© Semiconductor Components Industries, LLC, 2005
October, 2005 − Rev. 16 1Publication Order Number:
MC34064/D
MC34064, MC33064,
NCV33064
Undervoltage Sensing
Circuit
The MC34064 is an undervoltage sensing circuit specifically
designed for use as a reset controller in microprocessor−based
systems. It offers the designer an economical solution for low voltage
detection with a single external resistor. The MC34064 features a
trimmed−in−package bandgap reference, and a comparator with
precise thresholds and built-in hysteresis to prevent erratic reset
operation. The open collector reset output is capable of sinking in
excess of 1 0 mA, and operation is guaranteed down to 1.0 V input with
low standby current. The MC devices are packaged in 3−pin TO-92,
micro size TSOP−5, 8−pin SOIC−8 and Micro8t surface mount
packages. The NCV device is packaged in SOIC−8 and TO−92.
Applications include direct monitoring of the 5.0 V MPU/logic
power supply used in appliance, automotive, consumer and industrial
equipment.
Features
•T rimmed−In−Package Temperature Compensated Reference
•Comparator Threshold of 4.6 V at 25°C
•Precise Comparator Thresholds Guaranteed Over Temperature
•Comparator Hysteresis Prevents Erratic Reset
•Reset Output Capable of Sinking in Excess of 10 mA
•Internal Clamp Diode for Discharging Delay Capacitor
•Guaranteed Reset Operation with 1.0 V Input
•Low Standby Current
•Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount
Packages
•Pb−Free Packages are Available
•NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
1.2 Vref
Reset
GND
Input
=Sink Only
Positive True Logic
This device contains 21 active transistors.
Figure 1. Representative Block Diagram
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123
Pin 1. Reset
2. Input
3. Ground
TO−92
P SUFFIX
CASE 29
8
1
(Top View)
3
1N.C.
Ground
N.C.
N.C.
2
4
8
7
6
5N.C.
N.C.
Input
Reset
8
1
PIN CONNECTIONS
ORDERING INFORMATION
SOIC−8
D SUFFIX
CASE 751
Micro8
DM SUFFIX
CASE 846A
TSOP−5
SN SUFFIX
CASE 483
1
5
Pin 1. Ground
2. Input
3. Reset
4. NC
5. NC
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
See general marking information in the device marking
section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
MC34064, MC33064, NCV33064
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Input Supply Voltage Vin −1.0 to 10 V
Reset Output Voltage VO10 V
Reset Output Sink Current (Note 2) ISink Internally
Limited mA
Clamp Diode Forward Current, Reset to Input Pin (Note 2) IF100 mA
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
PD
RqJA
PD
RqJA
PD
RqJA
625
200
625
200
520
240
mW
°C/W
mW
°C/W
mW
°C/W
Operating Junction Temperature TJ+150 °C
Operating Ambient Temperature
MC34064
MC33064
NCV33064
TA0 to +70
−40 to +85
−40 to +125
°C
Storage Temperature Range Tstg −65 to +150 °C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. ESD data available upon request.
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating am bient temperature range
that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics Symbol Min Typ Max Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis
VIH
VIL
VH
4.5
4.5
0.01
4.61
4.59
0.02
4.7
4.7
0.05
V
RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, ISink = 8.0 mA)
(Vin = 4.0 V, ISink = 2.0 mA)
(Vin = 1.0 V, ISink = 0.1 mA)
VOL −
−
−
0.46
0.15
−
1.0
0.4
0.1
V
Output Sink Current (Vin, Reset = 4.0 V) ISink 10 27 60 mA
Output Off-State Leakage (Vin, Reset = 5.0 V) IOH − 0.02 0.5 mA
Clamp Diode Forward Voltage, Reset to Input Pin (IF = 10 mA) VF0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 6.5 − − V
