PC3H3J00000F Series Mini-flat Half Pitch Package, High CMR, AC Input Photocoupler PC3H3J00000F Series 4-channel package type is also available. (model No. PC3Q63J0000F) Description Agency approvals/Compliance PC3H3J00000F Series contains a IRED optically coupled to a phototransistor. It is packaged in a 4-pin Mini-flat, Half pitch type. Input-output isolation voltage(rms) is 2.5kV. Collector-emitter voltage is 80V and CMR is MIN. 10kV/s. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC3H3) 2. Package resin : UL flammability grade (94V-0) Applications 1. Programmable controllers Features 1. 4-pin Mini-flat Half pitch package (Lead pitch : 1.27mm) 2. Double transfer mold package (Ideal for Flow Soldering) 3. AC input type 4. High collector-emitter voltage (VCEO : 80V) 5. High noise immunity due to high common mode rejection voltage (CMR : MIN. 10kV/s) 6. Isolation voltage between input and output (Viso(rms) : 2.5kV) 7. Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A01302EN Date Jun. 30. 2005 (c) SHARP Corporation PC3H3J00000F Series Internal Connection Diagram 1 1 4 2 3 2 3 Outline Dimensions (Unit : mm) Date code 1 4 3H3 2 4.40.2 3 0.40.1 1.270.25 2.60.3 Rank mark SHARP mark "S" Primary side mark 4 Anode / Cathode Cathode / Anode Emitter Collector 5.30.3 Epoxy resin 0.5+0.4 -0.2 0.10.1 2.00.2 0.20.05 (1.7) 7.0+0.2 -0.7 *( ) : Reference dimensions Product mass : approx. 0.05g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A01302EN 2 PC3H3J00000F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * Mark P R S T U V W X A B C ** * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Rank mark Refer to the Model Line-up table Sheet No.: D2-A01302EN 3 PC3H3J00000F Series Absolute Maximum Ratings Output Input Parameter Symbol IF Forward current *1 Peak forward current IFM P Power dissipation Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation Topr Operating temperature Tstg Storage temperature *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 50 1 70 80 6 50 150 170 -30 to +100 -40 to +125 2.5 260 (Ta=25C) Unit mA A mW V V mA mW mW C C kV C *1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF Ct Terminal capacitance ICEO Collector dark current Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance tr Rise time Response time Fall time tf Common mode rejection voltage CMR Conditions IF=20mA V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=1mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=2V, IC=2mA, RL=100 Ta=25C, RL=470, VCM=1.5kV(peak), IF=0, VCC=9V, Vnp=100mV MIN. - - - 80 6 0.2 - 5x1010 - - - TYP. 1.2 30 - - - - 0.1 1x1011 0.6 4 3 MAX. 1.4 250 100 - - 4.0 0.2 - 1.0 18 18 (Ta=25C) Unit V pF nA V V mA V pF s s 10 - - kV/s Sheet No.: D2-A01302EN 4 PC3H3J00000F Series Model Line-up Package Model No. Taping 3 000pcs/reel PC3H3J00000F PC3H3AJ0000F PC3H3BJ0000F Rank mark IC [mA] (IF =1mA, VCE =5V, Ta =25C) with or without A B 0.2 to 4.0 0.5 to 1.5 1.0 to 2.5 Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A01302EN 5 PC3H3J00000F Series Fig.1 Test Circuit for Common Mode Rejection Voltage (dV/dt) VCM RL 1) VCC VO VCM : High wave pulse RL=470 VCC=9V VCM VO (Vcp Nearly = dV/dtxCfxRL) 1) Vcp : Voltage which is generated by displacement current in floating capacitance between primary and secondary side. Fig.3 Diode Power Dissipation vs. Ambient Temperature Fig.2 Forward Current vs. Ambient Temperature 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 -30 Vnp Vo 0 25 50 55 75 