CS4412 30 W Quad Half-Bridge Digital Amplifier Power Stage Features Common Applications Configurable Outputs (10% THD+N) Integrated Digital Televisions - - - - 2 x 15 W into 8 , Full-Bridge 1 x 30 W into 4 , Parallel Full-Bridge 4 x 7 W into 4 , Half-Bridge 2 x 7 W into 4 , Half-Bridge + 1 x 15 W into 8 , Full-Bridge Space-Efficient Thermally-Enhanced QFN - No External Heat Sink Required > 100 dB Dynamic Range - System Level 0.1% THD+N @ 1 W - System Level Built-In Protection with Error Reporting - - - Over-current Thermal Warning and Overload Under-voltage +9 V to +18 V High Voltage Supply PWM Popguard(R) for Quiet Startup High Efficiency (85%) Portable Docking Stations Mini/Micro Shelf Systems Powered Desktop Speakers General Description The CS4412 is a high-efficiency power stage for digital Class-D amplifiers designed to input PWM signals from a modulator such as the CS4525. The power stage outputs can be configured as four half-bridge channels, two half-bridge channels and one full-bridge channel, two full-bridge channels, or one parallel full-bridge channel. The CS4412 integrates on-chip over-current, undervoltage, over-temperature protection and error reporting as well as a thermal warning indicator. The low RDS(ON) outputs can source up to 2.4 A peak current, delivering 85% efficiency. This efficiency provides for a small device package and lower power supplies. The CS4412 is available in a 48-pin QFN package in Commercial grade (-40 to +70 C). The CRD4412 customer reference design is also available. Please refer to "Ordering Information" on page 22 for complete ordering information. Low RDS(ON) Low Quiescent Current Low Power Standby Mode 2.5 V to 5 V 9 V to 18 V VP Non-Overlap Time Insertion Gate Drive Amplifier Out 1 Non-Overlap Time Insertion Gate Drive Amplifier Out 2 In 1 In 2 In 3 In 4 Mode Configuration Reset Hardware Configuration Control Logic Non-Overlap Time Insertion Gate Drive Amplifier Out 3 Current & Thermal Data Protection & Error Reporting Non-Overlap Time Insertion Gate Drive Amplifier Out 4 PGND Advance Product Information http://www.cirrus.com This document contains information for a new product. Cirrus Logic reserves the right to modify this product without notice. Copyright (c) Cirrus Logic, Inc. 2006 (All Rights Reserved) SEPTEMBER '06 DS749A1 CS4412 TABLE OF CONTENTS 1. PIN DESCRIPTION ................................................................................................................................. 2 2. CHARACTERISTICS AND SPECIFICATIONS ...................................................................................... 4 RECOMMENDED OPERATING CONDITIONS .................................................................................... 4 ABSOLUTE MAXIMUM RATINGS ........................................................................................................ 4 PWM POWER OUTPUT CHARACTERISTICS ..................................................................................... 5 DC ELECTRICAL CHARACTERISTICS ................................................................................................ 6 DIGITAL INTERFACE SPECIFICATIONS ............................................................................................. 6 DIGITAL I/O PIN CHARACTERISTICS ................................................................................................. 7 3. TYPICAL CONNECTION DIAGRAMS ................................................................................................. 8 4. APPLICATIONS ................................................................................................................................... 12 4.1 Overview ........................................................................................................................................ 12 4.2 Reset and Power-Up ...................................................................................................................... 12 4.2.1 PWM Popguard Transient Control ........................................................................................ 12 4.2.2 Recommended Power-Up Sequence .................................................................................... 12 4.2.3 Recommended Power-Down Sequence .............................................................................. 13 4.3 Output Mode Configuration ............................................................................................................ 13 4.4 Output Filters ................................................................................................................................. 