3-1
TM
File Number 3138.7
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 |Intersil and Design is a trademark of Intersil Corporation. |Copyright © Intersil Corporation 2000
HIN230 thru HIN241
+5V Powered RS-232
Transmitters/Receivers
The HIN230-HIN241 f amily of RS-232 transmitters/receiv ers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not av ailab le . The y require a single +5V po wer supply (except
HIN231 and HIN239) and f eature onboard charge pump
voltage con verters which generate +10V and -10V supplies
from the 5V supply. The HIN233 and HIN235 require no
external capacitors and are ideally suited for applications where
circuit board space is critical. The family of devices offer a wide
variety of RS-232 transmitter/receiv er combinations to
accommodate various applications (see Selection Table).
The drivers feature true TTL/CMOS input compatibility, slew-
rate-limited output, and 300 power-off source impedance.
The receivers can handle up to ±30V, and have a 3kto 7k
input impedance. The receivers also feature hysteresis to
greatly improve noise rejection.
Features
Meets All RS-232E and V.28 Specifications
Requires Only Single +5V Power Supply
- (+5V and +12V - HIN231 and HIN239)
High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps
HIN233 and HIN235 Require No External Capacitors
Onboard Voltage Doubler/Inverter
Low Power Consumption
Low Power Shutdown Function
Three-State TTL/CMOS Receiver Outputs
Multiple Drivers
-±10V Output Swing for 5V lnput
- 300 Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
Multiple Receivers
-±30V Input Voltage Range
-3k to 7k Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
Applications
Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
PART
NUMBER POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-STATE NUMBER OF
LEADS
HIN230 +5V 5 0 4 Capacitors Yes/No 20
HIN231 +5V and +7.5V to 13.2V 2 2 2 Capacitors No/No 16
HIN232 +5V 2 2 4 Capacitors No/No 16
HIN233 +5V 2 2 None No/No 20
HIN234 +5V 4 0 4 Capacitors No/No 16
HIN235 +5V 5 5 None Yes/Yes 24
HIN236 +5V 4 3 4 Capacitors Yes/Yes 24
HIN237 +5V 5 3 4 Capacitors No/No 24
HIN238 +5V 4 4 4 Capacitors No/No 24
HIN239 +5V and +7.5V to 13.2V 3 5 2 Capacitors No/Yes 24
HIN240 +5V 5 5 4 Capacitors Yes/Yes 44
HIN241 +5V 4 5 4 Capacitors Yes/Yes 28
Data Sheet May 2000
3-2
Ordering Information
PART
NUMBER TEMP.
RANGE (oC) PACKAGE PKG. NO.
HIN230CB 0 to 70 20 Ld SOIC M20.3
HIN230IB -40 to 85 20 Ld SOIC M20.3
HIN231CB 0 to 70 16 Ld SOIC M16.3
HIN231CP 0 to 70 14 Ld PDIP E14.3
HIN231IB -40 to 85 16 Ld SOIC M16.3
HIN231IP -40 to 85 14 Ld PDIP E14.3
HIN232CP 0 to 70 16 Ld PDIP E16.3
HIN232CB 0 to 70 16 Ld SOIC M16.3
HIN232IP -40 to 85 16 Ld PDIP E16.3
HIN232IB -40 to 85 16 Ld SOIC M16.3
HIN233CP 0 to 70 20 Ld PDIP E20.3
HIN234CB 0 to 70 16 Ld SOIC M16.3
HIN234IB -40 to 85 16 Ld SOIC M16.3
HIN235CP 0 to 70 24 Ld PDIP E24.6
HIN236CP 0 to 70 24 Ld PDIP E24.3
HIN236CB 0 to 70 24 Ld SOIC M24.3
HIN236IP -40 to 85 24 Ld PDIP E24.3
HIN236IB -40 to 85 24 Ld SOIC M24.3
HIN237CP 0 to 70 24 Ld PDIP E24.3
HIN237CB 0 to 70 24 Ld SOIC M24.3
HIN237IP -40 to 85 24 Ld PDIP E24.3
HIN237IB -40 to 85 24 Ld SOIC M24.3
HIN238CP 0 to 70 24 Ld PDIP E24.3
HIN238CB 0 to 70 24 Ld SOIC M24.3
HIN238IP -40 to 85 24 Ld PDIP E24.3
HIN238IB -40 to 85 24 Ld SOIC M24.3
HIN239CB 0 to 70 24 Ld SOIC M24.3
HIN239CP 0 to 70 24 Ld PDIP E24.3
HIN239IB -40 to 85 24 Ld SOIC M24.3
HIN240CN 0 to 70 44 Ld MQFP Q44.10X10
HIN240IN -40 to 85 44 Ld MQFP Q44.10X10
HIN241CB 0 to 70 28 Ld SOIC M28.3
HIN241IB -40 to 85 28 Ld SOIC M28.3
HIN241CA 0 to 70 28 Ld SSOP M28.209
HIN241IA -40 to 85 28 Ld SSOP M28.209
NOTE: Many of the surface mount devices are available on tape and
reel; add -T to suffix.
