2010 Microchip Technology Inc. DS21713L-page 1
24AA32A/24LC32A
Device Selection Table
Features:
• Single Supply with Operation down to 1.7V for
24AA32A devices, 2.5V for 24LC32A devices
• Low-Power CMOS Technology:
- Active current 1 mA, typical
- Standby current 1 A, typical
• 2-Wire Serial Interface, I2C™ Compatible
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 5 ms max.
• Self-Timed Erase/Write Cycle
• 32-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection > 4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention > 200 Years
• Factory Programming Available
• Packages Include 8-lead PDIP, SOIC, SOIJ,
TSSOP, X-Rotated TSSOP, MSOP, DFN, TDFN,
5-lead SOT-23 and Chip Scale
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Description:
The Microchip Technology Inc. 24AA32A/24LC32A
(24XX32A*) is a 32 Kbit Electrically Erasable PROM.
The device is organized as a single block of 4K x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1 A and 1 mA,
respectively. It has been developed for advanced, low-
power applications such as personal communications
or data acquisition. The 24XX32A also has a page write
capability for up to 32 bytes of data. Functional address
lines allow up to eight devices on the same bus, for up
to 256 Kbits address space. The 24XX32A is available
in the standard 8-pin PDIP, surface mount SOIC, SOIJ,
TSSOP, DFN, TDFN and MSOP packages. The
24XX32A is also available in the 5-lead SOT-23 and
Chip Scale packages.
Block Diagram
Package Types
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
24AA32A 1.7-5.5 400 kHz(1) I
24LC32A 2.5-5.5 400 kHz I, E
Note 1: 100 kHz for VCC <2.5V.
HV Generator
EEPROM
Array
Page Latches
YDEC
XDEC
Sense Amp.
R/W Control
I/O
Control
Logic
I/O
Memory
Control
Logic
A0
A1
WP
A2
SCL
SDA
Vcc
V
SS
A0
A1
A2
V
SS
V
CC
WP
SCL
SDA
1
2
3
4
8
7
6
5
PDIP/MSOP/SOIC/SOIJ/TSSOP DFN/TDFN
A0
A1
A2
VSS
WP
SCL
SDA
VCC
8
7
6
5
1
2
3
4
SOT-23
1
2
34
5WP
VCC
SCL
VSS
SDA
CS (Chip Scale)(1)
12
3
45
VCC
WP
SDA
SCL
VSS
(Top Down View,
Balls Not Visible)
Note 1: Available in I-temp, “AA” only.
X-Rotated TSSOP
WP
V
CC
A0
A1
1
2
3
4
8
7
6
5
SCL
SDA
V
SS
A2
(X/ST)
32K I2C™ Serial EEPROM
*24XX32A is used in this document as a generic part number for the 24AA32A/24LC32A devices.
24AA32A/24LC32A
DS21713L-page 2 2010 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
TABLE 1-1: DC CHARACTERISTICS
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V
Automotive (E): T
A = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
No. Symbol Characteristic Min. Typ. Max. Units Conditions
D1 — A0, A1, A2, WP, SCL
and SDA pins
—————
D2 VIH High-level input voltage 0.7 VCC ——V—
D3 VIL Low-level input voltage — — 0.3 VCC
0.2 VCC
V
V
VCC 2.5V
VCC < 2.5V
D4 VHYS Hysteresis of Schmitt
Trigger inputs (SDA,
SCL pins)
0.05 VCC ——VVCC 2.5V (Note 1)
D5 VOL Low-level output voltage — — 0.40 V IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, Vcc = 2.5V
D6 ILI Input leakage current ——±1AVIN = VSS or VCC
D7 ILO Output leakage current ——±1AVOUT = VSS or VCC
D8 CIN,
COUT
Pin capacitance
(all inputs/outputs)
——10pFVCC = 5.0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D9 ICC write Operating current —0.1 3mAVCC = 5.5V, SCL = 400 kHz
D10 ICC read — 0.05 400 A
D11 ICCS Standby current —
—
0.01
—
1
5
A
A
Industrial
Automotive
SDA = SCL = VCC = 5.5V
A0, A1, A2, WP = VSS
Note 1: This parameter is periodically sampled and not 100% tested.
