© 2000,2001
BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
µµ
µ
PC2918,2925,2926
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR
DATA SHEET
Document No. G14983EJ3V0DS00 (3rd edition)
Date Published May 2001 NS CP(K)
Printed in Japan
The mark ★ shows major revised points.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
DESCRIPTION
The
µ
PC2918, 2925 and 2926 are three-terminal low dropout voltage regulators with the 1-A output. The
µ
PC2918
outputs 1.8 V, the
µ
PC2925 outputs 2.5 V and the
µ
PC2926 outputs 2.6 V. Since these regulators use a PNP
transistor for the output stage, they achieve a low dropout voltage of 0.7 V TYP. at IO = 1 A and minimize the power
dissipation of the IC. As a result, these regulators can be used to realize sets with lower voltage and power
dissipation.
FEATURES
• Output current capacity: 1 A
• Low dropout voltage (VDIF = 0.5 V MAX. (at IO = 0.5 A))
• Output voltage accuracy: ±2%
• On-chip saturation protector rising edge of input voltage
(at low input voltage)
• On-chip overcurrent limiter and thermal protection
• On-chip output transistor safe operation area protection
BLOCK DIAGRAM
Startup circuit
GND
OUTPUT
INPUT
Safe operation
area protection
Error
Amp.
Reference voltage
circuit
Thermal shut down
Drive circuit
Saturation protection
Overcurrent
protection
PIN CONFIGURATION (Marking Side)
1
1: INPUT
2: GND
3: OUTPUT
4: GND (Fin)
23
4
★
Data Sheet G14983EJ3V0DS
2
µ
µµ
µ
PC2918, 2925, 2926
ORDERING INFORMATION
Part Number Package Marking Packing Type
µ
PC29xxT MP-3Z (SC-63) 29xx • Bag stuffing
µ
PC29xxT-E1 MP-3Z (SC-63) 29xx • Embossed-type taping (16mm tape)
• Pin 1 on drawout side
• 2000 pcs/reel
µ
PC29xxT-E2 MP-3Z (SC-63) 29xx • Embossed-type taping (16mm tape)
• Pin 1 at takeup side
• 2000 pcs/reel
µ
PC29xxT-T1 MP-3Z (SC-63) 29xx • Adhesive-type taping (32mm tape)
• Pin 1 on drawout side
• 1500 pcs/reel
µ
PC29xxT-T2 MP-3Z (SC-63) 29xx • Adhesive-type taping (32mm tape)
• Pin 1 at takeup side
• 1500 pcs/reel
µ
PC29xxHB MP-3 (SC-64) 29xx • Bag stuffing
”xx” mark of the part number and marking columns expresses output voltage.
Example
Output Voltage Part Number Marking
1.8V
µ
PC2918T 2918
2.5V
µ
PC2925T 2925
2.6V
µ
PC2926T 2926
★
Data Sheet G14983EJ3V0DS 3
µ
µµ
µ
PC2918, 2925, 2926
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter Symbol Rating Unit
Input Voltage VIN –0.3 to +20 V
Internal Power Dissipation (TC = 25°C) PT10Note W
Operating Ambient Temperature TA–30 to +85 °C
Operating Junction Temperature TJ–30 to +150 °C
Storage Temperature Tstg –55 to +150 °C
Thermal Resistance (junction to case) Rth(J-C) 12.5 °C/W
Thermal Resistance (junction to ambient) Rth(J-A) 125 °C/W
Note Internally limited. When the operating junction temperature rises over 150°C, the internal circuit shuts down the
output voltage.
Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the
quality of the product may be degraded. In other words, absolute maximum ratings specify the
values exceeding which the product may be physically damaged. Be sure to use the product with
these ratings never exceeded.
TYPICAL CONNECTION
+
D
2
D
1
C
IN
C
OUT
INPUT OUTPUT
PC2918, 2925, 2926
µ
CIN: 0.1
µ
F or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure
to connect CIN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and
temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure
that CIN is 0.1
µ
F or higher for the voltage and temperature range to be used.
COUT: 10
µ
F or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place
CIN and COUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low
impedance characteristics if considering use at sub-zero temperatures.
D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode.
D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode.
Caution Make sure that no voltage is applied to the OUTPUT pin from external.