PART
NUMBER TEMP.
RANGE (oC) PACKAGE PKG. NO.
Pin Descriptions
PIN FUNCTION
VCC Power Supply Input 5V ±10%.
V+ Internally generated positive supply (+10V nominal), HIN231 and HIN239 require +7.5V to +13.2V.
V- Internally generated negative supply (-10V nominal).
GND Ground lead. Connect to 0V.
C1+ External capacitor (+ terminal) is connected to this lead.
C1- External capacitor (- terminal) is connected to this lead.
C2+ External capacitor (+ terminal) is connected to this lead.
C2- External capacitor (- terminal) is connected to this lead.
TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kpull-up resistor to VCC is connected to each lead.
TOUT Transmitter Outputs. These are RS-232 levels (nominally ±10V).
RIN Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kpull-down resistor to GND is connected to each input.
ROUT Receiver Outputs. These are TTL/CMOS levels.
EN Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placed in a high
impedance state.
SHUTDOWN Shutdown Input. With SHUTDOWN = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state
and the transmitters are shut off.
NC No Connect. No connections are made to these leads.
HIN230 thru HIN241
3-3
Pinouts HIN230 (SOIC)
TOP VIEW HIN231 (SOIC)
TOP VIEW
T3OUT
T1OUT
T2OUT
T2IN
T1IN
GND
C1+
VCC
V+
C1-
T4OUT
NC
SHUTDOWN
T5OUT
T5IN
T4IN
T3IN
V-
C2-
C2+
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C+
C-
V-
T2OUT
R2IN
NC
T2IN
V+
GND
T1OUT
R1IN
R1OUT
T1IN
NC
VCC
R2OUT
(14)
(13)
(12)
(11)
(10)
(9)
(8)
NOTE: Pin numbers in parentheses are for PDIP Package.
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T5OUT
T5IN
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
T5
+5V400k
+5V
+1µF
+1µF
+
1µF
5
4
2
3
14 1
15 20
1619
8
10 9
13
V+
V-
C1+
C1-
C2+
C2-
17 SHUTDOWN
7
+5V400k
+5V400k
+5V400k
+5V400k
+
1µF
11
12
6
VCC
+5V
16
V+
+7.5V TO +13.2V
15
T1OUT
T2OUT
T1IN
T2IN
T1
T2
10
7
13
4
+5V400k
+5V400k
R1OUT R1IN
R1
1211
5k
R2OUT R2IN
R2
56
5k
+12V TO -12V
VOLTAGE INVERTER 1µF
3
V-
C+
C-
+
1µF
1
2
+
14
NOTE: SOIC pin numbers shown.
HIN230 thru HIN241
3-4
HIN232 (PDIP, SOIC)
TOP VIEW HIN233 (PDIP, SOIC)
TOP VIEW
NOTE: Pin names in parentheses are for SOIC Package.
NOTE: Pin numbers in parentheses are for SOIC Package.
