Freescale Semiconductor Data Sheet: Document Number: MSC8144EC Rev. 10, 8/2008 MSC8144EC FC-PBGA-783 29 mm x 29 mm Quad Core Digital Signal Processor * Four StarCoreTM SC3400 DSP subsystems, each with an SC3400 DSP core, 16 Kbyte L1 instruction cache, 32 Kbyte L1 data cache, memory management unit (MMU), extended programmable interrupt controller (EPIC), two general-purpose 32-bit timers, debug and profiling support, and low-power Wait and Stop processing modes. * Chip-level arbitration and system (CLASS) that provides full fabric non-blocking arbitration between the processing elements and other initiators and the M2 memory, DDR SRAM controller, device configuration control and status registers, and other targets. * 128 Kbyte L2 shared instruction cache. * 512 Kbyte M2 memory for critical data and temporary data buffering. * 10 Mbyte 128-bit wide M3 memory. * 96 Kbyte boot ROM. * Three input clocks (shared, global, and differential). * Four PLLs (system, core, global, and serial RapidIO). * Security Engine (SEC0 optimized to process all the algorithms associated with IPSec, IKE, WTLS/WAP, SSL/TLS, and 3GPP using 4 crypto-channels with multi-command chains, integrated controller for assignment of the six execution units (PKEU, DEU, AESU, AFEU, MDEU, and KEU0) and the random number generator (RNG), and XOR engine to accelerate parity checking for RAID storage applications. * Code protection and anti-cloning support to prevent unauthorized access to internal application software, use of 7 specialized soft keys to encrypt and hash software prior to loading (and de-hash and decrypt internally), secure boot mechanism, and restricted access M2 memory zone to store clear text code that is not accessible via any external or debug interface. * DDR controller with up to a 200 MHz clock (400 MHz data rate), 16/32 bit data bus, supporting up to 1 Gbyte in up to two banks and support for DDR1 and DDR2. * DMA controller with 16 bidirectional channels with up to 1024 buffer descriptors, and programmable priority, buffer, and multiplexing configuration. * Up to eight independent TDM modules with programmable word size (2, 4, 8, or 16-bit), hardware-base A-law/-law conversion, up to 128 Mbps data rate for all channels, with glueless interface to E1 or T1 framers, and can interface with H-MVIP/H.110 devices, TSI, and codecs such as AC-97. * QUICC EngineTM technology subsystem with dual RISC processors, 48 Kbyte multi-master RAM, 48 Kbyte instruction RAM, supporting three communication controllers with one ATM and two Gigabit Ethernet interfaces, to offload scheduling tasks from the DSP cores. - The two Ethernet controllers support 10/100/1000 Mbps operations via MII/RMII/SMII/RGMII/SGMII and the SGMII protocol using a 4-pin SerDes interface at 1000 Mbps data rate only. - The ATM controller supports UTOPIA level II 8/16 bits at 25/50 MHz in UTOPIA/POS mode with adaptation layer support AAL0, AAL2, and AAL5. * PCI designed to comply with the PCI specification revision 2.2 at 33 MHz or 66 MHz with access to all PCI address spaces. * Serial RapidIO(R) 1x/4x endpoint corresponds to Specification 1.2 of the RapidIO trade association, and supports read, write, messages, doorbells, and maintenance accesses in inbound mode, and messages and doorbells in outbound mode. * I/O interrupt concentrator consolidates all chip maskable interrupt and non-maskable interrupt sources and routes them to INT_OUT, NMI_OUT, and the cores. * UART that permits full-duplex operation with a bit rate of up to 6.25 Mbps. * Serial peripheral interface (SPI). * Four timer modules, each with four configurable16-bit timers. * Four software watchdog timer (SWT) modules. * Up to 32 general-purpose input/output (GPIO) ports, 16 of which can be configured as maskable interrupt inputs. * I2C interface that allows booting from EEPROM devices. * Eight programmable hardware semaphores. * Thirty two virtual maskable interrupts and one virtual NMI that can be generated by a simple write access. * Optional booting via serial RapidIO port, PCI, I2C, SPI, or Ethernet interfaces. Note: (c) Freescale Semiconductor, Inc., 2007, 2008. All rights reserved. This document supports mask set M31H. Table of Contents 1 2 3 4 5 6 7 Pin Assignments and Reset States. . . . . . . . . . . . . . . . . . . . . .4 1.1 FC-PBGA Ball Layout Diagrams . . . . . . . . . . . . . . . . . . .4 1.2 Signal List By Ball Location. . . . . . . . . . . . . . . . . . . . . . .6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 2.2 Recommended Operating Conditions. . . . . . . . . . . . . .27 2.3 Default Output Driver Characteristics . . . . . . . . . . . . . .28 2.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .28 2.5 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . .29 2.6 AC Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . .64 3.1 Start-up Sequencing Recommendations . . . . . . . . . . .64 3.2 Power Supply Design Considerations. . . . . . . . . . . . . .65 3.3 Clock and Timing Signal Board Layout Considerations 66 3.4 Connectivity Guidelines . . . . . . . . . . . . . . . . . . . . . . . .66 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 List of Figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. MSC8144EC Block Diagram. . . . . . . . . . . . . . . . . . . . . . 3 StarCore SC3400 DSP Core Subsystem Block Diagram 3 MSC8144EC FC-PBGA Package, Top View. . . . . . . . . . 4 MSC8144EC FC-PBGA Package, Bottom View . . . . . . . 5 SerDes Reference Clocks Input Stage . . . . . . . . . . . . . 31 Start-Up Sequence with VDD Raised Before VDDIO with CLKIN Started with VDDIO . . . . . . . . . . . . . . . . . . . . . . . 35 Figure 7. Timing for a Reset Configuration Write . . . . . . . . . . . . . 38 Figure 8. Timing for tDDKHMH . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 9. DDR SDRAM Output Timing. . . . . . . . . . . . . . . . . . . . . 41 Figure 10.DDR AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 11.Differential VPP of Transmitter or Receiver . . . . . . . . . . 42 Figure 12.Transmitter Output Compliance Mask. . . . . . . . . . . . . . 46 Figure 13.Single Frequency Sinusoidal Jitter Limits . . . . . . . . . . . 48 Figure 14.Receiver Input Compliance Mask . . . . . . . . . . . . . . . . . 49 Figure 15.PCI AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Figure 16.PCI Input AC Timing Measurement Conditions . . . . . . . 51 Figure 17.PCI Output AC Timing Measurement Condition . . . . . . 51 Figure 18.TDM Inputs Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Figure 19.TDMxTSYN in TSO=0 mode . . . . . . . . . . . . . . . . . . . . . 52 Figure 20.TDM Output Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Figure 21.UART Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Figure 22.UART Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Figure 23.Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Figure 24.MII Management Interface Timing . . . . . . . . . . . . . . . . . 55 Figure 25.MII Transmit AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . 55 Figure 26.AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Figure 27.MII Receive AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . 56 Figure 28.RMII Transmit and Receive AC Timing . . . . . . . . . . . . . 57 Figure 29.AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Figure 30.SMII Mode Signal Timing. . . . . . . . . . . . . . . . . . . . . . . . 58 Figure 31.RGMII AC Timing and Multiplexing . . . . . . . . . . . . . . . . 59 Figure 32.ATM/UTOPIA/POS AC Test Load . . . . . . . . . . . . . . . . . 60 Figure 33.ATM/UTOPIAPOS AC Timing (External Clock) . . . . . . . 60 Figure 34.SPI AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Figure 35.SPI AC Timing in Slave Mode (External Clock). . . . . . . 61 Figure 36.SPI AC Timing in Master Mode (Internal Clock) . . . . . . 62 Figure 37.Asynchronous Signal Timing . . . . . . . . . . . . . . . . . . . . . 62 Figure 38.Test Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . 63 Figure 39.Boundary Scan (JTAG) Timing . . . . . . . . . . . . . . . . . . . 63 Figure 40.Test Access Port Timing . . . . . . . . . . . . . . . . . . . . . . . . 64 Figure 41.TRST Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Figure 42.VDDM3, VDDM3IO and V25M3 Power-on Sequence . . . . . 65 Figure 43.PLL Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Figure 44.MSC8144EC Mechanical Information, 783-ball FC-PBGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 2 Freescale Semiconductor DDR Interface 16/32-bit at 400 MHz data rate 10 Mbytes M3 Memory 512 Kbytes M2 Memory I/O-Interrupt Concentrator DDR Controller UART 128-bit at 400 MHz Clocks Timers CLASS Reset Dual RISC Processors Ether- Ethernet ATM SPI net Semaphores Ser. RapidIO Subsystem RMU SRIO Virtual Interrupts PCI Security Engine Core 8 TDMs 128 Kbyte L2 ICache DMA Four DSP Subsystems QUICC EngineTM Subsystem Boot ROM I2C Other Modules JTAG Eight TDMs 256-Channels each PCI 32-bit 33/66 MHz SPI 10/100/1000 Mbps 10/100/1000 Mbps 16-bit/8-bit UTOPIA Note: The arrow direction indicates master or slave. 1x/4x Figure 1. MSC8144EC Block Diagram Two Internal Buses (128 bits wide each) Interrupts IQBus Timer EPIC Bus Interface DQBus TWB Task Protection Debug Support OCE30 DPU Instruction Cache WriteThrough Buffer (WTB) Data Cache WriteBack Buffer Address Translation (WBB) MMU P-bus Xa-bus Xb-bus SC3400 Core Figure 2. StarCore SC3400 DSP Core Subsystem Block Diagram MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 3 Pin Assignments and Reset States 1 Pin Assignments and Reset States This section includes diagrams of the MSC8144EC package ball grid array layouts and tables showing how the pinouts are allocated for the package. 1.1 FC-PBGA Ball Layout Diagrams Top and bottom views of the FC-PBGA package are shown in Figure 3 and Figure 4 with their ball location index numbers. Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 A B C D E F G H J K L M N P R MSC8144EC T U V W Y AA AB AC AD AE AF AG AH Figure 3. MSC8144EC FC-PBGA Package, Top View MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 4 Freescale Semiconductor Bottom View AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Figure 4. MSC8144EC FC-PBGA Package, Bottom View MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 5 1.2 Signal List By Ball Location Table 1 presents the signal list sorted by ball number. The functionality of multi-functional (multiplexed) pins is separated for each mode. When designing a board, make sure that the reference supply for each signal is appropriately considered. The specified reference supply must be tied to the voltage level specified in this document if any of the related signal functions are used (active). Table 1. Signal List by Ball Number Ball Number Signal Name A2 GND A3 GE2_RX_ER/PCI_AD31 A4 VDDGE2 PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply GND Ethernet 2 PCI Ethernet 2 VDDGE2 VDDGE2 A5 GE2_RX_DV/PCI_AD30 Ethernet 2 PCI Ethernet 2 VDDGE2 A6 GE2_TD0/PCI_CBE0 Ethernet 2 PCI Ethernet 2 VDDGE2 A7 SRIO_IMP_CAL_RX A8 Reserved1 -- A9 Reserved 1 -- A10 Reserved1 -- A11 Reserved1 A12 SRIO_RXD0 VDDSXC A13 VDDSXC VDDSXC A14 SRIO_RXD1 VDDSXC A15 VDDSXC VDDSXC A16 SRIO_REF_CLK VDDSXC A17 VDDRIOPLL A18 GNDSXC A19 SRIO_RXD2/ GE1_SGMII_RX VDDSXC -- GNDRIOPLL GNDSXC SGMII support on SERDES is enabled by Reset Configuration Word VDDSXC SGMII support on SERDES is enabled by Reset Configuration Word VDDSXC A20 VDDSXC A21 SRIO_RXD3/ GE2_SGMII_RX A22 VDDSXC A23 SRIO_IMP_CAL_TX VDDSXP A24 MDQ28 VDDDDR A25 MDQ29 VDDDDR A26 MDQ30 VDDDDR A27 MDQ31 VDDDDR A28 MDQS3 VDDDDR B1 Reserved1 B2 GE2_TD1/PCI_CBE1 Ethernet 2 B3 GE2_TX_EN/PCI_CBE2 Ethernet 2 B4 GE_MDIO B5 GND B6 GE_MDC B7 GNDSXC B8 Reserved1 -- B9 1 -- Reserved VDDSXC VDDSXC -- PCI Ethernet 2 VDDGE2 PCI Ethernet 2 VDDGE2 Ethernet VDDGE2 Ethernet VDDGE2 GND GNDSXC MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 6 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply B10 Reserved1 B11 Reserved1 B12 SRIO_RXD0 VDDSXC B13 GNDSXC GNDSXC B14 SRIO_RXD1 VDDSXC B15 GNDSXC GNDSXC B16 SRIO_REF_CLK VDDSXC B17 Reserved1 B18 VDDSXC B19 SRIO_RXD2/ GE1_SGMII_RX -- -- -- VDDSXC SGMII support on SERDES is enabled by Reset Configuration Word VDDSXC B20 GNDSXC B21 SRIO_RXD3/ GE2_SGMII_RX GNDSXC B22 GNDSXC GNDSXC B23 GNDSXP GNDSXP B24 MDQ27 VDDDDR B25 VDDDDR VDDDDR B26 GND B27 VDDDDR B28 MDQS3 SGMII support on SERDES is enabled by Reset Configuration Word VDDSXC GND VDDDDR VDDDDR 1 C1 Reserved C2 GE2_RX_CLK/PCI_AD29 -- C3 VDDGE2 C4 TDM7RSYN/GE2_TD2/ PCI_AD2/UTP_TER TDM PCI Ethernet 2 UTOPIA VDDGE2 C5 TDM7RCLK/GE2_RD2/ PCI_AD0/UTP_RVL TDM PCI Ethernet 2 UTOPIA VDDGE2 C6 VDDGE2 Ethernet 2 PCI Ethernet 2 VDDGE2 VDDGE2 VDDGE2 C7 GE2_RD0/PCI_AD27 C8 Reserved1 Ethernet 2 PCI Ethernet 2 VDDGE2 -- C9 Reserved 1 -- C10 Reserved1 -- C11 Reserved1 C12 VDDSXP VDDSXP C13 SRIO_TXD0 VDDSXP C14 VDDSXP VDDSXP -- C15 SRIO_TXD1 VDDSXP C16 GNDSXC GNDSXC C17 GNDRIOPLL GNDRIOPLL C18 Reserved1 -- C19 VDDSXP C20 SRIO_TXD2/GE1_SGMII_T X VDDSXP SGMII support on SERDES is enabled by Reset Configuration Word VDDSXP MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 7 Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply C21 VDDSXP VDDSXP C22 SRIO_TXD3/GE2_SGMII_T X C23 VDDSXP VDDSXP C24 MDQ26 VDDDDR C25 MDQ25 VDDDDR C26 MDM3 VDDDDR C27 GND C28 MDQ24 D1 Reserved1 D2 GE2_RD1/PCI_AD28 D3 GND D4 TDM7TDAT/GE2_TD3/ PCI_AD3/UTP_TMD TDM PCI Ethernet 2 UTOPIA VDDGE2 D5 TDM7RDAT/GE2_RD3/ PCI_AD1/UTP_STA TDM PCI Ethernet 2 UTOPIA VDDGE2 D6 GE1_RD0/UTP_RD2/ PCI_CBE2 Ethernet 1 UTOPIA VDDGE1 D7 TDM7TCLK/GE2_TCK/ PCI_IDS/UTP_RER D8 Reserved1 -- D9 Reserved 1 -- D10 Reserved1 -- D11 Reserved1 D12 GNDSXP SGMII support on SERDES is enabled by Reset Configuration Word VDDSXP GND VDDDDR -- Ethernet 2 PCI Ethernet 2 VDDGE2 GND UTOPIA TDM Ethernet 1 PCI PCI UTOPIA Ethernet 2 UTOPIA VDDGE2 -- GNDSXP D13 SRIO_TXD0 VDDSXP D14 GNDSXP GNDSXP D15 SRIO_TXD1 VDDSXP D16 VDDSXC VDDSXC D17 Reserved1 -- D18 Reserved1 -- D19 GNDSXP D20 SRIO_TXD2/GE1_SGMII_T X D21 GNDSXP D22 SRIO_TXD3/GE2_SGMII_T X D23 GNDSXP GNDSXP D24 MDQ23 VDDDDR D25 VDDDDR VDDDDR D26 MDQ22 VDDDDR GNDSXP SGMII support on SERDES is enabled by Reset Configuration Word VDDSXP GNDSXP SGMII support on SERDES is enabled by Reset Configuration Word VDDSXP D27 MDQ21 VDDDDR D28 MDQS2 VDDDDR E1 Reserved1 -- MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 