Quiescent Input Current (Vin = 5.0 V) Iin − 390 500 mA
2. Maximum package power dissipation limits must be observed.
3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
4. Tlow =0°C for MC34064 Thigh = +70°C for MC34064
−40°C for MC33064 +85°C for MC33064
−40°C for NCV33064 +125°C for NCV33064
5. NCV prefix is for automotive and other applications requiring site and change control.
MC34064, MC33064, NCV33064
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3
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
Figure 2. Reset Output Voltage versus
Input Voltage Figure 3. Reset Output Voltage versus
Input Voltage
Figure 4. Comparator Threshold Voltage
versus Temperature Figure 5. Input Current versus Input Voltage
Figure 6. Reset Output Saturation versus
Sink Current Figure 7. Reset Delay Time
Vin, INPUT VOLTAGE (V)
10
8.0
6.0
4.0
2.0
00 2.0 4.0 6.0 8.0 10
RL = 10 k to Vin
TA = 25°C
Vin, INPUT VOLTAGE (V)
5.0
4.0
3.0
2.0
1.0
04.560 4.580 4.600 4.620 4.640
RL = 10 k to Vin
TA = 25°C
TA, AMBIENT TEMPERATURE (°C)
th, THRESHOLD VOLTAGE (V)
4.630
4.620
4.610
4.600
4.590
4.580
4.570−55 −25 0 25 50 75 100 125
V
RL = 10 k to Vin
Upper Threshold
High State Output
Lower Threshold
Low State Output
Vin, INPUT VOLTAGE (V)
in, INPUT CURRENT (mA)
1.0
0.8
0.6
0.4
0.2
00 2.0 4.0 6.0 8.0 10
I
TA = +25°C
−40°C
TA = +25°C
+85°C−40°C
VOL
, OUTPUT SATURATION (V)
ISink, SINK CURRENT (mA)
2.0
1.5
1.0
0.5
00102030 40
Vin = 4.0 V
TA = 85°C
TA = 25°C
TA = −40°C
90%
5.0 V −
4.0 V −
10%
+85°C
Reset
Vin
5.0V
4.0V
REF
10k
200 ns/DIV
Reset
Vin
Vin = 5.0 V to 4.0 V
RL = 10 k
TA = 25°C
MC34064, MC33064, NCV33064
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4
Figure 8. Clamp Diode Forward Current versus Voltage
Figure 9. Low Voltage Microprocessor Reset
Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis
80
60
40
20
00 0.4 0.8 1.2 1.6
VF , FORWARD VOLTAGE (V)
, FORWARD CURRENT (mA)
F
I
Vin = 0 V
TA = 25°C
A time delayed reset can be accomplished with the
addition of CDLY
. For systems with extremely fast
power supply rise times (<500 ns) it is recommended
that the RCDLY time constant be greater than 5.0 ms.
Vth(MPU) is the microprocessor reset input threshold.
tDLY = RCDLY In
1
1 − Vth(MPU)
Power
Supply
+
−
Input R
Reset
CDLY
Microprocessor
Circuit
1.2 Vref
GND
−
+
Power
Supply
+
−
Input RL
Reset
Microprocessor
Circuit
1.2Vref
GND
−
+
VH ≈4.6 RH+ 0.02
DVth(lower) ≈ 340 RH x 10−6
Where:RH ≤ 150 W
Where:RL ≥ 1.5 W, ≤ 10 kW
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been
simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold
(Figure 4). An increase of the lower threshold DVth(lower) will be observed due to Iin which is typically 340 mA at
4.59V. The equations are accurate to ±10% with RH less than 150 W and RL between 1.5 kW and 10 kW.
Iin
RH
Vin
RL
TEST DATA
VH
(mV)
DVth
(mV) RH
(W)RL
(kW)
20
51
40
81
71
112
100
164
190
327
276
480
0
3.4
6.8
6.8
10
10
16
16
34
34
51
51
0
10
20
20
30
30
47
47
100
100
150
150
0
1.5
4.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
Figure 11. Voltage Monitor Figure 12. Solar Powered Battery Charger
Figure 13. Low Power Switching Regulator
Figure 14. MOSFET Low Voltage Gate Drive Protection
Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above
circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2
MOSFET.
270
4.6V
VCC
RL
MTP3055EL
Input
Reset
GND
−
+
1.2Vref
Input
GND
−
+
1.2Vref
Power
Supply
+
−
1.0k
Input
Reset
GND
−
+
1.2Vref
+
−
Solar
Cells
Input
Reset
GND
−
+
1.2Vref
Vin = 11.5
to 14.5V
470
+
MPSW51A
25mH
VO = 5.0 V
IO = 50 mA
470 +
68022 +
1N5819
1.2k
330 1N756
4.7k
Reset
MC34064, MC33064, NCV33064
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5
Test Conditions Results
Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV
Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV
Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp
Efficiency Vin = 12.6 V, IO = 50 mA 77%
MC34064, MC33064, NCV33064
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6
ORDERING INFORMATION
Device Operating Temperature Range Package Shipping†
MC34064D−005
TA = 0°C to +70°C
SOIC−8 98 Units / Rail
MC34064D−005G SOIC−8
(Pb−Free)
MC34064D−5R2 SOIC−8 2500 Units/ Tape & Reel
MC34064D−5R2G SOIC−8
(Pb−Free)
MC34064DM−5R2 Micro8 4000 Units / Tape & Reel
MC34064DM−5R2G Micro8
(Pb−Free)
MC34064P−005 TO−92 2000 Units / Bag
MC34064P−005G TO−92
(Pb−Free)
MC34064P−5RA TO−92 2000 Units / Tape & Reel
MC34064P−5RAG TO−92
(Pb−Free)
MC34064P−5RP TO−92 2000 Units / Ammo Pack
MC34064P−5RPG TO−92
(Pb−Free)
MC34064P−5RM TO−92
MC34064P−5RMG TO−92
(Pb−Free)
MC34064SN−5T1 TSOP−5 3000 Units / Tape & Reel
MC34064SN−5T1G TSOP−5
(Pb−Free)
MC33064D−005
TJ = −40°C to +85°C
SOIC−8 98 Units / Rail
MC33064D−005G SOIC−8
(Pb−Free)
MC33064D−5R2 SOIC−8 2500 Units / Tape & Reel
MC33064D−5R2G SOIC−8
(Pb−Free)
MC33064DM−5R2 Micro8 4000 Units / Tape & Reel
MC33064DM−5R2G Micro8
(Pb−Free)
MC33064P−005 TO−92 2000 Units / Bag
MC33064P−005G TO−92
(Pb−Free)
MC33064P−5RA TO−92 2000 Units / Tape & Reel
MC33064P−5RAG TO−92
(Pb−Free)
MC33064P−5RP TO−92 2000 Units / Ammo Pack
MC33064P−5RPG TO−92
(Pb−Free)
MC33064SN−5T1 TSOP−5 3000 Units / Tape & Reel
MC33064SN−5T1G TSOP−5
(Pb−Free)
† For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
change control.