Pinouts (Continued)
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
V-
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
T2IN
T1IN
R1OUT
R1IN
T1OUT
GND
(V+) C1+
VCC
GND
(V-) C2-
R2OUT
T2OUT
V-
C2-
R2IN
C2+
V+ (C1-)
C1- (C1+)
V- (C2+)
C2+ (C2-)
VCC
+5V
2
V+
16
T1OUT
T2OUT
T1IN
T2IN
T1
T2
11
10
14
7
+5V400k
+5V400k
R1OUT R1IN
R1
1312
5k
R2OUT R2IN
R2
89
5k
+10V TO -10V
VOLTAGE INVERTER 1µF
6
V-
C2+
C2-
+
1µF
4
5
+5V TO 10V
VOLTAGE DOUBLER
C1+
C1-
+
1µF
1
3+1µF
+
+
1µF
15
6
VCC
T1OUT
T2OUT
R1OUT
R2IN
T1IN
T2IN
R1IN
T1
+5V
+0.1µF
4
5
1
2
18
14 (8)
19
8 (13)
12 (10)
V+
V-
C1+
C1-
C2+
C2-
+5V 400k
GND
9
GND
17
R2OUT
NO
CONNECT
INTERNAL
-10V
SUPPLY
INTERNAL
+10V
SUPPLY
V-
C2+
C2-
13 (14)
5k
6
20
11 (12)
15
16
10 (11)
3
T2
+5V 400k
5k
R1
R2
HIN230 thru HIN241
3-5
HIN234 (SOIC)
TOP VIEW HIN235 (PDIP)
TOP VIEW
Pinouts (Continued)
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
T1OUT
T2OUT
T2IN
T1IN
GND
V+
C1+
T3OUT
T4IN
T3IN
V-
C2-
C2+
C1-
T4OUT
VCC
1
2
3
4
5
6
7
8
9
10
11
12
T4OUT
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
16
17
18
19
20
21
22
23
24
15
14
13
R3IN
T5IN
SHUTDOWN
EN
T5OUT
R4OUT
T3IN
R5OUT
R5IN
R3OUT
R4IN
T4IN
6
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+1µF
+1µF
+
1µF
4
3
1
2
13 16
14 15
7
98
12
V+
V-
C1+
C1-
C2+
C2-
+5V400k
+5V400k
+5V400k
+5V400k
+
1µF
10
11
5
12
VCC
T1OUT
T1IN
T1
+5V
+0.1µF
6
2
3
18
1
19
24
10
400k
13
14
R1OUT R1IN
R1
4
5
R2OUT R2IN
R2
23
22
R3OUT R3IN
R3
16
17
21
20
+5V
T2OUT
T2IN
+5V
T3OUT
T3IN
+5V
T4OUT
T4IN
+5V
T5OUT
T5IN
+5V
400k
400k
400k
400k
T2
T3
T4
T5
GND
9
R4IN
R5IN
R4
R5
11
15
7
8
R4OUT
R5OUT
EN SHUTDOWN
5k
5k
5k
5k
5k
HIN230 thru HIN241
3-6
HIN236 (PDIP, SOIC)
TOP VIEW HIN237 (PDIP, SOIC)
TOP VIEW
Pinouts (Continued)
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
SHUTDOWN
EN
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
T5IN
T5OUT
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+1µF
+1µF
+
1µF
7
6
2
3
18 1
19 24
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400k
+5V400k
+5V400k
+5V400k
+
1µF
13
14
R1OUT R1IN
R1
45
5k
R2OUT R2IN
R2
2322
5k
R3OUT R3IN
R3
1617
5k
EN 20 21
SHUTDOWN
8
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+1µF
+1µF
+
1µF
7
6
2
3
18 1
19 24
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400k
+5V400k
+5V400k
+5V400k
+
1µF
13
14
R1OUT R1IN
R1
45
5k
R2OUT R2IN
R2
2322
5k
R3OUT R3IN
R3
1617
5k
T5OUT
T5IN
T5
21 20
+5V400k
8
HIN230 thru HIN241
3-7
HIN238 (PDIP, SOIC)
TOP VIEW HIN239 (SOIC)
TOP VIEW
NOTE: No Connect
Pinouts (Continued)
T2OUT
T1OUT
R2IN
R2OUT
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T3OUT
R3OUT
T4IN
T4OUT
T3IN
R4OUT
V-
C2-
C2+
R3IN
T2IN
R4IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
R1OUT
R1IN
GND
VCC
V+
C1+
C1-
V-
R5IN
R5OUT
R4OUT
R4IN
T1IN
R2OUT
R2IN
T2OUT
T1OUT
R3OUT
NC (NOTE)
EN
T3OUT
T2IN
R3IN
T3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+1µF
+1µF
+
1µF
5
18
2
1
19 24
21 20
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400k
+5V400k
+5V400k
+5V400k
+
1µF
13
14
R1OUT R1IN
R1
76
5k
R2OUT R2IN
R2
34
5k
R3OUT R3IN
R3
2322
5k
R4OUT R4IN
R4
1617
5k
8
4
VCC
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+1µF
+
1µF
24
23
19
20
16 13
6
75
8
V+
C1+
C1-
+5V400k
+5V400k
+5V400k
R1OUT R1IN
R1
2
5k
R2OUT R2IN
R2
2122
5k
R3OUT R3IN
R3
1817
5k
R4OUT R4IN
R4
1211
5k
R5OUT R5IN
R5
910
5k
EN 14