14 4.4.1 Half-Bridge Output Filter ........................................................................................................ 14 4.4.2 Full-Bridge Output Filter (Stereo or Parallel) ......................................................................... 15 4.5 Device Protection and Error Reporting .......................................................................................... 16 4.5.1 Over-current Protection ......................................................................................................... 16 4.5.2 Thermal Warning, Thermal Error, and Under-Voltage Error ................................................. 16 5. POWER SUPPLY, GROUNDING, AND PCB LAYOUT ....................................................................... 17 5.1 Power Supply and Grounding ........................................................................................................ 17 5.1.1 Integrated VD Regulator ........................................................................................................ 17 5.2 QFN Thermal Pad .......................................................................................................................... 17 6. PARAMETER DEFINITIONS ................................................................................................................ 18 7. PACKAGE DIMENSIONS .................................................................................................................... 19 8. THERMAL CHARACTERISTICS ......................................................................................................... 20 8.1 Thermal Flag .................................................................................................................................. 20 9. ORDERING INFORMATION ................................................................................................................ 21 10. REVISION HISTORY .......................................................................................................................... 21 LIST OF FIGURES Figure 1.Stereo Full-Bridge Typical Connection Diagram ........................................................................... 8 Figure 2.2.1 Channel Typical Configuration Diagram ................................................................................. 9 Figure 3.4-Channel Half-Bridge Typical Connection Diagram .................................................................. 10 Figure 4.Mono Parallel Full-Bridge Typical Connection Diagram ............................................................. 11 Figure 5.Output Filter - Half-Bridge ........................................................................................................... 14 Figure 6.Output Filter - Full-Bridge ............................................................................................................ 15 LIST OF TABLES Table 1. I/O Power Rails ............................................................................................................................. 7 Table 2. Output Mode Configuration Options ............................................................................................ 13 Table 3. Low-Pass Filter Components - Half-Bridge ................................................................................. 14 Table 4. DC-Blocking Capacitors Values - Half-Bridge ............................................................................. 15 Table 5. Low-Pass Filter Components - Full-Bridge ................................................................................. 15 Table 6. Over-current Error Conditions ..................................................................................................... 16 Table 7. Thermal and Under-Voltage Error Conditions ............................................................................. 16 Table 8. VD Supply Level Indication ......................................................................................................... 