8 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply E2 GE1_RX_CLK/UTP_RD6/ PCI_PAR UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 E3 GE1_RD2/UTP_RD4/ PCI_FRAME UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 E4 GE1_RD1/UTP_RD3/ PCI_CBE3 UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 E5 GE1_RD3/UTP_RD5/ PCI_IRDY UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 E6 VDDGE1 E7 GE1_TX_EN/UTP_TD6/ PCI_CBE0 E8 Reserved1 -- E9 Reserved1 -- E10 GND GND E11 VDD VDD E12 GND GND E13 VDD VDD E14 GND GND E15 VDD VDD E16 GND GND E17 VDD VDD E18 GND GND E19 VDD VDD E20 GND GND E21 VDD VDD E22 GND E23 VDDDDR VDDDDR E24 MDQ20 VDDDDR E25 GND E26 VDDDDR E27 GND E28 VDDGE1 UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 GND GND VDDDDR GND MDQS2 VDDDDR F1 Reserved1 F2 GE1_TX_CLK/UTP_RD0/ PCI_AD31 -- UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 F3 VDDGE1 F4 GE1_TD3/UTP_TD5/ PCI_AD30 UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 F5 GE1_TD1/UTP_TD3/ PCI_AD28 UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 F6 GND F7 GE1_TD0/UTP_TD2/ PCI_AD27 F8 VDDGE1 F9 GND VDDGE1 GND UTOPIA Ethernet 1 PCI UTOPIA Ethernet 1 UTOPIA VDDGE1 VDDGE1 GND MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 9 Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply F10 VDD VDD F11 GND GND F12 VDD VDD F13 GND GND F14 VDD VDD F15 GND GND F16 VDD VDD F17 GND GND F18 VDD VDD F19 GND GND F20 VDD VDD 1 F21 Reserved F22 VDDDDR -- F23 GND F24 MDQ19 VDDDDR F25 MDQ18 VDDDDR F26 MDM2 VDDDDR F27 MDQ17 VDDDDR F28 MDQ16 VDDDDR G1 Reserved1 -- G2 SRESET4 VDDIO G3 GND GND G4 PORESET4 VDDIO VDDDDR GND G5 GE1_COL/UTP_RD1 UTOPIA Ethernet 1 G6 GE1_TD2/UTP_TD4/ PCI_AD29 UTOPIA Ethernet 1 G7 GE1_RX_DV/UTP_RD7 UTOPIA Ethernet 1 G8 GE1_TX_ER/UTP_TD7/ PCI_CBE1 UTOPIA Ethernet 1 UTOPIA PCI UTOPIA UTOPIA PCI UTOPIA Ethernet 1 UTOPIA VDDIO Ethernet 1 UTOPIA VDDGE1 Ethernet 1 UTOPIA VDDGE1 Ethernet 1 UTOPIA VDDGE1 G9 VDD VDD G10 GND GND G11 VDD VDD G12 GND GND G13 VDD VDD G14 GND GND G15 VDD VDD G16 GND GND G17 VDD VDD G18 GND GND G19 VDD VDD G20 GND GND G21 Reserved1 G22 GND -- -- GND MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 10 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply G23 MBA1 VDDDDR G24 MA3 VDDDDR G25 MA8 VDDDDR G26 VDDDDR VDDDDR G27 GND GND G28 MCK0 VDDDDR H1 Reserved1 -- H2 CLKIN VDDIO H3 HRESET VDDIO H4 PCI_CLK_IN VDDIO H5 NMI VDDIO H6 URXD/GPIO14/IRQ8/ RC_LDF3, 6 H7 GE1_RX_ER/PCI_AD6/ GPIO25/IRQ153, 6 H8 GE1_CRS/PCI_AD5 RC_LDF UART/GPIO/IRQ GPIO/ IRQ Ethernet 1 PCI Ethernet 1 PCI VDDIO GPIO/ IRQ PCI Ethernet 1 VDDIO Ethernet 1 VDDIO H9 GND GND H10 VDD VDD H11 GND GND H12 VDD VDD H13 GND GND H14 VDD VDD H15 VDD VDD H16 VDD VDD H17 GND GND H18 VDD VDD H19 GND GND H20 VDD VDD H21 VDD H22 VDDDDR VDDDDR H23 MBA0 VDDDDR H24 MA15 VDDDDR H25 VDDDDR VDDDDR H26 MA9 VDDDDR H27 MA7 VDDDDR H28 MCK0 J1 Reserved J2 GND VDD VDDDDR 1 -- GND J3 VDDIO VDDIO J4 STOP_BS VDDIO J5 NMI_OUT4 VDDIO J6 INT_OUT4 J7 VDDIO 3, 4, 6 SDA/GPIO27 I2C/GPIO VDDIO MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 11 Table 1. Signal List by Ball Number (continued) Ball Number Signal Name J8 VDDIO PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply VDDIO J9 VDD VDD J10 GND GND J11 VDD VDD J12 GND GND J13 VDD VDD J14 GND GND J15 GND GND J16 GND GND J17 VDD VDD J18 GND GND J19 VDD VDD J20 GND GND J21 GND GND J22 GND GND J23 GND J24 VDDDDR J25 GND J26 VDDDDR J27 GND J28 VDDDDR K1 Reserved1 -- K2 Reserved1 -- K3 Reserved 1 -- K4 Reserved1 -- K5 VDDPLL2A VDDPLL2A K6 GND K7 VDDPLL0A VDDPLL0A K8 VDDPLL1A VDDPLL1A GND VDDDDR GND VDDDDR GND VDDDDR GND K9 VDD VDD K10 GND GND K11 VDD VDD K12 GND GND K13 VDD VDD K14 VDD VDD K15 VDD VDD K16 VDD VDD K17 VDD VDD K18 GND GND K19 VDD VDD K20 GND GND K21 VDD K22 VDDDDR VDD VDDDDR MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 12 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply K23 MBA2 VDDDDR K24 MA10 VDDDDR K25 MA12 VDDDDR K26 MA14 VDDDDR K27 MA4 VDDDDR MVREF VDDDDR K28 L1 Reserved1 L2 CLKOUT L3 TMR1/UTP_IR/PCI_CBE3/ GPIO173, 6 L4 -- VDDIO TMR4/PCI_PAR/GPIO203, UTP_REOP UTOPIA TMR/ GPIO TIMER/GPIO UTOPIA PCI UTOPIA VDDIO PCI TIMER/GPIO VDDIO 6/ L5 GND GND L6 TMR2/PCI_FRAME/ GPIO183, 6 L7 SCL/GPIO263, 4, 6 L8 UTXD/GPIO15/IRQ93, 6 TIMER/GPIO PCI TIMER/GPIO UTOPIA VDDIO I2C/GPIO VDDIO UART/GPIO/IRQ VDDIO L9 GND GND L10 VDD VDD L11 GND GND L12 VDD VDD L13 GND GND L14 VDD VDD 1 L15 Reserved L16 VDD VDD L17 GND GND L18 VDD VDD L19 GND GND L20 VDD VDD L21 GND GND L22 GND GND L23 MCKE1 VDDDDR L24 MA1 VDDDDR L25 VDDDDR VDDDDR L26 GND L27 VDDDDR L28 MCK1 GND GND VDDDDR VDDDDR 1 M1 Reserved M2 TRST VDDIO -- M3 EE0 VDDIO M4 EE1 VDDIO M5 UTP_RCLK/PCI_AD13 UTOPIA PCI UTOPIA VDDIO M6 UTP_RADDR0/PCI_AD7 UTOPIA PCI UTOPIA VDDIO M7 UTP_TD8/PCI_AD30 UTOPIA PCI UTOPIA VDDIO MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 13 Table 1. Signal List by Ball Number (continued) Ball Number Signal Name M8 VDDIO PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply VDDIO M9 VDD VDD M10 GND GND M11 VDD VDD M12 GND GND M13 VDD VDD M14 GND GND M15 VDD VDD M16 GND GND M17 VDD VDD M18 GND GND M19 VDD VDD M20 GND GND M21 VDD M22 VDDDDR M23 MCS1 VDDDDR M24 MA13 VDDDDR M25 MA2 VDDDDR M26 MA0 VDDDDR M27 GND GND M28 MCK1 VDDDDR VDD VDDDDR N1 Reserved1 N2 VDDIO N3 TMS N4 UTP_RD10/PCI_AD145 N5 VDDIO N6 -- VDDIO VDDIO UTOPIA PCI UTP_RADDR1/PCI_AD8 UTOPIA PCI N7 UTP_TD9/PCI_AD31 UTOPIA PCI N8 TMR3/PCI_IRDY/GPIO193, 6 / UTP_TEOP N9 GND N10 VDDM3 N11 VDD N12 VDDM3 N13 VDD N14 VDDM3 N15 VDD N16 VDDM3 N17 VDD N18 VDDM3 N19 VDD N20 VDDM3 N21 GND UTOPIA VDDIO Power TIMER/GPIO VDDIO UTOPIA VDDIO UTOPIA PCI VDDIO TIMER/GPIO UTOPIA VDDIO GND VDDM3 VDD VDDM3 VDD VDDM3 VDD VDDM3 VDD VDDM3 VDD VDDM3 GND MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 14 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number N22 Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) GND 7 (111) Ref. Supply GND N23 MODT1 VDDDDR N24 MCKE0 VDDDDR N25 VDDDDR VDDDDR N26 MA5 VDDDDR N27 MA6 VDDDDR N28 MA11 VDDDDR P1 Reserved1 P2 TDI5 -- VDDIO P3 UTP_RD11/PCI_AD15 P4 GND UTOPIA PCI UTOPIA VDDIO P5 UTP_RADDR3/PCI_AD10 UTOPIA PCI UTOPIA VDDIO P6 UTP_RADDR2/PCI_AD9 UTOPIA PCI UTOPIA VDDIO P7 PCI_GNT/GPIO29/IRQ73. 6 GPIO/IRQ PCI GPIO/IRQ VDDIO P8 PCI_STOP/GPIO30/IRQ23, GPIO/IRQ PCI GPIO/IRQ VDDIO GND 6 P9 GND GND P10 GND P11 VDDM3 P12 GND P13 VDDM3 P14 GND P15 VDDM3 P16 GND P17 VDDM3 P18 GND P19 VDDM3 P20 GND GND P21 GND GND P22 VDDDDR VDDDDR P23 MCS0 VDDDDR P24 MRAS VDDDDR P25 GND P26 VDDDDR P27 GND GND P28 MCK2 VDDDDR R1 Reserved1 GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND VDDDDR -- R2 TCK VDDIO R3 TDO VDDIO R4 UTP_RD12/PCI_AD16 UTOPIA PCI UTOPIA VDDIO R5 UTP_RCLAV_PDRPA/ PCI_AD12 UTOPIA PCI UTOPIA VDDIO R6 UTP_RADDR4/PCI_AD11 UTOPIA PCI UTOPIA VDDIO MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 15 Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply R7 VDDIO R8 PCI_REQ R9 GND GND R10 GND GND R11 GND GND R12 GND GND R13 GND GND R14 GND GND R15 GND GND R16 GND GND R17 GND GND R18 GND GND R19 GND GND R20 GND GND R21 GND GND R22 GND R23 MODT0 VDDDDR R24 MDIC1 VDDDDR R25 MDIC0 VDDDDR R26 MCAS VDDDDR R27 MWE VDDDDR MCK2 VDDDDR R28 T1 VDDIO PCI VDDIO GND Reserved1 -- T2 UTP_RPRTY/PCI_AD21 UTOPIA PCI UTOPIA VDDIO T3 UTP_RD13/PCI_AD17 UTOPIA PCI UTOPIA VDDIO UTOPIA T4 VDDIO T5 UTP_RD14/PCI_AD18 UTOPIA PCI VDDIO T6 UTP_RD15/PCI_AD19 UTOPIA PCI T7 PCI_TRDY T8 PCI_DEVSEL/GPIO31/ IRQ33, 6 VDDIO UTOPIA VDDIO PCI GPIO/IRQ PCI VDDIO GPIO/IRQ VDDIO T9 GND GND T10 GND GND T11 GND GND T12 GND GND T13 GND GND T14 GND GND T15 GND GND T16 GND GND T17 GND GND T18 GND GND T19 GND GND T20 GND GND MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 16 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number T21 Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) GND T22 VDDDDR T23 GND T24 VDDDDR T25 GND T26 VDDDDR T27 GND 7 (111) Ref. Supply GND VDDDDR GND VDDDDR GND VDDDDR GND VDDDDR T28 VDDDDR U1 Reserved1 U2 UTP_TCLK/PCI_AD29 UTOPIA PCI UTOPIA VDDIO U3 UTP_TADDR4/PCI_AD27 UTOPIA PCI UTOPIA VDDIO U4 UTP_TADDR2 U5 GND -- UTOPIA VDDIO GND UTOPIA PCI UTOPIA VDDIO U6 UTP_REN/PCI_AD20 U7 PCI_AD26 PCI VDDIO U8 PCI_AD25 PCI VDDIO U9 Reserved1 VDDIO U10 VDDM3 VDDM3 U11 GND U12 VDDM3 U13 GND U14 VDDM3 U15 GND U16 VDDM3 U17 GND U18 VDDM3 U19 GND U20 VDDM3 U21 GND U22 GND U23 MDQ7 VDDDDR U24 MDQ3 VDDDDR U25 MDQ4 VDDDDR U26 MDQ5 VDDDDR U27 MDQ1 VDDDDR MDQ0 VDDDDR U28 GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND GND V1 Reserved1 V2 UTP_TD10/PCI_CBE0 V3 UTP_TADDR3 V4 UTP_TD1/PCI_PERR UTOPIA V5 UTP_TADDR0/PCI_AD23 UTOPIA -- UTOPIA PCI UTOPIA UTOPIA PCI PCI VDDIO VDDIO UTOPIA UTOPIA VDDIO VDDIO V6 UTP_TADDR1/PCI_AD24 UTOPIA PCI UTOPIA VDDIO V7 UTP_TCLAV/PCI_AD28 UTOPIA PCI UTOPIA VDDIO MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 17 Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply V8 VDDIO VDDIO V9 Reserved1 VDDIO V10 GND GND V11 VDDM3 V12 GND V13 VDDM3 V14 GND V15 VDDM3 V16 GND V17 VDDM3 V18 GND V19 VDDM3 V20 GND V21 GND V22 VDDDDR V23 MDQ2 VDDDDR V24 VDDDDR VDDDDR V25 MDQ6 VDDDDR V26 GND V27 VDDDDR V28 MDQS0 VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND GND VDDDDR GND VDDDDR VDDDDR 1 W1 Reserved W2 UTP_TD12/PCI_CBE2 UTOPIA PCI UTOPIA -- W3 UTP_TD11/PCI_CBE1 UTOPIA PCI UTOPIA W4 VDDIO W5 GND W6 UTP_TD15/PCI_IRDY UTOPIA W7 UTP_TD0/PCI_SERR UTOPIA W8 UTP_RSOC/PCI_AD22 UTOPIA W9 Reserved1 VDDIO W10 VDDM3 VDDM3 W11 GND GND W12 V25M3 V25M3 W13 GND W14 VDDM3 W15 V25M3 V25M3 W16 VDDM3 VDDM3 W17 GND GND W18 V25M3 V25M3 W19 GND W20 VDDM3 W21 GND GND W22 GND GND VDDIO VDDIO VDDIO GND PCI UTOPIA PCI PCI VDDIO UTOPIA UTOPIA VDDIO VDDIO GND VDDM3 GND VDDM3 MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 18 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply W23 MDQ10 W24 GND W25 MDQ11 VDDDDR W26 MDM0 VDDDDR W27 GND W28 Y1 VDDDDR GND GND MDQS0 VDDDDR Reserved1 UTOPIA PCI UTOPIA VDDIO Y2 UTP_TD14/PCI_FRAME Y3 TDM5TSYN/PCI_AD18/ GPIO123, 6 TDM/GPIO PCI TDM/GPIO VDDIO Y4 TDM5TCLK/PCI_AD16 TDM PCI TDM VDDIO Y5 TDM4RCLK/PCI_AD7 TDM PCI TDM VDDIO Y6 TDM4TSYN/PCI_AD12 TDM PCI TDM VDDIO Y7 UTP_TPRTY/RC14 Y8 UTP_TEN/PCI_PAR RC14 UTOPIA Y9 Reserved1 VDDIO Y10 GND GND Y11 VDDM3 Y12 GND Y13 VDDM3 Y14 GND Y15 VDDM3 Y16 GND Y17 VDDM3 Y18 GND Y19 VDDM3 Y20 GND Y21 GND Y22 VDDDDR Y23 MDQ13 VDDDDR Y24 VDDDDR VDDDDR Y25 GND Y26 MDQ9 VDDDDR Y27 VDDDDR VDDDDR Y28 MDQ8 UTOPIA PCI VDDIO UTOPIA VDDIO VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND GND VDDDDR GND VDDDDR 1 AA1 Reserved AA2 UTP_TD13/PCI_CBE3 -- AA3 TDM5RSYN/PCI_AD15/ GPIO103, 6 TDM/GPIO PCI TDM/GPIO VDDIO AA4 TDM5TDAT, AT/PCI_AD17/ GPIO116 TDM/GPIO PCI TDM/GPIO VDDIO AA5 TDM5RCLK/PCI_AD13/ GPIO283, 6 TDM/GPIO PCI TDM/GPIO VDDIO AA6 GND UTOPIA PCI UTOPIA VDDIO GND MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 19 Table 1. Signal List by Ball Number (continued) Ball Number AA7 Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply TDM4TCLK/PCI_AD10 TDM PCI TDM AA8 TDM4TDAT/PCI_AD11 TDM PCI TDM AA9 VDDIO VDDIO AA10 VDDM3 VDDM3 AA11 GND AA12 VDDM3 AA13 GND AA14 VDDM3 AA15 GND AA16 VDDM3 AA17 GND AA18 VDDM3 AA19 GND VDDIO VDDIO GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 AA20 VDDM3 AA21 GND AA22 GND AA23 MDQ15 VDDDDR AA24 MDQ14 VDDDDR AA25 MDM1 VDDDDR AA26 MDQ12 VDDDDR AA27 MDQS1 VDDDDR AA28 MDQS1 VDDDDR AB1 Reserved1 AB2 UTP_TSOC/RC15 AB3 VDDIO AB4 TDM6RDAT/PCI_AD20/ GPIO5/IRQ113, 6 TDM/GPIO/ IRQ PCI TDM/GPIO/ IRQ VDDIO AB5 TDM5RDAT/PCI_AD14/ GPIO93, 6 TDM/GPIO PCI TDM/GPIO VDDIO AB6 TDM6TSYN/PCI_AD24/ GPIO8/ IRQ143, 6 TDM/GPIO/IRQ PCI TDM/GPIO/IRQ VDDIO AB7 TDM6RCLK/PCI_AD19/ GPIO4/IRQ103, 6 TDM/GPIO/IRQ PCI TDM/GPIO/IRQ VDDIO GND GND RC15 UTOPIA VDDIO VDDIO AB8 TDM4RSYN/PCI_AD9 TDM PCI TDM VDDIO AB9 TDM4RDAT/PCI_AD8 TDM PCI TDM VDDIO AB10 GND AB11 VDDM3 AB12 GND AB13 VDDM3 AB14 GND AB15 VDDM3 AB16 GND AB17 VDDM3 AB18 GND GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 20 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply AB19 VDDM3 VDDM3 AB20 GND GND AB21 GND GND AB22 VDDDDR VDDDDR AB23 MECC7 VDDDDR AB24 MECC1 VDDDDR AB25 MECC4 VDDDDR AB26 MECC5 VDDDDR AB27 MECC2 VDDDDR AB28 ECC_MDQS VDDDDR AC1 Reserved1 -- AC2 UTP_RD9/RC13 RC13 UTOPIA VDDIO AC3 UTP_RD8/RC12 RC12 UTOPIA VDDIO AC4 TDM6TCLK/PCI_AD22 TDM PCI TDM VDDIO AC5 TDM6RSYN/PCI_AD21/ GPIO6/ IRQ123, 6 TDM/GPIO/IRQ PCI TDM/GPIO/IRQ VDDIO AC6 VDDIO AC7 TDM3TSYN/RC11 AC8 PCI_AD23/GPIO7/IRQ13/ TDM6TDAT3, 6/UTP_RMOD TDM/GPIO/IRQ AC9 TDM7TSYN/ PCI_AD4 TDM AC10 VDDM3IO AC11 GND AC12 VDDM3 AC13 GND AC14 VDDM3 AC15 GND AC16 VDDM3 AC17 GND AC18 VDDM3 AC19 GND VDDIO RC11 TDM PCI PCI VDDIO TDM/GPIO/IRQ reserved UTOPIA VDDIO VDDIO VDDM3IO GND VDDM3 GND VDDM3 GND VDDM3 GND VDDM3 GND AC20 VDDM3IO AC21 Reserved1 AC22 MECC6 VDDDDR AC23 MECC3 VDDDDR AC24 ECC_MDM VDDDDR AC25 VDDDDR VDDDDR AC26 MECC0 VDDDDR AC27 VDDDDR VDDDDR AC28 ECC_MDQS VDDDDR AD1 Reserved1 3, 6 AD2 GPIO1 AD3 TMR0/GPIO13 VDDM3IO -- -- GPIO VDDIO TIMER/GPIO VDDIO MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 21 Table 1. Signal List by Ball Number (continued) Ball Number Signal Name AD4 GPIO23, 6 AD5 GND AD6 TDM1TCLK AD7 TDM3TDAT/RC10 AD8 TDM3RSYN/RC9 PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) GPIO 7 (111) Ref. Supply VDDIO GND TDM VDDIO RC10 TDM VDDIO RC9 TDM VDDIO RC8 TDM VDDIO AD9 TDM3RDAT/RC8 AD10 GND GND AD11 V25M3 V25M3 AD12 GND GND AD13 VDDM3 AD14 GND GND AD15 V25M3 V25M3 AD16 GND GND AD17 VDDM3 AD18 GND GND AD19 V25M3 V25M3 AD20 GND AD21 Reserved AD22 VDDDDR AD23 GND AD24 VDDDDR AD25 GND AD26 VDDDDR AD27 GND AD28 VDDDDR VDDM3 VDDM3 GND 1 -- VDDDDR GND VDDDDR GND VDDDDR GND VDDDDR AE1 Reserved1 AE2 GPIO03, 6 GPIO VDDIO AE3 GPIO33, 6 GPIO VDDIO AE4 TDM1RCLK TDM VDDIO AE5 TDM1TSYN/RC3 RC3 TDM VDDIO AE6 TDM1TDAT/RC2 RC2 TDM VDDIO AE7 TDM1RSYN/RC1 RC1 TDM VDDIO AE8 TDM3RCLK/RC16 RC16 TDM VDDIO TDM VDDIO RC6 TDM VDDIO GPIO/IRQ/SPI VDDIO -- AE9 TDM3TCLK AE10 TDM2TDAT/RC6 AE11 GPIO21/IRQ13. 