★
Data Sheet G14983EJ3V0DS
4
µ
µµ
µ
PC2918, 2925, 2926
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Type Number MIN. TYP. MAX. Unit
µ
PC2918 2.8 16 V
µ
PC2925 3.5 16 V
Input Voltage VIN
µ
PC2926 3.6 16 V
Output Current IOAll 0 1 A
Operating Ambient Temperature TAAll −30 +85 °C
Operating Junction Temperature TJAll −30 +125 °C
Caution Use of conditions other than the above-listed recommended operating conditions is not a problem
as long as the absolute maximum ratings are not exceeded. However, since the use of such
conditions diminishes the margin of safety, careful evaluation is required before such conditions
are used. Moreover, using the MAX. value for all the recommended operating conditions is not
guaranteed to be safe.
ELECTRICAL CHARACTERISTICS
µ
µµ
µ
PC2918 (TJ = 25°
°°
°C, VIN = 2.8 V, IO = 0.5 A, CIN = 0.1
µ
µµ
µ
F, COUT = 10
µ
µµ
µ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
1.764 1.8 1.836 VOutput Voltage VO
2.8 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A,
0°C ≤ TJ ≤ 125°C
(1.71) (1.854) V
Line Regulation REGIN 2.8 V ≤ VIN ≤ 16 V 6 25 mV
Load Regulation REGL0 A ≤ IO ≤ 1 A 7 30 mV
IO = 0 A 2 4 mAQuiescent Current IBIAS
IO = 1 A 20 60 mA
VIN = 2.4 V, IO = 0 A 10 30 mAStartup Quiescent Current IBIAS (s)
VIN = 2.4 V, IO = 1 A 80 mA
Quiescent Current Change
∆
IBIAS 2.8 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C2.920mA
Output Noise Voltage Vn10 Hz ≤ f ≤ 100 kHz 40
µ
Vr.m.s.
Ripple Rejection R•R f = 120 Hz, 2.8 V ≤ VIN ≤ 9 V 45 60 dB
IO = 0.5 A 0.25 0.5 VDropout Voltage VDIF
IO = 1 A, 0°C ≤ TJ ≤ 125°C0.7V
VIN = 2.8 V 1.2 1.7 3.0 AShort Circuit Current IOshort
VIN = 16 V 1.2 A
VIN = 2.8 V 1.0 1.5 3.0 APeak Output Current IOpeak
VIN = 16 V 1.1 A
Temperature Coefficient of
Output Voltage
∆
VO /
∆
TI
O = 5 mA, 0°C ≤ TJ ≤ 125°C−0.4 mV/°C
Remark Values in parentheses have been measured during product design and are provided as reference values.
★
Data Sheet G14983EJ3V0DS 5
µ
µµ
µ
PC2918, 2925, 2926
µ
µµ
µ
PC2925 (TJ = 25°
°°
°C, VIN = 3.5 V, IO = 0.5 A, CIN = 0.1
µ
µµ
µ
F, COUT = 10
µ
µµ
µ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
2.45 2.5 2.55 VOutput Voltage VO
3.5 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A,
0°C ≤ TJ ≤ 125°C
(2.375) (2.575) V
Line Regulation REGIN 3.5 V ≤ VIN ≤ 16 V 6 25 mV
Load Regulation REGL0 A ≤ IO ≤ 1 A 7 30 mV
IO = 0 A 2 4 mAQuiescent Current IBIAS
IO = 1 A 20 60 mA
VIN = 2.4 V, IO = 0 A 10 30 mAStartup Quiescent Current IBIAS (s)
VIN = 3.0 V, IO = 1 A 80 mA
Quiescent Current Change
∆
IBIAS 3.5 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C2.920mA
Output Noise Voltage Vn10 Hz ≤ f ≤ 100 kHz 40
µ
Vr.m.s.
Ripple Rejection R•R f = 120 Hz, 3.5 V ≤ VIN ≤ 9 V 45 60 dB
IO = 0.5 A 0.25 0.5 VDropout Voltage VDIF
IO = 1 A, 0°C ≤ TJ ≤ 125°C0.7V
VIN = 3.5 V 1.2 1.7 3.0 AShort Circuit Current IOshort
VIN = 16 V 1.2 A
VIN = 3.5 V 1.0 1.5 3.0 APeak Output Current IOpeak
VIN = 16 V 1.1 A
Temperature Coefficient of
Output Voltage
∆
VO /
∆
TI
O = 5 mA, 0°C ≤ TJ ≤ 125°C−0.5 mV/°C
Remark Values in parentheses have been measured during product design and are provided as reference values.