2: Typical measurements taken at room temperature.
2010 Microchip Technology Inc. DS21713L-page 3
24AA32A/24LC32A
TABLE 1-2: AC CHARACTERISTICS
AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
No. Symbol Characteristic Min. Max. Units Conditions
1F
CLK Clock Frequency —
—
400
100
kHz 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
2THIGH Clock High Time 600
4000
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
3T
LOW Clock Low Time 1300
4700
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
4TRSDA and SCL Rise Time
(Note 1)
—
—
300
1000
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
5TFSDA and SCL Fall Time — 300 ns (Note 1)
6THD:STA Start Condition Hold Time 600
4000
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
7TSU:STA Start Condition Setup Time 600
4700
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
8T
HD:DAT Data Input Hold Time 0 — ns (Note 2)
9TSU:DAT Data Input Setup Time 100
250
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
10 TSU:STO Stop Condition Setup Time 600
4000
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
11 TSU:WP WP Setup Time 600
4000
—
—
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA32A)
12 THD:WP WP Hold Time 1300
4700
—
—
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA32A)
13 TAA Output Valid from Clock
(Note 2)
—
—
900
3500
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
14 TBUF Bus free time: Time the bus
must be free before a new
transmission can start
1300
4700
—
—
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
15 TOF Output Fall Time from VIH
Minimum to VIL Maximum
20+0.1CB
—
250
250
ns 2.5V VCC 5.5V
1.7V VCC 2.5V (24AA32A)
16 TSP Input Filter Spike Suppression
(SDA and SCL pins)
—50ns(Notes 1 and 3)
17 TWC Write Cycle Time (byte or
page)
—5ms—
18 — Endurance 1M — cycles Page mode, 25°C, VCC 5.5V
(Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained on Microchip’s web site at
www.microchip.com.
24AA32A/24LC32A
DS21713L-page 4 2010 Microchip Technology Inc.
FIGURE 1-1: BUS TIMING DATA
FIGURE 1-2: BUS TIMING START/STOP
(unprotected)
(protected)
SCL
SDA
IN
SDA
OUT
WP
5
7
6
16
3
2
89
13
D4 4
10
11 12
14
76
D4
10
Start Stop
SCL
SDA
2010 Microchip Technology Inc. DS21713L-page 5
24AA32A/24LC32A
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
2.1 A0, A1, A2 Chip Address Inputs
The A0, A1 and A2 inputs are used by the 24XX32A for
multiple device operation. The levels on these inputs
are compared with the corresponding bits in the slave
address. The chip is selected if the comparison is true.
Up to eight devices may be connected to the same bus
by using different Chip Select bit combinations. These
inputs must be connected to either VCC or VSS.
In most applications, the chip address inputs A0, A1
and A2 are hard-wired to logic ‘0’ or logic ‘1’. For
applications in which these pins are controlled by a
microcontroller or other programmable device, the chip
address pins must be driven to logic ‘0’ or logic ‘1’
before normal device operation can proceed. Address
pins are not available in the SOT-23 and chip scale
packages.
2.2 Serial Data (SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open-drain
terminal, therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 k for 100 kHz, 2 k for
400 kHz)
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
2.3 Serial Clock (SCL)
The SCL input is used to synchronize the data transfer
to and from the device.
2.4 Write-Protect (WP)
This pin must be connected to either VSS or VCC. If tied
to VSS, write operations are enabled. If tied to VCC,
write operations are inhibited but read operations are
not affected.
Name PDIP SOIC SOIJ TSSOP Rotated
TSSOP DFN(1) TDFN(1) MSOP SOT-23 CS Description
A0 1 1 1 1 3 1 1 1 — — Chip Address Input
A1 2 2 2 2 4 2 2 2 — — Chip Address Input
A2 3 3 3 3 5 3 3 3 — — Chip Address Input
VSS 4 4 4 4 6 4 4 4 2 2 Ground
SDA 5 5 5 5 7 5 5 5 3 5 Serial Address/Data I/O
SCL 6 6 6 6 8 6 6 6 1 4 Serial Clock
WP 7 7 7 7 1 7 7 7 5 3 Write-Protect Input
VCC 8 8 8 8 2 8 8 8 4 1 +1.7V to 5.5V Power Supply
Note 1: The exposed pad on the DFN/TDFN packages can be connected to VSS or left floating.
