AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Features 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor AR0230CS Datasheet, Rev. 8 For the latest datasheet, please visit www.onsemi.com Features continuous video and single frames makes it the perfect choice for a wide range of applications, including surveillance and HD video. * Superior low-light performance * Latest 3.0 m pixel with ON Semiconductor DR-PixTM technology with Dual Conversion Gain * Full HD support at up to 1080P 60 fps for superior video performance * Linear or high dynamic range capture * Optional adaptive local tone mapping (ALTM) * Pixel or Line interleaved T1/T2 output * Support for external mechanical shutter * On-chip phase-locked loop (PLL) oscillator * Integrated position-based color and lens shading correction * Slave mode for precise frame-rate control * Stereo/3D camera support * Statistics engine * Data interfaces: four-lane serial high-speed pixel interface (HiSPi) differential signaling (SLVS and HiVCM), or parallel * Auto black level calibration * High-speed configurable context switching * Temperature sensor Table 1: Parameter Typical Value Optical format 1/2.7-inch (6.6 mm) Active pixels 1928(H) x 1088(V) (16:9 mode) Pixel size 3.0 m x 3.0m Color filter array RGB Bayer Shutter type Electronic rolling shutter and GRR Input clock range 6 - 48 MHz Output clock maximum 148.5 Mp/s (4-lane HiSPi) 74.25 Mp/s (Parallel) Output Frame rate Serial HiSPi 10-, 12-, 14-, 16-, or 20-bit Parallel 10-, 12-bit 1080p 60 fps Responsivity 4.0 V/lux-sec SNRMAX 41 dB Max Dynamic range Up to 96 dB I/O Applications Supply Digital voltage Analog * Video surveillance * 1080p60 (Surveillance) video applications * High dynamic range imaging HiSPi 1.8 or 2.8 V 1.8 V 2.8 V 0.3 V - 0.6 V (SLVS), 1.7 V - 1.9 V (HiVcm) 386 mW (Linear, 1080p30, 25C, parallel Power consumption output) (typical) 558 mW (HDR, 1080p30, 25C, parallel output) General Description ON Semiconductor's AR0230CS is a 1/2.7-inch CMOS digital image sensor with an active-pixel array of 1928Hx1088V. It captures images in either linear or high dynamic range modes, with a rolling-shutter readout. It includes sophisticated camera functions such as in-pixel binning, windowing and both video and single frame modes. It is designed for both low light and high dynamic range scene performance. It is programmable through a simple two-wire serial interface. The AR0230CS produces extraordinarily clear, sharp digital pictures, and its ability to capture both AR0230CS/D Rev. 8, Pub. 11/15 EN Key Parameters 1 Operating temperature -30C to +85C ambient Package options 10x10 mm 80-pin iBGA (c)Semiconductor Components Industries, LLC 2015, AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Ordering Information Ordering Information Table 2: Available Part Numbers Part Number Product Description Orderable Product Attribute Description AR0230CSSC00SUEA0-DRBR 2 Mp 1/3" CIS RGB, 0deg CRA, iBGA Package Drypack, Anti-Reflective Glass AR0230CSSC00SUEAD3-GEVK RGB, 0deg CRA, Demo Kit Demo Kit AR0230CSSC00SUEAH3-GEVB RGB, 0deg CRA, Headboard Headboard AR0230CSSC12SUEA0-DR 2 Mp 1/3" CIS RGB, 12deg CRA, iBGA Package Drypack AR0230CSSC12SUEAD3-GEVK RGB, 12deg CRA, Demo Kit Demo Kit AR0230CSSC12SUEAH3-GEVB RGB, 12deg CRA, Headboard Headboard See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the naming convention used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at www.onsemi.com. AR0230CS/D Rev. 8, Pub. 11/15 EN 2 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Table of Contents Table of Contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Pixel Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Features Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Power-On Reset and Standby Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Package Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 AR0230CS/D Rev. 8, Pub. 11/15 EN 3 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor List of Figures List of Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Block Diagram of AR0230CS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Typical Configuration: Serial Four-Lane HiSPi Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Typical Configuration: Parallel Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 80-Ball IBGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Pixel Array Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Pixel Color Pattern Detail (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Imaging a Scene . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Quantum Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 I/O Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Power Down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 80iBGA 10 x 10 Package Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 AR0230CS/D Rev. 8, Pub. 11/15 EN 4 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor List of Tables List of Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Key Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Pin Descriptions, 80-ball iBGA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 List of Configurable Registers for Context A and Context B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 I/O Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1080p30 HDR (ALTM) 74MHz Parallel 2.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 1080p30 Linear 74MHz Parallel 2.