1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC3H3)
2. Package resin : UL flammability grade (94V-0)
■ Features
■ Agency approvals/Compliance
1. Programmable controllers
■ Applications
Mini-flat Half Pitch Package,
High CMR, AC Input
Photocoupler
1. 4-pin Mini-flat Half pitch package (Lead pitch :
1.27mm)
2. Double transfer mold package (Ideal for Flow
Soldering)
3. AC input type
4. High collector-emitter voltage (VCEO : 80V)
5. High noise immunity due to high common mode
rejection voltage (CMR : MIN. 10kV/µs)
6. Isolation voltage between input and output (Viso(rms) :
2.5kV)
7. Lead-free and RoHS directive compliant
■ Description
PC3H3J00000F Series contains a IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin Mini-flat, Half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter voltage is 80V and CMR is MIN.
10kV/µs.
1Sheet No.: D2-A01302EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC3H3J00000F
Series
∗4-channel package type is also available.
(model No. PC3Q63J0000F)
PC3H3J00000F Series
■ Internal Connection Diagram
Anode / Cathode
Cathode / Anode
Emitter
Collector
11
2
3
4
2
4
3
2
Sheet No.: D2-A01302EN
■ Outline Dimensions (Unit : mm)
3H3
0.4±0.1
4.4±0.2
0.2±0.05
5.3±0.3
0.5+0.4
−0.2
7.0+0.2
−0.7
Primary side mark
SHARP mark "S"
Rank mark
0.1±0.1 2.0±0.2
Epoxy resin
1.27
±0.25
2.6±0.3
1 4
32
Date code
(1.7)
*( ) : Reference dimensions
PC3H3J00000F Series
Product mass : approx. 0.05g
Plating material : SnCu (Cu : TYP. 2%)
Date code (2 digit)
Rank mark
Refer to the Model Line-up table
Country of origin
Japan
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
3
repeats in a 20 year cycle
Sheet No.: D2-A01302EN
PC3H3J00000F Series
Sheet No.: D2-A01302EN
■ Electro-optical Characteristics
10 −−kV/µs
CMR
Common mode rejection voltage
Ta=25˚C, RL=470Ω, VCM=1.5kV(peak),
IF=0, VCC=9V, Vnp=100mV
Parameter Conditions
Forward voltage
Terminal capacitance
Collector dark current
Transfer
charac-
teristics
Emitter-collector breakdown voltage
Collector current
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
MIN.
−
−
−
6
0.2
−
5×1010
−
−
−
TYP.
1.2
30
−
−
−
−
0.1
1×1011
0.6
4
3
MAX.
1.4
250
100
−
−
4.0
0.2
−
1.0
18
18
Unit
V
V
pF
nA
V
mA
V
Ω
pF
µs
µs
Symbol
VF
Ct
ICEO
BVCEO
BVECO
IC
VCE (sat)
Cf
tr
tf
RISO
Response time Rise time
Fall time
Input
Output
IF=±20mA
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=±1mA, VCE=5V
DC500V, 40 to 60%RH
VCE=2V, IC=2mA, RL=100Ω
V=0, f=1MHz
IF=±20mA, IC=1mA
80
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation mW
Output
Collector-emitter voltage
V
Emitter-collector voltage
V
Collector current mA
Collector power dissipation
mW
Total power dissipation mW
*2 Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VCEO
VECO
IC
PC
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
Rating
±50
±1
70
80
6
50
150
170
−30 to +100
−40 to +125
260
2.5 kV
4
PC3H3J00000F Series
Sheet No.: D2-A01302EN
■ Model Line-up
IC [mA]
(I
F
=±1mA, V
CE
=5V, T
a
=25˚C)
with or without
A
B
0.2 to 4.0
0.5 to 1.5
1.0 to 2.5
Model No.
Package Rank mark
PC3H3J00000F
PC3H3AJ0000F
PC3H3BJ0000F
3 000pcs/reel
Taping
5
Please contact a local SHARP sales representative to inquire about production status.
PC3H3J00000F Series
Sheet No.: D2-A01302EN
Total power dissipation Ptot (mW)
0
50
100
150
200
170
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
250
Fig.5 Total Power Dissipation vs. Ambient
Temperature
Forward current IF (mA)
0
10
20
30
40
50
−30 0 25 75 100 1255550
Ambient temperature Ta (˚C)
Fig.2 Forward Current vs. Ambient
Temperature
0
20
40
60
70
80
100
−30 0 25 75 100 1255550
Ambient temperature Ta (˚C)
Diode power dissipation P (mW)
Fig.3 Diode Power Dissipation vs. Ambient
Temperature
Collector power dissipation PC (mW)
0
50
100
150
200
250
−30 0 25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.4 Collector Power Dissipation vs.