6/SPICLK AE12 GND GND 1 AE13 Reserved AE14 GND AE15 Reserved1 -- AE16 Reserved1 -- AE17 Reserved1 AE18 GND -- GND -- GND MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 22 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number AE19 Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) GND 7 (111) Ref. Supply GND VDDM3IO AE20 VDDM3IO AE21 Reserved1 AE22 GND GND AE23 GND GND AE24 GND AE25 VDDDDR AE26 GND AE27 VDDDDR AE28 GND AF1 -- GND VDDDDR GND VDDDDR GND Reserved1 -- AF2 VDDIO VDDIO AF3 GND GND AF4 TDM0RDAT/ RCFG_CLKIN_RNG RCFG_ CLKIN_ RNG TDM VDDIO AF5 TDM0TSYN/RCW_SRC2 RCW_ SRC2 TDM VDDIO AF6 TDM1RDAT/RC0 RC0 TDM VDDIO AF7 VDDIO VDDIO AF8 GND GND AF9 TDM2RDAT/RC4 AF10 TDM2TCLK AF11 GPIO22/IRQ4 AF12 GND AF13 GND AF14 VDDM3IO AF15 GND AF16 GND 3, 6 RC4 /SPIMOSI TDM VDDIO TDM VDDIO GPIO/IRQ/SPI VDDIO GND GND VDDM3IO GND GND 1 AF17 Reserved AF18 VDDM3IO AF19 GND AF20 Reserved1 AF21 Reserved 1 AF22 M3_RESET AF23 GND AF24 VDDDDR AF25 GND AF26 VDDDDR AF27 GND AF28 VDDDDR AG1 Reserved1 AG2 GPIO16/IRQ03, 6 AG3 TDM0TCLK -- VDDM3IO GND -- -- VDDM3IO GND VDDDDR GND VDDDDR GND VDDDDR -- GPIO/IRQ VDDIO TDM VDDIO MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 23 Table 1. Signal List by Ball Number (continued) Ball Number Signal Name AG4 TDM0RSYN/RCW_SRC0 AG5 TDM0RCLK AG6 TDM0TDAT/RCW_SRC1 AG7 TDM2TSYN/RC7 AG8 TDM2RCLK AG9 TDM2RSYN/RC5 AG10 GPIO24/IRQ63, 6/SPISEL 3, 6 PowerOn Reset Value RCW_ SRC0 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply TDM VDDIO TDM VDDIO RCW_ SRC1 TDM VDDIO RC7 TDM VDDIO TDM VDDIO RC5 /SPIMISO I/O Multiplexing Mode2 TDM VDDIO GPIO/IRQ/SPI VDDIO GPIO/IRQ/SPI VDDIO AG11 GPIO23/IRQ5 AG12 Reserved1 AG13 GND GND AG14 GND GND AG15 GND GND AG16 GND -- GND AG17 Reserved 1 -- AG18 Reserved1 -- AG19 GND GND AG20 GND GND AG21 VDDM3IO AG22 GND GND AG23 GND GND AG24 GND GND AG25 VDDDDR AG26 GND AG27 VDDDDR AG28 GND VDDM3IO VDDDDR GND VDDDDR GND AH1 Reserved 1 -- AH2 Reserved1 -- AH3 Reserved1 -- AH4 Reserved1 -- AH5 Reserved 1 -- AH6 Reserved1 -- AH7 Reserved 1 -- AH8 Reserved1 -- AH9 Reserved 1 -- AH10 Reserved1 -- AH11 Reserved 1 -- AH12 Reserved1 -- AH13 Reserved1 -- AH14 Reserved1 -- AH15 Reserved 1 -- AH16 Reserved1 -- MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 24 Freescale Semiconductor Table 1. Signal List by Ball Number (continued) Ball Number Signal Name PowerOn Reset Value I/O Multiplexing Mode2 0 (000) 1 (001) 2 (010) 3 (011) 4 (100) 5 (101) 6 (110) 7 (111) Ref. Supply AH17 Reserved1 -- AH18 Reserved1 -- AH19 Reserved1 -- AH20 Reserved 1 -- AH21 Reserved1 -- AH22 Reserved 1 -- AH23 Reserved1 -- AH24 Reserved1 -- AH25 Reserved1 -- AH26 Reserved 1 -- AH27 Reserved1 -- AH28 1 -- Notes: Reserved 1. 2. 3. 4. 5. 6. Reserved signals should be disconnected for compatibility with future revisions of the device. For signals with same functionality in all modes the appropriate cells are empty. The choice between GPIO function and other function is by GPIO registers setup. For configuration details, see Chapter 23, GPIO in the MSC8144EC Reference Manual. Open-drain signal. Internal 20 K pull-up resistor. For signals with GPIO functionality, the open-drain and internal 20 K pull-up resistor can be configured by GPIO register programming. See Chapter 23, GPIO of the MSC8144EC Reference Manual for configuration details. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 25 Electrical Characteristics 2 Electrical Characteristics This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications. For additional information, see the MSC8144EC Reference Manual. 2.1 Maximum Ratings CAUTION This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, normal precautions should be taken to avoid exceeding maximum voltage ratings. Reliability is enhanced if unused inputs are tied to an appropriate logic voltage level (for example, either GND or VDD). In calculating timing requirements, adding a maximum value of one specification to a minimum value of another specification does not yield a reasonable sum. A maximum specification is calculated using a worst case variation of process parameter values in one direction. The minimum specification is calculated using the worst case for the same parameters in the opposite direction. Therefore, a "maximum" value for a specification never occurs in the same device with a "minimum" value for another specification; adding a maximum to a minimum represents a condition that can never exist. Table 2 describes the maximum electrical ratings for the MSC8144EC. Table 2. Absolute Maximum Ratings Rating Symbol Value Unit Vdd -0.3 to 1.1 V VDDPLL0 VDDPLL1 VDDPLL2 -0.3 to 1.1 V M3 memory Internal voltage VDDM3 -0.3 to 1.32 V DDR memory supply voltage * DDR mode * DDR2 mode VDDDDR -0.3 to 2.75 -0.3 to 1.98 V V DDR reference voltage MVREF -0.3 to 0.51 x VDDDDR V Input DDR voltage VINDDR -0.3 to VDDDDR + 0.3 V Ethernet 1 I/O voltage VDDGE1 -0.3 to 3.465 V Input Ethernet 1 I/O voltage VINGE1 -0.3 to VDDGE1 + 0.3 V Ethernet 2 I/O voltage VDDGE2 -0.3 to 3.465 V Input Ethernet 2I/O voltage VINGE2 -0.3 to VDDGE2 + 0.3 V I/O voltage excluding Ethernet, DDR, M3, and RapidIO lines VDDIO -0.3 to 3.465 V Input I/O voltage VINIO -0.3 to VDDIO + 0.3 V Core supply voltage PLL supply voltage 3 MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 26 Freescale Semiconductor Electrical Characteristics Table 2. Absolute Maximum Ratings Rating Symbol Value Unit M3 memory I/O and M3 memory charge pump voltage VDDM3IO V25M3 -0.3 to 2.75 V Input M3 memory I/O voltage VINM3IO -0.3 to VDDM3IO + 0.3 V Rapid I/O C voltage VDDSXC -0.3 to 1.21 V Rapid I/O P voltage VDDSXP -0.3 to 1.26 V Rapid I/O PLL voltage VDDRIOPLL -0.3 to 1.21 V Operating temperature TJ -40 to 105 C TSTG -55 to +150 C Storage temperature range Notes: 1. 2. 3. 2.2 Functional operating conditions are given in Table 3. Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond the listed limits may affect device reliability or cause permanent damage. PLL supply voltage is specified at input of the filter and not at pin of the MSC8144EC (see Figure 43) Recommended Operating Conditions Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed. Table 3. Recommended Operating Conditions Rating Symbol Min Nominal Max Unit Core supply voltage VDD 0.97 1.0 1.05 V PLL supply voltage VDDPLL0 VDDPLL1 VDDPLL2 0.97 1.0 1.05 V 1.213 1.25 1.313 V 2.375 1.71 0.49 x VDDDDR 2.5 1.8 0.5 x VDDDDR 2.625 1.89 0.51 x VDDDDR V V V 2.375 3.135 2.5 3.3 2.625 3.465 V V 2.375 3.135 2.5 3.3 2.625 3.465 V V M3 memory Internal voltage VDDM3 DDR memory supply voltage * DDR mode * DDR2 mode DDR reference voltage VDDDDR Ethernet 1 I/O voltage * 2.5 V mode * 3.3 V mode VDDGE1 Ethernet 2 I/O voltage * 2.5 V mode * 3.3 V mode VDDGE2 MVREF I/O voltage excluding Ethernet, DDR, M3, and RapidIO lines VDDIO 3.135 3.3 3.465 V M3 memory I/O and M3 charge pump voltage VDDM3IO V25M3 2.375 2.5 2.625 V Rapid I/O C voltage VDDSXC 0.97 1.0 1.05 V Rapid I/O P voltage * Short run (haul) mode * Long run (haul) mode VDDSXP 0.97 1.14 1.0 1.2 1.05 1.26 V V VDDRIOPLL 0.97 1.0 1.05 V TJ TA TJ 0 -40 -- 90 -- 105 C C C Rapid I/O PLL voltage Operating temperature range: * Standard * Extended Note: PLL supply voltage is specified at input of the filter and not at pin of the MSC8144EC (see Figure 43). MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 27 Electrical Characteristics 2.3 Default Output Driver Characteristics Table 4 provides information on the characteristics of the output driver strengths. Table 4. Output Drive Impedance Driver Type Output Impedance () DDR signal 18 DDR2 signal 18 35 (half strength mode) 2.4 Thermal Characteristics Table 5 describes thermal characteristics of the MSC8144EC for the FC-PBGA packages. Table 5. Thermal Characteristics for the MSC8144EC Characteristic FC-PBGA 29 x 29 mm5 Symbol Unit Natural Convection 200 ft/min (1 m/s) airflow Junction-to-ambient1, 2 RJA 20 15 C/W Junction-to-ambient, four-layer board1, 3 RJA 15 12 C/W Junction-to-board (bottom) Junction-to-case5 Notes: 1. 2. 3. 4. 5. 4 RJB 7 C/W RJC 0.8 C/W Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on the top surface of the board near the package. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL SPEC-883 Method 1012.1) with the calculated case temperature. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 28 Freescale Semiconductor Electrical Characteristics 2.5 DC Electrical Characteristics This section describes the DC electrical characteristics for the MSC8144EC. 2.5.1 DDR SDRAM DC Electrical Characteristics This section describes the DC electrical specifications for the DDR SDRAM interface of the MSC8144EC. Note: DDR SDRAM uses VDDDDR(typ) = 2.5 V and DDR2 SDRAM uses VDDDDR(typ) = 1.8 V. 2.5.1.1 DDR2 (1.8 V) SDRAM DC Electrical Characteristics Table 6 provides the recommended operating conditions for the DDR2 SDRAM component(s) of the MSC8144EC when VDDDDR(typ) = 1.8 V. Table 6. DDR2 SDRAM DC Electrical Characteristics for VDDDDR (typ) = 1.8 V Parameter/Condition Symbol Min Max Unit VDDDDR 1.7 1.9 V MVREF 0.49 x VDDDDR 0.51 x VDDDDR V VTT MVREF - 0.04 MVREF + 0.04 V Input high voltage VIH MVREF + 0.125 VDDDDR + 0.3 V Input low voltage VIL -0.3 MVREF - 0.125 V IOZ -50 50 A Output high current (VOUT = 1.420 V) IOH -13.4 -- mA Output low current (VOUT = 0.280 V) IOL 13.4 -- mA I/O supply voltage1 2 I/O reference voltage voltage3 I/O termination Output leakage Notes: 1. 2. 3. 4. current4 VDDDDR is expected to be within 50 mV of the DRAM VDD at all times. MVREF is expected to be equal to 0.5 x VDDDDR, and to track VDDDDR DC variations as measured at the receiver. Peak-to-peak noise on MVREF may not exceed 2% of the DC value. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREF. This rail should track variations in the DC level of VDDDDR. Output leakage is measured with all outputs are disabled, 0 V VOUT VDDDDR. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 29 Electrical Characteristics 2.5.1.2 DDR (2.5V) SDRAM DC Electrical Characteristics Table 7 provides the recommended operating conditions for the DDR SDRAM component(s) of the MSC8144EC when VDDDDR(typ) = 2.5 V. Table 7. DDR SDRAM DC Electrical Characteristics for VDDDDR (typ) = 2.5 V Parameter/Condition Symbol Min Max Unit VDDDDR 2.3 2.7 V MVREF 0.49 x VDDDDR 0.51 x VDDDDR V I/O termination voltage VTT MVREF - 0.04 MVREF + 0.04 V Input high voltage VIH MVREF + 0.15 VDDDDR + 0.3 V VIL -0.3 MVREF - 0.15 V Output leakage current IOZ -50 50 A Output high current (VOUT = 1.95 V) IOH -16.2 -- mA Output low current (VOUT = 0.35 V) IOL 16.2 -- mA I/O supply voltage1 I/O reference voltage2 3 Input low voltage 4 Notes: 1. 2. 3. 4. VDDDDR is expected to be within 50 mV of the DRAM VDD at all times. MVREF is expected to be equal to 0.5 x VDDDDR, and to track VDDDDR DC variations as measured at the receiver. Peak-to-peak noise on MVREF may not exceed 2% of the DC value. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREF. This rail should track variations in the DC level of VDDDDR. Output leakage is measured with all outputs are disabled, 0 V VOUT VDDDDR. Table 8 lists the current draw characteristics for MVREF. Table 8. Current Draw Characteristics for MVREF Parameter / Condition Current draw for MVREF Note: Symbol Min Max Unit IMVREF -- 500 A The voltage regulator for MVREF must be able to supply up to 500 A current. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 30 Freescale Semiconductor Electrical Characteristics 2.5.2 Serial RapidIO DC Electrical Characteristics DC receiver logic levels are not defined since the receiver is AC-coupled. 2.5.2.1 DC Requirements for SerDes Reference Clocks The SerDes reference clocks SRIO_REF_CLK and SRIO_REF_CLK are AC-coupled differential inputs. Each differential clock input has an internal 50 termination to GNDSXC. The reference clock must be able to drive this termination. The recommended minimum operating voltage is -0.4 V; the recommended maximum operating voltage is 1.32 V; and the maximum absolute voltage is 1.72 V. The maximum average current allowed in each input is 8 mA. This current limitation sets the maximum common mode input voltage to be less than 0.4 V (0.4 V/50 = 8 mA) while the minimum common mode input level is GNDSXC. For example, a clock with a 50/50 duty cycle can be driven by a current source output that ranges from 0 mA to 16 mA (0-0.8 V). The input is AC-coupled internally, so, therefore, the exact common mode input voltage is not critical. Note: This internal AC-couple network does not function correctly with reference clock frequencies below 90 MHz. If the device driving the SRIO_REF_CLK inputs cannot drive 50 to GNDSXC, or if it exceeds the maximum input current limitations, then it must use external AC-coupling. The minimum differential peak-to-peak amplitude of the input clock is 0.4 V (0.2 V peak-to-peak per phase). The maximum differential peak-to-peak amplitude of the input clock is 1.6 V peak-to-peak (see Figure 5. The termination to GNDSXC allows compatibility with HCSL type reference clocks specified for PCI-Express applications. Many other low voltage differential type outputs can be used but will probably need to be AC-coupled due to the limited common mode input range. LVPECL outputs can produce too large an amplitude and may need to be source terminated with a divider network to reduce the amplitude. The amplitude of the clock must be at least a 400 mV differential peak-peak for single-ended clock. If driven differentially, each signal wire needs to drive 100 mV around common mode voltage. The differential reference clock (SRIO_REF_CLK/ SRIO_REF_CLK) input is HCSL-compatible DC coupled or LVDS-compatible with AC-coupling. SRIO_REF_CLK 50 GNDSXC 50 SRIO_REF_CLK Figure 5. SerDes Reference Clocks Input Stage MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 31 Electrical Characteristics 2.5.2.2 Spread Spectrum Clock SRIO_REF_CLK/ SRIO_REF_CLK is designed to work with a spread spectrum clock (0 to 0.5% spreading at 3033 kHz rate is allowed), assuming both ends have same reference clock. For better results use a source without significant unintended modulation. 