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 1080p30 HDR (ALTM) 74MHz Parallel 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 1080p30 Linear 74 MHz Parallel 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 1080p30 HDR (ALTM) 74 MHz HiSPi SLVS (Low Power Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 1080p30 Linear 74 MHz HiSPi SLVS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 1080p30 HDR (ALTM) 74 MHz HiSPi HiVcm (Low Power Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 1080p30 Linear 74 MHz HiSPi HiVcm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Line Interleaved HiSPi SLVS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Line Interleaved HiSPi HiVcm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Channel Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Power-Up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 AR0230CS/D Rev. 8, Pub. 11/15 EN 5 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor General Description General Description The ON Semiconductor AR0230CS can be operated in its default mode or programmed for frame size, exposure, gain, and other parameters. The default mode output is a 1080p-resolution image at 60 frames per second (fps) through the HiSPi port. In linear mode, it outputs 12-bit or 10-bit A-Law compressed raw data, using either the parallel or serial (HiSPi) output ports. In high dynamic range mode, it outputs 12-bit compressed data using parallel output. In HiSPi mode, 12- or 14-bit compressed, or 16-bit linearized data may be output. The device may be operated in video (master) mode or in single frame trigger mode. FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a synchronized pixel clock in parallel mode. The AR0230CS includes additional features to allow application-specific tuning: windowing and offset, auto black level correction, and on-board temperature sensor. Optional register information and histogram statistic information can be embedded in the first and last 2 lines of the image frame. The AR0230CS is designed to operate over a wide temperature range of -30C to +85C ambient. AR0230CS/D Rev. 8, Pub. 11/15 EN 6 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Functional Overview Functional Overview The AR0230CS is a progressive-scan sensor that generates a stream of pixel data at a constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally enabled to generate all internal clocks from a single master input clock running between 6 and 48 MHz. The maximum output pixel rate is 148.5 Mp/s, corresponding to a clock rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor configured in linear mode, and in HDR mode. Figure 1: Block Diagram of AR0230CS In Linear Mode In HDR Mode ADC Data ADC Data 12 12 Row Noise Correction Row Noise Correction Black Level Correction Black Level Correction Test Pattern Generator Test Pattern Generator Pixel Defect Correction Pixel Defect Correction Adaptive CD Filter Adaptive CD Filter 12 12 Digital Gain and Pedestal Digital Gain and Pedestal Motion Correction HDR HDRLinearization Linearization A-Law Compression Smoothing Filter 10 bits 16 12 bits 16 bits HiSPi Parallel Companding or ALTM 14 or 12 bits HiSPi 12 bits Parallel User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the sensor is a 2.1 Mp Active- Pixel Sensor array. The timing and control circuitry sequences through the rows of the array, resetting and then reading each row in turn. In the time interval between resetting a row and reading that row, the pixels in the row integrate incident light. The exposure is controlled by varying the time interval between reset and readout. Once a row has been read, the data from the columns is sequenced through an analog signal chain (providing offset correction and gain), and then through an analogto-digital converter (ADC). The output from the ADC is a 12-bit value for each pixel in the array. The ADC output passes through a digital processing signal chain (which provides further data path corrections and applies digital gain). The sensor also offers a AR0230CS/D Rev. 8, Pub. 11/15 EN 7 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Functional Overview high dynamic range mode of operation where multiple images are combined on-chip to produce a single image at 16-bit per pixel value. A compression mode is further offered to allow the 16 bits per pixel to be transmitted to the host system as a 12-bit value with close to zero loss in image quality. Typical Configuration: Serial Four-Lane HiSPi Interface VDD_IO 1.5k2 1.5k2 Digital Digital I/O Core power1 power1 VDD Master clock (6-48 MHz) EXTCLK From controller SADDR SDATA SCLK TRIGGER OE_BAR RESET_BAR HiSPi power1 VDD_SLVS Figure 2: VDD Notes: AR0230CS/D Rev. 8, Pub. 11/15 EN VDD_SLVS VDD_PLL VAA VDD_PLL VAA VAA_PIX SLVS0_P SLVS0_N SLVS1_P SLVS1_N SLVS2_P SLVS2_N SLVS3_P SLVS3_N SLVSC_P SLVSC_N FLASH SHUTTER TEST VDD_IO PLL Analog Analog power1 power1 power1 DGND AGND Digital ground Analog ground To controller VAA_PIX 1. All power supplies must be adequately decoupled. 2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for slower two-wire speed. 3. The parallel interface output pads can be left unconnected if the serial output interface is used. 4. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the AR0230CS demo headboard schematics for circuit recommendations. 5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized. 6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents. 8 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Functional Overview Figure 3: Typical Configuration: Parallel Pixel Data Interface 1.5k2, 1.5k2 Digital Digital core I/O power1 power1 Master clock (6-48 MHz) VDD_IO PLL Analog Analog power1 power1 power1 VDD DOUT [11:0] EXTCLK PIXCLK LINE_VALID FRAME_VALID SADDR SDATA SCLK TRIGGER OE_BAR From Controller VAA_PIX VDD_PLL VAA To controller FLASH SHUTTER RESET_BAR TEST DGND VDD_IO VDD VDD_PLL VAA VAA_PIX Digital ground Notes: AR0230CS/D Rev. 8, Pub. 11/15 EN AGND Analog ground 1. All power supplies must be adequately decoupled. 2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for slower two-wire speed. 3. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used. 4. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the AR0230CS demo headboard schematics for circuit recommendations. 5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized. 6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents. 7. The EXTCLK input is limited to 6-48 MHz. 9 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Functional Overview Figure 4: 80-Ball IBGA Package 1 A 2 3 4 5 6 7 8 9 SLVS0_P SLVS1_P SLVSC_P SLVS2_P SLVS3_P VDD VDD_IO SLVSC_N SLVS2_N SLVS3_N DGND DGND SHUTTER DGND DGND DGND Reserved TRIGGER DGND AGND AGND B VDD_PLL SLVS0_N SLVS1_N C VAA AGND DGND VDD_ SLVS VDD D VDD DGND EXTCLK PIXCLK SADDR E VDD_IO DGND SDATA FLASH FRAME_ VALID SCLK DGND F VDD DGND DOUT11 DOUT10 DOUT9 LINE_ VALID Reserved G VAA AGND DGND DOUT8 DOUT7 DOUT6 H VDD_IO DGND DGND DOUT5 DOUT4 DOUT3 J DOUT2 VDD_IO DOUT1 DOUT0 VDD DGND VDD VAA VAA_PIX AGND VAA DGND DGND VDD_IO RESET_ BAR TEST VDD_IO VDD OE_BAR VDD_IO Top View (Ball Down) AR0230CS/D Rev. 8, Pub. 11/15 EN 10 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Functional Overview Table 3: Pin Descriptions, 80-ball iBGA Name iBGA Pin Type Description SLVS0_P A2 Output HiSPi serial data, lane 0, differential P. SLVS1_P A3 Output HiSPi serial data, lane 1, differential P. SLVSC_P A4 Output HiSPi serial DDR clock differential P. SLVS2_P A5 Output HiSPi serial data, lane 2, differential P. SLVS3_P A6 Output HiSPi serial data, lane 3, differential P. VDD_PLL B1 Power SLVS0_N B2 Output HiSPi serial data, lane 0, differential N. PLL power. SLVS1_N B3 Output HiSPi serial data, lane 1, differential N. SLVSC_N B4 Output HiSPi serial DDR clock differential N. SLVS2_N B5 Output HiSPi serial data, lane 2, differential N. SLVS3_N B6 Output HiSPi serial data, lane 3, differential N. SHUTTER B9 Output Control for external mechanical shutter. Can be left floating if not used. VAA C1, G1, D9, F9 Power Analog power. AGND C2, G2, D8, E8, F8 Power Analog ground. VDD_SLVS C4 Power 0.3V-0.6V or 1.7V - 1.9V port to HiSPi Output Driver. Set the High_VCM (R0x306E[9]) bit to 1 when configuring VDD_SLVS to 1.7 - 1.9V. VDD C5, J5, A9, H9, A7, D1, F1 Power Digital power. Power Digital ground. Input External input clock. Reserved C9, F7 DGND EXTCLK B7, C7, D7, E7, G7, B8, C8, G8, D2, E2, F2, H2, C3, G3, H3, C6, J6 D3 PIXCLK D4 Output Pixel clock out. Dout is valid on rising edge of this clock. SADDR D5 Input TRIGGER D6 Input Exposure synchronization input. VAA_PIX E9 Power Pixel power. VDD_IO E1, H1, J2, J7, A8, G9, J9 Power I/O supply power. SDATA E3 I/O Two-Wire Serial data I/O. Two-Wire Serial address select. 0: 0x20. 1: 0x30 FLASH E4 Output Flash control output. FRAME_VALID E5 Output Asserted when Dout frame data is valid. SCLK E6 Input DOUT11 F3 Output Parallel pixel data output (MSB) DOUT10 F4 Output Parallel pixel data output. DOUT9 F5 Output Parallel pixel data output. LINE_VALID F6 Output Asserted when Dout line data is valid. DOUT8 G4 Output Parallel pixel data output. DOUT7 G5 Output Parallel pixel data output. DOUT6 G6 Output Parallel pixel data output. DOUT5 H4 Output Parallel pixel data output. DOUT4 H5 Output Parallel pixel data output. DOUT3 H6 Output Parallel pixel data output. RESET_BAR H7 AR0230CS/D Rev. 8, Pub. 11/15 EN Input Two-Wire Serial clock input. Asynchronous reset (active LOW). All settings are restored to factory default. 11 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Functional Overview Table 3: Pin Descriptions, 80-ball iBGA Name iBGA Pin Type Description TEST H8 Input. Manufacturing test enable pin (connect to Dgnd). DOUT2 J1 Output Parallel pixel data output. DOUT1 J3 Output Parallel pixel data output. DOUT0 J4 Output Parallel pixel data output (LSB) OE_BAR J8 Input AR0230CS/D Rev. 8, Pub. 11/15 EN Output enable (active LOW). 12 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Pixel Data Format Pixel Data Format Pixel Array Structure While the sensor's format is 1928 x1088, additional active columns and active rows are included for use when horizontal or vertical mirrored readout is enabled, to allow readout to start on the same pixel. The pixel adjustment is always performed for monochrome or color versions. The active area is surrounded with optically transparent dummy pixels to improve image uniformity within the active area. Not all dummy pixels or barrier pixels can be read out. Figure 5: Pixel Array Description 1944 10 barrier + 4 border pixels 19281 x 1088 5.78 mm x 3.26 mm 1116 2 barrier + 6 border pixels 2 barrier + 6 border pixels 10 barrier + 4 border pixels Light dummy pixel AR0230CS/D Rev. 8, Pub. 11/15 EN Active pixel 13 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Pixel Data Format Figure 6: Pixel Color Pattern Detail (Top Right Corner) Column Readout Direction Row Readout Direction Active Pixel (0,0) Array Pixel (0, 0) R G R G R G R G G B G B G B G B R G R G R G R G G B G B G B G B R G R G R G R G G B G B G B G B Default Readout Order By convention, the sensor core pixel array is shown with pixel (0,0) in the top right corner (see Figure 6). This reflects the actual layout of the array on the die. Also, the first pixel data read out of the sensor in default condition is that of pixel (10, 14). When the sensor is imaging, the active surface of the sensor faces the scene as shown in Figure 7. When the image is read out of the sensor, it is read one row at a time, with the rows and columns sequenced as shown in Figure 7. Figure 7: Imaging a Scene Lens Scene Sensor (rear view) Row Readout Order Column Readout Order AR0230CS/D Rev. 8, Pub. 11/15 EN Pixel (0,0) 14 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Features Overview Features Overview For a complete description, recommendations, and usage guidelines for product features, refer to the AR0230CS Developer Guide. 