Ambient Temperature
6
Fig.1 Test Circuit for Common Mode Rejection Voltage
VCM
VoVnp
VO
(dV/dt)
1)
RLVO
VCC
VCM 1) Vcp : Voltage which is generated by displacement current in floating
capacitance between primary and secondary side.
(Vcp Nearly = dV/dt×Cf×RL)
VCM : High wave
pulse
RL=470Ω
VCC=9V
PC3H3J00000F Series
Sheet No.: D2-A01302EN
Relative current transfer ratio (%)
0
150
100
50
−40 −20 0 20 406080100
Ambient temperature Ta (˚C)
IF=1mA
VCE=5V
Fig.10 Relative Current Transfer Ratio vs.
Ambient Temperature
Collector-emitter saturation
voltage VCE (sat) (V)
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
−40 −20 0 20 40 60 80 100
Ambient temperature Ta (˚C)
IF=20mA
IC=1mA
Fig.11 Collector - emitter Saturation Voltage
vs. Ambient Temperature
7
IF=30mA
PC (max)
20mA
10mA
5mA
1mA
Collector current IC (mA)
0
10
20
30
40
50
0246810
Collector-emitter voltage VCE (V)
Ta=25˚C
Fig.9 Collector Current vs. Collector-emitter
Voltage
Current transfer ratio CTR (%)
0
100
200
300
110100
Forward current IF (mA)
VCE=5V
Ta=25˚C
Fig.8 Current Transfer Ratio vs. Forward
Current
Forward voltage VF (V)
50˚C 25˚C
0˚C
00.511.5 2 2.5 3 3.5
10
100
1
−25˚C
Ta=75˚C
Forward current IF (mA)
Fig.7 Forward Current vs. Forward Voltage
Pulse width≤100µs
Ta=25˚C
Peak forward current IFM (mA)
10
100
1 000
10−310−210−11
Duty ratio
Fig.6 Peak Forward Current vs. Duty Ratio
PC3H3J00000F Series
Sheet No.: D2-A01302EN
Remarks : Please be aware that all data in the graph
are just for reference and not for guarantee.
8
−20
−10
0
Voltage gain AV (dB)
0.1 1 10 100 1 000
Frequency f (kHz)
VCE=5V
IC=2mA
Ta=25˚C
RL=10kΩ1kΩ100Ω
Fig.15 Frequency Response
Collector dark current ICEO (A)
10−9
10−8
10−7
10−6
10−5
10−4
−40 −20 0 20 406080100
Ambient temperature Ta (˚C)
VCE=50V
Fig.12 Collector Dark Current vs. Ambient
Temperature
td
tr
tf
ts
Response time (µs)
0.1
1
10
100
0.1 1 10
Load resistance RL (kΩ)
VCE=2V
IC=2mA
Ta=25˚C
Fig.13 Response Time vs. Load Resistance
10%
Input
Output
Input Output
90%
ts
td
VCC
RDRL
tf
tr
Please refer to the conditions in Fig.13
VCE
Fig.14 Test Circuit for Response Time
IC=0.5mA
7mA
5mA
3mA
1mA
0
1
2
3
4
5
03691215
Forward current IF (mA)
Collector-emitter saturation voltage
VCE (sat) (V)
Ta=25˚C
Fig.16 Collector-emitter Saturation Voltage
vs. Forward Current
PC3H3J00000F Series
Sheet No.: D2-A01302EN
■ Design Considerations
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
1.5
1.27
0.8
6.3
(Unit : mm)
● Design guide
PC3H3J00000F Series
Sheet No.: D2-A01302EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC3H3J00000F Series
Sheet No.: D2-A01302EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
11
PC3H3J00000F Series
Sheet No.: D2-A01302EN
12
■ Package specification
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
E
I
DJ
G
L
B
H
A
C
H
5˚
MAX.
A
12.0±0.3
B
5.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
7.5±0.1
I
0.3±0.05
J
2.3±0.1
K
3.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
L
φ1.6+0.1
−0
Dimensions List (Unit : mm)
a
c
e
g
f
b
d
a
330
b
13.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Dimensions List (Unit : mm)
Pull-out direction
[Packing : 3 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC3H3J00000F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
13
Sheet No.: D2-A01302EN
■ Important Notices
PC3H3J00000F Series
[E215]