µ
µµ
µ
PC2926 (TJ = 25°
°°
°C, VIN = 3.6 V, IO = 0.5 A, CIN = 0.1
µ
µµ
µ
F, COUT = 10
µ
µµ
µ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
2.548 2.6 2.652 VOutput Voltage VO
3.6 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A,
0°C ≤ TJ ≤ 125°C
(2.470) (2.678) V
Line Regulation REGIN 3.6 V ≤ VIN ≤ 16 V 6 25 mV
Load Regulation REGL0 A ≤ IO ≤ 1 A 7 30 mV
IO = 0 A 2 4 mAQuiescent Current IBIAS
IO = 1 A 20 60 mA
VIN = 2.4 V, IO = 0 A 10 30 mAStartup Quiescent Current IBIAS (s)
VIN = 3.0 V, IO = 1 A 80 mA
Quiescent Current Change
∆
IBIAS 3.6 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C2.920mA
Output Noise Voltage Vn10 Hz ≤ f ≤ 100 kHz 40
µ
Vr.m.s.
Ripple Rejection R•R f = 120 Hz, 3.6 V ≤ VIN ≤ 9 V 45 60 dB
IO = 0.5 A 0.25 0.5 VDropout Voltage VDIF
IO = 1 A, 0°C ≤ TJ ≤ 125°C0.7V
VIN = 3.6 V 1.2 1.7 3.0 AShort Circuit Current IOshort
VIN = 16 V 1.2 A
VIN = 3. 6 V 1.0 1.5 3.0 APeak Output Current IOpeak
VIN = 16 V 1.1 A
Temperature Coefficient of
Output Voltage
∆
VO /
∆
TI
O = 5 mA, 0°C ≤ TJ ≤ 125°C−0.5 mV/°C
Remark Values in parentheses have been measured during product design and are provided as reference values.
★
Data Sheet G14983EJ3V0DS
6
µ
µµ
µ
PC2918, 2925, 2926
TYPICAL CHARACTERISTICS (Reference Values)
12
10
8
6
4
2
0
0 50 100 150
1.0
PD - Total Power Dissipation - W
With infinite heatsink
Without heatsink
TA - Operating Ambient Temperature - °C
PD vs. TA
50
25
0
–25
–50
0 100 150
I
O
= 5 mA
–50 50
µPC2925
µPC2918
∆V
O
vs. T
J
∆V
O
- Output Voltage Deviation - mV
T
J
- Operating Junction Temperature - °C
2.0
1.5
1.0
0.5
0
I
O
= 5 mA
0 1 2 3 4 5 6 7 8
I
O
= 0.5 A
I
O
= 1 A
T
J
= 25˚C
V
O
vs. V
IN
(µPC2918)
V
O
- Output Voltage - V
V
IN
- Input Voltage - V
50
40
30
20
10
00 5 10 15 20
I
O
= 0 A
I
O
= 1 A
I
O
= 0.5 A
T
J
= 25˚C
I
BIAS
(I
BIAS(s)
) vs. V
IN
(µPC2918)
I
BIAS
- Quiescent Current - mA
V
IN
- Input Voltage - V
3.0
2.0
1.0
0
I
O
= 5 mA
0 1 2 3 4 5 6 7 8
I
O
= 0.5 A
I
O
= 1 A
V
O
vs. V
IN
(µPC2925)
T
J
= 25˚C
V
O
- Output Voltage - V
V
IN
- Input Voltage - V
50
40
30
20
10
00 5 10 15 20
IO = 0 A
IO = 1 A
IO = 0.5 A
T
J
= 25˚C
I
BIAS
(I
BIAS(s)
) vs. V
IN
(µPC2925)
I
BIAS
- Quiescent Current - mA
V
IN
- Input Voltage - V
Data Sheet G14983EJ3V0DS 7
µ
µµ
µ
PC2918, 2925, 2926
1
0.8
0.6
0.4
0.2
0
–25 1250 15075 1005025
I
O
= 1 A
V
DIF
vs. T
J
V
DIF
- Dropout Voltage - V
T
J
- Operating Junction Temperature - °C
2.5
2
1.5
1
0.5
0
T
J
= 0˚C
T
J
= 125˚C
T
J
= 25˚C
05101520
I
Opeak
vs. V
DIF
(µPC2918)
IOpeak - Peak Output Current - A
VDIF - Dropout Voltage - V
2.5
2
1.5
1
0.5
0
T
J
= 0˚C
T
J
= 125˚C
T
J
= 25˚C
05101520
IOpeak vs. VDIF (µPC2925)
VDIF - Dropout Voltage - V
IOpeak - Peak Output Current - A
70
60
50
40
30
20
10
0100 1000 10000 100000
10
T
J
= 25˚
C
I
O
= 1 A
µPC2918
µPC2925
R R vs. f
.
