TCD2560D - Toshiba America Electronic Components, Inc.

TCD2560D

2002-12-25

TOSHIBA CCD Image Sensor CCD (charge coupled device)

TCD2560D

The TCD2560D is a high sensitive and low dark current 5400

elements × 3 line CCD color image sensor which includes CCD

drive circuit and clamp circuit. The sensor is designed for

scanner.

The device contains a row of 5400 elements × 3 line

photodiodes which provide a 24 lines/mm (600 dpi) across a A4

size paper. The device is operated by 5 V pulse, and 12 V power

supply.

Features

· Number of image sensing elements: 5400 elements × 3 line

· Image sensing element size: 5.25 µm by 5.25 µm on 5.25 µm

centers

· Photo sensing region: High sensitive and low dark current PN photodiode

· Distance between photodiode array: 42 µm (8 lines)

· Clock: 2 phase (5 V)

· Power supply: 12 V power supply voltage

· Internal circuit: Clamp circuit

· Package: 22 pin CERDIP package

· Color filter: Red, green, blue

Pin Assignment (top view)

Weight: 4.5 g (typ.)

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Maximum Ratings (Note 1)

Characteristics Symbol Rating Unit

Clock pulse voltage VfA V

Shift pulse voltage VSH V

Reset pulse voltage RS

V V

Clamp pulse voltage CP

-0.3~8.0

Power supply voltage VOD -0.3~15 V

Operating temperature Topr 0~60 °C

Storage temperature Tstg -25~85 °C

Note 1: All voltage are with respect to SS terminals (ground).

Circuit Diagram

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Pin Names

Pin No. Symbol Name Pin No. Symbol Name

1 OS3 Signal Output 3 (red) 12 SH2 Shift Gate 2

2 SS Ground 13 SH1 Shift Gate 1

3 RS Reset Gate 14 f1A1 Clock 1 (phase 1)

4 CP Clamp Gate 15 f2A1 Clock 1 (phase 2)

5 NC Non Connection 16 NC Non Connection

6 NC Non Connection 17 NC Non Connection

7 NC Non Connection 18 NC Non Connection

8 f2A2 Clock 2 (phase 2) 19 NC Non Connection

9 f1A2 Clock 2 (phase 1) 20 OD Power

10 SH3 Shift Gate 3 21 OS1 Signal Output 1 (blue)

11 SS Ground 22 OS2 Signal Output 2 (green)

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Optical/Electrical Characteristics

(Ta =

= 25°C, VOD =

= 12 V, Vf

f =

= VSH =

= RS

V =

= CP

V =

= 5 V (pulse), f f

f =

= 1.0 MHz,

f =

= 1 MH z, tINT =

= 10 ms, light source =

= light source A +

+ CM500S filter (t =

= 1 mm),

load resistance =

= 100 kW

Characteristics Symbol Min Typ. Max Unit Note

Red R

(R) 3.4 4.8 6.2

Green R

(G) 4.7 6.7 8.7

Sensitivity

Blue R

(B) 2.0 2.9 3.8

V/lx･s (Note 2)

PRNU (1) ¾ 15 20 % (Note 3)

Photo response non uniformity

PRNU (3) ¾ 3 12 mV (Note 4)

Saturation output voltage VSAT 2.5 3.0 ¾ V (Note 5)

Saturation exposure SE ¾ 0.45 ¾ Ix･s (Note 6)

Dark signal voltage VDRK ¾ 0.5 3.0 mV (Note 7)

Dark signal non uniformity DSNU ¾ 2.0 9.0 mV (Note 7)

DC power dissipation PD ¾ 300 400 mW

Total transfer efficiency TTE 92 98 ¾ %

Output impedance ZO ¾ 0.3 1.0 kW

DC compensation output voltage VOS 4.0 5.0 6.0 V (Note 8)

Random noise NDs ¾ 1.0 ― mV (Note 9)

Reset noise VRSN ¾ 0.3 1.0 V (Note 8)

Masking noise VMS ¾ 0.1 0.5 V (Note 8)

Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied

with the light of uniform illumination and uniform color temperature.

Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive

surface is applied with the light of uniform illumination and uniform color temperature.

(%)´

=100(1)PRNU

Where

? is average of total signal output and Dc is the maximum deviation from ?. The amount of

incident light is shown below.

Red = 1/2･SE

Green = 1/2･SE

Blue = 1/4･SE

Note 4: PRNU (3) is defined as maximum voltage with next pixels, where measured at 5% of SE (typ.).

Note 5: VSAT is defined as minimum saturation output of all effective pixels.

Note 6: Definition of SE

s)Ix

SAT ×(=

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Note 7: VDRK is defined as average dark signal voltage of all effective pixels.

DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal

voltage.

Note 8: DC signal output voltage is defined as follows.

Reset Noise Voltage is defined as follows.

Note 9: Random noise is defined as the standard deviation (sigma) of the output level difference between two

adjacent effective pixels under no illumination (i.e. dark conditions) calculated by the following procedure.

1) Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points.

2) Each of the output level at video output periods averaged over 200ns period to get V (n) and V (n + 1).

3) V (n + 1) is subtracted from V (n) to get DV.

DV = V (n) - V (n + 1)

4) The standard deviation of DV is calculated after procedure 2) and 3) are repeated 30 times (30

readings).

