DATASHEET Board Level Cooling - Extruded 5330 BOARD LEVEL COOLING - Extruded 5330 Extruded 5330 is a series of dual radial board level heat sinks designed to cool TO220 and TO220single gauge devices. Representative image only. ORDERING INFORMATION Part Number Device Type 533002B02551G 533101B02551G 533102B02551G TO220, TO220single gauge (0.020") TO220, TO220single gauge (0.020") TO220, TO220single gauge (0.020") HEAT SINK DETAILS Property Details Property Details Material Finishing Device Attachment Options Thermal Interface Material Aluminum Black Anodize Kool Clip 51 N/A Heat Sink Width (mm) Heat Sink Height (mm) Heat Sink Length (mm) Heat Sink Mounting Direction 34.92 See "A" Dim below 12.70 Vertical MECHANICAL & PERFORMANCE Drawing dimensions are shown in mm, (in) Part Number "A" Dim "B" Dim "C" Dim "X" Dim "Y" Dim "Z" Dim 533002B02551G 533101B02551G 533102B02551G 25.40 38.10 38.10 18.29 21.59 18.29 15.88 17.20 15.88 12.70 (0.500) 12.70 (0.500) 12.70 (0.500) 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) 2.67 (0.105) 2.67 (0.105) 2.67 (0.105) USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com DATASHEET Board Level Cooling - Extruded 5330 Mounting Details: USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com