Memory Module Specifications KHX16C9P1K2/16 16GB (8GB 2Rx8 1G x 64-Bit x 2 pcs.) DDR3-1600MHz CL9 240-Pin DIMM Kit Supports Kingston HyperX Plug and Play (PnP) SPECIFICATIONS CL(IDD) 9 cycles Row Cycle Time (tRCmin) 48.125ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 260ns (min.) Row Active Time (tRASmin) 33.75ns (min.) Maximum Operating Power (DDR3-1600 CL9-9-9 @ 1.5V) 2.580 W* (per module) UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES Kingston's KHX16C9P1K2/16 is a kit of two 1G x 64-bit (8GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8 memory * * * * * * * * * * JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply * * Bi-directional Differential Data Strobe * * On Die Termination using ODT pin * * Asynchronous Reset modules, based on sixteen 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 16GB. Each module kit has been tested to run at JEDEC DDR3-1600 at a low latency timing of 9-9-9 at 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The electrical and mechanical specifications are as follows: Note: PnP implementation is only possible in configurations that include a BIOS that supports the PnP function. Your maximum speed will be determined by your BIOS. PnP JEDEC TIMING PARAMETERS: * * * DDR3-1600 CL9-9-9 @1.5V DDR3-1333 CL8-8-8 @1.5V DDR3-1066 CL6-6-6 @1.5V VDDQ = 1.5V (1.425V ~ 1.575V) 800MHz fCK for 1600Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5 Posted CAS Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 8 (DDR3-1600) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C PCB : Height 1.180" (30.00mm), double sided component Continued >> Document No. 4806450-001.A00 07/18/12 Page 1 continued HyperX MODULE DIMENSIONS T E C H N O L O G Y 133.35 Units: millimeters 30.00 18.80 15.80 11.00 8.00 54.70 0.00 0.00 MODULE WITH HEAT SPREADER FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. Document No. 4806450-001.A00 Page 2