MC34064, MC33064, NCV33064
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7
ORDERING INFORMATION
Device Shipping†
PackageOperating Temperature Range
NCV33064D−5R2*
TA = −40°C to +125°C
SOIC−8 2500 Units / Tape & Reel
NCV33064D−5R2G* SOIC−8
(Pb−Free)
NCV33064P−5RA* TO−92 2000 Units / Tape & Reel
NCV33064P−5RAG* TO−92
(Pb−Free)
NCV33064P−5RP* TO−92 2000 Units / Ammo Pack
NCV33064P−5RPG* TO−92
(Pb−Free)
NCV33064DM−5R2* Micro8 4000 Units / Tape & Reel
NCV33064DM−5R2G* Micro8
(Pb−Free)
† For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
change control.
V3064
ALYW5
G
SOIC−8
D SUFFIX
CASE 751
x = 3 or 4
y = C or I
A = Assembly Location
L = Wafer Lot
Y = Year
W, WW = Work Week
G= Pb−Free Package
MARKING DIAGRAMS
Micro8
DM SUFFIX
CASE 846A
1
8
TO−92
P SUFFIX
CASE 29
123
TSOP−5
SN SUFFIX
CASE 483
1
5
SRB AYWG
G
MC3x0
64P−5
ALYWW G
G
123
NCV30
64P−5
ALYWW G
G
(Note: Microdot may be in either location)
1
5
SSN AYWG
G
MC34064 MC33064
1
8
3x064
ALYW5
G
1
8
Ly50
AYW G
G
1
8
VI50
AYW G
G
MC34064, MC33064, NCV33064
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8
PACKAGE DIMENSIONS
SOIC−8
D SUFFIX
PLASTIC PACKAGE
CASE 751−07
ISSUE AG
SEATING
PLANE
1
4
58
N
J
X 45_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
AMIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024 1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC34064, MC33064, NCV33064
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9
PACKAGE DIMENSIONS
S
B
M
0.08 (0.003) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C−−− 1.10 −−− 0.043
D0.25 0.40 0.010 0.016
G0.65 BSC 0.026 BSC
H0.05 0.15 0.002 0.006
J0.13 0.23 0.005 0.009
K4.75 5.05 0.187 0.199
L0.40 0.70 0.016 0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
−B−
−A−
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
−T− SEATING
PLANE
C
HJL
Micro8
DM SUFFIX
PLASTIC PACKAGE
CASE 846A−02
ISSUE F
8X 8X
6X ǒmm
inchesǓ
SCALE 8:1
1.04
0.041 0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC34064, MC33064, NCV33064
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10
PACKAGE DIMENSIONS
TSOP−5
SN SUFFIX
PLASTIC PACKAGE
CASE 483−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.1142 0.1220
B1.30 1.70 0.0512 0.0669
C0.90 1.10 0.0354 0.0433
D0.25 0.50 0.0098 0.0197
G0.85 1.05 0.0335 0.0413
H0.013 0.100 0.0005 0.0040
J0.10 0.26 0.0040 0.0102
K0.20 0.60 0.0079 0.0236
L1.25 1.55 0.0493 0.0610
M0 10 0 10
S2.50 3.00 0.0985 0.1181
0.05 (0.002)
123
54
S
AG
L
B
D
H
C
KM
J
____
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC34064, MC33064, NCV33064
http://onsemi.com
11
PACKAGE DIMENSIONS
TO−92
P SUFFIX
PLASTIC PACKAGE
CASE 29−11
ISSUE AL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION X−X
C
V
D
N
N
XX
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.021 0.407 0.533
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 −−− 12.70 −−−
L0.250 −−− 6.35 −−−
N0.080 0.105 2.04 2.66
P−−− 0.100 −−− 2.54
R0.115 −−− 2.93 −−−
V0.135 −−− 3.43 −−−
1
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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Phone: 81−3−5773−3850
MC34064/D
Micro8 is a trademark of International Rectifier.
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