source switching time 3 – 4 Periods –
Table 36. Smart I/O Pass-through Time (Delay in Bypass Mode)
Spec ID# Parameter Description Min Typ Max Units Details / Conditions
SID252 PRG_BYPASS Max delay added by Smart I/O in
bypass mode
– – 1.6 ns –
Note
14. Guaranteed by characterization.
Document Number: 002-20489 Rev. *C Page 27 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Ordering Information
The PSoC 4700S part numbers and features are listed in the following table.
The nomenclature used in the preceding table is based on the
following part numbering convention:
Table 37. PSoC 4700S Ordering Information
Category MPN
Features Package
Max CPU Speed (MHz)
Flash (KB)
SRAM (KB)
CapSense
MagSense
10-bit CSD ADC
LP Comparators
TCPWM Blocks
SCB Blocks
Smart I/Os
GPIO
WLCSP (0.35-mm pitch)
24-Pin QFN
48-Pin TQFP
4724 CY8C4724FNI-S402 24 16 2011252221 ✔– –
CY8C4724LQI-S401 24 16 2011252219 –✔–
4725 CY8C4725FNI-S402 24 32 4011252421 ✔– –
CY8C4725LQI-S401 24 32 4011252419 –✔–
4744
CY8C4744FNI-S402 48 16 2011252221 ✔– –
CY8C4744LQI-S401 48 16 2011252219 –✔–
CY8C4744AZI-S403 48 32 2011252436 – – ✔
4745 CY8C4745FNI-S402 48 32 4011252421 ✔– –
CY8C4745LQI-S401 48 32 4011252419 –✔–
CY8C4745AZI-S403 48 32 4011252836 – – ✔
CY8C4745FNI-S412 48 32 4111252821 ✔– –
CY8C4745LQI-S411 48 32 4111252819 –✔–
CY8C4745AZI-S413 48 32 411125216 36 – – ✔
Field Description Values Meaning
CY8C Cypress Prefix
4Architecture 4PSoC 4
AFamily 74700 Family
BCPU Speed 224 MHz
448 MHz
CFlash Capacity 416 KB
532 KB
DE Package Code
AZ TQFP (0.5-mm pitch)
LQ QFN
FN CSP
FTemperature Range IIndustrial
SSub-family Identifier
SPSoC 4 S-Series
MPSoC 4 M-Series
LPSoC 4 L-Series
XYZ Attributes Code 000-999 Code of feature set in the specific family
Document Number: 002-20489 Rev. *C Page 28 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
The following is an example of a part number:
7: 4700 Family
Document Number: 002-20489 Rev. *C Page 29 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Packaging
The PSoC 4700S will be offered in 48-pin TQFP, 24-pin QFN, and 25-ball WLCSP packages. Package dimensions and Cypress
drawing numbers are in the following table.
Table 38. Package List
Spec ID# Package Description Package Diagram
BID20 48-pin TQFP 7 × 7 × 1.4 mm height with 0.5-mm pitch 51-85135
BID34 24-pin QFN 4 × 4 × 0.6 mm height with 0.5-mm pitch 001-13937
BID34F 25-ball WLCSP 2.02 × 1.93 × 0.48 mm height with 0.35-mm pitch 002-09957
Table 39. Package Thermal Characteristics
Parameter Description Package Min Typ Max Units
TAOperating ambient temperature –40 25 85 °C
TJOperating junction temperature –40 – 100 °C
TJA Package θJA 48-pin TQFP – 73.5 – °C/Watt
TJC Package θJC 48-pin TQFP – 33.5 – °C/Watt
TJA Package θJA 24-pin QFN – 21.7 – °C/Watt
TJC Package θJC 24-pin QFN – 5.6 – °C/Watt
TJA Package θJA 25-ball WLCSP – 54.6 – °C/Watt
TJC Package θJC 25-ball WLCSP – 0.5 – °C/Watt
Table 40. Solder Reflow Peak Temperature
Package Maximum Peak
Temperature Maximum Time at Peak Temperature
All 260 °C 30 seconds
Table 41. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-020
Package MSL
All except WLCSP MSL 3
25-ball WLCSP MSL 1
Document Number: 002-20489 Rev. *C Page 30 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Package Diagrams
Figure 6. 48-pin TQFP Package Outline
Figure 7. 24-pin QFN Package Outline
51-85135 *C
001-13937 *G
Document Number: 002-20489 Rev. *C Page 31 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
The center pad on the QFN package should be connected to ground (VSS) for best mechanical, thermal, and electrical performance.
If not connected to ground, it should be electrically floating and not connected to any other signal.
Figure 8. 25-ball WLCSP Package Outline
002-09957 **
Document Number: 002-20489 Rev. *C Page 32 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Acronyms
Table 42. Acronyms Used in this Document
Acronym Description
abus analog local bus
ADC analog-to-digital converter
AG analog global
AHB AMBA (advanced microcontroller bus
architecture) high-performance bus, an Arm data
transfer bus
ALU arithmetic logic unit
AMUXBUS analog multiplexer bus
API application programming interface
APSR application program status register
Arm®advanced RISC machine, a CPU architecture
ATM automatic thump mode
BW bandwidth
CAN Controller Area Network, a communications
protocol
CMRR common-mode rejection ratio
CPU central processing unit
CRC cyclic redundancy check, an error-checking
protocol
DAC digital-to-analog converter, see also IDAC,
VDAC
DFB digital filter block
DIO digital input/output, GPIO with only digital
capabilities, no analog. See GPIO.