2.5.3 PCI DC Electrical Characteristics Table 9. PCI DC Electrical Characteristics Characteristic Supply voltage 3.3 V Symbol Min Max Unit VDDPCI 3.135 3.465 V Input high voltage VIH 0.5 x VDDPCI 3.465 V Input low voltage VIL -0.5 0.3 x VDDPCI V 1 VIPU 0.7 x VDDPCI Input leakage current, 0<VIN <VDDPCI IIN -30 30 A Tri-state (high impedance off state) leakage current, 0<VIN <VDDPCI Input Pull-up voltage IOZ -30 30 A Signal low input current, VIL = 0.4 V1 IL -30 30 A Signal high input current, VIH = 2.0 V1 IH -30 30 A V Output high voltage, IOH = -0.5 mA, except open drain pins VOH 0.9 x VDDPCI -- Output low voltage, IOL= 1.5 mA VOL -- 0.1 x VDDPCI V Input Pin Capacitance1 CIN 10 pF Notes: 2.5.4 1. Not tested. Guaranteed by design. TDM DC Electrical Characteristics Table 10. TDM DC Electrical Characteristics Characteristic Supply voltage 3.3 V Symbol Min Max Unit VDDTDM 3.135 3.465 V Input high voltage VIH 2.0 3.465 V Input low voltage VIL -0.3 0.8 V Input leakage current 0<VIN <VDDTDM IIN -30 30 A Tri-state (high impedance off state) leakage current IOZ -30 30 A Output high voltage, IOH = -1.6 mA VOH 2.4 -- V Output low voltage, IOL= 0.4mA VOL -- 0.4 V MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 32 Freescale Semiconductor Electrical Characteristics 2.5.5 Ethernet DC Electrical Characteristics 2.5.5.1 MII, SMII and RMII DC Electrical Characteristics Table 11. MII, SMII and RMII DC Electrical Characteristics Characteristic Symbol Min Max Unit VDDGE1 VDDGE2 3.135 3.465 V Input high voltage VIH 2.0 3.465 V Input low voltage VIL -0.3 0.8 V IIN -30 30 A IL -30 30 A IH -30 30 A Output high voltage, IOH = -4 mA VOH 2.4 3.465 V Output low voltage, IOL= 4mA VOL -- 0.4 V 8 pF Supply voltage 3.3 V Input leakage current, VIN = supply voltage Signal low input current, VIL = 0.4 V1 Signal high input current, VIH = 2.4 V Input Pin Capacitance Note: 1 1 CIN 1. Not tested. Guaranteed by design. 2.5.5.2 RGMII DC Electrical Characteristics Table 12. RGMII DC Electrical Characteristics Characteristic Symbol Min Max Unit VDDGE1 VDDGE2 2.375 2.625 V Input high voltage VIH 1.7 2.625 V Input low voltage VIL -0.3 0.7 V Input leakage current, VIN = supply voltage IIN -30 30 A Output high voltage, IOH = -1 mA VOH 2.0 2.625 V Output low voltage, IOL= 1 mA VOL -- 0.4 V 8 pF Supply voltage 2.5 V Input Pin Capacitance Note: 1 CIN 1. Not tested. Guaranteed by design. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 33 Electrical Characteristics 2.5.6 ATM/UTOPIA/POS DC Electrical Characteristics Table 13. ATM/UTOPIA/POS DC Electrical Characteristics Characteristic Supply voltage 3.3 V Symbol Min Max Unit VDDIO 3.135 3.465 V Input high voltage VIH 2.0 3.465 V Input low voltage VIL -0.3 0.8 V IIN -30 30 A Signal low input current, VIL = 0.4 V IL -30 30 A Signal high input current, VIH = 2.4 V1 IH -30 30 A Output high voltage, IOH = -4 mA VOH 2.4 3.465 V Output low voltage, IOL= 4 mA VOL -- 0.5 V Input leakage current, VIN = supply voltage 1 Notes: 1. 2.5.7 Not tested. Guaranteed by design. SPI DC Electrical Characteristics Table 14 provides the SPI DC electrical characteristics. Table 14. SPI DC Electrical Characteristics Characteristic Symbol Min Max Unit Input high voltage VIH 2.0 3.465 V Input low voltage VIL -0.3 0.8 V Input current IIN 30 A Output high voltage, IOH = -4.0 mA VOH 2.4 -- V Output low voltage, IOL = 4.0 mA VOL -- 0.5 V GPIO, UART, TIMER, EE, STOP_BS, I2C, IRQn, NMI_OUT, INT_OUT, CLKIN, JTAG Ports DC Electrical Characteristics 2.5.8 Table 15. GPIO, UART, Timer, EE, STOP_BS, I2C, IRQn, NMI_OUT, INT_OUT, CLKIN, and JTAG Port1 DC Electrical Characteristics Characteristic Symbol Min Max Unit VDDIO 3.135 3.465 V Input high voltage VIH 2.0 3.465 V Input low voltage VIL -0.3 0.8 V Supply voltage 3.3 V Input leakage current, VIN = supply voltage IIN -30 30 A Tri-state (high impedance off state) leakage current, VIN = supply voltage IOZ -30 30 A 2 IL -30 30 A IH -30 30 A Output high voltage, IOH = -2 mA, except open drain pins VOH 2.4 3.465 V Output low voltage, IOL= 3.2 mA VOL -- 0.4 V Signal low input current, VIL = 0.4 V 2 Signal high input current, VIH = 2.0 V Notes: 1. 2. This does not include TDI and TMS, which have internal pullup resistors. Not tested. Guaranteed by design. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 34 Freescale Semiconductor Electrical Characteristics 2.6 AC Timings The following sections include illustrations and tables of clock diagrams, signals, and parallel I/O outputs and inputs. 2.6.1 Start-Up Timing Starting the device requires coordination among several input sequences including clocking, reset, and power. Section 2.6.2 describes the clocking characteristics. Section 2.6.3 describes the reset and power-up characteristics. You must use the following guidelines when starting up an MSC8144EC device: * Note: * * PORESET and TRST must be asserted externally for the duration of the power-up sequence using the VDDIO (3.3 V) supply. See Table 19 for timing. TRST must be deasserted before normal operation begins to ensure correct initialization of the Security Engine. For applications that use M3 memory, M3_RESET should replicate the PORESET sequence timing, but using the VDDM3IO (2.5 V) supply. See Section 3.1.1, Power-on Sequence for additional design information. CLKIN should start toggling at least 32 cycles before the PORESET deassertion to guarantee correct device operation (see Figure 6). 32 cycles should be accounted only after VDDIO reaches its nominal value. CLKIN and PCI_CLK_IN should either be stable low during the power-up of VDDIO supply and start their swings after power-up or should swing within VDDIO range during VDDIO power-up., so their amplitude grows as VDDIO grows during power-up. Figure 6 shows a sequence in which VDDIO is raised after VDD and CLKIN begins to toggle with the raise of VDDIO supply. VDDIO = Nominal VDD = Nominal 1 VDDIO Nominal Voltage 3.3 V VDD Nominal 1.0 V Time PORESET/TRST asserted VDD applied CLKIN starts toggling PORESET VDDIO applied Figure 6. Start-Up Sequence with VDD Raised Before VDDIO with CLKIN Started with VDDIO 2.6.2 Clock and Timing Signals The following sections include a description of clock signal characteristics. Table 16 shows the maximum frequency values for CLKIN and PCI_CLK_IN. The user must ensure that maximum frequency values are not exceeded. Table 16. Clock Frequencies Characteristic CLKIN frequency PCI_CLK_IN frequency CLKIN duty cycle PCI_CLK_IN duty cycle Symbol Min Max Unit FCLKIN 33 133 MHz FPCI_CLK_IN 33 133 MHz DCLKIN 40 60 % DPCI_CLK_IN 40 60 % MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 35 Electrical Characteristics 2.6.3 Reset Timing The MSC8144EC has several inputs to the reset logic: * * * * * * * * Power-on reset (PORESET) External hard reset (HRESET) External soft reset (SRESET) Software watchdog reset JTAG reset RapidIO reset Software hard reset Software soft reset All MSC8144EC reset sources are fed into the reset controller, which takes different actions depending on the source of the reset. The reset status register indicates the most recent sources to cause a reset. Table 17 describes the reset sources. Table 17. Reset Sources Name Direction Description Power-on reset (PORESET) Input Initiates the power-on reset flow that resets the MSC8144EC and configures various attributes of the MSC8144EC. On PORESET, the entire MSC8144EC device is reset. All PLLs states is reset, HRESET and SRESET are driven, the extended cores are reset, and system configuration is sampled. The reset source and word are configured only when PORESET is asserted. External hard reset (HRESET) Input/ Output Initiates the hard reset flow that configures various attributes of the MSC8144EC. While HRESET is asserted, SRESET is also asserted. HRESET is an open-drain pin. Upon hard reset, HRESET and SRESET are driven, the extended cores are reset, and system configuration is sampled. Note that the RCW (reset Configuration Word) is not reloaded during HRESET assertion after out of power on reset sequence. The reset configuration word is described in the Reset chapter in the MSC8144EC Reference Manual. External soft reset (SRESET) Input/ Output Initiates the soft reset flow. The MSC8144EC detects an external assertion of SRESET only if it occurs while the MSC8144EC is not asserting reset. SRESET is an open-drain pin. Upon soft reset, SRESET is driven, the extended cores are reset, and system configuration is maintained. Host reset command through the TAP Internal When a host reset command is written through the Test Access Port (TAP), the TAP logic asserts the soft reset signal and an internal soft reset sequence is generated. Software watchdog reset Internal When the MSC8144EC watchdog count reaches zero, a software watchdog reset is signalled. The enabled software watchdog event then generates an internal hard reset sequence. RapidIO reset Internal When the RapidIO logic asserts the RapidIO hard reset signal, it generates an internal hard reset sequence. Software hard reset Internal A hard reset sequence can be initialized by writing to a memory mapped register (RCR) Software soft reset Internal A soft reset sequence can be initialized by writing to a memory mapped register (RCR) Table 18 summarizes the reset actions that occur as a result of the different reset sources. Table 18. Reset Actions for Each Reset Source Power-On Reset (PORESET) Hard Reset (HRESET) External only External or Internal (Software Watchdog, Software or RapidIO) External or internal Software JTAG Command: EXTEST, CLAMP, or HIGHZ Yes No No No Soft Reset (SRESET) Reset Action/Reset Source Configuration pins sampled (Refer to Section 2.6.3.2 for details). PLL state reset Yes No No No Select reset configuration source Yes No No No System reset configuration write Yes No No No MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 36 Freescale Semiconductor Electrical Characteristics Table 18. Reset Actions for Each Reset Source (continued) Power-On Reset (PORESET) Hard Reset (HRESET) External only External or Internal (Software Watchdog, Software or RapidIO) Soft Reset (SRESET) Reset Action/Reset Source External or internal Software JTAG Command: EXTEST, CLAMP, or HIGHZ HRESET driven Yes Yes No No IPBus modules reset (TDM, UART, SWT, DDRC, IPBus master, GIC, HS, and GPIO) Yes Yes Yes Yes Depends on command SRESET driven Yes Yes Yes Extended cores reset Yes Yes Yes Yes CLASS registers reset Yes Yes Some registers Some registers Timers, Performance Monitor Yes Yes No No QUICC Engine Subsystem, PCI, DMA Yes Yes Most registers Most registers 2.6.3.1 Power-On Reset (PORESET) Pin Asserting PORESET initiates the power-on reset flow. PORESET must be asserted externally for at least 32 CLKIN cycles after VDD and VDDIO are both at their nominal levels. 2.6.3.2 Reset Configuration The MSC8144EC has two mechanisms for writing the reset configuration: * * * Through the I2C port Through external pins Through internal hard coded Twenty-three signals (see Section 1 for signal description details) are sampled during the power-on reset sequence to define the Reset Word Configuration Source and operating conditions: * * RCW_SRC[2-0] RC[16-0] The RCFG_CLKIN_RNG pin must be valid during power-on or hard reset sequence. The STOP_BS pin must be always valid and is also sampled during power-on reset sequence for RCW loading from an I2C EEPROM. 2.6.3.3 Reset Timing Tables Table 19 and Figure 7 describe the reset timing for a reset configuration. Table 19. Timing for a Reset Configuration Write No. 1 Characteristics Required external PORESET duration minimum * 33 MHz <= CLKIN < 44 MHz * 44 MHz <= CLKIN < 66 MHz * 66 MHz <= CLKIN < 100 MHz * 100 MHz <= CLKIN < 133 MHz Expression Max Min Unit 1280 728 485 320 727 484 320 241 ns ns ns ns 32/CLKIN MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 37 Electrical Characteristics Table 19. Timing for a Reset Configuration Write (continued) No. Characteristics Expression Max Min Unit 2 Delay from de-assertion of external PORESET to HRESET deassertion for external pins and hard coded RCW * 33 MHz <= CLKIN < 66 MHz * 66 MHz <= CLKIN <= 133 MHz 15369/CLKIN 34825/CLKIN 615 528 233 262 s s Delay from de-assertion of external PORESET to HRESET deassertion for loading RCW the I2C interface * 33 MHz <= CLKIN < 44 MHz * 44 MHz <= CLKIN < 66 MHz * 66 MHz <= CLKIN < 100 MHz * 100 MHz <= CLKIN < 133 MHz 92545/CLKIN 107435/CLKIN 124208/CLKIN 157880/CLKIN 3702 2441 1882 1579 2103 1627 1242 1187 s s s s 16/CLKIN 640 120 ns 3 Note: Delay from HRESET deassertion to SRESET deassertion * REFCLK = 33 MHz to 133 MHz Timings are not tested, but are guaranteed by design. RCW_SRC2,RCW_SRC1,RCW_SRC0,STOP_BS and RCFG_CLKIN_RNG 1 pins must be valid PORESET Input HRESET Output (I/O) 2 SRESET Output (I/O) Reset configuration write sequence during this period. 3 Figure 7. Timing for a Reset Configuration Write See also Reset Errata for PLL lock and reset duration. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 38 Freescale Semiconductor Electrical Characteristics 2.6.4 DDR SDRAM AC Timing Specifications This section describes the AC electrical characteristics for the DDR SDRAM interface. 2.6.4.1 DDR SDRAM Input Timings Table 20 provides the input AC timing specifications for the DDR SDRAM when VDDDDR (typ) = 2.5 V. Table 20. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface Parameter Symbol Min Max Unit AC input low voltage VIL -- MVREF - 0.31 V AC input high voltage VIH MVREF + 0.31 -- V Note: At recommended operating conditions with VDDDDR of 2.5 5%. Table 21 provides the input AC timing specifications for the DDR SDRAM when VDDDDR (typ) = 1.8 V. Table 21. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface Parameter Symbol Min Max Unit AC input low voltage VIL -- MVREF - 0.25 V AC input high voltage VIH MVREF + 0.25 -- V Note: At recommended operating conditions with VDDDDR of 1.8 5%. Table 22 provides the input AC timing specifications for the DDR SDRAM interface. Table 22. DDR SDRAM Input AC Timing Specifications Parameter Controller Skew for * 400 MHz * 333 MHz * 266 MHz * 200 MHz Notes: 1. 2. MDQS--MDQ/MECC/MDM1 Symbol Min Max Unit -365 -390 -428 -490 365 390 428 490 ps ps ps ps tCISKEW tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that is captured with MDQS[n]. Subtract this value from the total timing budget. At recommended operating conditions with VDDDDR (1.8 V or 2.5 V) 5% MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 39 Electrical Characteristics 2.6.4.2 DDR SDRAM Output AC Timing Specifications Table 23 provides the output AC timing specifications for the DDR SDRAM interface. Table 23. DDR SDRAM Output AC Timing Specifications Parameter MCK[n] cycle time, (MCK[n]/MCK[n] crossing)2 Symbol 1 Min Max Unit tMCK 3 10 ns 1.95 2.40 3.15 4.20 -- -- -- -- ns ns ns ns 1.85 2.40 3.15 4.20 -- -- -- -- ns ns ns ns 1.95 2.40 3.15 4.20 -- -- -- -- ns ns ns ns 1.95 2.40 3.15 4.20 -- -- -- -- ns ns ns ns -0.6 0.6 ns 700 900 1100 1200 -- -- -- -- ps ps ps ps 700 900 1100 1200 -- -- -- -- ps ps ps ps ADDR/CMD output setup with respect to MCK3 * 400 MHz * 333 MHz * 266 MHz * 200 MHz tDDKHAS ADDR/CMD output hold with respect to MCK3 * 400 MHz * 333 MHz * 266 MHz * 200 MHz tDDKHAX MCSn output setup with respect to MCK3 * 400 MHz * 333 MHz * 266 MHz * 200 MHz tDDKHCS MCSn output hold with respect to MCK3 * 400 MHz * 333 MHz * 266 MHz * 200 MHz tDDKHCX MCK to MDQS Skew4 tDDKHMH MDQ/MECC/MDM output setup with respect to MDQS5 * 400 MHz * 333 MHz * 266 MHz * 200 MHz tDDKHDS, tDDKLDS MDQ/MECC/MDM output hold with respect to MDQS5 * 400 MHz * 333 MHz * 266 MHz * 200 MHz tDDKHDX, tDDKLDX MDQS preamble start6 tDDKHMP -0.5 x tMCK - 0.6 -0.5 x tMCK +0.6 ns MDQS epilogue end6 tDDKHME -0.6 0.6 ns Notes: 1. 