17 2 DS749A1 CS4412 Pin Name GND GND RST34 RAMP ERROC34 ERROC12 ERRUVTE TWR PGND PGND PGND PGND 1. PIN DESCRIPTION 48 47 46 45 44 43 41 40 39 38 37 42 CNFG0 1 36 VP CNFG1 2 35 OUT1 CNFG2 3 34 PGND IN1 4 33 PGND IN2 5 32 OUT2 IN3 6 31 VP IN4 7 30 VP RST12 8 29 OUT3 LVD 9 28 PGND GND 10 27 PGND VD_REG 11 26 OUT4 VD 12 25 VP CS4412 18 19 GND GND GND GND GND GND 20 21 22 23 24 PGND 17 RAMP_CAP 16 PGND 15 OCREF 14 GND 13 VA_REG Top-Down View 48-Pin QFN Package Pin # Pin Description CNFG0 CNFG1 CNFG2 1 2 3 Out Configuration Select (Input) - Used to set the PWM output configuration mode. See "Output Mode Configuration" on page 14. IN1 IN2 IN3 IN4 4 5 6 7 PWM Input (Input) - Inputs from a PWM modulator. RST1/2 RST3/4 8 46 Reset Input (Input) - Reset inputs for channels 1/2 and 3/4 respectively. Active low. LVD 9 VD Voltage Level Indicator (Input) - Identifies the voltage level attached to VD. When applying 5.0 V to VD, LVD must be connected to VD. When applying 2.5 V or 3.3 V to VD, LVD must be GND. VD_REG 11 Core Digital Power (Output) - Filter connection for the internally generated power supply for the low voltage digital circuitry. VD 12 Digital Power (Input) - Low voltage power supply for internal logic. VA_REG 13 Core Analog Power (Output) - Filter connection for internally generated power supply for the low voltage analog circuitry DS749A1 3 CS4412 Pin Name Pin # Pin Description OCREF 21 Over-current Reference (Input) - Sets over-current trip level. Connect pin through a resistor to GND. See "Device Protection and Error Reporting" on page 17. This pins should not be left floating. RAMP_CAP 24 Output Ramp Capacitor (Input) - Sets the output ramp time for half-bridge configured outputs. GND 10,14 15,16 17,18 19,20 47,48 Ground (Input) - Ground for the internal logic and I/O. These pins should be connected to the common system ground. VP 25,30 31,36 High Voltage Output Power (Input) - High voltage power supply for the individual output power half-bridge devices. PGND 22,23 27,28 33,34 37,38 39,40 Power Ground (Input) - Ground for the individual output power half-bridge devices. These pins should be connected to the common system ground. OUT4 OUT3 OUT2 OUT1 26 29 32 35 PWM Output (Output) - Amplified PWM power half-bridge outputs. TWR 41 Thermal Warning Output (Output) - Thermal warning output. Open drain, active low. See "Device Protection and Error Reporting" on page 17. ERRUVTE 42 Thermal and Under-voltage Error Output (Output) - Error flag for thermal shutdown and undervoltage. Open drain, active low. See "Device Protection and Error Reporting" on page 17 ERROC1/2 ERROC3/4 43 44 Over-current Error Output (Output) - Over-current error flag for the associated outputs. Open drain, active low. See "Device Protection and Error Reporting" on page 17. RAMP 45 Ramp-up/down Select (Input) - Set high to enable ramping. When set low, ramping is disabled. See "PWM Popguard Transient Control" on page 13. 4 DS749A1 CS4412 2. CHARACTERISTICS AND SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS GND=PGND=0 V, all voltages with respect to ground. Parameters Symbol Min Nom Max Units VD 2.375 2.5 2.625 V VD 3.135 3.3 3.465 V VD 4.75 5.0 5.25 V VP 8.1 19.8 V TA -40 - +70 C - +150 C DC Power Supply Digital and Analog Core Power Stage Temperature Ambient Temperature Commercial Junction Temperature TJ ABSOLUTE MAXIMUM RATINGS GND = PGND = 0 V; all voltages with respect to ground. (Note 1) Parameters Symbol Min Max Units VP VP VD -0.3 -0.3 -0.3 19.8 23.0 6.0 V V V DC Power Supply Power Stage Power Stage Digital and Analog Core Outputs Switching and Under Load No Output Switching (Note 2) Inputs (Note 2) Input Current (Note 3) Iin - 10 mA Digital Input Voltage (Note 4) VIND -0.3 VD + 0.4 V Temperature (Note 2) TA -40 +85 C Tstg -65 +150 C Ambient Operating Temperature - Power Applied Commercial Storage Temperature Notes: 1. Operation beyond these limits may result in permanent damage to the device. 2. Normal operation is not guaranteed at these extremes. 3. Any pin except supplies. Transient currents of up to 100 mA on the PWM input pins will not cause SCR latch-up. 4. The maximum over/under voltage is limited by the input current. DS749A1 5 CS4412 PWM POWER OUTPUT CHARACTERISTICS Test Conditions (unless otherwise specified): GND = PGND = 0 V; All voltages with respect to ground; TA = 25 C; VD = 3.3 V; VP = 18 V; RL = 8 for full-bridge, RL = 4 for half-bridge and parallel full-bridge; PWM Switch Rate = 384 kHz; 10 Hz to 20 kHz Measurement Bandwidth; Input source is CS4525 PWM_SIG outputs; Performance measurements taken with a full scale 997 Hz sine wave and AES17 filter. Parameters Symbol Conditions Min Typ Max Units THD+N < 10% THD+N < 1% THD+N < 10% THD+N < 1% THD+N < 10% THD+N < 1% - 15 12 7 5.5 30 23.5 - W W W W W W PO = 1 W PO = 0 dBFS = 11.3 W PO = 1 W PO = 0 dBFS = 5.0 W PO = 1 W PO = 0 dBFS = 22.6 W - 0.1 0.3 0.1 0.3 0.1 0.3 - % % % % % % PO = -60 dBFS, A-Weighted PO = -60 dBFS, Unweighted PO = -60 dBFS, A-Weighted PO = -60 dBFS, Unweighted PO = -60 