113
Detector Slide Push Rotary Power
Dual-in-line
Package Type
300
200
100
A max.
B
D
C
E
Time (s)
F max.
Pre-heating
Room
temperature
Temperature (C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the
PC board’s temperature greatly differs from that of the switch, depending on the PC board’s material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly
recommended.
Notes
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2.
Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K)or CC (T)at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
Slide Switches Soldering Conditions
SSSS8
SSSS7
SSAC
Soldering temperature Duration of immersionPreheating temperature
Preheating time
SSAH, SSAG, SSAJ, SSAL
SSSS9
SSSS2
SSSF, SSSU
Series
Series
3 +1/ 0 s
4s max.
3s max.
3s max.
3s max.
3s max.
2s max.
Items
Soldering time
Dip soldering
SSSS9
SSSS2
12 0 ℃ ma x .
10 0 ℃ m a x .
10 0 ℃ m a x .
10 0 ℃ m a x .
60s max.
60s max.
60s max.
60s max.
260±5℃
260±5℃
5+0/-1s (2 times)
3 ±1 s
SSSF, SSSU 260±5℃ 10 ±1s / 5 ±1 s
SSAC 260±5℃ 5 ±1 s
Reference for Hand Soldering
Reference for Dip Soldering
(For PC board terminal types)
330±5℃
320±5℃
3 0 0 ±10 ℃
3 5 0 ±10 ℃
3 5 0 ±10 ℃
3 5 0 ±10 ℃
350±5℃
Soldering temperature
SSSS2
Vertical 1-pole, 3-position
Vertical 1-pole, 2-position
Horizontal
1-pole, 2-position
1-pole, 3-position
2-pole, 3-position
SSSS7
SSAH, SSAG, SSAJ, SSAL, SSSS8 260
15 0
Series(Reflow type)
260
250
230 40 18 0 12 0
A(℃)
3s max. B(℃) C(s) D(℃) E(℃) F(s)
Small size
General Use type
Big size
General Use type