Product
Specification
108-1332
07Oct09 Rev C
AMPMODU* 50/50 Grid Connector System
©2009 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved.
* Trademark
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LOC B
1. SCOPE
1.1. Content
This specification covers performance, tests and quality requirements for AMPMODU* 50/50 Grid
Connector System. This miniature board to board system consists of printed circuit board mounted
receptacles and headers on a .050 by .050 inch centerline. Both the receptacles and headers are
designed to be soldered to the surface of printed wiring boards having pads with preapplied solder
paste. Conventional processes shall be used in placing and reflowing the solder paste as defined in
applicable documents. This specification applies when receptacles and/or headers are mounted to G-10
or FR-4 epoxy printed wiring boards.
1.2. Qualification
When tests are performed on subject product line, procedures specified in Figure 1 shall be used. All
inspections shall be performed using applicable inspection plan and product drawing.
1.3. Qualification Test Results
Successful qualification testing on the subject product line was completed on 25Sep95. Additional
testing was completed on 27Sep02. The Qualification Test Report number for this testing is 501-317.
This documentation is on file at and available from Engineering Practices and Standards (EPS).
2. APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
2.1. Tyco Electronics Documents
!102-950: Quality Specification (Qualification of Separable Interface Connectors)
!114-7010: Application Specification (AMPMODU 50/50 Grid Connectors for SMT PC Board and
IDC Ribbon Cable Applications)
!501-317: Qualification Test Report (AMPMODU* 50/50 Grid Connector System)
2.2. Industry Document|
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications|
2.3. Reference Document|
109-197: Test Specification (Tyco Electronics Test Specifications vs EIA and IEC Test Methods)|
|3. REQUIREMENTS
3.1. Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
108-1332
Rev C 2 of 7
3.2. Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
3.3. Ratings
!Voltage: 30 volts AC
!Current: See Figure 4 for applicable current carrying capability
!Temperature: -65 to 105°C
3.4. Performance and Test Description
Product is designed to meet electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions.|
3.5. Test Requirements and Procedures Summary
Test Description Requirement Procedure
Examination of product. Meets requirements of product
drawing and Application
Specification 114-7010.
Visual, dimensional and functional
per applicable quality inspection
plan.
ELECTRICAL
Termination resistance. Header Milliohms
Stack Maximum
Height Initial
.250 inch 12
.320 inch 14
.390 inch 16
ΔR 8 milliohms maximum.
EIA-364-23.
Subject mated contacts assembled
in housing to 50 mv maximum open
circuit at 100 ma maximum.
See Figure 3.
Insulation resistance. 5000 megohms minimum. EIA-364-21.
Test between adjacent contacts of
mated specimens.
Dielectric withstanding voltage. 300 volts AC at sea level for 1
minute.
EIA-364-20, Condition I.
Test between adjacent contacts of
mated specimens.
Temperature rise vs current. 30°C maximum temperature rise at
3.9 amperes AC.
EIA-364-70, Method 1.
Measure temperature rise vs
current.
See Figure 4.
MECHANICAL
Vibration, random. No discontinuities of 1 microsecond
or longer duration.
See Note.
EIA-364-28, Test Condition V.
Subject mated specimens to 16.91
G's rms. 20 minutes in each of 3
mutually perpendicular planes.
See Figure 5.
Figure 1 (continued)
108-1332
Test Description Requirement Procedure
Rev C 3 of 7
Physical shock. No discontinuities of 1 microsecond
or longer duration.
See Note.
EIA-364-27, Method G.
Subject mated specimens to 100
G's sawtooth shock pulses of 6
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 5.
Durability. See Note. EIA-364-9.
Mate and unmate specimens for
200 cycles at maximum rate of 150
cycles per hour.
Contact retention. Contacts shall not dislodge from
circuit cavity.
EIA-364-29.
Apply axial load of .25 pound to
header and .40 pound to receptacle
in mating direction to solder tails of
header and receptacle.
Mating force. 6.4 ounces maximum per contact. EIA-364-9.
Measure force necessary to mate
specimens a distance of .060 inch
from point of initial contact at
maximum rate of .5 inch per minute.
Unmating force. 1 ounce minimum per contact. EIA-364-9.
Measure force necessary to unmate
specimens at maximum rate of .5
inch per minute.
ENVIRONMENTAL
Thermal shock. See Note. EIA-364-32, Test Condition II.
Subject mated specimens to 10
cycles between -65 and 105°C.
Humidity-temperature cycling. See Note. EIA-364-31, Method III.
Subject specimens to 10 cycles (10
days) between 25 and 65°C at 80 to
100% RH.
Temperature life. See Note. EIA-364-17, Method A, Test
Condition 4, Time Condition C.
Subject mated specimens to 105°C
for 500 hours.
Figure 1 (continued)
108-1332
Test Description Requirement Procedure
Rev C 4 of 7
Mixed flowing gas. See Note. EIA-364-65, Class III (3 gas).
Subject mated beryllium copper
specimens to environmental class
III for 20 days.
Mixed flowing gas. See Note. EIA-364-65, Class IIIA (4 gas).
Subject mated copper alloy
specimens to environmental Class
IIIA for 20 days.
Shall meet visual requirements, show no physical damage and shall meet requirements of
NOTE additional tests as specified in Test Sequence in Figure 2.
Figure 1 (end)
3.6. Product Qualification and Requalification Test Sequence
Test or Examination
Test Group (a)
1234
Test Sequence (b)
Examination of product 1,9 1,9 1,8 1,3
Termination resistance 3,7 2,7
Insulation resistance 2,6
Dielectric withstanding voltage 3,7
Temperature rise vs current 3,8
Vibration 5 6(c)
Physical shock 6
Durability 4
Contact retention 2
Mating force 2
Unmating force 8
Thermal shock 4
Humidity-temperature cycling 5
Temperature life 5
Mixed flowing gas, Class III 4(d)
Mixed flowing gas, Class IIIA 4(d)
(a) See paragraph 4.1.A.
NOTE (b) Numbers indicate sequence in which tests are performed.
(c) Discontinuities shall not be measured. Energize at 18
E
C level for 100% loadings
per Quality Specification 102-950.
(d) Precondition specimens with 10 cycles durability.
Figure 2
108-1332
Rev C 5 of 7
Figure 3
Termination Resistance Measurement Points
4. QUALITY ASSURANCE PROVISIONS
4.1. Qualification Testing
A. Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected from current production. Test groups shall consist of a minimum of 5 vertical receptacles
and shrouded headers containing at least 30 contacts total. Test group 1 shall consist of the
smallest and largest position sizes available. Test groups 2, 3 and 4 shall each consist of the
largest position size available.
B. Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
4.2. Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
4.3. Acceptance
Acceptance is based on verification that the product meets requirements of Figure 1. Failures attributed
to equipment, test setup or operator deficiencies shall not disqualify the product. When product failure
occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to confirm
corrective action is required before resubmittal.
4.4. Quality Conformance Inspection
The applicable quality inspection plan will specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
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108-1332
Rev C 6 of 7
Figure 4A
Current Carrying Capability
Percent Connector Loading F-Factor
Single Contact 1
50 .42
100 .29
To determine the acceptable current carrying capacity for the percentage connector loading
NOTE indicated, use the Multiplication Factor (F) from the above chart and multiply it times the Base
rated Current for a single circuit at maximum ambient operating temperature as shown in Figure
4A.
Figure 4B
Current Rating
108-1332
Rev C 7 of 7
Figure 5
Vibration & Physical Shock Mounting Fixture
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