DMIPS Dhrystone million instructions per second
DMA direct memory access, see also TD
DNL differential nonlinearity, see also INL
DNU do not use
DR port write data registers
DSI digital system interconnect
DWT data watchpoint and trace
ECC error correcting code
ECO external crystal oscillator
EEPROM electrically erasable programmable read-only
memory
EMI electromagnetic interference
EMIF external memory interface
EOC end of conversion
EOF end of frame
EPSR execution program status register
ESD electrostatic discharge
ETM embedded trace macrocell
FIR finite impulse response, see also IIR
FPB flash patch and breakpoint
FS full-speed
GPIO general-purpose input/output, applies to a PSoC
pin
HVI high-voltage interrupt, see also LVI, LVD
IC integrated circuit
IDAC current DAC, see also DAC, VDAC
IDE integrated development environment
I2C, or IIC Inter-Integrated Circuit, a communications
protocol
IIR infinite impulse response, see also FIR
ILO internal low-speed oscillator, see also IMO
IMO internal main oscillator, see also ILO
INL integral nonlinearity, see also DNL
I/O input/output, see also GPIO, DIO, SIO, USBIO
IPOR initial power-on reset
IPSR interrupt program status register
IRQ interrupt request
ITM instrumentation trace macrocell
LCD liquid crystal display
LIN Local Interconnect Network, a communications
protocol.
LR link register
LUT lookup table
LVD low-voltage detect, see also LVI
LVI low-voltage interrupt, see also HVI
LVTTL low-voltage transistor-transistor logic
MAC multiply-accumulate
MCU microcontroller unit
MISO master-in slave-out
NC no connect
NMI nonmaskable interrupt
NRZ non-return-to-zero
NVIC nested vectored interrupt controller
NVL nonvolatile latch, see also WOL
opamp operational amplifier
Table 42. Acronyms Used in this Document (continued)
Acronym Description
Document Number: 002-20489 Rev. *C Page 33 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
PAL programmable array logic, see also PLD
PC program counter
PCB printed circuit board
PGA programmable gain amplifier
PHUB peripheral hub
PHY physical layer
PICU port interrupt control unit
PLA programmable logic array
PLD programmable logic device, see also PAL
PLL phase-locked loop
PMDD package material declaration data sheet
POR power-on reset
PRES precise power-on reset
PRS pseudo random sequence
PS port read data register
PSoC®Programmable System-on-Chip™
PSRR power supply rejection ratio
PWM pulse-width modulator
RAM random-access memory
RISC reduced-instruction-set computing
RMS root-mean-square
RTC real-time clock
RTL register transfer language
RTR remote transmission request
RX receive
SAR successive approximation register
SC/CT switched capacitor/continuous time
SCL I2C serial clock
SDA I2C serial data
S/H sample and hold
SINAD signal to noise and distortion ratio
SIO special input/output, GPIO with advanced
features. See GPIO.
SOC start of conversion
SOF start of frame
SPI Serial Peripheral Interface, a communications
protocol
SR slew rate
SRAM static random access memory
SRES software reset
Table 42. Acronyms Used in this Document (continued)
Acronym Description
SWD serial wire debug, a test protocol
SWV single-wire viewer
TD transaction descriptor, see also DMA
THD total harmonic distortion
TIA transimpedance amplifier
TRM technical reference manual
TTL transistor-transistor logic
TX transmit
UART Universal Asynchronous Transmitter Receiver, a
communications protocol
UDB universal digital block
USB Universal Serial Bus
USBIO USB input/output, PSoC pins used to connect to
a USB port
VDAC voltage DAC, see also DAC, IDAC
WDT watchdog timer
WOL write once latch, see also NVL
WRES watchdog timer reset
XRES external reset I/O pin
XTAL crystal
Table 42. Acronyms Used in this Document (continued)
Acronym Description
Document Number: 002-20489 Rev. *C Page 34 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Document Conventions
Units of Measure
Table 43. Units of Measure
Symbol Unit of Measure
°C degrees Celsius
dB decibel
fF femto farad
Hz hertz
KB 1024 bytes
kbps kilobits per second
Khr kilohour
kHz kilohertz
kkilo ohm
ksps kilosamples per second
LSB least significant bit
Mbps megabits per second
MHz megahertz
Mmega-ohm
Msps megasamples per second
µA microampere
µF microfarad
µH microhenry
µs microsecond
µV microvolt
µW microwatt
mA milliampere
ms millisecond
mV millivolt
nA nanoampere
ns nanosecond
nV nanovolt
ohm
pF picofarad
ppm parts per million
ps picosecond
s second
sps samples per second
sqrtHz square root of hertz
Vvolt
Document Number: 002-20489 Rev. *C Page 35 of 36
PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
Document History Page
Description Title: PSoC® 4: PSoC 4700S Family Datasheet Programmable System-on-Chip (PSoC)
Document Number: 002-20489
Revision ECN Orig. of
Change
Submission
Date Description of Change
** 5843084 WKA 09/12/2017 New data sheet.
*A 6219085 QVS 06/26/2018 Updated Features:
Updated Inductive Sensing:
Updated More Information:
Updated Electrical Specifications:
Updated Analog Peripherals:
Updated Inductive Sensing (MagSense):
Updated Ta b le 13.
Updated Package Diagrams:
Spec 001-13937 – Changed revision from *F to *G.
Updated to new template.
*B 6290288 QVS 08/24/2018 Changed “IndSense” to “MagSense” throughout the document.
Updated links in More Information.
*C 6318929 QVS 09/24/2018 Updated Features, More Information.
Updated Block Diagram.
Removed Functional Description and updated Functional Overview.
Updated Pinouts.
Document Number: 002-20489 Rev. *C Revised September 24, 2018 Page 36 of 36
© Cypress Semiconductor Corporation, 2017-2018. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document,
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to deviate from published specifications. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any
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PRELIMINARY PSoC® 4: PSoC 4700S Family
Datasheet
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