3.0m Dual Conversion Gain Pixel To improve the low light performance and keep the high dynamic range, a large (3.0um) dual conversion gain pixel is implemented for better image optimization. With a dual conversion gain pixel, the conversion gain of the pixel may be dynamically changed to better adapt the pixel response based on dynamic range of the scene. This gain can be switched manually or automatically by an auto exposure control module. HDR By default, the sensor powers up in HDR Mode. The HDR scheme used is multi-exposure HDR. This allows the sensor to handle up to 96 dB of dynamic range. In HDR mode, the sensor sequentially captures two exposures by maintaining two separate read and reset pointers that are interleaved within the rolling shutter readout. The intermediate pixel values are stored in line buffers while waiting for the two exposure values to be present. As soon as a pixel's two exposure values are available, they are combined to create a linearized 16-bit value for each pixel's response. The exposure ratio may be set to 4x, 8x, 16x, or 32x. Depending on whether HiSPi or Parallel mode is selected, the full 16 bit value may be output, it can be compressed to 12 bits using Adaptive Local Tone Mapping (ALTM), or companded to 12 or 14 bits. Options to output T1 only, T2 only, or pixel interleaved data are also available. Individual exposures may be read out in a line interleaved mode as described in the T1/T2 Line Interleaved Mode section. Resolution The active array supports a maximum of 1928x1088 pixels to support 1080p resolution. Utilizing a 3.0um pixel will result in an optical format of 1/2.7-inch (approximately 6.6mm diagonal). Frame Rate At full (1080p) resolution, the AR0230CS is capable of running up to 3060 fps. Image Acquisition Mode The AR0230CS supports two image acquisition modes: * Electronic rolling shutter (ERS) mode This is the normal mode of operation. When the AR0230CS is streaming, it generates frames at a fixed rate, and each frame is integrated (exposed) using the ERS. When ERS mode is in use, timing and control logic within the sensor sequences through the rows of the array, resetting and then reading each row in turn. In the time interval between resetting a row and subsequently reading that row, the pixels in the row integrate incident light. The integration (exposure) time is controlled by varying the time between row reset and row readout. For each row in a frame, the time between row reset and row readout is the same, leading to a uniform integration time across the frame. When the integration time is changed (by using the two-wire serial interface to change register settings), the timing and control logic controls the transition from old to new integration AR0230CS/D Rev. 8, Pub. 11/15 EN 15 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Features Overview time in such a way that the stream of output frames from the AR0230CS switches cleanly from the old integration time to the new while only generating frames with uniform integration. See "Changes to Integration Time" in the AR0230CS Register Reference. * Global reset mode. This mode can be used to acquire a single image at the current resolution. In this mode, the end point of the pixel integration time is controlled by an external electromechanical shutter, and the AR0230CS provides control signals to interface to that shutter. The benefit of using an external electromechanical shutter is that it eliminates the visual artifacts associated with ERS operation. Visual artifacts arise in ERS operation, particularly at low frame rates, because an ERS image effectively integrates each row of the pixel array at a different point in time. Embedded Data and Statistics The AR0230CS has the capability to output image data and statistics embedded within the frame timing. There are two types of information embedded within the frame readout. * Embedded Data: If enabled, these are displayed on the two rows immediately before the first active pixel row is displayed. * Embedded Statistics: If enabled, these are displayed on the two rows immediately after the last active pixel row is displayed. Multi-Camera Synchronization The AR0230CS supports advanced line synchronization controls for multi-camera (stereo) support. Slave Mode The slave mode feature of the AR0230CS supports triggering the start of a frame readout from an input signal that is supplied from an external ASIC. The slave mode signal allows for precise control of frame rate and register change updates. Context Switching and Register Updates The user has the option of using the highly configurable context memory, or a simplified implementation in which only a subset of registers is available for switching. The AR0230 supports a highly configurable context switching RAM of size 256 x 16. Within this Context Memory, changes to any register may be stored. The register set for each context must be the same, but the number of contexts and registers per context are limited only by the size of the context memory. Alternatively, the user may switch between two predefined register sets A and B by writing to a context switch change bit. When the context switch is configured to context A the sensor will reference the context A registers. If the context switch is changed from A to B during the readout of frame n, the sensor will then reference the context B coarse_integration_time registers in frame n+1 and all other context B registers at the beginning of reading frame n+2. The sensor will show the same behavior when changing from context B to context A. The registers listed in Table 4 are context-switchable: AR0230CS/D Rev. 8, Pub. 11/15 EN 16 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Features Overview Table 4: List of Configurable Registers for Context A