© 2017 Kingbright. All Rights Reserved. Spec No: DSAN0653 / 1301000248 Rev No: V.2A Date: 09/22/2017 Page 4 / 5
RECOMMENDED WAVE SOLDERING PROFILE Soldering General Notes
1. Through-hole displays are incompatible with reflow soldering.
2. If components will undergo multiple soldering processes,
or other processes where the components may be subjected
to intense heat, please check with Kingbright for compatibility.
CLEANING
1. Mild "no-clean" fluxes are recommended for use in soldering.
2. If cleaning is required, Kingbright recommends to wash
components with water only. Do not use harsh organic
solvents for cleaning because they may damage the plastic
parts .
3. The cleaning process should take place at room temperature
and the devices should not be washed for more than one
minute.
4. When water is used in the cleaning process, Immediately
remove excess moisture from the component with forced-air
drying afterwards.
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°Cfor 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
7. During wave soldering, the PCB top-surface temperature should be kept below 105°C.
PACKING & LABEL SPECIFICATIONS
THROUGH HOLE DISPLAY MOUNTING METHOD
Lead Forming
1. Do not bend the component leads by hand without
proper tools. The leads should be bent by clinching the
upper part of the lead firmly such that the bending force
is not exerted on the plastic body.
Installation
1. The installation process should not apply stress to the lead terminals.
2. When inserting for assembly, ensure the terminal pitch matches the substrate board's hole pitch to prevent spreading or pinching
the lead terminals. (Fig.1)
3. The component shall be placed at least 5mm from edge of PCB to avoid damage caused excessive heat during
wave soldering.(Fig.2)
SA23-12SRWA