SOD-123 Plastic Applications ee BAT46W SMD Schottky Diode Higher Voltage and lower Leakage. Low forward drop. More ESD protection. Efficient portable systems battery isolator. Able to directly replace SMA, SOD-80 or MELF packages on boards without redesign. Features e Small size ne ie \ L. ay tee apn SOD 123 PACKAGE OUTLINE (all dimensions in millimeters) 0.15 Bond Pad package footprint e High quality . e Thermally matched system mee $ e High surge capability a AAR |F e Guaranteed solderability oe e Also available in MELF & leaded iments aim glass packages. = omarcra PC bor enper oc Absolute Maximum Ratings Symbol Value Unit Peak Inverse Voltage @ 100 pA (pulsed)300"US @ 2% PIV 100 (Min.) Volts Power Dissipation at T, = 80C Pict 150) mw Average Forward Rectified Current at T, = 25 C lay 450 mAmps Ambient Operating & StorageTemperature Range Topast -55 to 125 C Junction Temperature T, 125 C Repetitive peak forward current (t,,..= 1sec),T,= 25 C lem 350 mAmps Single cycle Surge Current (t,= 10 msecs.),T,= 25 C lise 750 mAmps Electrical Characteristics @ 25C Symbol Max.@ am. Max.@ 60C Unit Forward Voltage Drop @ |, = 0.1 mA Vv," 0.25 Volt Forward Voltage Drop @ |, = 10 mA Vv, 0.45 Volt a Forward Voltage Drop @ I, = 250 mA V," 1.0 Volt a Reverse Leakage Current @ V, = 1.5 V I, 0.5 5.0 yA on Reverse Leakage Current @ V, = 10 V I 0.8 7.5 yA = Reverse Leakage Current @ V, = 50 V I, 2.0 15 UA / Reverse Leakage Current @ V, = 75 V aD 5.0 20 yA = Capacitance @V,=1V, f= 1mHz Cost 6.0 (typ.) pF Capacitance @ V,=0V, f= 1mHz Cat 10 (typ.) pF 1): Diode on Ceramic Substrate 0.7 mm, 2.3 cm? area. ~ Available in a DO-35 leaded glass package (BAT46) we Hd BKC Semiconductors and Mini-MELF surface mount (LL46). oe A Incorporated USA O18 41 Telephone (508) 681-0392 FAX (508) 681-9135