1
+7.5V TO +13.2V
V-
3
HIN230 thru HIN241
3-8
HIN240 (MQFP) HIN241 (SOIC, SSOP)
TOP VIEW
Pinouts (Continued)
NC
GND
NC
R2IN
NC
T2OUT
T1OUT
T3OUT
T4OUT
R3IN
R3OUT
T5IN
NC 1
2
3
4
5
6
7
8
9
10
11
12 13 14 15 16 17
28
27
26
25
24
23
2221201918
39 38 37 36 35 34
33
32
31
30
29
44 43 42 41 40
R4OUT
T4IN
T3IN
R5OUT
R5IN
NC
NC
SHUT
EN
T5OUT
R4IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
VCC
NC
NC
NC
NC
NC
C1+
V+
C1-
C2+
C2-
V-
NC
NC
NC
DOWN
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T4OUT
R3OUT
SHUTDOWN
EN
R4IN
T4IN
R5OUT
R5IN
V-
C2-
C2+
R3IN
R4OUT
T3IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
19
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+1µF
1µF
+
1µF
15
14
7
8
37 6
25
27 26
30
V+
V-
C1+
C1-
C2+
C2-
+5V400k
+5V400k
+5V400k
+
1µF
28
29
R1OUT R1IN
R1
17
5k
R2OUT R2IN
R2
1013
5k
R3OUT R3IN
R3
43
5k
R4OUT R4IN
R4
4039
5k
R5OUT R5IN
R5
3536
5k
EN 42
16
T4OUT
T4IN
T4
38 5
+5V400k
T5OUT
T5IN
T5
241
+5V400k
SHUTDOWN
43
18
11
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+1µF
+1µF
+
1µF
7
6
2
3
20 1
12
14 13
17
V+
V-
C1+
C1-
C2+
C2-
+5V400k
+5V400k
+5V400k
+
1µF
15
16
R1OUT R1IN
R1
9
5k
R2OUT R2IN
R2
45
5k
R3OUT R3IN
R3
2726
5k
R4OUT R4IN
R4
2322
5k
R5OUT R5IN
R5
1819
5k
EN 24
8T4OUT
T4IN
T4
21 28
+5V400k
SHUTDOWN
25
10
HIN230 thru HIN241
3-9
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . .(VCC -0.3V) < V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 70oC
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Resistance (Typical, Note 1) θJA (oC/W)
14 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90
20 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 80
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 70
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100
20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 120
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . . 80
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range. . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC, SSOP, MQFP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENTS
Power Supply Current, ICC No Load,
TA = 25oCHIN232-233 - 5 10 mA
HIN230, HIN234-238, HIN240-241 - 7 15 mA
HIN231, HIN239 - 0.4 1 mA
V+ Power Supply Current, ICC
No Load, TA = 25oCNo Load,
TA = 25oCHIN231 - 1.8 5 mA
HIN239 - 5.0 15 mA
Shutdown Supply Current, ICC(SD) TA = 25oC-110µA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL TIN, EN, Shutdown - - 0.8 V
Input Logic High, VlH TIN 2.0 - - V
EN, Shutdown 2.4 - - V
Transmitter Input Pullup Current, IPTIN = 0V - 15 200 µA
TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA
(HIN231-HIN233 IOUT = 3.2mA) - 0.1 0.4 V
TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1.0mA 3.5 4.6 - V
RECEIVER INPUTS
RS-232 Input Voltage Range VIN -30 - +30 V
Receiver Input Impedance RIN VIN = ±3V 3.0 5.0 7.0 k
Receiver Input Low Threshold, VlN (H-L) VCC = 5V, TA = 25oC 0.8 1.2 - V
Receiver Input High Threshold, VIN (L-H) VCC = 5V, TA = 25oC - 1.7 2.4 V
Receiver Input Hysteresis VHYST 0.2 0.5 1.0 V
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching) RL = 3k120 - - kbps
Output Enable Time, tEN HIN235, 236, 239, 240, 241 - 400 - ns
Output Disable Time, tDIS HIN235, 236, 239, 240, 241 - 250 - ns
HIN230 thru HIN241
3-10
Propagation Delay, tPD RS-232 to TTL - 0.5 - µs
Instantaneous Slew Rate SR CL = 10pF, RL = 3k, TA = 25oC