dBFS, A-Weighted PO = -60 dBFS, Unweighted - 102 99 102 99 102 99 - dB dB dB dB dB dB RDS(ON) Id = 0.5 A, TJ = 50C - 518 615 m Power Output per Channel Stereo Full-Bridge Half-Bridge PO Parallel Full-Bridge Total Harmonic Distortion + Noise Stereo Full-Bridge Half-Bridge THD+N Parallel Full-Bridge Dynamic Range Stereo Full-Bridge Half-Bridge DYR Parallel Full-Bridge MOSFET On Resistance h PO = 2 x 11.3 W, RL = 8 - 85 - % PWmin No Load - 50 - ns Rise Time of OUTx tr Resistive Load - 20 - ns Fall Time of OUTx tf Resistive Load - 20 - ns PWM Output Over-Current Error Trip Point ICE OCREF = 16.2 k 2.4 - - A Junction Thermal Warning Trip Point TTW - 120 - C Efficiency Minimum Output Pulse Width Junction Thermal Error Trip Point TTE - 140 - C VP Under-Voltage Error Trip Point VUV 4.5 - - V Ramp-Up Time - Half-Bridge Configuration TRU Capacitor = 1000 F - 0.8 - s Ramp-Down Time- Half-Bridge Configuration TRD Capacitor = 1000 F - 50 - s 6 DS749A1 CS4412 DC ELECTRICAL CHARACTERISTICS GND = PGND = 0 V; All voltages with respect to ground; PWM switch rate = 384 kHz; Unless otherwise specified. Parameters Min Normal Operation Typ Max Units (Notes 5, 8) Power Supply Current VD = 3.3 V - 20 - mA Power Dissipation VD = 3.3 V - 66 - mW VP = 18 V - 20 - mA 50 % Duty Cycle VP Idle Current (Note 6) Power-Down Mode (Note 7) Power Supply Current VD = 3 .3 V - 4.3 - mA Power Supply Current VP = 18 V - 100 - A 2.25 - 2.5 - 2.75 3 V mA 2.25 - 2.5 - 2.75 1 V mA VD_REG Characteristics Nominal Voltage DC current source VA_REG Characteristics Nominal Voltage DC current source Notes: 5. Normal operation is defined as RSTx/y = HI. 6. All outputs idle. 7. Power-Down Mode is defined as RSTx/y = LOW with all input lines held static. 8. Power supply current increases with increasing PWM switching rates. DIGITAL INTERFACE SPECIFICATIONS GND = PGND = 0 V; All voltages with respect to ground; Unless otherwise specified. Parameters High-Level Input Voltage Low-Level Input Voltage High-Level Output Voltage Input Leakage Current Input Capacitance DS749A1 Io=2 mA Symbol Min Max Units VIH 0.7*VD_REG VD V VIL - 0.20*VD_REG V VOH 0.90*VD - V Iin - 10 A - 8 pF 7 CS4412 DIGITAL I/O PIN CHARACTERISTICS The logic level for each input is set by its corresponding power supply and should not exceed the maximum ratings. Power Pin Supply Number VD VP Pin Name I/O Driver Receiver 1 CNFG0 Input - 2.5 V-5.0 V 2 CNFG1 Input - 2.5 V-5.0 V 3 CNFG2 Input - 2.5 V-5.0 V 4 IN1 Input - 2.5 V-5.0 V 5 IN2 Input - 2.5 V-5.0 V 6 Input - 2.5 V-5.0 V 7 IN3 IN4 Input - 2.5 V-5.0 V 8 RST12 Input - 2.5 V-5.0 V 9 LVD Input - 2.5 V-5.0 V 41 TWR Output 2.5 V-5.0 V, Open Drain - 42 ERRUVTE Output 2.5 V-5.0 V, Open Drain - 43 ERROC12 Output 2.5 V-5.0 V, Open Drain - 44 ERROC34 Output 2.5 V-5.0 V, Open Drain - 45 RAMP Input - 2.5 V-5.0 V 46 RST34 Input/ - 2.5 V-5.0 V 35 OUT1 Output 9 V-18 V Power MOSFET - 32 OUT2 Output 9 V-18 V Power MOSFET - 29 OUT3 Output 9 V-18 V Power MOSFET - 26 OUT4 Output 9 V-18 V Power MOSFET - Table 1. I/O Power Rails 8 DS749A1 CS4412 3. TYPICAL CONNECTION DIAGRAMS +9 V to +18 V +3.3 V or +5.0 V 0.1 F 30 VP VD 0.1 F 31 VP 25 12 0.1 F 0.1 F 36 VP 470 F VP 10 F 0.1 F RAMP_CAP 24 PWM1+ 4 IN1 PWM2+ 5 IN2 PWM3+ 6 IN3 PWM4+ 7 IN4 OUT1 35 Output Filter OUT2 32 Output Filter OUT3 29 Output Filter OUT4 26 Output Filter CS4412 1 CNFG0 2 CNFG1 3 CNFG2 9 LVD 45 RAMP Hardware Control Settings System Control Logic 22 k 22 k 22 k 22 k VD 43 ERROC12 44 ERROC34 42 ERRUVTE 41 TWR 8 RST12 46 RST34 11 VD_REG GND 10 10 F 0.1 F GND 14 GND 15 13 GND 16 VA_REG 10 F 0.1 F GND 17 GND 18 GND 19 16.2 k 21 GND 20 OCREF GND 47 PG N D P G N D PG N D PG N D PG N D PG N D PG N D PG N D PG N D PG N D GND 48 22 23 27 28 33 34 37 38 39 40 Figure 1. Stereo Full-Bridge Typical Connection Diagram DS749A1 9 CS4412 +9 V to +18 V +3.3 V or +5.0 V 0.1 F 25 30 0.1 F 31 VP VD VP 12 0.1 F 0.1 F 470 F 470 F 36 VP 470 F VP 10 F 0.1 F RAMP_CAP 24 PWM1+ 4 IN1 PWM2+ 5 IN2 PWM3+ 6 IN3 PWM4+ 7 IN4 OUT1 35 Output Filter OUT2 32 Output Filter OUT3 29 Output Filter OUT4 26 Output Filter CS4412 1 CNFG0 2 CNFG1 3 CNFG2 9 LVD 45 RAMP 43 ERROC12 Hardware Control Settings System Control Logic 22 k 22 k 22 k 22 k VD 44 ERROC34 42 ERRUVTE 41 TWR 8 RST12 46 RST34 11 VD_REG GND 10 10 F 0.1 F GND 14 GND 15 13 10 F VA_REG GND 16 0.1 F GND 17 GND 18 GND 19 16.2 k 21 GND 20 OCREF GND 47 PG N D P G N D PG N D PG N D PG N D PG N D PG N D PG N D PG N D PG N D GND 48 22 23 27 28 33 34 37 38 39 40 Figure 2. 