General Purpose Chip Resistors
Anti-Sulfuration
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Test and Requirements:
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT/UCT/56 (rated temperature
range : Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing also meets the
requirements specified by EIA, EIAJ and JIS
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness testing
procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1, sub-clause 5.3. Unless
otherwise specified, the following value supplied :
Temperature : 15 to 35°C
Relative humidity : 45 to 75%
Air pressure : 86kPa to 106 kPa (860 mbar to 1,060 mbar)
All soldering tests are performed with midly activated flux
Test Procedure / Test Method
Requirement
Resistor 0 ΩΩ
Electrical Characteristics
JISC5201-1: 1998
Clause 4.8
- DC resistance values measurement
- Temperature Coefficient of Resistance (T.C.R)
Natural resistance change per change in degree
centigrade
R2 - R1
R1(t2- t1)
R1: Resistance at reference temperature
R2: Resistance at test temperature
Within the specified tolerance
Refer to “Quick Reference
Data”
Resistance to soldering
heat (R.S.H)
MIL-STD-202
method 210
Un-mounted chips completely immersed for 10
±1second in a SAC solder bath at 270°C ±5°C ∆∆R/R maximum ± (0.5%+0.05 Ω)
No visible damage < 50 mΩ
Solderability
J-STD-002
a) Bake the sample for 155°C dwell time 4
hours / solder dipping 235°C / 5 s
b) Steam the sample dwell time 1 hour / solder
dipping 215°C / 5 s
c) Steam the sample dwell time 1 hour / solder
dipping 260°C / 7 s
95% coverage minimum, good tinning
No visible damage
Temperature cycling
JESD22
method JA-104
1,000 cycles, -55°C to +155°C, dwell time 5 to
10 mins
∆R/R maximum ± (0.5%+0.05 Ω)
No visible damage < 50 mΩ
Moisture Resistance
MIL-STD-202
method 106
65 ±2°C, 80 to 100% RH, 10 cycles, 24 hours /
cycle
∆R/R maximum ± (0.5%+0.05 Ω)
No visible damage < 50 mΩ
Bias Humidity
MIL-STD-202
method 103
1,000 + 48/-0 hours; 85°C, 85% RH, 10% of
operation Power
∆R/R maximum ± (1%+0.05 Ω)
No visible damage < 50 mΩ
Operational Life
MIL-STD-202
method 108
1,000 + 48/-0 hours; 35% of operation power,
125 ±2°C
∆R/R maximum ± (1%+0.05 Ω)
No visible damage < 50 mΩ
High Temperature
Exposure
MIL-STD-202
method 108
1,000 + 48/-0 hours; without load in a
temperature chamber controlled 155 ±3°C
∆R/R maximum ± (1%+0.05 ΩΩ)
No visible damage < 50 mΩ
× 106(ppm/°C) t1: 20°C+5°C-1°C