(Note 2) - - 30 V/µs
Transition Region Slew Rate, SRTRL = 3k, CL = 2500pF Measured
from +3V to -3V or -3V to +3V, 1
Transmitter Switching
-3-V/µs
TRANSMITTER OUTPUTS
Output Voltage Swing, TOUT Transmitter Outputs, 3kto Ground ±5±9±10 V
Output Resistance, ROUT VCC = V+ = V- = 0V, VOUT = ±2V 300 - -
RS-232 Output Short Circuit Current, ISC TOUT shorted to GND - ±10 - mA
NOTE:
2. Guaranteed by design.
Electrical Specifications Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range (Continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
HIN230 thru HIN241
3-11
Detailed Description
The HIN230 thru HIN241 family of RS-232
transmitters/receiv ers are po wered b y a single +5V po wer
supply (e xcept HIN231 and HIN239), f eature lo w po wer
consumption, and meet all ElA RS-232C and V.28
specifications. The circuit is divided into three sections: The
charge pump , transmitter, and receiv er.
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure
1. The charge pump contains two sections: the v oltage
doubler and the voltage inverter . Each section is driv en by a
two phase, internally generated cloc k to gener ate +10V and -
10V. The nominal clock frequency is 16kHz. During phase one
of the clock, capacitor C1 is charged to VCC. During phase
two, the voltage on C1 is added to VCC, producing a signal
across C3 equal to twice VCC. During phase one, C2 is also
charged to 2VCC, and then during phase two , it is inverted
with respect to ground to produce a signal across C4 equal to
-2VCC. The charge pump accepts input voltages up to 5.5V.
The output impedance of the voltage doubler section (V+) is
approximately 200, and the output impedance of the voltage
inverter section (V-) is approximately 450. A typical
application uses 1µF capacitors for C1-C4, however, the value
is not critical. Increasing the values of C1 and C2 will lower the
output impedance of the voltage doubler and inverter ,
increasing the values of the reservoir capacitors , C3 and C4,
lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN230, 235, 236, 240 and 241),
SHUTDOWN control line set to logic “1”, the charge pump is
turned off, V+ is pulled down to VCC, V- is pulled up to GND,
and the supply current is reduced to less than 10µA. The
transmitter outputs are disabled and the receiver outputs are
placed in the high impedance state.
Transmitters
The transmitters are TTL/CMOS compatib le in v erters which
translate the inputs to RS-232 outputs. The input logic
threshold is about 26% of VCC, or 1.3V f or VCC = 5V. A logic 1
at the input results in a voltage of betw een -5V and V- at the
output, and a logic 0 results in a voltage between +5V and (V+ -
0.6V). Each transmitter input has an internal 400k pullup
resistor so any unused input can be left unconnected and its
output remains in its low state. The output voltage swing meets
the RS-232C specifications of ±5V minimum with the worst
case conditions of: all transmitters driving 3k minimum load
impedance, VCC = 4.5V, and maximum allow ab le operating
temperature. The tr ansmitters ha v e an internally limited output
slew r ate which is less than 30V/µs. The outputs are short
circuit protected and can be shorted to ground indefinitely. The
powered do wn output impedance is a minim um of 300 with
±2V applied to the outputs and VCC = 0V.