2.1 Channel Typical Configuration Diagram 10 DS749A1 CS4412 +9 V to +18 V +3.3 V or +5.0 V 10 F 0.1 F 470 F 470 F 0.1 F 0.1 F 0.1 F 0.1 F 470 F 470 F 390 pF 36 VP VP VD 31 VP 30 VP 25 12 RAMP_CAP 24 PWM1+ 4 IN1 PWM2+ 5 IN2 PWM3+ 6 IN3 PWM4+ 7 IN4 OUT1 35 Output Filter OUT2 32 Output Filter OUT3 29 Output Filter OUT4 26 Output Filter CS4412 Hardware Control Settings 1 CNFG0 2 CNFG1 3 CNFG2 9 LVD 45 RAMP System Control Logic 22 k 22 k 22 k 22 k VD 43 ERROC12 44 ERROC34 42 ERRUVTE 41 TWR 8 RST12 46 RST34 11 VD_REG GND 10 10 F 0.1 F GND 14 GND 15 13 10 F GND 16 VA_REG 0.1 F GND 17 GND 18 GND 19 16.2 k 21 GND 20 OCREF GND 47 PG PG PG PG N D N D N D PG N D N D N D PG N D N D PG D PG 22 P G N PG N D GND 48 23 27 28 33 34 37 38 39 40 Figure 3. 4-Channel Half-Bridge Typical Connection Diagram DS749A1 11 CS4412 +9 V to +18 V +3.3 V or +5.0 V 0.1 F 30 VP VD 0.1 F 31 VP 25 12 0.1 F 0.1 F 36 VP 470 F VP 10 F 0.1 F RAMP_CAP 24 PWM1+ 4 IN1 PWM2+ 5 IN2 PWM3+ 6 IN3 PWM4+ 7 IN4 CS4412 Hardware Control Settings 1 CNFG0 2 CNFG1 OUT1 35 3 CNFG2 OUT2 32 9 LVD 45 RAMP OUT3 29 OUT4 26 22 k 22 k 22 k VD 43 System Control Logic Output Filter Output Filter ERROC12 44 ERROC34 42 ERRUVTE 41 TWR 8 RST12 46 RST34 11 VD_REG GND 10 10 F 0.1 F GND 14 GND 15 13 10 F GND 16 VA_REG 0.1 F GND 17 GND 18 GND 19 16.2 k 21 GND 20 OCREF GND 47 PG N D P G N D PG N D PG N D PG N D PG N D PG N D PG N D PG N D PG N D GND 48 22 23 27 28 33 34 37 38 39 40 Figure 4. Mono Parallel Full-Bridge Typical Connection Diagram 12 DS749A1 CS4412 4. APPLICATIONS 4.1 Overview The CS4412 is a high-efficiency power stage for digital Class-D amplifiers designed to be configured as four half-bridge channels, two half-bridge channels and one full-bridge channel, two full-bridge channels, or one parallel full-bridge channel. The CS4412 integrates on-chip over-current, under-voltage, over-temperature protection and error reporting as well as a thermal warning indicator. The low RDS(ON) outputs can source up to 2.4 A peak current, delivering 85% efficiency. This efficiency provides for smaller device package, no external heat sink requirements, and smaller power supplies. 4.2 Reset and Power-Up Reliable power-up can be accomplished by keeping the device in reset until the power supplies, clocks, and configuration pins are stable. It is also recommended that the RSTx/y pin be activated if the voltage supplies drop below the recommended operating condition to prevent power-glitch- related issues. When RSTx/y is low, the corresponding channels of the CS4412 enter a low-power mode and all of the channels' internal states are reset and the outputs are set to HI-Z. When RSTx/y is high, the desired mode settings will be loaded and the outputs will begin normal operation. 4.2.1 PWM Popguard Transient Control The CS4412 uses Popguard technology to minimize the effects of output transients during power-up and power-down for half-bridge configurations. This technique reduces the audio transients commonly produced by half-bridge, single-supply amplifiers when implemented with external DC-blocking capacitors connected in series with the audio outputs. When the device is configured for ramping (RAMP set high) and RSTx/y is set high, the OUTx/y outputs will ramp-up to the bias point (VP/2). This gradual voltage ramping allows time for the external DC-blocking capacitor to charge to the quiescent voltage, minimizing the power-up transient. The OUTx/y outputs will not begin normal operation until the ramp has reached the bias point. The INx/y inputs must begin switching before the ramp cycle begins. When the device is configured for ramping (RAMP set high) and RSTx/y is set low, the OUTx/y outputs will begin to slowly ramp down from the bias point to PGND, allowing the DC-blocking capacitor to discharge. The ramp feature should only be used in quad half-bridge configuration. It is not necessary to complete a ramp-up/down sequence before ramping up/down again. 4.2.2 Recommended Power-Up Sequence 1. Turn on the system power. 2. Hold RSTx/y low until the power supply and system clocks are stable. In this state, all associated outputs are HI-Z. 3. Start the PWM modulator output. 4. Once the PWM modulator output is valid, release RSTx/y high. If the CS4412 is configured for ramping, the outputs will ramp to the bias point and then begin switching normally. If the CS4412 is not configured for ramping, the outputs will immediately begin switching normally. DS749A1 13 CS4412 4.2.3 Recommended Power-Down Sequence 1. Mute the logic-level PWM inputs present on IN1 - IN4 by applying 50 % duty-cycle inputs. 