INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-LCB120-R09 1
LCB120
Single-Pole, Normally Closed
OptoMOS® Relay
e3
Pb
Part # Description
LCB120 6-Pin DIP (50/Tube)
LCB120S 6-Pin Surface Mount (50/Tube)
LCB120STR 6-Pin Surface Mount (1000/Reel)
* For other packaging options consult factory.
Parameter Ratings Units
Blocking Voltage 250 VP
Load Current 170 mArms / mADC
On-Resistance (max) 20
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Surface Mount Tape & Reel Version Available
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
Approvals
Switching Characteristics
of Normally Closed Devices
1
3
2
4
5
6
+ Control
– Control
Do Not Use
Load
Do Not Use
Load
AC/DC Configuration
1
3
2
4
5
6
+ Control
– Control
Do Not Use
+ Load
– Load
DC Only Configuration
Form-B
IF
10%
90%
ILOAD
ton
toff
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
The LCB120 is a single-pole, normally closed
(1-Form-B) relay that uses optically coupled MOSFET
technology to provide 3750Vrms of input to output
isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
The LCB120 has low on-resistance, and is well suited
for most applications requiring a normally closed relay.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R09
LCB120
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 250 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
1 Derate linearly 6.67 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current, Continuous
AC/DC Confi guration -I
L
- - 170 mArms / mADC
DC Confi guration - - 300 mADC
Peak Load Current t=10ms IL- - ±400 mAP
On-Resistance
AC/DC Confi guration IL=170mA RON
-1120
DC Confi guration IL=300mA - 5 6
Off-State Leakage Current IF=5mA, VL=250VPILEAK --1A
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 0.65 5 ms
Turn-Off toff - 1.30 5 ms
Output Capacitance VL=50V, f=1MHz, IF=50mA COUT -50 -pF
Input Characteristics
Input Control Current to Activate IL=170mA IF--5mA
Input Control Current to Deactivate - IF0.4 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10A
Common Characteristics
Input to Output Capacitance - CI/O -3 -pF
Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION
LCB120
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R09
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0.42 0.66 0.900.54 0.78
Turn-On Time (ms)
Device Count (N)
35
30
25
20
15
10
5
0
0.30
Typical Turn-On Time
(N=50, IF=5mA, IL=170mADC)
0.875 1.375 1.8750.625 1.125 1.625
Turn-Off Time (ms)
Device Count (N)
35
30
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=170mADC)
0.63 0.81 1.17 1.530.99 1.35
LED Current (mA)
Device Count (N)
30
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=170mADC)
35
25
20
15
10
5
0
0.63 0.99 1.350.45 0.81 1.17
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=170mADC)
35
30
25
20
15
10
5
0
10.4 10.8 11.2 12.011.6 12.4
On-Resistance (:)
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=170mADC)
35
30
25
20
15
10
5
0
291.25 293.75 296.25 298.75 301.25 303.75
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, IF=5mA)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
Temperature (ºC) LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.634
0.632
0.630
0.628
0.626
0.624
0.622
50
Typical Turn-On Time
vs. LED Forward Current
(IL=170mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=170mADC)
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
INTEGRATED CIRCUITS DIVISION
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4R09
LCB120
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
On-Resistance (:)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical On-Resistance
vs. Temperature
(IL=170mADC)
Turn-On Time (ms)
-40
0.12
0.10
0.08
0.06
0.04
0.02
0
-20 0 20 40 60 80 100
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=170mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
IF=5mA
IF=10mA
IF=20mA
Typical Turn-Off Time
vs. Temperature
(IL=170mADC)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=170mADC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical IF for Switch Dropout
vs. Temperature
(IL=170mADC)
Temperature (ºC)
Load Current (mA)
250
200
150
100
50
0
Maximum Load Current
vs. Temperature
(IF=0mA)
-40 -20 0 20 40 60 80 120100
Temperature (ºC)
Load Voltage (V)
Load Current (mA)
200
150
100
50
0
-50
-100
-150
-200
-2.0 -1.5 -1.0 -0.5 0.5 1.0 1.5
02.0
Typical Load Current
vs. Load Voltage
Blocking Voltage (VP)
-40
310
305
300
295
290
285
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
(IF=5mA)
Temperature (ºC)
Leakage (PA)
-40
0.030
0.025
0.020
0.015
0.010
0.005
0-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(IF=5mA)
Temperature (ºC)
Time
Load Current (A)
1.2
1.0
0.8
0.6
0.4
0.2
0
10Ps 1ms 100ms 10s100Ps 10ms 1s 100s
Energy Rating Curve
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
INTEGRATED CIRCUITS DIVISION
LCB120
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R09
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LCB120 / LCB120S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LCB120 / LCB120S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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Pb
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R09
LCB120
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002) 4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020) 6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
LCB120
LCB120S
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
Specification: DS-LCB120-R09
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
For additional information please visit our website at: www.ixysic.com
7
LCB120
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
A0 = 10.10
(0.398)
P = 12.00
(0.472)
K1 = 3.80
(0.15)
K0 = 4.90
(0.19)
User Direction of Feed
LCB120STR Tape & Reel
Mouser Electronics
Authorized Distributor
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