and Context B Context A Context B Register Description Register Description coarse_integration_time coarse_integration_time_cb line_length_pck line_length_pck_cb frame_length_lines frame_length_lines_cb row_bin row_bin_cb col_bin col_bin_cb fine_gain fine_gain_cb coarse_gain coarse_gain_cb x_addr_start x_addr_start_cb y_addr_start y_addr_start_cb x_addr_end x_addr_end_cb y_addr_end y_addr_end_cb y_odd_inc y_odd_inc_cb x_odd_inc x_odd_inc_cb green1_gain green1_gain_cb blue_gain blue_gain_cb red_gain red_gain_cb green2_gain green2_gain_cb global_gain global_gain_cb operation_mode_ctrl operation_mode_ctrl_cb bypass_pix_comb bypass_pix_comb_cb Motion Compensation/DLO In typical multi-exposure HDR systems, motion artifacts can be created when objects move during the T1 or T2 integration time. When this happens, edge artifacts can potentially be visible and might look like a ghosting effect. To correct this, the AR0230CS has special 2D motion compensation circuitry that detects motion artifacts and corrects the image. The motion compensation feature can be optionally enabled by register write. Additional parameters are available to control the extent of motion detection and correction as per the requirements of the specific application. Tone Mapping Real-world scenes often have a very high dynamic range (HDR) that far exceeds the electrical dynamic range of the imager. Dynamic range is defined as the luminance ratio between the brightest and the darkest objects in a scene. Even though the AR0230CS can capture full dynamic range images, the images are still limited by the low dynamic range of display devices. Today's typical LCD monitor has a contrast ratio around 1,000:1 while it is not atypical for an HDR image having a contrast ratio of around 250,000:1. Therefore, in order to reproduce HDR images on a low dynamic range display device, the captured high dynamic range must be compressed to the available range of the display device. This is commonly called tone mapping. The AR0230CS has implemented an adaptive local tone mapping (ALTM) feature to reproduce visually appealing images that increase the local contrast and the visibility of the images. AR0230CS/D Rev. 8, Pub. 11/15 EN 17 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Features Overview Adaptive Color Difference (ADACD) Noise Filtering A good noise reduction filter will remove noise from an image while retaining as much image detail as possible. To retain image detail, the noise reduction filter must adapt to the image signal. To remove noise, the noise reduction filter must adapt to the noise level of the image signal. The key is to remove the appropriate amount of noise. Over-filtering will cause image blurring while under-filtering will leave noise in the image. The AdaCD algorithm relies on a noise model derived from characterization data to aid in separating noise from signal. The AR0230CS AdaCD algorithm performs pixel-by-pixel color noise correction for each of the red, blue, and green color planes. Each pixel is corrected based on surrounding pixel values on the same color plane and a noise model. The noise model is based on characterization data, and takes into account applied analog gain. Fast Mode Switch (Combi Mode) To facilitate faster switching between linear and HDR modes, the AR0230CS includes a Combi Mode feature. When enabled, Combi Mode loads a single (HDR) sequencer. When switching from HDR to linear modes, the sequencer remains the same, but only the T1 image is output. While not optimized for linear mode operation, it allows faster mode switching as a new sequencer load is not needed. Switching between modes may result in the output of one bad frame. Analog/Digital Gains A programmable analog gain of 1.5x to 12x (HDR) and 1.5x to 16x (linear) applied simultaneously to all color channels will be featured along with a digital gain of 1x to 16x that may be configured on a per color channel basis. Skipping/Binning Modes The AR0230CS supports subsampling. Subsampling allows the sensor to read out a smaller set of active pixels by either skipping, binning, or summing pixels within the readout window. Horizontal binning is achieved in the digital readout. The sensor will sample the combined 2x adjacent pixels within the same color plane. Vertical row binning is applied in the pixel readout. Row binning can be configured as 2x rows within the same color plane. Pixel skipping can be configured up to 2x in both the x-direction and y-direction. Skipping pixels in the x-direction will not reduce the row time. Skipping pixels in the y direction will reduce the number of rows from the sensor effectively reducing the frame time. Skipping will introduce image artifacts from aliasing. The AR0230CS supports row wise vertical binning. Row wise vertical summing is not supported. Clocking Options The sensor contains a phase-locked loop (PLL) that is used for timing generation and control. The required VCO clock frequency is attained through the use of a pre-PLL clock divider followed by a multiplier. The PLL multiplier should be an even integer. If an odd integer (M) is programmed, the PLL will default to the lower (M-1) value to maintain an even multiplier value. The multiplier is followed by a set of dividers used to generate the output clocks required for the sensor array, the pixel analog and digital readout paths, and the output parallel and serial interfaces. Use of the PLL is required when using the HiSPi interface. AR0230CS/D Rev. 8, Pub. 11/15 EN 18 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Features Overview Temperature Sensor The AR0230CS sensor has a built-in PTAT-based temperature sensor, accessible through registers, that is capable of measuring die junction temperature. The value read out from the temperature sensor