2. Set RSTx/y low. If the CS4412 is configured for ramping, the outputs will ramp down to PGND and then become HI-Z. If the CS4412 is not configured for ramping, the outputs will immediately become HI-Z. 3. Power down the remainder of the system. 4. Turn off the system power. 4.3 Output Mode Configuration The CS4412 can be configured for several modes of operation. Table 2 shows the setting of the CNFG[2:0] inputs and the corresponding mode of operation. These pins should remain static during operation (RSTx/y set high). CNFG2 CNFG1 CNFG0 Output Config. 0 0 0 Stereo Full-Bridge Tied Loads Stereo Half-Bridge and Mono FullBridge Tied Loads Mono Parallel FullBridge Tied Load Quad Half-Bridge Tied Loads 0 0 1 0 1 0 0 1 1 1 0 0 Stereo Full-Bridge Tied Loads With Inversion 1 0 1 1 1 0 1 1 1 Stereo Half-Bridge & Mono Full-Bridge Tied Loads With Inversion Mono Parallel FullBridge Tied Load With Inversion Quad Half-Bridge Tied Loads Description IN1 must be inverted from IN2 for full-bridge operation. IN3 must be inverted from IN4 for full-bridge operation. IN1 must be provided for half-bridge operation. IN2 must be provided for half-bridge operation. IN3 must be inverted from IN4 for full-bridge operation. IN1 and IN3 must be inverted from IN2 and IN4 for parallel fullbridge operation. IN1 must be provided for half-bridge operation. IN2 must be provided for half-bridge operation. IN3 must be provided for half-bridge operation. IN4 must be provided for half-bridge operation. IN1 must be provided for full-bridge operation. Wire IN2 to IN1. IN2 is internally inverted for full-bridge operation. IN3 must be provided for full-bridge operation. Wire IN4 to IN3. IN4 is internally inverted for full-bridge operation. IN1 must be provided for half-bridge operation. IN2 must be provided for half-bridge operation. IN3 must be provided for full-bridge operation. Wire IN4 to IN3. IN4 is internally inverted for full-bridge operation. IN1 must be provided for parallel full-bridge operation. Wire IN4, IN3, and IN2 to IN1. IN2 and IN4 are internally inverted for parallel full-bridge operation. IN1 must be provided for half-bridge operation. IN2 must be provided for half-bridge operation. IN3 must be provided for half-bridge operation. IN4 must be provided for half-bridge operation. Table 2. Output Mode Configuration Options 14 DS749A1 CS4412 4.4 Output Filters The filter placed after the PWM outputs can greatly affect the output performance. The filter not only reduces radiated EMI (snubber filter), but also filters high frequency content from the switching output before going to the speaker (low-pass LC filter). 4.4.1 Half-Bridge Output Filter Figure 5 shows the output filter for a half-bridge configuration. The transient-voltage suppression circuit (snubber circuit) is comprised of a resistor (20 , 1/4 W) and capacitors (220 pF) and should be placed as close as possible to the corresponding PWM output pin to greatly reduce radiated EMI. VP PWM Output L1 C2 + - 20 220 pF *Diode is Zetex ZHCS400 or equivalent C1 Figure 5. Output Filter - Half-Bridge The inductor, L1, and capacitor, C1, comprise the low-pass filter. Along with the nominal load impedance of the speaker, these values set the cutoff frequency of the filter. Table 3 shows the component values for L1 and C1 based on nominal speaker (load) impedance for a corner frequency (-3 dB point) of approximately 35 kHz. Load L1 C1 4 6 8 22 H 33 H 47 H 1.0 F 0.68 F 0.47 F Table 3. Low-Pass Filter Components - Half-Bridge C2 is the DC-blocking capacitor. Table 4 shows the component values for C2 based on corner frequency (-3 dB point) and a nominal speaker (load) impedances of 4 , 6 , and 8 . This capacitor should also be chosen to have a ripple current rating above the amount of current that will passed through it. DS749A1 15 CS4412 Load Corner Frequency C2 4 40 Hz 58 Hz 120 Hz 39 Hz 68 Hz 120 Hz 42 Hz 60 Hz 110 Hz 1000 F 680 F 330 F 680 F 390 F 220 F 470 F 330 F 180 F 6 8 Table 4. DC-Blocking Capacitors Values - Half-Bridge 4.4.2 Full-Bridge Output Filter (Stereo or Parallel) Figure 6 shows the output filter for a full-bridge configuration. The transient-voltage suppression circuit (snubber circuit) is comprised of a resistor (20 ) and capacitor (330 pF) and should be placed as close as possible to the corresponding PWM output pins to greatly reduce radiated EMI. The inductors, L1, and capacitor, C1, comprise the low-pass filter. Along with the nominal load impedance of the speaker, these values set the cutoff frequency of the filter. Table 5 shows the component values based on nominal speaker (load) impedance for a corner