2. 3. 4. 5. 6. 7. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time. All MCK/MCK referenced measurements are made from the crossing of the two signals 0.1 V. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. For the ADDR/CMD setup and hold specifications, it is assumed that the Clock Control register is set to adjust the memory clocks by 1/2 applied cycle. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the DQSS override bits in the TIMING_CFG_2 register. This will typically be set to the same delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same adjustment value. See the MSC8144EC Reference Manual for a description and understanding of the timing modifications enabled by use of these bits. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC (MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that tDDKHMP follows the symbol conventions described in note 1. At recommended operating conditions with VDDDDR (1.8 V or 2.5 V) 5%. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 40 Freescale Semiconductor Electrical Characteristics Figure 8 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH). MCK[n] MCK[n] tMCK tDDKHMHmax) = 0.6 ns MDQS tDDKHMH(min) = -0.6 ns MDQS Figure 8. Timing for tDDKHMH Figure 9 shows the DDR SDRAM output timing diagram. MCK[n] MCK[n] tMCK tDDKHAS, tDDKHCS tDDKHAX ,tDDKHCX ADDR/CMD Write A0 NOOP tDDKHMP tDDKHMH MDQS[n] tDDKHME tDDKHDS tDDKLDS MDQ[x] D0 D1 tDDKLDX tDDKHDX Figure 9. DDR SDRAM Output Timing MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 41 Electrical Characteristics Figure 10 provides the AC test load for the DDR bus. Z0 = 50 Output RL = 50 VDDDDR/2 Figure 10. DDR AC Test Load 2.6.5 Serial RapidIO Timing and SGMII Timing 2.6.5.1 AC Requirements for SRIO_REF_CLK and SRIO_REF_CLK Table 24 lists AC signal specifications. Table 24. SDn_REF_CLK and SDn_REF_CLK AC Signal Specifications Parameter Description REFCLK cycle time 2.6.5.2 Symbol Min Typical Max Units Comments tREF -- 10 (8, 6.4) -- ns 8 ns applies only to serial RapidIO system with 125-MHz reference clock. 6.4 ns applies only to serial RapidIO systems with a 156.25 MHz reference clock. Note: SGMII uses the 8 ns (125 MHz) value only. Signal Definitions LP-Serial links use differential signaling. This section defines terms used in the description and specification of differential signals. Figure 11 shows how the signals are defined. The figure shows waveforms for either a transmitter output (TD and TD) or a receiver input (RD and RD). Each signal swings between voltage levels A and B, where A > B. TD or RD A B TD or RD Differential Peak-Peak = 2 x (A - B) Figure 11. Differential VPP of Transmitter or Receiver Note: This explanation uses generic TD/TD/RD/RD signal names. These correspond to SRIO_TXD/SRIO_TXD/ SRIO_RXD/SRIO_RXD respectively. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 42 Freescale Semiconductor Electrical Characteristics Using these waveforms, the definitions are as follows: 1. 2. 3. 4. 5. 6. The transmitter output signals and the receiver input signals TD, TD, RD and RD each have a peak-to-peak voltage (VPP) swing of A - B. The differential output signal of the transmitter, VOD, is defined as VTD - VTD. The differential input signal of the receiver, VID, is defined as VRD - VRD. The differential output signal of the transmitter and the differential input signal of the receiver each range from A - B to -(A - B). The peak value of the differential transmitter output signal and the differential receiver input signal is A - B. The value of the differential transmitter output signal and the differential receiver input signal is 2 x (A - B) VPP. To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic) transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing that goes between 2.5 V and 2.0 V. Using these values, the peak-to-peak voltage swing of the signals TD and TD is 500 mVPP. The differential output signal ranges between 500 mV and -500 mV. The peak differential voltage is 500 mV. The peak-to-peak differential voltage is 1000 mVPP. Note: AC electrical specifications are given for transmitter and receiver. Long run and short run interfaces at three baud rates (a total of six cases) are described. The parameters for the AC electrical specifications are guided by the XAUI electrical interface specified in Clause 47 of IEEETM Std 802.3ae-2002TM. XAUI has similar application goals to serial RapidIO. The goal of this standard is that electrical designs for serial RapidIO can reuse electrical designs for XAUI, suitably modified for applications at the baud intervals and reaches described herein. 2.6.5.3 Equalization With the use of high speed serial links, the interconnect media will cause degradation of the signal at the receiver. Effects such as Inter-Symbol Interference (ISI) or data dependent jitter are produced. This loss can be large enough to degrade the eye opening at the receiver beyond what is allowed in the specification. To negate a portion of these effects, equalization can be used. The most common equalization techniques that can be used are: * * A passive high pass filter network placed at the receiver. This is often referred to as passive equalization. The use of active circuits in the receiver. This is often referred to as adaptive equalization. 2.6.5.4 Transmitter Specifications LP-Serial transmitter electrical and timing specifications are stated in the text and tables of this section. The differential return loss, S11, of the transmitter in each case shall be better than * * -10 dB for (baud frequency)/10 < freq(f) < 625 MHz, and -10 dB + 10log(f/625 MHz) dB for 625 MHz freq(f) baud frequency The reference impedance for the differential return loss measurements is 100 resistive. Differential return loss includes contributions from internal circuitry, packaging, and any external components related to the driver. The output impedance requirement applies to all valid output levels. It is recommended that the 20-80% rise/fall time of the transmitter, as measured at the transmitter output, have a minimum value 60 ps in each case. It is also recommended that the timing skew at the output of an LP-Serial transmitter between the two signals comprising a differential pair not exceed 25 ps at 1.25 GB, 20 ps at 2.50 GB, and 15 ps at 3.125 GB. Table 25. Short Run Transmitter AC Timing Specifications--1.25 GBaud Range Characteristic Output Voltage Differential Output Voltage Symbol Unit Min Max VO -0.40 2.30 V VDIFFPP 500 1000 mVPP Deterministic Jitter JD 0.17 UIPP Total Jitter JT 0.35 UIPP Notes Voltage relative to COMMON of either signal comprising a differential pair MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 43 Electrical Characteristics Table 25. Short Run Transmitter AC Timing Specifications--1.25 GBaud (continued) Range Characteristic Symbol Unit Min Multiple output skew SMO Unit Interval UI 800 Notes Max 1000 ps Skew at the transmitter output between lanes of a multilane link 800 ps 100 ppm Table 26. Short Run Transmitter AC Timing Specifications--2.5 GBaud Range Characteristic Output Voltage Differential Output Voltage Deterministic Jitter Symbol Unit Max VO -0.40 2.30 V VDIFFPP 500 1000 mVPP 0.17 UIPP JT 0.35 UIPP SMO 1000 ps Skew at the transmitter output between lanes of a multilane link 400 ps 100 ppm JD Total Jitter Multiple Output skew Unit Interval Notes Min UI 400 Voltage relative to COMMON of either signal comprising a differential pair Table 27. Short Run Transmitter AC Timing Specifications--3.125 GBaud Range Characteristic Output Voltage Differential Output Voltage Deterministic Jitter Symbol Unit Max VO -0.40 2.30 V VDIFFPP 500 1000 mVPP 0.17 UIPP JT 0.35 UIPP SMO 1000 ps Skew at the transmitter output between lanes of a multilane link 320 ps 100 ppm JD Total Jitter Multiple output skew Unit Interval Notes Min UI 320 Voltage relative to COMMON of either signal comprising a differential pair Table 28. Long Run Transmitter AC Timing Specifications--1.25 GBaud Range Characteristic Output Voltage Differential Output Voltage Symbol Unit Min Max VO -0.40 2.30 V VDIFFPP 800 1600 mVPP Notes Voltage relative to COMMON of either signal comprising a differential pair Deterministic Jitter JD 0.17 UIPP Total Jitter JT 0.35 UIPP SMO 1000 ps Skew at the transmitter output between lanes of a multilane link 800 ps 100 ppm Multiple output skew Unit Interval UI 800 MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 44 Freescale Semiconductor Electrical Characteristics Table 29. Long Run Transmitter AC Timing Specifications--2.5 GBaud Range Characteristic Output Voltage Differential Output Voltage Deterministic Jitter Symbol Unit Max VO -0.40 2.30 V VDIFFPP 800 1600 mVPP 0.17 UIPP JT 0.35 UIPP SMO 1000 ps Skew at the transmitter output between lanes of a multilane link 400 ps 100 ppm JD Total Jitter Multiple output skew Unit Interval Notes Min UI 400 Voltage relative to COMMON of either signal comprising a differential pair Table 30. Long Run Transmitter AC Timing Specifications--3.125 GBaud Range Characteristic Output Voltage Differential Output Voltage Symbol Unit Min Max VO -0.40 2.30 V VDIFFPP 800 1600 mVPP Notes Voltage relative to COMMON of either signal comprising a differential pair Deterministic Jitter JD 0.17 UIPP Total Jitter JT 0.35 UIPP SMO 1000 ps Skew at the transmitter output between lanes of a multilane link 320 ps 100 ppm Multiple output skew Unit Interval UI 320 For each baud rate at which an LP-Serial transmitter is specified to operate, the output eye pattern of the transmitter shall fall entirely within the unshaded portion of the transmitter output compliance mask shown in Figure 12 with the parameters specified in Table 31 when measured at the output pins of the device and the device is driving a 100 5% differential resistive load. The output eye pattern of an LP-Serial transmitter that implements pre-emphasis (to equalize the link and reduce inter-symbol interference) need only comply with the transmitter output compliance mask when pre-emphasis is disabled or minimized. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 45 Transmitter Differential Output Voltage Electrical Characteristics VDIFF max VDIFF min 0 -VDIFF min -VDIFF max 0 A B 1-B 1-A 1 Time in UI Figure 12. Transmitter Output Compliance Mask Table 31. Transmitter Differential Output Eye Diagram Parameters Transmitter Type VDIFFmin (mV) VDIFFmax (mV) A (UI) B (UI) 1.25 GBaud short range 250 500 0.175 0.39 1.25 GBaud long range 400 800 0.175 0.39 2.5 GBaud short range 250 500 0.175 0.39 2.5 GBaud long range 400 800 0.175 0.39 3.125 GBaud short range 250 500 0.175 0.39 3.125 GBaud long range 400 800 0.175 0.39 MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 46 Freescale Semiconductor Electrical Characteristics 2.6.5.5 Receiver Specifications LP-Serial receiver electrical and timing specifications are stated in the text and tables of this section. Receiver input impedance shall result in a differential return loss better that 10 dB and a common mode return loss better than 6 dB from 100 MHz to 0.8 x baud frequency. This includes contributions from internal circuitry, the package, and any external components related to the receiver. AC coupling components are included in this requirement. The reference impedance for return loss measurements is 100 resistive for differential return loss and 25 resistive for common mode. Table 32. Receiver AC Timing Specifications--1.25 GBaud Range Characteristic Symbol Unit Min Max 1600 Notes Differential Input Voltage VIN 200 mVPP Measured at receiver Deterministic Jitter Tolerance JD 0.37 UIPP Measured at receiver Combined Deterministic and Random Jitter Tolerance JDR 0.55 UIPP Measured at receiver Total Jitter Tolerance JT 0.65 UIPP Measured at receiver. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 13. The sinusoidal jitter component is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects. Multiple Input Skew SMI 24 Bit Error Rate BER 10-12 Unit Interval UI 800 800 ns Skew at the receiver input between lanes of a multilane link ps 100 ppm Table 33. Receiver AC Timing Specifications--2.5 GBaud Range Characteristic Symbol Unit Min Max VIN 200 1600 Deterministic Jitter Tolerance JD Combined Deterministic and Random Jitter Tolerance JDR Total Jitter Tolerance JT Multiple Input Skew SMI 24 Bit Error Rate BER 10-12 Differential Input Voltage Unit Interval UI Notes mVPP Measured at receiver 0.37 UIPP Measured at receiver 0.55 UIPP Measured at receiver 0.65 UIPP Measured at receiver. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 13. The sinusoidal jitter component is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects. 400 400 ns Skew at the receiver input between lanes of a multilane link ps 100 ppm MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 47 Electrical Characteristics Table 34. Receiver AC Timing Specifications--3.125 GBaud Range Characteristic Symbol Unit Min Max VIN 200 1600 Deterministic Jitter Tolerance JD Combined Deterministic and Random Jitter Tolerance JDR Total Jitter Tolerance JT Multiple Input Skew SMI 22 Bit Error Rate BER 10-12 Differential Input Voltage Unit Interval UI Notes mVPP Measured at receiver 0.37 UIPP Measured at receiver 0.55 UIPP Measured at receiver 0.65 UIPP Measured at receiver. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 13. The sinusoidal jitter component is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects. 320 320 ns Skew at the receiver input between lanes of a multilane link ps 100 ppm 8.5 UI p-p Sinusoidal Jitter Amplitude 0.10 UI p-p 22.1 kHz Frequency 1.875 MHz 20 MHz Figure 13. Single Frequency Sinusoidal Jitter Limits MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 48 Freescale Semiconductor Electrical Characteristics 2.6.5.6 Receiver Eye Diagrams For each baud rate at which an LP-Serial receiver is specified to operate, the receiver shall meet the corresponding bit error rate specification (Table 32, Table 33, and Table 34) when the eye pattern of the receiver test signal (exclusive of sinusoidal jitter) falls entirely within the unshaded portion of the receiver input compliance mask shown in Figure 14 with the parameters specified in Table 35. The eye pattern of the receiver test signal is measured at the input pins of the receiving device with the device replaced with a 100 5% differential resistive load. Receiver Differential Input Voltage VDIFF max VDIFF min 0 -VDIFF min -VDIFF max 0 A B 1-B 1 1-A Time (UI) Figure 14. Receiver Input Compliance Mask Table 35. Receiver Input Compliance Mask Parameters Exclusive of Sinusoidal Jitter Receiver Type VDIFFmin (mV) VDIFFmax (mV) A (UI) B (UI) 1.25 GBaud 100 800 0.275 0.400 2.5 GBaud 100 800 0.275 0.400 3.125 GBaud 100 800 0.275 0.400 2.6.5.7 Measurement and Test Requirements Since the LP-Serial electrical specification are guided by the XAUI electrical interface specified in Clause 47 of IEEE Std. 802.3ae-2002TM, the measurement and test requirements defined here are similarly guided by Clause 47. In addition, the CJPAT test pattern defined in Annex 48A of IEEE Std. 802.3ae-2002 is specified as the test pattern for use in eye pattern and jitter measurements. Annex 48B of IEEE Std. 802.3ae-2002 is recommended as a reference for additional information on jitter test methods. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 49 Electrical Characteristics 2.6.5.8 Eye Template Measurements For the purpose of eye template measurements, the effects of a single-pole high pass filter with a 3 dB point at (baud frequency)/1667 is applied to the jitter. The data pattern for template measurements is the continuous jitter test pattern (CJPAT) defined in Annex 48A of IEEE Std. 802.3ae. All lanes of the LP-Serial link shall be active in both the transmit and receive directions, and opposite ends of the links shall use asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. The amount of data represented in the eye shall be adequate to ensure that the bit error ratio is less than 10-12. The eye pattern shall be measured with AC coupling and the compliance template centered at 0 Volts differential. The left and right edges of the template shall be aligned with the mean zero crossing points of the measured data eye. The load for this test shall be 100 resistive 5% differential to 2.5 GHz. 2.6.5.9 Jitter Test Measurements For the purpose of jitter measurement, the effects of a single-pole high pass filter with a 3 dB point at (baud frequency)/1667 is applied to the jitter. The data pattern for jitter measurements is the Continuous Jitter Test Pattern (CJPAT) pattern defined in Annex 48A of IEEE Std. 802.3ae. All lanes of the LP-Serial link shall be active in both the transmit and receive directions, and opposite ends of the links shall use asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. Jitter shall be measured with AC coupling and at 0 V differential. Jitter measurement for the transmitter (or for calibration of a jitter tolerance setup) shall be performed with a test procedure resulting in a BER curve such as that described in Annex 48B of IEEE Std. 802.3ae. 2.6.5.10 Transmit Jitter Transmit jitter is measured at the driver output when terminated into a load of 100 resistive 5% differential to 2.5 GHz. 2.6.5.11 Jitter Tolerance Jitter tolerance is measured at the receiver using a jitter tolerance test signal. This signal is obtained by first producing the sum of deterministic and random jitter defined in Section 2.6.5.9 and then adjusting the signal amplitude until the data eye contacts the 6 points of the minimum eye opening of the receive template shown in Figure 14 and Table 35. Note that for this to occur, the test signal must have vertical waveform symmetry about the average value and have horizontal symmetry (including jitter) about the mean zero crossing. Eye template measurement requirements are as defined above. Random jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20 dB/decade roll-off below this. The required sinusoidal jitter specified in Section 8.6 is then added to the signal and the test load is replaced by the receiver being tested. 2.6.6 PCI Timing This section describes the general AC timing parameters of the PCI bus. Table 36 provides the PCI AC timing specifications. Table 36. PCI AC Timing Specifications 33 MHz Parameter 66 MHz Symbol Unit Min Max Min Max Output delay tPCVAL 2.0 11.0 1.0 6.0 ns High-Z to Valid Output delay tPCON 2.0 -- 1.0 -- ns Valid to High-Z Output delay tPCOFF -- 28 -- 14 ns Input setup tPCSU 7.0 -- 3.0 -- ns Input hold tPCH 0 -- 0 -- ns MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 50 Freescale Semiconductor Electrical Characteristics Table 36. PCI AC Timing Specifications (continued) 33 MHz Parameter Unit Min Notes: 1. 2. 3. 4. 5. 66 MHz Symbol Max Min Max See the timing measurement conditions in the PCI 2.2 Local Bus Specifications. All PCI signals are measured from 0.5 x VDDIO of the rising edge of PCI_CLK_IN to 0.4 x VDDIO of the signal in question for 3.3-V PCI signaling levels. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. Input timings are measured at the pin. The reset assertion timing requirement for HRESET is in Table 19 and Figure 7 Figure 15 provides the AC test load for the PCI. Z0 = 50 Output RL = 50 VDD/2 Figure 15. PCI AC Test Load Figure 16 shows the PCI input AC timing conditions. CLK tPCSU tPCH Input Figure 16. PCI Input AC Timing Measurement Conditions Figure 17 shows the PCI output AC timing conditions. CLK tPCVAL Output Delay tPCOFF tPCON High-Impedance Output Figure 17. PCI Output AC Timing Measurement Condition MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 51 Electrical Characteristics 2.6.7 TDM Timing Table 37. TDM Timing Characteristic Symbol Expression Min Max Units TDMxRCLK/TDMxTCLK tTDMC TC1 16 -- ns TDMxRCLK/TDMxTCLK high pulse width tTDMCH (0.5 0.1) x TC4 7 -- ns TDMxRCLK/TDMxTCLK low pulse width tTDMCL (0.5 0.1) x TC4 7 -- ns TDM receive all input setup time related to TDMxRCLK TDMxTSYN input setup time related to TDMxTCLK in TSO=0 mode tTDMVKH 3.6 -- ns TDM receive all input hold time related to TDMxRCLK TDMxTSYN input hold time related to TDMxTCLK in TSO=0 mode tTDMXKH 1.9 -- ns TDMxTCLK high to TDMxTDAT output active2 tTDMDHOX 2.5 -- ns TDMxTCLK high to TDMxTDAT output valid2 tTDMDHOV -- 9.8 ns All output hold time (except TDMxTSYN) 3 tTDMHOX 2.5 -- ns TDMxTCLK high to TDMxTDAT output high impedance2 tTDMDHOZ -- 9.8 ns TDMxTCLK high to TDMxTSYN output valid2 tTDMSHOV -- 9.25 ns TDMxTSYN output hold time3 tTDMSHOX 2.0 -- ns Notes: 1. 2. 3. 4. Values are based on a a maximum frequency of 62.5 MHz. The TDM interface supports any frequency below 62.5 MHz. Values are based on 20 pF capacitive load. Values are based on 10 pF capacitive load. The expression is for common calculations only. Figure 18 shows the TDM input AC timing. tTDMC tTDMCH tTDMCL TDMxRCLK tTDMXKH tTDMVKH TDMxRDAT tTDMXKH tTDMVKH TDMxRSYN Figure 18. TDM Inputs Signals Note: For some TDM modes, receive data and receive sync are input on other pins. This timing is also valid for them. See the MSC8144EC Reference Manual. Figure 19 shows TDMxTSYN AC timing in TSO=0 mode. TDMxTCLK tTDMXKH tTDMVKH TDMxTSYN Figure 19. TDMxTSYN in TSO=0 mode Figure 20 shows the TDM Output AC timing MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 52 Freescale Semiconductor tTDMC tTDMCH tTDMCL TDMxTCLK tTDMDHOX TDMxTDAT tTDMSHOV TDMxTSYN ~ ~ ~ ~ tTDMDHOZ tTDMDHOV tTDMHOX tTDMSHOX Figure 20. TDM Output Signals Note: 2.6.8 For some TDM modes, transmit data is output on other pins. This timing is also valid for those pins. See the MSC8144EC Reference Manual UART Timing Table 38. UART Timing Characteristics URXD and UTXD inputs high/low duration Note: Symbol Expression Min Max Unit TUREFCLK 16 x TREFCLK 160 -- ns TUREFCLK = TREFCLK is guaranteed by design. Figure 21 shows the UART input AC timing UTXD, URXD inputs TUREFCLK TUREFCLK Figure 21. UART Input Timing Figure 22 shows the UART output AC timing UTXD output TUREFCLK TUREFCLK Figure 22. UART Output Timing MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 53 2.6.9 Timer Timing Table 39. Timer Timing Characteristics Symbol Min Unit TTMREFCLK 10.0 ns TIMERx Input high phase TTMCH 4.0 ns TIMERx Output low phase TTMCL 4.0 ns TIMERx frequency Figure 23 shows the timer input AC timing TTMREFCLK TTMCH TTMCL TIMERx (Input) Figure 23. Timer Timing 2.6.10 Ethernet Timing This section describes the AC electrical characteristics for the Ethernet interface. There are programmable delay units (PDU) that should be programmed differently for each Interface to meet timing. There is a general configuration register 4 (GCR4) used to configure the timing. For additional information, see the MSC8144EC Reference Manual. 2.6.10.1 Management Interface Timing Table 40. Ethernet Controller Management Interface Timing Characteristics ETHMDC to ETHMDIO delay2 Symbol Min Max Unit tMDKHDX 10 70 ns ETHMDIO to ETHMDC rising edge setup time tMDDVKH 7 -- ns ETHMDC rising edge to ETHMDIO hold time tMDDXKH 0 -- ns Notes: 1. 2. Program the ETHMDC frequency (fMDC) to a maximum value of 2.5 MHz (400 ns period for tMDC). The value depends on the source clock and configuration of MIIMCFG[MCS] and UPSMR[MDCP]. For example, for a source clock of 400 MHz, to achieve fMDC = 2.5 MHz, program MIIMCFG[MCS] = 0x4 and UPSMR[MDCP] = 0. See the MSC8144EC Reference Manual for configuration details. The value depends on the source clock. For example, for a source clock of 267 MHz, the delay is 70 ns. For a source clock of 333 MHz, the delay is 58 ns. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 54 Freescale Semiconductor tMDC ETHMDC ETHMDIO (Input) tMDDVKH ETHMDIO (Output) tMDDXKH tMDKHDX Figure 24. MII Management Interface Timing 2.6.10.2 MII Transmit AC Timing Specifications Table 41 provides the MII transmit AC timing specifications. Table 41. MII Transmit AC Timing Specifications Symbol 1 Min Max Unit tMTKHDX 0 25 ns Symbol 1 Min Max Unit RXD[3:0], RX_DV, RX_ER setup time to RX_CLK tMRDVKH 10.0 -- ns RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 2 -- ns Parameter/Condition TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay Notes: 1. 2. Typical TX_CLK period (tMTX) for 10 Mbps is 400 ns and for 100 Mbps is 40 ns. Program GCR4 as 0x00030CC3. Figure 25 shows the MII transmit AC timing diagram. TX_CLK TXD[3:0] TX_EN TX_ER tMTKHDX Figure 25. MII Transmit AC Timing 2.6.10.3 MII Receive AC Timing Specifications Table 42 provides the MII receive AC timing specifications. Table 42. MII Receive AC Timing Specifications Parameter/Condition Notes: 1. 2. Typical RX_CLK period (tMRX) for 10 Mbps is 400 ns and for 100 Mbps is 40 ns. Program GCR4 as 0x00030CC3. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 55 Figure 26 provides the AC test load. Z0 = 50 Output RL = 50 VDDGE/2 Figure 26. AC Test Load Figure 27 shows the MII receive AC timing diagram. RX_CLK RXD[3:0] RX_DV RX_ER Valid Data tMRDVKH tMRDXKH Figure 27. MII Receive AC Timing 2.6.10.4 RMII Transmit and Receive AC Timing Specifications Table 43 provides the RMII transmit and receive AC timing specifications. Table 43. RMII Transmit and Receive AC Timing Specifications Parameter/Condition Symbol 1 Min Max Unit tRMXH/tRMX 35 65 % REF_CLK to RMII data TXD[1-0], TX_EN delay tRMTKHDX 2 10 ns RXD[1-0], CRS_DV, RX_ER setup time to REF_CLK tRMRDVKH 4.0 -- ns RXD[1-0], CRS_DV, RX_ER hold time to REF_CLK tRMRDXKH 2.0 -- ns REF_CLK duty cycle Typical REF_CLK clock period (tRMX) is 20 ns Notes: 1. 2. Typical REF_CLK clock period (tRMX) is 20 ns Program GCR4 as 0x00001405 MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 56 Freescale Semiconductor Figure 28 shows the RMII transmit and receive AC timing diagram. tRMXR tRMX REF_CLK tRMXF tRMXH TXD[1-0] TX_EN tRMTKHDX RXD[1-0] CRS_DV RX_ER Valid Data tRMRDVKH tRMRDXKH Figure 28. RMII Transmit and Receive AC Timing Figure 29 provides the AC test load. Output Z0 = 50 RL = 50 VDDGE/2 Figure 29. AC Test Load 2.6.10.5 SMII AC Timing Specification Table 44. SMII Mode Signal Timing Characteristics Symbol Min Max Unit ETHSYNC_IN, ETHRXD to ETHCLOCK rising edge setup time tSMDVKH 1.5 -- ns ETHCLOCK rising edge to ETHSYNC_IN, ETHRXD hold time tSMDXKH 1.0 -- ns ETHCLOCK rising edge to ETHSYNC, ETHTXD output delay tSMXR 1.5 5.0 ns Notes: 1. 2. 3. 4. Typical REF_CLK clock period is 8ns Measured using a 5 pF load. Measured using a 15 pF load Program GCR4 as 0x00002008 Figure 30 shows the SMII Mode signal timing. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 57 ETHCLOCK tSMDVKH tSMDXKH ETHSYNC_IN ETHRXD Valid tSMXR ETHSYNC ETHTXD Valid Valid Figure 30. SMII Mode Signal Timing 2.6.10.6 RGMII AC Timing Specifications Table 45 presents the RGMII AC timing specifications for applications requiring an on-board delayed clock. Table 45. RGMII with On-Board Delay AC Timing Specifications Parameter/Condition Symbol Min Data to clock output skew (at transmitter) tSKEWT -0.5 -- 0.5 ns Data to clock input skew (at receiver) 2 tSKEWR 0.9 -- 2.6 ns Notes: 1. 2. 3. Typ Max Unit At recommended operating conditions with LVDD of 2.5 V +/- 5%. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns is added to the associated clock signal. GCR4 should be programmed as 0x00001004. Table 46 presents the RGMII AC timing specification for applications required non-delayed clock on board. Table 46. RGMII with No On-Board Delay AC Timing Specifications Parameter/Condition Data to clock output skew (at transmitter) Data to clock input skew (at receiver) Notes: 1. 2. 3. 2 Symbol Min Typ Max Unit tSKEWT -2.6 -- -0.9 ns tSKEWR -0.5 -- 0.5 ns At recommended operating conditions with LVDD of 2.5 V +/- 5%. This implies that PC board design will require clocks to be routed with no additional trace delay GCR4 should be programmed as 0x0004C130. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 58 Freescale Semiconductor Figure 31 shows the RGMII AC timing and multiplexing diagrams. GTX_CLK (At Transmitter) tSKEWT TXD[8:5][3:0] TXD[7:4][3:0] TX_CTL TXD[3:0] TXD[8:5] TXD[7:4] TXD[4] TXEN TXD[9] TXERR tSKEWR TX_CLK (At PHY) RXD[8:5][3:0] RXD[7:4][3:0] RXD[3:0] RXD[8:5] RXD[7:4] tSKEWT RX_CTL RXD[4] RXDV RXD[9] RXERR tSKEWR RX_CLK (At PHY) Figure 31. RGMII AC Timing and Multiplexing MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 59 2.6.11 ATM/UTOPIA/POS Timing Table 47 provides the ATM/UTOPIA/POS input and output AC timing specifications. Table 47. ATM/UTOPIA/POS AC Timing (External Clock) Specifications Characteristic Symbol Min Max Unit tUEKHOV 1 9 ns tUEKHOX 1 9 ns Inputs--External clock input setup time tUEIVKH 4 ns Inputs--External clock input hold time tUEIXKH 1 ns Outputs--External clock delay Outputs--External clock High Notes: 1. 2. Impedance1 Not tested. Guaranteed by design. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. Although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. Figure 32 provides the AC test load for the ATM/UTOPIA/POS. Z0 = 50 Output RL = 50 VDD/2 Figure 32. ATM/UTOPIA/POS AC Test Load Figure 33 shows the ATM/UTOPIA/UTOPIA timing with external clock. CLK (input) tUEIVKH tUEIXKH Input Signals: tUEKHOV Output Signals: tUEKHOX Figure 33. ATM/UTOPIAPOS AC Timing (External Clock) MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 60 Freescale Semiconductor 2.6.12 SPI Timing Table 48 lists the SPI input and output AC timing specifications. Table 48. SPI AC Timing Specifications 1 Symbol 2 Characteristic Min Max Unit 6 ns SPI outputs valid--Master mode (internal clock) delay tNIKHOV SPI outputs hold--Master mode (internal clock) delay tNIKHOX SPI outputs valid--Slave mode (external clock) delay tNEKHOV SPI outputs hold--Slave mode (external clock) delay tNEKHOX 2 ns SPI inputs--Master mode (internal clock) input setup time tNIIVKH 4 ns SPI inputs--Master mode (internal clock) input hold time tNIIXKH 0 ns SPI inputs--Slave mode (external clock) input setup time tNEIVKH 4 ns SPI inputs--Slave mode (external clock) input hold time tNEIXKH 2 ns Notes: 1. 2. 0.5 ns 8 ns Output specifications are measured from the 50 percent level of the rising edge of CLKIN to the 50 percent level of the signal. Timings are measured at the pin. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOX symbolizes the internal timing (NI) for the time SPICLK clock reference (K) goes to the high state (H) until outputs (O) are invalid (X). Figure 35 provides the AC test load for the SPI. Z0 = 50 Output RL = 50 OVDD/2 Figure 34. SPI AC Test Load Figure 36 and Figure 37 represent the AC timings from Table 48. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. Figure 36 shows the SPI timings in slave mode (external clock). SPICLK (Input) Input Signals: SPIMOSI (See Note) tNEIVKH tNEIXKH tNIKHOX tNIKHOV Output Signals: SPIMISO (See Note) Note: The clock edge is selectable on SPI. Figure 35. SPI AC Timing in Slave Mode (External Clock) Figure 37 shows the SPI timings in master mode (internal clock). MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 61 SPICLK (Output) Input Signals: SPIMISO (See Note) tNIIXKH tNIIVKH tNIKHOX tNIKHOV Output Signals: SPIMOSI (See Note) Note: The clock edge is selectable on SPI. Figure 36. SPI AC Timing in Master Mode (Internal Clock) 2.6.13 Asynchronous Signal Timing Table 49. Signal Timing Characteristics Input Output Note: Symbol Type Min tIN Asynchronous One CLKIN cycle1 tOUT Asynchronous Application dependent 1. Relevant for EE0, IRQ[15-0], and NMI only. The following interfaces use the specified asynchronous signals: * GPIO. Signals GPIO[31-0], when used as GPIO signals, that is, when the alternate multiplexed special functions are not selected. Note: When used as a GPI, the input should be driven until it is acknowledged by the device; the GPIO input status is read from a register. * * * * * EE port. Signals EE0, EE1, EE2_0, EE2_1, EE2_2, and EE2_3. Boot function. Signal STOP_BS. I2C interface. Signals I2C_SCL and I2C_SDA. Interrupt inputs. Signals IRQ[15-0] and NMI. Interrupt outputs. Signals INT_OUT and NMI_OUT (pulse width is 10 ns). Figure 38 shows the behavior of the asynchronous signals. tIN Input tOUT Output Figure 37. Asynchronous Signal Timing MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 62 Freescale Semiconductor 2.6.14 JTAG Signals Table 50. JTAG Timing All frequencies Characteristics Symbol Unit Min Max TCK cycle time tTCKX 36.0 -- TCK clock high phase measured at VM = 1.6 V tTCKH 15.0 -- ns Boundary scan input data setup time tBSVKH 0.0 -- ns ns tBSXKH 15.0 -- ns TCK fall to output data valid tTCKHOV -- 20.0 ns TCK fall to output high impedance tTCKHOZ -- 24.0 ns TMS, TDI data setup time tTDIVKH 0.0 -- ns TMS, TDI data hold time tTDIXKH 5.0 -- ns TCK fall to TDO data valid tTDOHOV -- 10.0 ns TCK fall to TDO high impedance tTDOHOZ -- 12.0 ns tTRST 100.0 -- ns Boundary scan input data hold time TRST assert time Note: All timings apply to OnCE module data transfers as well as any other transfers via the JTAG port. Figure 40 Shows the Test Clock Input Timing Diagram tTCKX tTCKH VM TCK (Input) VM tTCKR tTCKR Figure 38. Test Clock Input Timing Figure 41 Shows the boundary scan (JTAG) timing diagram. TCK (Input) tBSVKH Data Inputs tBSXKH Input Data Valid tTCKHOV Data Outputs Output Data Valid tTCKHOZ Data Outputs Figure 39. Boundary Scan (JTAG) Timing MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 63 Figure 42 Shows the test access port timing diagram TCK (Input) tTDIVKH TDI TMS (Input) tTDIXKH Input Data Valid tTDOHOV TDO (Output) Output Data Valid tTDOHOZ TDO (Output) Figure 40. Test Access Port Timing Figure 43 Shows the TRST timing diagram. TRST (Input) tTRST Figure 41. TRST Timing 3 Hardware Design Considerations The following sections discuss areas to consider when the MSC8144EC device is designed into a system. 3.1 Start-up Sequencing Recommendations 3.1.1 Power-on Sequence Use the following guidelines for power-on sequencing: * * * There are no dependencies in power-on/power-off sequence between VDDM3 and VDD supplies. There are no dependencies in power-on/power-off sequence between RapidIO supplies: VDDSXC, VDDSXP, VDDRIOPLL and other MSC8144EC supplies. VDDPLL should be coupled with the VDD power rail with extremely low impedance path. External voltage applied to any input line must not exceed the related to this port I/O supply by more than 0.6 V at any time, including during power-up. Some designs require pull-up voltages applied to selected input lines during power-up for configuration purposes. This is an acceptable exception to the rule during start-up. However, each such input can draw up to 80 mA per input pin per MSC8144EC device in the system during start-up. An assertion of the inputs to the high voltage level before power-up should be with slew rate less than 4V/ns. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 64 Freescale Semiconductor Hardware Design Considerations The following supplies should rise before any other supplies in any sequence * * VDD and VDDPLL coupled together VDDM3 After the above supplies rise to 90% of their nominal value the following I/O supplies may rise in any sequence (see Figure 44): * * * * * * VDDGE1 VDDGE2 VDDIO VDDDDR and MVREF coupled one to another. MVREF should be either at same time or after VDDDDR. VDDM3IO V25M3 I/O supplies VDDM3, VDD, and VDDPLL 90% Figure 42. VDDM3, VDDM3IO and V25M3 Power-on Sequence Note: 3.1.2 1. 2. 3. 4. 5. 6. This recommended power sequencing is different from the MSC8122/MSC8126. If no pins that require VDDGE1 as a reference supply are used (see Table 1), VDDGE1 can be tied to GND. If no pins that require VDDGE2 as a reference supply are used (see Table 1), VDDGE2 can be tied to GND. If the DDR interface is not used, VDDDDR and MVREF can be tied to GND. If the M3 memory is not used, VDDM3, VDDM3IO, and V25M3 can be tied to GND. If the RapidIO interface is not used, VDDSX, VDDSXP, and VDDRIOPLL can be tied to GND. Start-Up Timing Section 2.7.1 describes the start-up timing. 3.2 Power Supply Design Considerations Each PLL supply must have an external RC filter for the VDDPLL input. The filter is a 10 resistor in series with two 2.2 F, low ESL (<0.5 nH) and low ESR capacitors. All three PLLs can connect to a single supply voltage source (such as a voltage regulator) as long as the external RC filter is applied to each PLL separately (see Figure 45). For optimal noise filtering, place the circuit as close as possible to its VDDPLL inputs. These traces should be short and direct. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 65 Hardware Design Considerations MSC8144EC 10 Voltage Regulator VDDPLL0 2.2 F 2.2 F 10 VDDPLL0 2.2 F 2.2 F 10 VDDPLL0 2.2 F 2.2 F Figure 43. PLL Supplies 3.3 Clock and Timing Signal Board Layout Considerations When laying out the system board, use the following guidelines: * * Note: 3.4 Note: Keep clock and timing signal paths as short as possible and route with 50 impedance. Use a serial termination resistor placed close to the clock buffer to minimize signal reflection. Use the following equation to compute the resistor value: Rterm = Rim - Rbuf where Rim = trace characteristic impedance Rbuf = clock buffer internal impedance. See MSC8144 CLKIN and PCI_CLK_IN Board Layout (AN3440) for an example layout. Connectivity Guidelines Although the package actually uses a ball grid array, the more conventional term pin is used to denote signal connections in this discussion. First, select the pin multiplexing mode to allocate the required I/O signals. Then use the guidelines presented in the following subsections for board design and connections. The following conventions are used in describing the connectivity requirements: 1. 2. 3. 4. GND indicates using a 10 k pull-down resistor (recommended) or a direct connection to the ground plane. Direct connections to the ground plane may yield DC current up to 50mA through the I/O supply that adds to overall power consumption. VDD indicates using a 10 k pull-up resistor (recommended) or a direct connection to the appropriate power supply. Direct connections to the supply may yield DC current up to 50mA through the I/O supply that adds to overall power consumption. Mandatory use of a pull-up or pull-down resistor it is clearly indicated as "pull-up/pull-down". NC indicates "not connected" and means do not connect anything to the pin. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 66 Freescale Semiconductor Hardware Design Considerations 5. Note: The phrase "in use" indicates a typical pin connection for the required function. Please see recommendations #1 and #2 as mandatory pull-down or pull-up connection for unused pins in case of subset interface connection. 3.4.1 DDR Memory Related Pins This section discusses the various scenarios that can be used with DDR1 and DDR2 memory. Note: For information about unused differential/non-differential pins in DDR1/DDR2 modes (that is, unused negative lines of strobes in DDR1), please refer to Table 57. 3.4.1.1 DDR Interface Is Not Used Table 51. Connectivity of DDR Related Pins When the DDR Interface Is Not Used Signal Name Pin Connection MDQ[0-31] NC MDQS[0-3] NC MDQS[0-3] NC MA[0-15] NC MCK[0-2] NC MCK[0-2] NC MCS[0-1] NC MDM[0-3] NC MBA[0-2] NC MCAS NC MCKE[0-1] NC MODT[0-1] NC MDIC[0-1] NC MRAS NC MWE NC MECC[0-7] NC ECC_MDM NC ECC_MDQS NC ECC_MDQS NC MVREF GND VDDDDR GND Note: If the DDR controller is not used, disable the internal DDR clock by writing a 1 to the CLK11DIS bit in the System Clock Control Register (SCCR[CLK!11DIS]). See Chapter 7, Clocks, in the MSC8144EC Reference Manual for details. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 67 Hardware Design Considerations 3.4.1.2 16-Bit DDR Memory Only Table 58 lists unused pin connection when using 16-bit DDR memory. The 16 most significant data lines are not used. Table 52. Connectivity of DDR Related Pins When Using 16-bit DDR Memory Only Signal Name Pin connection MDQ[0-15] in use MDQ[16-31] pull-up to VDDDDR MDQS[0-1] in use MDQS[2-3] pull-down to GND MDQS[0-1] in use MDQS[2-3] pull-up to VDDDDR MA[0-15] in use MCK[0-2] in use MCK[0-2] in use MCS[0-1] in use MDM[0-1] in use MDM[2-3] NC MBA[0-2] in use MCAS in use MCKE[0-1] in use MODT[0-1] in use MDIC[0-1] in use MRAS in use MWE in use MVREF 1/2*VDDDDR VDDDDR 2.5 V or 1.8 V 3.4.1.3 ECC Unused Pin Connections When the error code corrected mechanism is not used in any 32- or 16-bit DDR configuration, refer to Table 59 to determine the correct pin connections. Table 53. Connectivity of Unused ECC Mechanism Pins Signal Name Pin connection MECC[0-7] pull-up to VDDDDR ECC_MDM NC ECC_MDQS pull-down to GND ECC_MDQS pull-up to VDDDDR MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 68 Freescale Semiconductor Hardware Design Considerations 3.4.2 Serial RapidIO Interface Related Pins 3.4.2.1 Serial RapidIO interface Is Not Used Table 54. Connectivity of Serial RapidIO Interface Related Pins When the RapidIO Interface Is Not Used Signal Name Pin Connection SRIO_IMP_CAL_RX GND SRIO_IMP_CAL_TX GND SRIO_REF_CLK GND SRIO_REF_CLK GND SRIO_RXD[0-3] GND SRIO_RXD[0-3] GND SRIO_TXD[0-3] NC SRIO_TXD[0-3] NC VDDRIOPLL GND GNDRIOPLL GND GNDSXP GND GNDSXC GND VDDSXP GND VDDSXC GND 3.4.2.2 Serial RapidIO Specific Lane Is Not Used Table 55. Connectivity of Serial RapidIO Related Pins When Specific Lane Is Not Used Signal Name Pin Connection SRIO_IMP_CAL_RX in use SRIO_IMP_CAL_TX in use SRIO_REF_CLK in use SRIO_REF_CLK in use SRIO_RXDx GNDSXC SRIO_RXDx GNDSXC SRIO_TXDx NC SRIO_TXDx NC VDDRIOPLL in use GNDRIOPLL in use GNDSXP GNDSXP GNDSXC GNDSXC VDDSXP 1.0 V VDDSXC 1.0 V Note: The x indicates the lane number {0,1,2,3} for all unused lanes. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 69 Hardware Design Considerations 3.4.3 M3 Memory Related Pins Table 56. Connectivity of M3 Related Pins When M3 Memory Is Not Used Signal Name M3_RESET Pin Connection NC V25M3 GND VDDM3 GND VDDM3IO GND 3.4.4 Ethernet Related Pins 3.4.4.1 Note: Ethernet Controller 1 (GE1) Related Pins Table 63 and Table 64 assume that the alternate function of the specified pin is not used. If the alternate function is used, connect the pin as required to support that function. 