24AA32A/24LC32A
DS21713L-page 6 2010 Microchip Technology Inc.
3.0 FUNCTIONAL DESCRIPTION
The 24XX32A supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and gener-
ates the Start and Stop conditions, while the 24XX32A
works as slave. Both master and slave can operate as
transmitter or receiver, but the master device
determines which mode is activated.
4.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1 Bus Not Busy (A)
Both data and clock lines remain high.
4.2 Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3 Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4 Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically,
unlimited (although only the last thirty-two bytes will be
stored when doing a write operation). When an over-
write does occur, it will replace data in a first-in first-out
(FIFO) fashion.
4.5 Acknowledge
Each receiving device, when addressed, is obliged to
generate an Acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
The device that acknowledges, has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the Acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX32A) will leave the data
line high to enable the master to generate the Stop
condition.
FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
Note: The 24XX32A does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
SCL
SDA
(A) (B) (D) (D) (A)(C)
Start
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
2010 Microchip Technology Inc. DS21713L-page 7
24AA32A/24LC32A
5.0 DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code. For
the 24XX32A, this is set as ‘1010’ binary for read and
write operations. The next three bits of the control byte
are the Chip Select bits (A2, A1, A0). The Chip Select
bits allow the use of up to eight 24XX32A devices on
the same bus and are used to select which device is
accessed. The Chip Select bits in the control byte must
correspond to the logic levels on the corresponding A2,
A1 and A0 pins for the device to respond. These bits
are in effect the three Most Significant bits of the word
address.
For the SOT-23 and chip scale packages, the address
pins are not available. During device addressing, the
A1, A2, and A0 Chip Selects bits (Figure 5-2) should be
set to ‘0’.
The last bit of the control byte defines the operation to
be performed. When set to a ‘1’, a read operation is
selected. When set to a zero, a write operation is
selected. The next two bytes received define the
address of the first data byte (Figure 5-2). Because
only A11 to A0 are used, the upper four address bits are
“don’t care” bits. The upper address bits are transferred
first, followed by the Less Significant bits.
Following the Start condition, the 24XX32A monitors
the SDA bus checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code and
appropriate device select bits, the slave device outputs
an Acknowledge signal on the SDA line. Depending on
the state of the R/W bit, the 24XX32A will select a read
or write operation.
FIGURE 5-1: CONTROL BYTE FORMAT
5.1 Contiguous Addressing Across
Multiple Devices
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 256K
bits by adding up to eight 24XX32A devices on the
same bus. In this case, software can use A0 of the con-
trol byte as address bit A12; A1 as address bit A13; and
A2 as address bit A14. It is not possible to sequentially
read across device boundaries.
The SOT-23 and chip scale packages do not support
multiple device addressing on the same bus.
FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS
1010A2 A1 A0SACK
R/W
Control Code Chip Select
Bits
Slave Address
Acknowledge Bit
Start Bit
Read/Write Bit
1 010A
2
A
1A
0R/W x xxxA
11
A
10 A
9
A
7
A
0
A
8••••••
Control Byte Address High Byte Address Low Byte
Control
Code Chip
Select
Bits
x = “don’t care” bit
24AA32A/24LC32A
DS21713L-page 8 2010 Microchip Technology Inc.