register is an ADC output value that needs to be converted downstream to a final temperature value in degrees Celsius. Since the PTAT device characteristic response is quite linear in the temperature range of operation required, a simple linear function can be used to convert the ADC output value to the final temperature in degrees Celsius. A single reference point will be made available via register read as well as a slope for back-calculating the junction temperature value. An error of +/-5% or better over the full specified operating range of the sensor is to be expected. Silicon / Firmware / Sequencer Revision Information A revision register will be provided to read out (via I2C) silicon and sequencer/OTPM revision information. This will be helpful to distinguish among different lots of material if there are future OTPM or sequencer revisions. Lens Shading Correction The latest lens shading correction algorithm will be included for potential low Z height applications. Companding The 16-bit linearized HDR image may be compressed to 12- or 14- bits using on-chip companding. This is useful if on-chip ALTM will not be used and the ISP cannot handle 16 bit data. Compression When the AR0230CS is configured for linear mode operation, the sensor can optionally compress 12-bit data to 10-bit using A-law compression. The A-law compression is disabled by default. Packaging The AR0230CS will be offered in a 10x10 80-iBGA package (parallel and HiSPi). The package will have anti-reflective coating on both sides of the cover glass. Parallel Interface The parallel pixel data interface uses these output-only signals: * FRAME_VALID * LINE_VALID * PIXCLK * DOUT[11:0] The parallel pixel data interface is disabled by default at power up and after reset. It can be enabled by programming R0x301A. When the parallel pixel data interface is in use, the serial data output signals can be left unconnected. AR0230CS/D Rev. 8, Pub. 11/15 EN 19 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Features Overview High Speed Serial Pixel (HiSPi) Interface The HiSPi interface supports three protocols, Streaming-S, Streaming-SP, and Packetized SP. The streaming protocols conform to a standard video application where each line of active or intra-frame blanking provided by the sensor is transmitted at the same length. The Packetized SP protocol will transmit only the active data ignoring line-to-line and frame-to-frame blanking data. The HiSPi interface building block is a unidirectional differential serial interface with four data and one double data rate (DDR) clock lanes. One clock for every four serial data lanes is provided for phase alignment across multiple lanes. The AR0230CS supports serial data widths of 10, 12, 14, 16, or 20 bits on one, two, or four lanes. The specification includes a DLL to compensate for differences in group delay for each data lane. The DLL is connected to the clock lane and each data lane, which acts as a control master for the output delay buffers. Once the DLL has gained phase lock, each lane can be delayed in 1/8 unit interval (UI) steps. This additional delay allows the user to increase the setup or hold time at the receiver circuits and can be used to compensate for skew introduced in PCB design. Delay compensation may be set for clock and/or data lines in the hispi_timing register R0x31C0. If the DLL timing adjustment is not required, the data and clock lane delay settings should be set to a default code of 0x0000 to reduce jitter, skew, and power dissipation. Sensor Control Interface The two-wire serial interface bus enables read/write access to control and status registers within the AR0230CS. The interface protocol uses a master/slave model in which a master controls one or more slave devices. The sensor acts as a slave device. The master generates a clock (SCLK) that is an input to the sensor and is used to synchronize transfers. Data is transferred between the master and the slave on a bidirectional signal (SDATA). SDATA is pulled up to VDD_IO off-chip by a 1.5k resistor. Either the slave or master device can drive SDATA LOW-the interface protocol determines which device is allowed to drive SDATA at any given time. The two-wire serial interface can run at 100 kHz or 400 kHz. T1/T2 Line Interleaved Mode The AR0230CS has the capability to output the T1 and T2 exposures separately, in a line interleaved format. The purpose of this is to enable off chip HDR linear combination and processing. See the AR0230CS Developer Guide for more information. AR0230CS/D Rev. 8, Pub. 11/15 EN 20 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Features Overview Figure 8: Quantum Efficiency 80 B lue 70 Q uantum E fficiency (% ) G reen (B ) G reen (R ) 60 R ed 50 40 30 20 10 0 350 450 550 650 750 850 950 1050 1150 W avelength (nm ) AR0230CS/D Rev. 8, Pub. 11/15 EN 21 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications Electrical Specifications Unless otherwise stated, the following specifications apply under the following conditions: VDD = 1.8V - 0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8V 0.3V; VDD_SLVS = 0.4V - 0.1/+0.2; TA = -30C to +85C-40C to +105C; output load = 10pF; frequency = 74.25 MHz; HiSPi off. Two-Wire Serial Register Interface The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are shown in Figure 9 and Table 5. Figure 9: Two-Wire Serial Bus Timing Parameters SDATA tLOW tf tf tSU;DAT tr tHD;STA tr tBUF SCLK S tHD;STA tHD;DAT Note: Table 5: tSU;STA tHIGH tSU;STO Sr P S Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register address are issued. Two-Wire Serial Bus Characteristics fEXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDD_PLL = 2.8V; T = 25C A Standard Mode Parameter Symbol Min Max fSCL 0 tHD;STA 4.0 LOW period of the SCLK clock tLOW 4.7 HIGH period of