D=D 30

|Vi|

V å

)D-D=s 30

V|Vi(|

5) Procedure 2), 3) and 4) are repeated 10 times to get sigma value.

6) 10 sigma values are averaged.

s=s

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7) I value calculated using the above procedure is observed 2 times larger than that measured

relative to the ground level. So we specify random noise as follows.

s=s 2

Operating Condition

Characteristics Symbol Min Typ. Max Unit Note

“H” level 4.5 5.0 5.5

Clock pulse voltage

“L” level

VfA

0 0 0.3

“H” level

VfA

“H”

- 0.5

VfA

“H”

VfA

“H”

Shift pulse voltage

“L” level

VSH

0 0 0.5

V (Note10)

“H” level 4.5 5.0 5.5

Reset pulse voltage

“L” level RS

0 0 0.5

“H” level 4.5 5.0 5.5

Clamp pulse voltage

“L” level CP

0 0 0.5

Power supply voltage VOD 11.4 12.0 13.0 V

Note 10: VfA “H” means the high level voltage of VfA when SH pulse is high level.

Clock Characteristics (Ta =

= 25°C)

Characteristics Symbol Min Typ. Max Unit

Clock pulse frequency ffA 0.3 1.0 6.0 MHz

Reset pulse frequency RS

f 0.3 1.0 6.0 MHz

Clamp pulse frequency CP

f 0.3 1.0 6.0 MHz

Clock 1 capacitance (Note 11) Cf1 ¾ 190 300 pF

Clock 2 capacitance (Note 11) Cf2 ¾ 160 300 pF

Shift gate capacitance CSH ¾ 20 100 pF

Reset gate capacitance RS

C ¾ 10 40 pF

Clamp gate capacitance CP

C ¾ 10 40 pF

Note 11: VOD = 12 V

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Timing Chart (bit clamp mode)

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Timing Chart (line clamp mode)

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Timing Requirements

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Timing Requirements

Characteristics Symbol Min Typ.

(Note 12) Max Unit

t1 120 1000 ¾

Pulse timing of SH and f1

t5 800 1000 ¾

SH pulse rise time, fall time t2, t4 0 50 ¾ ns

SH pulse width t3 3000 5000 ¾ ns

Pulse timing of SH and CP t6 200 500 ¾ ns

Pulse timing of SH and CP (line clamp mode) t7 10 100 ¾ ns

f1, f2 pulse rise time, fall time t8, t9 0 50 ¾ ns

RS pulse rise time, fall time t10, t11 0 20 ¾ ns

RS pulse width t12 30 80 ¾ ns

Pulse timing of RS and CP t13 10 20 ¾ ns

Pulse timing of f1A, f2A and CP t14 0 20 ¾ ns

CP pulse rise time, fall time t15, t16 0 20 ¾ ns

CP pulse width (Note 13) t17 40

(3000)

(5000) ¾ ns

Reference level settle time (bit clamp mode) t18 ¾ 35 45

(Note 16)

Video data delay time (Note 14) t19 ¾ 40 60

(Note 15)

Reference level settle time (line clamp mode) t20 ¾ 60 70

(Note 16)

Note 12: Typ. is the case of RS

f = 1.0 MHz

Note 13: Line clamp Mode inside ( ).

Note 14: Load resistance is 100 kW

Note 15: Typical settle time to about 1% of final value

Note 16: Typical settle time to about 1% of the peak

Clamp Mode

Clamp Means CP Input Pulse

Bit Clamp CP Pulse

Line Clamp CP = SH or CP = DC 5 V

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Typical Spectral Response

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Typical Drive Circuit

IC1, 2: TC74HC04AP

TR1, 2, 3: 2SC1815-Y

R1: 150 W

R2: 1500 W

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Caution

1. Window Glass

The dust and stain on the glass window of the package degrade optical performance of CCD sensor.

Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and

allow the glass to dry, by blowing with filtered dry N2.

Care should be taken to avoid mechanical or thermal shock because the glass window is easily to

damage.

2. Electrostatic Breakdown

Store in shorting clip or in conductive foam to avoid electrostatic breakdown.

CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static

electricity is sometimes detected. When handling the device, it is necessary to execute the following static

electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system

due to static electricity.

(1) Prevent the generation of static electricity due to friction by making the work with bare hands or by

putting on cotton gloves and non-charging working clothes.

(2) Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the

work room.

(3) Ground the tools such as soldering iron, radio cutting pliers of or pincer.

It is not necessarily required to execute all precaution items for static electricity.

It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed

range.

3. Incident Light

CCD sensor is sensitive to infrared light.

Note that infrared light component degrades resolution and PRNU of CCD sensor.

4. Lead Frame Forming

Since this package is not strong against mechanical stress, you should not reform the lead frame.

We recommend to use a IC-inserter when you assemble to PCB.

5. Soldering

Soldering by the solder flow method cannot be guaranteed because this method may have deleterious

effects on prevention of window glass soiling and heat resistance.

Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260°C, or

within three seconds for lead temperatures of up to 350°C.

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Package Dimensions

Note 1: Top of chip to bottom of package

Note 2: Glass thickness (n = 1.5)

Note 3: No.1 sensor element (S1) to center of No.1 pin.

Weight: 4.5 g (typ.)

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devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

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In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

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conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc..

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(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

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