6.0 WRITE OPERATIONS
6.1 Byte Write
Following the Start condition from the master, the
control code (4 bits), the Chip Select (3 bits), and the
R/W bit (which is a logic low) are clocked onto the bus
by the master transmitter. This indicates to the
addressed slave receiver that the address high byte
will follow once it has generated an Acknowledge bit
during the ninth clock cycle. Therefore, the next byte
transmitted by the master is the high-order byte of the
word address and will be written into the Address
Pointer of the 24XX32A. The next byte is the Least
Significant Address Byte. After receiving another
Acknowledge signal from the 24XX32A, the master
device will transmit the data word to be written into the
addressed memory location. The 24XX32A acknowl-
edges again and the master generates a Stop
condition. This initiates the internal write cycle and,
during this time, the 24XX32A will not generate
Acknowledge signals (Figure 6-1). If an attempt is
made to write to the array with the WP pin held high,
the device will acknowledge the command, but no
write cycle will occur. No data will be written and the
device will immediately accept a new command. After
a byte Write command, the internal address counter
will point to the address location following the one that
was just written.
6.2 Page Write
The write control byte, word address and the first data
byte are transmitted to the 24XX32A in the same way
as in a byte write. However, instead of generating a
Stop condition, the master transmits up to 31 additional
bytes which are temporarily stored in the on-chip page
buffer and will be written into memory once the master
has transmitted a Stop condition. Upon receipt of each
word, the five lower Address Pointer bits are internally
incremented by ‘1’. If the master should transmit more
than 32 bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 6-2). If an attempt
is made to write to the array with the WP pin held high,
the device will acknowledge the command, but no write
cycle will occur, no data will be written, and the device
will immediately accept a new command.
6.3 Write Protection
The WP pin allows the user to write-protect the entire
array (000-FFF) when the pin is tied to VCC. If tied to
VSS the write protection is disabled. The WP pin is
sampled at the Stop bit for every Write command
(Figure 4-1). Toggling the WP pin after the Stop bit will
have no effect on the execution of the write cycle.
Note: When doing a write of less than 32 bytes
the data in the rest of the page is refreshed
along with the data bytes being written.
This will force the entire page to endure a
write cycle, for this reason endurance is
specified per page.
Note: Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
2010 Microchip Technology Inc. DS21713L-page 9
24AA32A/24LC32A
FIGURE 6-1: BYTE WRITE
FIGURE 6-2: PAGE WRITE
xxx
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
Control
Byte Address
High Byte Address
Low Byte Data
S
T
O
P
A
C
K
A
C
K
A
C
K
A
C
K
x = “don’t care” bit
S1010 0
A
2A
1A
0P
x
xxx
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
Control
Byte Address
High Byte Address
Low Byte Data Byte 0
S
T
O
P
A
C
K
A
C
K
A
C
K
A
C
K
Data Byte 31
A
C
K
x = “don’t care” bit
S1010 0
A
2A
1A
0P
x
24AA32A/24LC32A
DS21713L-page 10 2010 Microchip Technology Inc.
7.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle. ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, the Start bit and control byte must
be re-sent. If the cycle is complete, the device will
return the ACK and the master can then proceed with
the next Read or Write command. See Figure 7-1 for
flow diagram of this operation.
FIGURE 7-1: ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
No
Yes
2010 Microchip Technology Inc. DS21713L-page 11
24AA32A/24LC32A
8.0 READ OPERATION
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
control byte is set to ‘1’. There are three basic types of
read operations: current address read, random read
and sequential read.
8.1 Current Address Read
The 24XX32A contains an address counter that main-
tains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous read
access was to address ‘n’ (n is any legal address), the
next current address read operation would access data
from address n + 1.
Upon receipt of the control byte with R/W bit set to ‘1’,
the 24XX32A issues an acknowledge and transmits the
8-bit data word. The master will not acknowledge the
transfer, but does generate a Stop condition and the
24XX32A discontinues transmission (Figure 8-1).
8.2 Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must
first be set. This is accomplished by sending the word
address to the 24XX32A as part of a write operation
(R/W bit set to ‘0’). Once the word address is sent, the
master generates a Start condition following the
acknowledge. This terminates the write operation, but
not before the internal Address Pointer is set. The
master issues the control byte again, but with the R/W
bit set to a ‘1’. The 24XX32A will then issue an
acknowledge and transmit the 8-bit data word. The
master will not acknowledge the transfer, but does
generate a Stop condition which causes the 24XX32A
to discontinue transmission (Figure 8-2). After a
random Read command, the internal address counter
will point to the address location following the one that
was just read.