the SCLK clock t HIGH 4.0 SU;STA 4.7 HD;DAT 04 3.455 SCLK Clock Frequency Hold time (repeated) START condition. After this period, the first clock pulse is generated Set-up time for a repeated START condition t Data hold time t Data set-up time t Fast Mode Min Max Unit 100 0 400 KHz - 0.6 - s - 1.3 - s - 0.6 - s - 0.6 - s 06 0.95 s 6 SU;DAT 250 - 100 - ns Rise time of both SDATA and SCLK signals tr - 1000 20 + 0.1Cb7 300 ns Fall time of both SDATA and SCLK signals t 7 Set-up time for STOP condition Bus free time between a STOP and START condition Capacitive load for each bus line AR0230CS/D Rev. 8, Pub. 11/15 EN f - 300 20 + 0.1Cb 300 ns tSU;STO 4.0 - 0.6 - s tBUF 4.7 - 1.3 - s Cb - 400 - 400 pF 22 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications Table 5: Two-Wire Serial Bus Characteristics (continued) f EXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDD_PLL = 2.8V; TA = 25C Standard Mode Fast Mode Parameter Symbol Min Max Min Max Unit Serial interface input pin capacitance CIN_SI - 3.3 - 3.3 pF SDATA max load capacitance SDATA pull-up resistor Notes: CLOAD_SD - 30 - 30 pF RSD 1.5 4.7 1.5 4.7 K This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor. Two-wire control is I2C-compatible. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 27 MHz. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK. 5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal. 6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCLK line is released. 7. Cb = total capacitance of one bus line in pF. 1. 2. 3. 4. I/O Timing By default, the AR0230CS launches pixel data, FV, and LV with the falling edge of PIXCLK. The expectation is that the user captures DOUT[11:0], FV, and LV using the rising edge of PIXCLK. See Figure 10 below and Table 6 on page 24 for I/O timing (AC) characteristics. Figure 10: I/O Timing Diagram tR t RP tF t FP 90% 90% 10% 10% t EXTCLK EXTCLK PIXCLK t PD Data[11:0] LINE_VALID/ FRAME_VALID AR0230CS/D Rev. 8, Pub. 11/15 EN Pxl _0 Pxl _1 Pxl _2 Pxl _n t PLH t PFL t PFH t PLL FRAME_VALID leads LINE_VALID by 6 PIXCLKs. 23 FRAME_VALID trails LINE_VALID by 6 PIXCLKs. (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications Table 6: I/O Timing Characteristics Symbol Definition fEXTCLK1s Input clock frequency Condition tEXTCLK1 Input clock period Min Typ Max Unit 6 - 48 MHz 20.8 - 166 ns tR Input clock rise time - 3 - ns - 3 - ns tF Input clock fall time tRP Pixclk rise time 2 3.5 5 ns tFP Pixclk fall time 2 3.5 5 ns Clock duty cycle 45 50 55 % EXTCLK to PIXCLK propagation delay Nominal voltages, PLL Disabled 10 14 18 ns PIXCLK frequency Default, Nominal Voltages 6 74.25 MHz tPD PIXCLK to data valid Default, Nominal Voltages 3.6 5.5 9.5 ns tPFH PIXCLK to FV HIGH Default, Nominal Voltages 2.9 5.3 9 ns tPLH PIXCLK to LV HIGH Default, Nominal Voltages 2.9 5 9 ns tPFL PIXCLK to FV LOW Default, Nominal Voltages 2.9 5 9 ns tPLL PIXCLK to LV LOW Default, Nominal Voltages 2.9 4.8 9 ns Output load capacitance - <10 - pF Input pin capacitance - 2.5 - pF tCP fPIXCLK CLOAD CIN Note: AR0230CS/D Rev. 8, Pub. 11/15 EN I/O timing characteristics are measured under the following conditions: - Temperature is 25C ambient - 10 pF load - 1.8V I/O supply voltage 24 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications DC Electrical Characteristics The DC electrical characteristics are shown in the tables below. Table 7: DC Electrical Characteristics Symbol Definition Condition Min Typ Max Unit VDD Core digital voltage 1.7 1.8 1.95 V VDD_IO I/O digital voltage 1.7/2.5 1.8/2.8 1.9/3.1 V Analog voltage 2.5 2.8 3.1 V VAA_PIX VAA Pixel supply voltage 2.5 2.8 3.1 V VDD_PLL PLL supply voltage 2.5 2.8 3.1 V VDD_SLVS HiSPi supply voltage 0.3 0.4 0.6 V VIH Input HIGH voltage VDD_IO*0.7 - - V VIL Input LOW voltage - - VDD_IO*0.3 V 20 - - A IIN Input leakage current No pull-up resistor; VIN = VDD_IO or DGND VOH Output HIGH voltage VDD_IO-0.3 - - V VOL Output LOW voltage - - 0.4 V IOH Output HIGH current At specified VOH -22 - - mA IOL Output LOW current At specified VOL - - 22 mA Caution Table 8: Stresses greater than those listed in Table 8 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Definition Condition Min Max Unit VDD_MAX Core digital voltage -0.3 2.4 V VDD_IO_MAX I/O digital voltage -0.3 4 V VAA_MAX VAA_PIX VDD_PLL VDD_SLVS_MAX tST Analog voltage -0.3 4 V Pixel supply voltage -0.3 4 V PLL supply voltage -0.3 4 V HiSPi I/O digital voltage -0.3 2.4 V Storage temperature -40 85 C Note: AR0230CS/D Rev. 8, Pub. 11/15 EN Exposure to absolute maximum rating conditions for extended periods may affect reliability. 25 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications Table 9: 1080p30 HDR (ALTM) 74MHz Parallel 2.8V Definition Voltage Min Typ Max Digital operating current Streaming 1080p30 Condition IDD 1.8 90 175 220 I/O digital operating current Streaming 1080p30 IDD_IO 2.8 10 30 50 Analog operating current Streaming 1080p30 IAA 2.8 35 45 85 Pixel supply current Streaming 1080p30 IAA_PIX 2.8 2 4 7 PLL supply current Streaming 1080p30 IDD_PLL 2.8 5.5 6.2 7 Power (mW) 309 557.76 813.2 Note: Table 10: Symbol Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL = VDD_IO =2.8 V - VDD= 1.8 V - PLL Enabled and PIXCLK = 74.25 MHz - Low power mode enabled - TA = 25C 1080p30 Linear 74MHz Parallel 2.8V Definition Condition Symbol Voltage Min Typ Max 75 107 145 Digital operating current Streaming 1080p30 IDD 1.8 I/O digital operating current Streaming 1080p30 IDD_IO 2.8 10 30 50 Analog operating current Streaming 1080p30 IAA 2.8 20 30 50 Pixel supply current Streaming 1080p30 IAA_PIX 2.8 1 3 7 PLL supply current Streaming 1080p30 IDD_PLL 2.8 5.5 6.2 7 Power (mW) 237.2 386.36 580.2 Note: Table 11: Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL = VDD_IO =2.8 V - VDD= 1.8 V - PLL Enabled and PIXCLK = 74.25 