frequency (-3 dB point) of approximately 35 kHz. VP + PWM Output L1 *Diode is Zetex ZHCS400 or equivalent 20 330 pF C1 VP - PWM Output L1 Figure 6. Output Filter - Full-Bridge Load L1 C1 4 6 8 10 H 15 H 22 H 1.0 F 0.47 F 0.47 F Table 5. Low-Pass Filter Components - Full-Bridge 16 DS749A1 CS4412 4.5 Device Protection and Error Reporting The CS4412 has built-in protection circuitry for over-current, under-voltage, and thermal warning/overload conditions. The levels of the over-current error, thermal error, and VP under-voltage trip points are listed in the PWM Power Output Characteristics table on page 6. Automatic shut-down will occur whenever any of these preset thresholds are crossed. Each error and warning pin implements an active-low open-drain driver and requires an external pull-up for proper operation. 4.5.1 Over-current Protection Over-current errors are reported on the ERROCx/y pins. For example, an over-current error on OUT1 is reported by the ERROC1/2 pin. The power output of the channel which is reporting the over-current condition will be set to high-impedance until the error condition has been removed and the RSTx/y signal for that channel has been toggled from low to high. ERROCx/y 0 1 Reported Condition Over-current error on channel x or channel y. Operating current of channel x and y within allowable limits. Table 6. Over-current Error Conditions 4.5.2 Thermal Warning, Thermal Error, and Under-Voltage Error Table 7 shows the behavior of the TWR and ERRUVTE pins. When the junction temperature exceeds the junction thermal warning trip point, the TWR pin will be set low. If the junction temperature continues to increase beyond the junction thermal error trip point, the ERRUVTE pin will be set low. If the voltage on VP falls below the VP under-voltage error trip point, ERRUVTE will be set low. When the thermal error or VP under-voltage trip point is crossed, all power outputs will be set to highimpedance until the error condition has been removed and the RSTx/y signals have been toggled from low to high. TWR ERRUVTE 0 0 1 1 0 1 0 1 Reported Condition Thermal warning and thermal error and/or under-voltage error. Thermal warning only. Under-voltage error. Junction temperature and VP voltage within normal limits. Table 7. Thermal and Under-Voltage Error Conditions DS749A1 17 CS4412 5. POWER SUPPLY, GROUNDING, AND PCB LAYOUT 5.1 Power Supply and Grounding The CS4412 requires careful attention to power supply and grounding arrangements if its potential performance is to be realized. Extensive use of power and ground planes, ground plane fill in unused areas and surface mount decoupling capacitors are recommended. It is necessary to decouple the power supply by placing capacitors directly between the power and ground of the CS4412. Decoupling capacitors should be as close to the pins of the CS4412 as possible. The lowest value ceramic capacitor should be closest to the pin and should be mounted on the same side of the board as the CS4412 to minimize inductance effects. The CRD4412 reference design demonstrates the optimum layout and power supply arrangements. 5.1.1 Integrated VD Regulator The CS4412 includes two internal linear regulators, one from the VD supply voltage to provide a fixed 2.5 V supply to its internal digital blocks, and another from the VD supply voltage to provide a fixed 2.5 V supply to its internal analog blocks. The LVD pin must be set to indicate the voltage present on the VD pin as shown in Table 8 below. LVD Low High Indicated VD Supply Level 2.5 V or 3.3 V Nominal 5 V Nominal Table 8. VD Supply Level Indication The output of the digital regulator is presented on the VD_REG pin and may be used to provide an external device with up to 3 mA of current at its nominal output voltage of 2.5 V. The output of the analog regulator is presented on the VA_REG pin and must only be connected to the bypass capacitors as shown in the typical connection diagrams. If a nominal supply voltage of 2.5 V is used as the VD supply (see the Recommended Operating Conditions table on page 5), the VD, VD_REG, and VA_REG pins must all be connected to the VD supply source. In this configuration, the internal regulators are bypassed and the external supply source is used to directly drive the internal digital and analog sections. 