Receivers
The receiver inputs accept up to ±30V while presenting the
required 3kto 7kinput impedance even if the power is off
(VCC = 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to VCC. The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to improve noise rejection. The receiver Enable
line EN, when set to logic “1”, (HIN235, 236, 239, 240, and
241) disables the receiver outputs, placing them in the high
impedance mode. The receiver outputs are also placed in
the high impedance state when in shutdown mode.
+
-C1 +
-C3 +
-C2 +
-C4
S1 S2 S5 S6
S3 S4 S7 S8
VCC GND
RC
OSCILLATOR
VCC
GND
V+ = 2VCC GND
V- = -(V+)
C1+
C1- C2-
C2+
VOLTAGE INVERTER
VOLTAGE DOUBLER
FIGURE 1. CHARGE PUMP
TOUT
V- < VTOUT < V+
300
400k
TXIN
GND < TXIN < VCC
V-
V+
VCC
FIGURE 2. TRANSMITTER
ROUT
GND < VROUT < VCC
5k
RXIN
-30V < RXIN < +30V
GND
VCC
FIGURE 3. RECEIVER
HIN230 thru HIN241
3-12
TIN
VOL
VOL
tPLH
tPHL
Average Propagation Delay =tPHL + tPLH
2
OR
RIN
TOUT
OR
ROUT
FIGURE 4. PROPAGATION DELAY DEFINITION
Typical Performance Curves
FIGURE 5. V- SUPPLY VOLTAGE vs VCC, VARYING
CAPACITORS FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
12
10
8
6
4
2
03.5 4.0 4.5 6.0
VCC
V- SUPPLY VOLTAGE
5.0 5.5
3.0
0.10µF
0.47µF
1µF
35
|ILOAD| (mA)
V+ (VCC = 4.5V)
V- (VCC = 4.5V)
TA = 25oC
TRANSMITTER OUTPUTS
OPEN CIRCUIT
30252015105
0
SUPPLY VOLTAGE (|V|)
0
12
10
8
6
4
2
V+ (VCC = 5V)
V- (VCC = 5V)
Test Circuits (HIN232)
FIGURE 7. GENERAL TEST CIRCUIT FIGURE 8. POWER-OFFSOURCE RESISTANCE
CONFIGURATION
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
+4.5V TO
+5.5V INPUT
3k
T1 OUTPUT
RS-232 ±30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
-
1µF
C3
+
-
1µF
C1
+
-
1µF
C2
+
-
1µF C4
3k
OUTPUT
RS-232
±30V INPUT
T2
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
T2OUT
T1OUT
VIN = ±2V A
ROUT = VIN/1
HIN230 thru HIN241
3-13
Applications
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5k resistor
connected to V+.
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
-
+
-
+
-
+
DTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
RS-232
INPUTS AND OUTPUTS
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)15
8
13
7
14
16
-
+
6
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN232
C1
1µF
C2
1µF
TD
RTS
RD
CTS
SELECT
+5V
INPUTS AND
OUTPUTS
TTL/CMOS
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
2
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
-
+
RS-232
INPUTS AND OUTPUTS
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)15
8
13
7
14
2
-
+
4
R2 R1
T2
T1
9
12
10
11
3
1HIN232
C1
1µF
DTR
DSRS
DCD
R1
+5V
INPUTS AND
OUTPUTS
TTL/CMOS
-
+-
+
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
8
13
7
14
15
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN232
C1
1µFC2
1µF
TD
RTS
RD
CTS
INPUTS AND
OUTPUTS
TTL/CMOS
-
+
5C2
1µF
16
C3
2µF
6
26
V- V+
-
+
C4
2µF
16
HIN230 thru HIN241
3-14
Die Characteristics
DIE DIMENSIONS:
160 mils x 140 mils
METALLIZATION:
Type: Al
Thickness: 10kű1kÅ
SUBSTRATE POTENTIAL
V+
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
TRANSISTOR COUNT:
238
PROCESS:
CMOS Metal Gate
Metallization Mask Layout HIN240
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+ V+ C1-
T4OUT R3OUT
EN
R4IN
T4IN
R5OUT
V-C2-C2+
R3IN
R4OUT
T3IN
R5IN
SHUTDOWN
T5OUT
T5IN
HIN230 thru HIN241
3-15
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
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7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HIN230 thru HIN241