8.3 Sequential Read
Sequential reads are initiated in the same way as a
random read, except that once the 24XX32A transmits
the first data byte, the master issues an acknowledge
as opposed to the Stop condition used in a random
read. This acknowledge directs the 24XX32A to
transmit the next sequentially addressed 8-bit word
(Figure 8-3). Following the final byte transmitted to the
master, the master will NOT generate an acknowledge,
but will generate a Stop condition. To provide sequen-
tial reads, the 24XX32A contains an internal Address
Pointer which is incremented by ‘1’ upon completion of
each operation. This Address Pointer allows the entire
memory contents to be serially read during one
operation. The internal Address Pointer will automati-
cally roll over from address FFF to address 000 if the
master acknowledges the byte received from the array
address FFF.
FIGURE 8-1: CURRENT ADDRESS READ
SP
Bus Activity
Master
SDA Line
Bus Activity
S
T
O
P
Control
Byte Data (n)
A
C
K
N
O
A
C
K
S
T
A
R
T
24AA32A/24LC32A
DS21713L-page 12 2010 Microchip Technology Inc.
FIGURE 8-2: RANDOM READ
FIGURE 8-3: SEQUENTIAL READ
xxx
Bus Activity
Master
SDA Line
Bus Activity A
C
K
N
O
A
C
K
A
C
K
A
C
K
A
C
K
S
T
O
P
S
T
A
R
T
Control
Byte Address
High Byte Address
Low Byte Control
Byte Data
Byte
S
T
A
R
T
x = “don’t care” bit
S1010AAA0
210 S1010AAA
1
210 P
x
Bus Activity
Master
SDA Line
Bus Activity
Control
Byte Data n Data n + 1 Data n + 2 Data n + x
N
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C
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C
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2010 Microchip Technology Inc. DS21713L-page 13
24AA32A/24LC32A
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
XXXXXXXX
T/XXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
8-Lead SOIC (3.90 mm) Example:
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP Example:
24LC32A
I/P 13F
0527
24LC32AI
SN 0527
13F
4LA
I527
13F
8-Lead MSOP Example:
XXXXXT
YWWNNN
4L32AI
52713F
8-Lead SOIC (5.28 mm) Example:
XXXXXXXX
T/XXXXXX
YYWWNNN
24LC32A
I/SM
052713F
XXXX
TYWW
NNN
3
e
3
e
8-Lead 2x3 DFN Example:
264
527
13
XXX
YWW
NN
3
e
24AA32A/24LC32A
DS21713L-page 14 2010 Microchip Technology Inc.
Part Number
1st Line Marking Codes
TSSOP TSSOP
X-Rotated
MSOP DFN TDFN SOT-23
I Temp. E Temp. I Temp. E Temp. I Temp. E Temp.
24AA32A 4AA 4AAX 4A32AT 261 — A61 — B6NN —
24LC32A 4LA 4LAX 4L32AT 264 265 A64 A65 M6NN N6NN
Note: T = Temperature grade (I, E).
8-Lead 2x3 TDFN
Example:
A64
527
I3
XXX
YWW
NN
5-Lead SOT-23 Example:
XXNN M6NN
5-Lead Chip Scale
XW
Example:
67
Legend: XX...X Part number or part number code
T Temperature (I, E)
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
2010 Microchip Technology Inc. DS21713L-page 15
24AA32A/24LC32A
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DS21713L-page 16 2010 Microchip Technology Inc.
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24AA32A/24LC32A
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24AA32A/24LC32A
DS21713L-page 18 2010 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc. DS21713L-page 19
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA32A/24LC32A
DS21713L-page 20 2010 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc. DS21713L-page 21
24AA32A/24LC32A
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DS21713L-page 22 2010 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc. DS21713L-page 23
24AA32A/24LC32A
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DS21713L-page 24 2010 Microchip Technology Inc.
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2010 Microchip Technology Inc. DS21713L-page 25
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA32A/24LC32A
DS21713L-page 26 2010 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc. DS21713L-page 27
24AA32A/24LC32A
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DS21713L-page 28 2010 Microchip Technology Inc.
