Technical Data 4343 Effective December 2015
Supersedes September 2008
Product description
• High current carrying capacity
• Low core losses
• Inductance range from 70nH to 220nH
• Current range from 35 to 108 amps
• Frequency range up to 2MHz
• 7.4 x 7.6 footprint surface mount package in a
7.0mm height
• Ferrite core material
• Halogen free, lead free, RoHS compliant
Applications
• Multi-phase and Vcore regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D
compliant
Pb
HALOGEN
HF
FREE
FP0807
High frequency, high current power inductors
2
Technical Data 4343
Effective December 2015
FP0807
High frequency, high current power inductors
www.eaton.com/elx
Product Specifications
Part Number7OCL1 (nH) ±10% FLL2 (nH) min Irms3 (amps) Isat14 (amps)
I sat25
(amps)
DCR (mΩ)
±6% @ 20°C K-factor6
R1 version
FP0807R1-R07-R 70 50 45 108 79 0.50 520
FP0807R1-R10-R 100 72 45 77 55 0.50 520
FP0807R1-R12-R 120 86 45 66 48 0.50 520
FP0807R1-R16-R 160 115 45 48 36 0.50 520
FP0807R1-R18-R 180 129 45 42 32 0.50 520
FP0807R1-R20-R 200 144 45 38 28 0.50 520
FP0807R1-R22-R 220 158 45 35 25 0.50 520
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc @25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 @25°C
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC
currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will
affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating
conditions verified in the end application.
4. Isat1: Peak current for approximately 20% rolloff at +25°C.
5. Isat2: Peak current for approximately 20% rolloff at +125°C.
6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3, Bp-p : (Gauss), K: (K-factor from
table), L: (inductance in nH), ∆I (peak-to-peak ripple current in amps).
7. Part Number Definition: FP0807Rx-Rxx-R
• FP0807R = Product code and size
• x is the version indicator
• -Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant
Dimensions (mm)
Part marking: 0807Rx (x= version indicator )
Rxx (xx=inductance value in uH, R= decimal point)
wwllyy = date code, R = revision level
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor
Packaging information (mm)
Supplied in tape-and-reel packaging, 600 parts per reel, 13” diameter reel.
Recommended Pad Layout Schematic
1
2
7.0
max
a
b
2.6
2.6
2.0
7.4
max
1.55
+/-0.2
2.0
+/-0.2
3.3
typ.
2
1
2
2.7
0807Rx 7.6
max
Rxx
wwllyy R
7.0
1.5 dia.
7.7
9.5
4.0
2.0
1.5 dia.
A
A
1.75
7.5 16.0
+/-0.3
7.5
16.0
0807Rx
Rxx
wwllyy R
1
2
Section A-A
User direction of feed
3
Technical Data 4343
Effective December 2015
FP0807
High frequency, high current power inductors
www.eaton.com/elx
Temperature rise vs.total loss
Core loss
Inductance characteristics
0
10
20
30
40
50
00.2 0.40.6 0.811.21.4 1.61.8
2
Total Loss (W )
Temperature Rise(°C)
Core Loss vs. B
0.00001
0.0001
0.001
0.01
0.1
1
10
000010001001
B (G auss)
Core Loss (W )
1MHz
500kHz
300kHz
200kHz
100kHz
p-p
p-p
% of OCL vs. % of I
sat
1
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
0% 20% 40%60% 80% 100% 120% 140%
160%
% of I
sat
1
% of OCL
+25°C
-40°C
+125°C
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 4343 BU-SB08620
December 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
FP0807
High frequency, high current power inductors
Technical Data 4343
Effective December 2015
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