100 80 70 60 40 20 0 -30 125 0 Fig.4 Collector Power Dissipation vs. Ambient Temperature 75 100 125 250 Total power dissipation Ptot (mW) Collector power dissipation PC (mW) 50 55 Fig.5 Total Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 -30 25 Ambient temperature Ta (C) Ambient temperature Ta (C) 0 25 50 75 100 200 170 150 100 50 0 -30 125 Ambient temperature Ta (C) 0 25 50 75 100 125 Ambient temperature Ta (C) Sheet No.: D2-A01302EN 6 PC3H3J00000F Series Fig.7 Forward Current vs. Forward Voltage Fig.6 Peak Forward Current vs. Duty Ratio Pulse width100s Ta=25C 50C Forward current IF (mA) Peak forward current IFM (mA) 1 000 Ta=75C 100 10 10-3 10-2 -25C 10 1 10-1 1 0 0.5 1 Duty ratio 2 2.5 3 3.5 Fig.9 Collector Current vs. Collector-emitter Voltage 50 300 PC (max) VCE=5V Ta=25C Ta=25C 40 Collector current IC (mA) Current transfer ratio CTR (%) 1.5 Forward voltage VF (V) Fig.8 Current Transfer Ratio vs. Forward Current 200 100 30 IF=30mA 20mA 20 10mA 10 5mA 1mA 0 0 1 10 0 100 2 4 6 8 10 Collector-emitter voltage VCE (V) Forward current IF (mA) Fig.10 Relative Current Transfer Ratio vs. Ambient Temperature Fig.11 Collector - emitter Saturation Voltage vs. Ambient Temperature 150 0.2 IF=20mA IC=1mA 0.18 IF=1mA VCE=5V 0.16 Collector-emitter saturation voltage VCE (sat) (V) Relative current transfer ratio (%) 25C 0C 100 100 50 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 -40 -20 0 20 40 60 80 0 -40 100 Ambient temperature Ta (C) -20 0 20 40 60 80 100 Ambient temperature Ta (C) Sheet No.: D2-A01302EN 7 PC3H3J00000F Series Fig.12 Collector Dark Current vs. Ambient Temperature Fig.13 Response Time vs. Load Resistance 10-4 100 VCE=2V IC=2mA Ta=25C 10-5 Response time (s) Collector dark current ICEO (A) VCE=50V 10-6 10-7 tf 10 tr td ts 1 10-8 10-9 -40 -20 0 20 40 60 80 0.1 0.1 100 1 Ambient temperature Ta (C) 10 Load resistance RL (k) Fig.14 Test Circuit for Response Time Fig.15 Frequency Response VCE=5V IC=2mA Ta=25C VCC RL Output Input 0 Output Input Voltage gain AV (dB) RD 10% VCE ts tf td tr 90% RL=10k 1k 100 -10 Please refer to the conditions in Fig.13 -20 0.1 1 10 100 1 000 Frequency f (kHz) Fig.16 Collector-emitter Saturation Voltage vs. Forward Current 5 Collector-emitter saturation voltage VCE (sat) (V) IC=0.5mA Ta=25C 1mA 4 3mA 5mA 3 7mA 2 1 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. 0 0 3 6 9 12 15 Forward current IF (mA) Sheet No.: D2-A01302EN 8 PC3H3J00000F Series Design Considerations Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through IRED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of IRED. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Recommended Foot Print (reference) 0.8 1.27 6.3 1.5 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A01302EN 9 PC3H3J00000F Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A01302EN 10 PC3H3J00000F Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A01302EN 11 PC3H3J00000F Series Package specification Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F G D J I L K Dimensions List A B 12.00.3 5.50.1 H I 0.1 7.5 0.30.05 C 1.750.1 J 2.30.1 D 8.00.1 K 3.10.1 E 2.00.1 L +0.1 1.6-0 5 MAX . H H A B C E (Unit : mm) F G +0.1 4.00.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 330 13.51.5 e f 1.0 23 2.00.5 f a b (Unit : mm) c d 1.0 100 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 3 000pcs/reel] Sheet No.: D2-A01302EN 12 PC3H3J00000F Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E215] Sheet No.: D2-A01302EN 13