R R - Ripple Rejection - dB
.
f - Frequency - Hz
80
70
30 0.2 0.4 0.6 1
0.80
60
50
40
µPC2918
µPC2925
R R - Ripple Rejection - dB
I
O
- Output Current - A
.
R R vs. I
O
.
T
J
= 25˚C, f = 120 Hz
2.8 V < V
IN
< 9 V (µPC2918)
3.5 V < V
IN
< 9 V (µPC2925)
1
00.2 0.4 0.6 1
0.8
0.6
0.4
0.2
00.8
T
J
= 25˚C
V
DIF
vs. I
O
V
DIF
- Dropout Voltage - V
I
O
- Output Current - A
Data Sheet G14983EJ3V0DS
8
µ
µµ
µ
PC2918, 2925, 2926
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
00.5 1 1.5 2 2.5
T
J
= 25˚C
0
V
IN
= 5 V
V
IN
= 16 V
V
IN
= 2.8 V
V
O
vs. I
O
(
µ
PC2918)
V
O
- Output Voltage - V
I
O
- Output Current - A
3
2.5
2
1.5
1
0.5
00.5 1 1.5 2 2.5
T
J
= 25˚C
0
V
IN
= 16 V
V
IN
= 3.5 V
V
IN
= 5 V
V
O
vs. I
O
(
µ
PC2925)
VO - Output Voltage - V
IO - Output Current - A
★★
Data Sheet G14983EJ3V0DS 9
µ
µµ
µ
PC2918, 2925, 2926
PACKAGE DRAWINGS
2.3 2.3
1.1±0.2 0.9 MAX. 0.8 MAX.
5.5±0.2
2.0 MIN.
10.0 MAX.
5.0±0.2
4.3 MAX.0.8
6.5±0.2
2.3
±
0.2
0.5
±
0.1
1.0 MIN.
1.5 TYP.
0.5
1.5
+0.2
–0.1
123
4
0.8
MP-3Z (SC-63) (Unit: mm)
'
213
4
7.0 MIN.
13.7 MIN.
2.32.3
0.75
0.5±0.1
2.3±0.2
1.6±0.2
5.0±0.2
6.5±0.2
5.5±0.2
1.1±0.1
MP-3 (SC-64) (Unit: mm)
1.5
+0.2
−0.1
0.5
+0.2
−0.1
0.5
+0.2
−0.1
★
Data Sheet G14983EJ3V0DS
10
µ
µµ
µ
PC2918, 2925, 2926
RECOMMENDED SOLDERING CONDITIONS
The
µ
PC2918, 2925 and 2926 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact our sales representative.
Type of Surface Mount Device
µ
µµ
µ
PC2918T,
µ
µµ
µ
PC2925T,
µ
µµ
µ
PC2926T: MP-3Z(SC-63)
Process Conditions Symbol
Infrared Ray Reflow Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times or less.
IR35-00-3
Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times or less.
VP15-00-3
Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
WS60-00-1
Partial Heating Method Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µ
µµ
µ
PC2918HB,
µ
µµ
µ
PC2925HB,
µ
µµ
µ
PC2926HB: MP-3(SC-64)
Process Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less
Partial Heating Method Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
★
Data Sheet G14983EJ3V0DS 11
µ
µµ
µ
PC2918, 2925, 2926
NOTES ON USE
When the
µ
µµ
µ
PC2918, 2925, and 2926 are used with an input voltage that is lower than the value indicated in
the recommended operating conditions, a large quiescent current flows through the device due to saturation
of the transistor of the output stage. (Refer to the IBIAS (IBIAS(S)) vs. VIN curves in TYPICAL CHARACTERISTICS).
These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device.
Thus the power supply on the input side must have sufficient capacity to allow this quiescent current to pass
when the device starts up.
REFERENCE DOCUMENTS
Document Name Document No.
Usage of Three-Terminal Regulators User’s Manual G12702E
Voltage Regulator of SMD Information G11872E
Semiconductor Device Mounting Technology Manual Information C10535E
SEMICONDUCTOR SELECTION GUIDE - Products and Packages- X13769X
µ
µµ
µ
PC2918, 2925, 2926
M8E 00. 4
The information in this document is current as of May, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
