BAR66... Silicon PIN Diode Array * Surge protection device * Designed for surge overvoltage clamping in antiparallel connection * Pb-free (RoHS compliant) package BAR66 ! , , Type BAR66 Package SOT23 Configuration series LS(nH) 1.8 Marking PMs Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 150 V Forward current IF 200 mA Total power dissipation Ptot 250 mW ESD contact discharge1) VESD 25 kV Peak pulse current (tp = 8 / 20 s)2) Ipp 12 A Junction temperature Tj 150 C Operating temperature range Top -55 ... 125 Storage temperature Tstg -55 ... 150 Ts 25 C Thermal Resistance Parameter Symbol Value Unit Junction - soldering point3) , BAR 66 RthJS 290 K/W 1V ESD according to IEC61000-4-2, only valid if pin 1 and pin 2 are connected pp according to IEC61000-4-5, only valid if pin 1 and pin 2 are connected 2I 3For calculation of RthJA please refer to Application Note Thermal Resistance 1 2011-06-27 BAR66... Electrical Characteristics at TA = 25C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. 150 - - V IR - - 20 nA VF - 0.95 1.2 V VESD = 15 kV (contact)1) - tbd - IPP = 12 A, tp = 8/20 s2) - 7 - DC Characteristics Breakdown voltage V(BR) I(BR) = 5 A Reverse current VR = 100 V Forward voltage IF = 50 mA Clamping voltage VCL AC Characteristics Diode capacitance pF CT VR = 35 V, f = 1 MHz - 0.4 0.6 VR = 0 V, f = 100 MHz - 0.35 0.9 gP - 220 - S rf - 1.5 1.8 rr - 0.7 - s Zero bias conductance VR = 0 V, f = 1 GHz Forward resistance IF = 5 mA, f = 100 MHz Charge carrier life time IF = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 1V ESD according to IEC61000-4-2, only valid if pin 1 and pin 2 are connected pp according to IEC61000-4-5, only valid if pin 1 and pin 2 are connected 2I 2 2011-06-27 BAR66... Diode capacitance CT = (VR) Forward resistance rf = (IF) f = Parameter f = 100MHz 10 3 0.8 Ohm pF 10 2 0.5 rf CT 0.6 0.3 10 1 1MHz 0.4 100MHz 10 0 0.2 0.1 0 0 5 10 15 20 25 V 10 -1 -2 10 35 10 -1 10 0 10 VR 1 mA 10 2 IF Forward current IF = (VF) Forward current IF = (TS ) TA = Parameter BAR66 10 0 A 220 mA 10 -1 180 160 IF IF 10 -2 140 120 10 -3 100 -40 C 25 C 85 C 125 C 10 -4 80 60 10 -5 40 20 10 -6 0 0.2 0.4 0.6 0.8 V 0 0 1.2 VF 20 40 60 80 100 120 C 150 TS 3 2011-06-27 BAR66... Permissible Puls Load RthJS = (t p) Permissible Pulse Load BAR66 IFmax/ IFDC = (t p) BAR66 10 3 10 2 IFmax/IFDC K/W RthJS 10 2 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -6 10 - 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 tP 10 -5 10 -4 10 -3 10 -2 s 10 0 tP 4 2011-06-27 Package SOT23 BAR66... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 0.1 1 2.4 0.15 3 0.1 MAX. 10 MAX. B 1 0.1 10 MAX. 2.9 0.1 0.15 MIN. Package Outline A 5 0...8 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 5 2011-06-27 BAR66... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2011-06-27