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2010 Microchip Technology Inc. DS21713L-page 29
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA32A/24LC32A
DS21713L-page 30 2010 Microchip Technology Inc.
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2010 Microchip Technology Inc. DS21713L-page 31
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA32A/24LC32A
DS21713L-page 32 2010 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc. DS21713L-page 33
24AA32A/24LC32A
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Please contact your local Microchip representative for specific details.
24AA32A/24LC32A
DS21713L-page 34 2010 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc. DS21713L-page 35
24AA32A/24LC32A
APPENDIX A: REVISION HISTORY
Revision D
Corrections to Section 1.0, Electrical Characteristics.
Revision E
Added DFN package.
Revision F
Revised Sections 4.3, 7.2 and 7.4.
Revision G
Replaced 2x3 DFN (MC) Package
Revision H
Changed 1.8V to 1.7V; Revised Features Section;
Replaced Package Drawings; Deleted Rotated
TSSOP; Revised Product ID Section.
Revision J
Added TDFN and SOT-23 packages; Updated
Package Drawings; Moved Pin Descriptions to Section
2.0; Renumbered Sections.
Revision K (12/2009)
Added Chip Scale Package.
Revision L (03/2010)
Added X-Rotated TSSOP package; Updated Package
Drawings.
24AA32A/24LC32A
DS21713L-page 36 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS21713L-page 37
24AA32A/24LC32A
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
24AA32A/24LC32A
DS21713L-page 38 2010 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To: Technical Publications Manager
RE: Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: Literature Number:
Questions:
FAX: (______) _________ - _________
DS21713L24AA32A/24LC32A
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2010 Microchip Technology Inc. DS21713L-page 39
24AA32A/24LC32A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX
PackageTemperature
Range
Device
Device: 24AA32A: 1.7V, 32 Kbit I2C Serial EEPROM
24AA32AT: 1.7V, 32 Kbit I2C Serial EEPROM
(Tape and Reel)
24AA32AX: 1.7V, 32 Kbit I2C Serial EEPROM in
alternate pinout (ST only)
24AA32AXT 1.7V, 32 Kbit I2C Serial EEPROM in
alternate pinout (ST only)
24LC32A: 2.5V, 32 Kbit I2C Serial EEPROM
24LC32AT: 2.5V, 32 Kbit I2C Serial EEPROM
(Tape and Reel)
24LC32AX: 2.5V, 32 Kbit I2C Serial EEPROM in
alternate pinout (ST only)
24LC32AXT 2.5V, 32 Kbit I2C Serial EEPROM in
alternate pinout (ST only)
Temperature
Range:
I = -40°C to +85°C
E = -40°C to +125°C
Package: P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (3.90 mm body), 8-lead
SM = Plastic SOIJ (5.28 mm body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
MC = 2x3 DFN, 8-lead
MNY(1) = TDFN (2x3x0.75mm body), 8-lead
OT = SOT-23 (Tape and Reel only), 5-lead
CS16K(2) = Chip Scale (CS), 5-lead (I-temp, “AA” Tape
and Reel only)
Examples:
a) 24AA32A-I/P: Industrial Temperature,1.7V,
PDIP package
b) 24AA32A-I/SN: Industrial Temperature,1.7V,
SOIC package
c) 24AA32A-I/SM: Industrial Temperature.,1.7V,
SOIJ (5.28 mm) package
d) 24AA32A-I/ST: Industrial Temperature.,1.7V,
TSSOP package
e) 24LC32A-I/P: Industrial Temperature, 2.5V,
PDIP package
f) 24LC32A-E/SN: Automotive Temperature,
2.5V SOIC package
g) 24LC32A-E/SM: Automotive Temperature,
2.5V SOIJ (5.28 mm) package
h) 24LC32AT-I/ST: Industrial Temperature, 2.5V,
TSSOP package, Tape and Reel
Note 1: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
2: “16K” indicates 160K technology.
24AA32A/24LC32A
DS21713L-page 40 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS21713L-page 41
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-053-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21713L-page 42 2010 Microchip Technology Inc.
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01/05/10