5.2 QFN Thermal Pad The CS4412 is available in a compact QFN package. The underside of the QFN package reveals a large metal pad that serves as a thermal relief to provide for maximum heat dissipation. This pad must mate with an equally dimensioned copper pad on the PCB and must be electrically connected to ground. A series of thermal vias should be used to connect this copper pad to one or more larger ground planes on other PCB layers. The CRD4412 reference design demonstrates the optimum thermal pad and via configuration. 18 DS749A1 CS4412 6. PARAMETER DEFINITIONS Dynamic Range (DYR) The ratio of the rms value of the signal to the rms sum of all other spectral components over the specified bandwidth, typically 20 Hz to 20 kHz. Dynamic Range is a signal-to-noise ratio measurement over the specified band width made with a -60 dBFS signal. 60 dB is then added to the resulting measurement to refer the measurement to full-scale. This technique ensures that the distortion components are below the noise level and do not effect the measurement. This measurement technique has been accepted by the Audio Engineering Society, AES17-1991, and the Electronic Industries Association of Japan, EIAJ CP-307. Expressed in decibels. Total Harmonic Distortion + Noise (THD+N) The ratio of the rms value of the signal to the rms sum of all other spectral components over the specified band width (typically 10 Hz to 20 kHz), including distortion components. Expressed in decibels. Measured at -1 and -20 dBFS as suggested in AES17-1991 Annex A. DS749A1 19 CS4412 7. PACKAGE DIMENSIONS 48L QFN (9 x 9 MM BODY) PACKAGE DRAWING e b D Pin #1 ID Pin #1 ID E E2 A1 L D2 A Top View DIM MIN A A1 b D D2 E E2 e L -0.0000 0.0118 0.2618 0.2618 0.0177 Side View INCHES NOM --0.0138 0.3543 BSC 0.2677 0.3543 BSC 0.2677 0.0256 BSC 0.0217 Bottom View MAX MIN 0.0354 0.0020 0.0157 -0.00 0.30 0.2736 6.65 0.2736 6.65 0.0276 0.45 MILLIMETERS NOM --0.35 9.00 BSC 6.80 9.00 BSC 6.80 0.65 BSC 0.55 NOTE MAX 0.90 0.05 0.40 6.95 6.95 0.70 1 1 1,2 1 1 1 1 1 1 JEDEC #: MO-220 Controlling Dimension is Millimeters. Notes: 1. Dimensioning and tolerance per ASME Y4.5M - 1994. 2. Dimensioning lead width applies to the plated terminal and is measured between 0.20 mm and 0.25 mm from the terminal tip. 20 DS749A1 CS4412 8. THERMAL CHARACTERISTICS Parameter Junction to Case Thermal Impedance 8.1 Symbol Min Typ Max Units JC - 1 - C/Watt Thermal Flag This device is designed to have the metal flag on the bottom of the device soldered directly to a metal plane on the PCB. To enhance the thermal dissipation capabilities of the system, this metal plane should be coupled with vias to a large metal plane on the backside (and inner ground layer, if applicable) of the PCB. In either case, it is beneficial to use copper fill in any unused regions inside the PCB layout, especially those immediately surrounding the CS4412. In addition to improving in electrical performance, this practice also aids in heat dissipation. The heat dissipation capability required of the metal plane for a given output power can be calculated as follows: CA = [(TJ(MAX) - TA) / PD] - JC where, CA = Thermal resistance of the metal plane in C/Watt TJ(MAX) = Maximum rated operating junction temperature in C, equal to 150 C TA = Ambient temperature in C PD = RMS power dissipation of the device, equal to 0.15*PRMS-IN or 0.176*PRMS-OUT (assuming 85% efficiency) JC = Junction-to-case thermal resistance of the device in C/Watt DS749A1 21 CS4412 9. ORDERING INFORMATION Product Description CS4412 30 W Quad HalfBridge Digital Amplifier Power Stage Package 48-QFN Yes Commercial CRD4412 1 x 30 W Reference Design Daughter Card - - CRD4525 2 x 15 W Reference Design Main Board - - Pb-Free Grade Temp Range Container Order# Rail CS4412-CNZ -40 to +70C Tape and Reel CS4412-CNZR - - - CRD4412 - - - CRD4525 10.REVISION HISTORY Release A1 Changes Initial Release Contacting Cirrus Logic Support For all product questions and inquiries, contact a Cirrus Logic Sales Representative. To find one nearest you, go to www.cirrus.com. IMPORTANT NOTICE "Advance" product information describes products that are in development and subject to development changes. Cirrus Logic, Inc. and its subsidiaries ("Cirrus") believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided "AS IS" without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN AIRCRAFT SYSTEMS, MILITARY APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER'S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS' FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES. Cirrus Logic, Cirrus, and the Cirrus Logic logo designs, and Popguard are trademarks of Cirrus Logic, Inc. All other brand and product names in this document may be trademarks or service marks of their respective owners. 22 DS749A1