3.4.4.1.1 GE1 Interface Is Not Used Table 63 assumes that the GE1 signals are not used for any purpose (including any multiplexed functions) and that VDDGE1 is tied to GND. Table 57. Connectivity of GE1 Related Pins When the GE1 Interface Is Not Used Signal Name Pin Connection GE1_COL NC GE1_CRS NC GE1_RD[0-4] NC GE1_RX_ER NC GE1_RX_CLK NC GE1_RX_DV NC GE1_SGMII_RX GNDSXC GE1_SGMII_RX GNDSXC GE1_SGMII_TX NC GE1_SGMII_TX NC GE1_TD[0-4] NC GE1_TX_CLK NC GE1_TX_EN NC GE1_TX_ER NC MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 70 Freescale Semiconductor Hardware Design Considerations 3.4.4.1.2 Subset of GE1 Pins Required When only a subset of the whole GE1 interface is used, such as for RMII, the unused GE1 pins should be connected as described in Table 64. This table assumes that the unused GE1 pins are not used for any purpose (including any multiplexed function) and that VDDGE1 is tied to either 2.5 V or 3.3 V. Table 58. Connectivity of GE1 Related Pins When only a subset of the GE1 Interface Is required Signal Name Pin Connection GE1_COL GND GE1_CRS GND GE1_RD[0-3] GND GE1_RX_ER GND GE1_RX_CLK GND GE1_RX_DV GND GE1_SGMII_RX GNDSXC GE1_SGMII_RX GNDSXC GE1_SGMII_TX NC GE1_SGMII_TX NC GE1_TD[0-3] NC GE1_TX_CLK GND GE1_TX_EN NC GE1_TX_ER NC 3.4.4.2 Note: Ethernet Controller 2 (GE2) Related Pins Table 65 through Table 67 assume that the alternate function of the specified pin is not used. If the alternate function is used, connect the pin as required to support that function. 3.4.4.2.1 GE2 interface Is Not Used Table 65 assumes that the GE2 pins are not used for any purpose (including any multiplexed function) and that VDDGE2 is tied to GND. Table 59. Connectivity of GE2 Related Pins When the GE2 Interface Is Not Used Signal Name Pin Connection GE2_RD[0-3] NC GE2_RX_CLK NC GE2_RX_DV NC GE2_RX_ER NC GE2_SGMII_RX GNDSXC GE2_SGMII_RX GNDSXC GE2_SGMII_TX NC GE2_SGMII_TX NC GE2_TCK Nc MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 71 Hardware Design Considerations Table 59. Connectivity of GE2 Related Pins When the GE2 Interface Is Not Used (continued) Signal Name Pin Connection GE2_TD[0-3] Nc GE2_TX_EN NC 3.4.4.2.2 Subset of GE2 Pins Required When only a subset of the whole GE2 interface is used, such as for RMII, the unused GE2 pins should be connected as described in Table 66. The table assumes that the unused GE2 pins are not used for any purpose (including any multiplexed functions) and that VDDGE2 is tied to either 2.5 V or 3.3 V. Table 60. Connectivity of GE1 Related Pins When only a subset of the GE1 Interface Is required Signal Name Pin Connection GE2_RD[0-3] GND GE2_RX_CLK GND GE2_RX_DV GND GE2_RX_ER GND GE2_SGMII_RX GNDSXC GE2_SGMII_RX GNDSXC GE2_SGMII_TX NC GE2_SGMII_TX NC GE2_TCK NC GE2_TD[0-3] NC GE2_TX_EN NC 3.4.4.3 GE1 and GE2 Management Pins GE_MDC and GE_MDIO pins should be connected as required by the specified protocol. If neither GE1 nor GE2 is used (that is, VDDGE2 is connected to GND), Table 67 lists the recommended management pin connections. Table 61. Connectivity of GE Management Pins When GE1 and GE2 Are Not Used Signal Name Pin Connection GE_MDC NC GE_MDIO NC MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 72 Freescale Semiconductor Hardware Design Considerations 3.4.5 UTOPIA/POS Related Pins Table 68 lists the board connections of the UTOPIA/POS pins when the entire UTOPIA/POS interface is not used or subset of UTOPIA/POS interface is used. For multiplexing options that select a subset of the UTOPIA/POS interface, use the connections described in Table 68 for those signals that are not selected. Table 68 assumes that the alternate function of the specified pin is not used. If the alternate function is used, connect that pin as required to support the selected function. Table 62. Connectivity of UTOPIA/POS Related Pins When UTOPIAPOS Interface Is Not Used Signal Name Pin Connection UTP_IR GND UTP_RADDR[0-4] VDDIO UTP_RCLAV_PDRPA NC UTP_RCLK GND UTP_RD[0-15] GND UTP_REN VDDIO UTP_RPRTY GND UTP_RSOC GND UTP_TADDR[0-4] VDDIO UTP_TCLAV NC UTP_TCLK GND UTP_TD[0-15] NC VDDIO UTP_TEN UTP_TPRTY NC UTP_TSOC NC 3.3 V VDDIO 3.4.6 TDM Interface Related Pins Table 69 lists the board connections of the TDM pins when an entire specific TDM is not used. For multiplexing options that select a subset of a TDM interface, use the connections described in Table 69 for those signals that are not selected. Table 69 assumes that the alternate function of the specified pin is not used. If the alternate function is used, connect that pin as required to support the selected function. Table 63. Connectivity of TDM Related Pins When TDM Interface Is Not Used Signal Name Pin Connection TDMxRCLK GND TDMxRDAT GND TDMxRSYN GND TDMxTCLK GND TDMTxDAT GND TDMxTSYN GND VDDIO 3.3 V Notes: 1. 2. x = {0, 1, 2,3, 4, 5, 6, 7} In case of subset of TDM interface usage please make sure to disable unused TDM modules. See Chapter 20, TDM, in the MSC8144EC Reference Manual for details. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 73 Hardware Design Considerations 3.4.7 PCI Related Pins Table 70 lists the board connections of the pins when PCI is not used. Table 70 assumes that the alternate function of the specified pin is not used. If the alternate function is used, connect that pin as required to support the selected function. Table 64. Connectivity of PCI Related Pins When PCI Is Not Used Signal Name Pin Connection PCI_AD[0-31] GND PCI_CBE[0-3] GND PCI_CLK_IN GND PCI_DEVSEL VDDIO PCI_FRAME VDDIO PCI_GNT VDDIO PCI_IDS GND PCI_IRDY VDDIO PCI_PAR GND PCI_PERR VDDIO PCI_REQ NC PCI_SERR VDDIO PCI_STOP VDDIO PCI_TRDY VDDIO VDDIO 3.3 V 3.4.8 Miscellaneous Pins Table 71 lists the board connections for the pins if they are not required by the system design. Table 71 assumes that the alternate function of the specified pin is not used. If the alternate function is used, connect that pin as required to support the selected function. Table 65. Connectivity of Individual Pins When They Are Not Required Signal Name CLKOUT Pin Connection NC EE0 GND EE1 NC GPIO[0-31] GND SCL See the GPIO connectivity guidelines in this table. SDA See the GPIO connectivity guidelines in this table. INT_OUT IRQ[0-15] NMI NC See the GPIO connectivity guidelines in this table. VDDIO NMI_OUT NC RC[0-16] GND RC_LDF NC STOP_BS GND MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 74 Freescale Semiconductor Ordering Information Table 65. Connectivity of Individual Pins When They Are Not Required (continued) Signal Name Pin Connection TCK GND TDI GND TDO NC TMR[0-4] See the GPIO connectivity guidelines in this table. TMS GND TRST GND URXD See the GPIO connectivity guidelines in this table. UTXD See the GPIO connectivity guidelines in this table. 3.3 V VDDIO Note: Note: 4 When using I/O multiplexing mode 5 or 6, tie the TDM7TSYN/PCI_AD4 signal (ball number AC9) to GND. For details on configuration, see the MSC8144EC Reference Manual. For additional information, refer to the MSC8144 Design Checklist (AN3202). Ordering Information Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order. Part Package Type MSC8144EC Flip Chip Plastic Ball Grid Array (FC-PBGA) Spheres Core Voltage Operating Temperature Core Frequency (MHz) Order Number Lead-free 1.0 V 0 to 90C 800 Customer special 0 to 105C 800 Customer special -40 to 105C 800 Customer special 0 to 90C 1000 Customer special 0 to 105C 1000 Customer special -40 to 105C 1000 Customer special MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 75 Package Information 5 Package Information Notes: 1. All dimensions in millimeters. 2. Dimensioning and tolerancing per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to Datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement should exclude any effect of marking. 6. Capacitors may not be present on all devices. 7. Caution must be taken not to short exposed metal capacitor pads on package top. CASE NO. 1842-02 Figure 44. MSC8144EC Mechanical Information, 783-ball FC-PBGA Package 6 Product Documentation * * * * * MSC8144EC Technical Data Sheet (MSC8144EC). Details the signals, AC/DC characteristics, clock signal characteristics, package and pinout, and electrical design considerations of the MSC8144EC device. MSC8144EC Reference Manual (MSC8144ECRM). Includes functional descriptions of the extended cores and all the internal subsystems including configuration and programming information. Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8144EC device. SC3400 DSP Core Reference Manual. Covers the SC3400 core architecture, control registers, clock registers, program control, and instruction set. MSC8144 SC3400 DSP Core Subsystem Reference Manual. Covers core subsystem architecture, functionality, and registers. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 76 Freescale Semiconductor Revision History 7 Revision History Table 72 provides a revision history for this data sheet. Table 66. Document Revision History Revision Date 0 June 2007 * Initial public release. 1 Sep 2007 * Updated M3 voltage range in Table 3. * Changed note in Table 7 for PLL power supplies. * DDR voltage designator changed from VDD to VDDDDR in Table 8, Table 10, Section 2.7.4.1, Section 2.7.4.2, and Figure 11. Changed range on IOZ in Table 8 and Table 10. * Deleted text before Table 13 and added note 2 to input pin capacitance. * Deleted text before Table 14, added a 1 to the note, and added note 1 to input pin capacitance. * Deleted Section 2.6.5 on page 32 and renumbered subsequent subsections. * Deleted text before new Section 2.6.5.1. * Added a 1 to the note in Table 15 and added note 1 to input pin capacitance. * Deleted ac voltage rows from Table 16. Added note 1 to input pin capacitance. * Changed output high and low voltage levels in Table 17 and Table 18. * Deleted text before Table 19. * Added clock skew ranges in percent in Table 21. * Changed VREF to MVREF in Table 26. * Changed VDD to VDDIO in Table 41 Updated note 2. * Added note 4 to Table 42. Changed tTDMSHOX value. * Changed VDD to VDDGE in Figure 27 and Figure 30. * Changed the value of the data to clock out skew in Table 51. * Changed EE pin timing in Table 55. * Changed the head for the JTAG timing section, now Section 2.7.15. * Updated JTAG timing for TCK cycle time, TCK high phase, and boundary scan input data hold time in Table 56. * Added new Section 3.4 with guidelines for board layout for clock and timing signals. Renumbered subsequent sections. 2 Sep 2007 3 Oct 2007 * Changed leakage current values in Table 13, Table 14, Table 15, Table 16, Table 17, Table 18, and Table 19 from -10 and 10 a to -30 and 30 a. * Change the minimum value of tMDDVKH in Table 45 from 5 ns to 7 ns. * Updated note 1 in Table 45. * Corrected column numbering in Figure 3 and Figure 4. * Updated SPI signal names in Table 1. * Updated SPI signal names in Table 1. 4 Oct 2007 5 Dec 2007 6 Dec 2007 7 8 Mar 2008 Apr 2008 Description Changed minimum voltage level for VDDM3 to 1.213 (1.25 - 3%) in Table 3. Added POS to titles in Section 2.6.6. Added additional signals to titles in Section 2.6.8. Added high and low voltage ranges to Table 15. Added ATM and POS to headings in Section 2.7.11. Changed characteristics to generic input/output in Table 52, Figure 33, and Figure 34. * Replaced Sections 2.7.13 and 2.7.14 with new Figure 2.7.13. Renumbered subsequent sections, tables, and figures. * Added POS to all UTOPIA references in Section 3.4.5. * Changed GCR4 program value to 0x0004C130 in Note 7 in Table 51. * * * * * Changed description of Table 20 in Section 2.7.2. * Added 3 to the PLL supply voltage row in Table 2. * Changed the first sentence in Section 3.4.8 to reflect that Table 70 indicates what to do with pins if they are "not" required by the design. Changed the Pin Connection for GPIO[0-31] to GND. * Updated ordering information in Section 4. * Multiple corrections of minor punctuation errors. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 77 Revision History Table 66. Document Revision History (continued) Revision Date Description 9 Aug 2008 * Removed the comment about preliminary estimates before Table 4 and removed non-DDR rows in the table. * Table 9 and Table 11 for DDR and DDR2 SDRAM capacitance removed and subsequent tables renumbered. * Changed units for IOH and IOL to mA in Table 9. * Removed signal low and high input current from Table 12. * Added a note to Table 15 to exclude TDM and TMS. Removed reference to overshoot and undershoot and associated figure. * Changed TRST deassertion description in Section 3.1. * Changed minimum clock frequency to 33 MHz and maximum clock frequency to 133 MHz in Table 16. * Deleted old Table 17 Clock Parameters. * Changed minimum input clock frequency to 33 MHz in Table 19. * Changed the tDDKHAX minimum value in Table 23 to 1.85 ns. * Removed tREFPJ and tREFCJ from Table 24 because the specifications are not required or tested. * Removed tPCRSTCLK, tPCRSTOFF, tPCRST, and tPCRHFA from Table 36 because the specifications are not required or tested. * Removed tUAVKH and tUAVXH from Table 38 because the specifications are not required or tested. * The parameters tMDCH, tMDCR, and tMDHF were removed from Table 40 because the specifications are not required or tested. * The parameters tMTXH/tMTX, tMTXR, and tMTXF were removed from Table 41 because the specifications are not required or tested. * The parameters tMRXH/tMRX, tMRXR, and tMRXF were removed from Table 42 because the specifications are not required or tested. * The parameters tRMXH/tRMX, tRMXR, and tRMXF, were removed from Table 43 because the specifications are not required or tested. * Removed the parameters tRGT, tRGTH/tRGT (1000Base-T), tRGTH/tRGT (10Base-T), tRGTR, tRGTF, tG12, and tG125H/tG125 were removed from Table 45 and Table 46 because the specifications are not required or tested. * Changed tUEKHOX to guaranteed by design in Table 47. * Updated Figure 35 and Figure 36 SPI timing diagrams. * Removed TCK rise and fall time from Table 50. 10 Aug 2008 * Changed b8t to bit in the M3 memory description on the first page. * Changed maximum input high voltage (VIH) for SPI to 3.465 in the first row of Table 14. * Changed packet processor to QUICC Engine Subsystem in the last row of Table 18. MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 78 Freescale Semiconductor Revision History MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 10 Freescale Semiconductor 79 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. 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