MHz - Low power mode enabled - TA = 25C 1080p30 HDR (ALTM) 74MHz Parallel 1.8V Definition Condition Symbol Voltage Min Typ Max Digital operating current Streaming 1080p30 IDD 1.8 90 175 220 I/O digital operating current Streaming 1080p30 IDD_IO 1.8 10 20 30 Analog operating current Streaming 1080p30 IAA 2.8 35 45 85 Pixel supply current Streaming 1080p30 IAA_PIX 2.8 2 4 7 PLL supply current Streaming 1080p30 IDD_PLL 2.8 Power (mW) Note: AR0230CS/D Rev. 8, Pub. 11/15 EN 5.5 6.2 7 299 509.76 727.2 Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL =2.8 V - VDD = VDD_IO= 1.8 V - PLL Enabled and PIXCLK = 74.25 MHz - Low power mode enabled - TA = 25C 26 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications Table 12: 1080p30 Linear 74 MHz Parallel 1.8V Voltage Min Typ Max Digital operating current Definition Streaming 1080p30 Condition IDD 1.8 75 107 145 I/O digital operating current Streaming 1080p30 IDD_IO 1.8 10 20 30 Analog operating current Streaming 1080p30 IAA 2.8 20 30 50 Pixel supply current Streaming 1080p30 IAA_PIX 2.8 1 3 7 PLL supply current Streaming 1080p30 IDD_PLL 2.8 5.5 6.2 7 Power (mW) 227.2 338.36 494.2 Note: Table 13: Symbol Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL =2.8 V - VDD = VDD_IO= 1.8 V - PLL Enabled and PIXCLK = 74.25 MHz - Low power mode enabled - TA = 25C 1080p30 HDR (ALTM) 74 MHz HiSPi SLVS (Low Power Mode) Definition Condition Symbol Voltage Min Typ Max Digital Operating Current Streaming 1080p30 IDD 1.8 145 175 235 Analog Operating Current Streaming 1080p30 IDD_IO 2.8 25 46 65 Pixel Supply Current Streaming 1080p30 IAA 2.8 1 4 7 8.5 PLL Supply Current Streaming 1080p30 IAA_PIX 2.8 6 7.4 SLVS Supply Current Streaming 1080p30 IDD_PLL 0.4 3 9 14 Power (mW) 351.8 479.32 654 Note: AR0230CS/D Rev. 8, Pub. 11/15 EN Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL =2.8 V - VDD = VDD_IO= 1.8 V - VDD_SLVS= 0.4V - PLL Enabled and PIXCLK = 37.125 MHz - 4-lane HiSPi mode - Low power mode enabled - TA = 25C 27 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications Table 14: 1080p30 Linear 74 MHz HiSPi SLVS Voltage Min Typ Max Digital Operating Current Definition Streaming 1080p30 Condition IDD 1.8 75 115 155 Analog Operating Current Streaming 1080p30 IDD_IO 2.8 20 30 50 Pixel Supply Current Streaming 1080p30 IAA 2.8 1 3 7 PLL Supply Current Streaming 1080p30 IAA_PIX 2.8 6 7.4 8.5 SLVS Supply Current Streaming 1080p30 IDD_PLL Note: Table 15: Symbol 0.4 3 9 14 Power (mW) 211.8 323.72 468 Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL =2.8 V - VDD = VDD_IO= 1.8 V - VDD_SLVS= 0.4V - PLL Enabled and PIXCLK = 74.25 MHz - 4-lane HiSPi mode - Low power mode enabled - TA = 25C 1080p30 HDR (ALTM) 74 MHz HiSPi HiVcm (Low Power Mode) Definition Condition Symbol Voltage Min Typ Max Digital Operating Current Streaming 1080p30 IDD 1.8 145 175 235 Analog Operating Current Streaming 1080p30 IDD_IO 2.8 25 46 65 Pixel Supply Current Streaming 1080p30 IAA 2.8 1 4 7 PLL Supply Current Streaming 1080p30 IAA_PIX 2.8 6 7.4 8.5 SLVS Supply Current Streaming 1080p30 IDD_PLL Note: AR0230CS/D Rev. 8, Pub. 11/15 EN 1.8 10 20 30 Power (mW) 368.6 511.72 702.4 Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL =2.8 V - VDD = VDD_IO = VDD_SLVS = 1.8 V - PLL Enabled and PIXCLK = 37.125 MHz - 4-lane HiSPi mode - Low power mode enabled - TA = 25C 28 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications Table 16: 1080p30 Linear 74 MHz HiSPi HiVcm Definition Voltage Min Typ Max Digital Operating Current Streaming 1080p30 Condition IDD 1.8 75 115 155 Analog Operating Current Streaming 1080p30 IDD_IO 2.8 20 30 50 Pixel Supply Current Streaming 1080p30 IAA 2.8 1 3 7 PLL Supply Current Streaming 1080p30 IAA_PIX 2.8 6 7.4 8.5 SLVS Supply Current Streaming 1080p30 IDD_PLL Note: Table 17: Symbol 1.8 10 20 30 Power (mW) 228.6 356.12 516.4 Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL =2.8 V - VDD = VDD_IO = VDD_SLVS= 1.8 V - PLL Enabled and PIXCLK = 74.25 MHz - 4-lane HiSPi mode - Low power mode enabled - TA = 25C Line Interleaved HiSPi SLVS Definition Condition Symbol Voltage Min Typ Max Digital Operating Current Streaming 1080p30 IDD 1.8 185 230 265 Analog Operating Current Streaming 1080p30 IDD_IO 2.8 20 36 55 Pixel Supply Current Streaming 1080p30 IAA 2.8 1 3.3 7 PLL Supply Current Streaming 1080p30 IAA_PIX 2.8 7 8.2 9.5 SLVS Supply Current Streaming 1080p30 IDD_PLL 0.4 3 9 14 Power (mW) 412.6 550.6 668.8 Note: AR0230CS/D Rev. 8, Pub. 11/15 EN Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL =2.8 V - VDD = VDD_IO= 1.8 V - VDD_SLVS= 0.4V - PLL Enabled and PIXCLK = 74.25 MHz - 4-lane HiSPi mode - TA= 25C 29 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Electrical Specifications Table 18: Line Interleaved HiSPi HiVcm Definition Condition Symbol IDD Voltage Min Typ Max 1.8 185 230 265 Digital Operating Current Streaming 1080p30 Analog Operating Current Streaming 1080p30 IDD_IO 2.8 20 36 55 Pixel Supply Current Streaming 1080p30 IAA 2.8 1 3.3 7 PLL Supply Current Streaming 1080p30 IAA_PIX 2.8 7 8.2 9.5 SLVS Supply Current Streaming 1080p30 IDD_PLL 1.8 10 20 30 Power (mW) 429.4 583 717.2 Note: Operating currents are measured in mA at the following conditions: - VAA = VAA_PIX = VDD_PLL = 2.8 V - VDD= VDD_IO = 1.8 V - VDD_SLVS = 1.8 V - PLL Enabled and PIXCLK = 74.25 MHz - 4-lane HiSPi mode - TA = 25C HiSPi Electrical Specifications The ON Semiconductor AR0230CS sensor supports both SLVS and HiVCM HiSPi modes. Refer to the High-Speed Serial Pixel (HiSPi) Interface Physical Layer Specification v2.00.00 for electrical definitions, specifications, and timing information. The VDD_SLVS supply in this datasheet corresponds to VDD_TX in the HiSPi Physical Layer Specification. Similarly, VDD is equivalent to VDD_HiSPi as referenced in the specification. The DLL as implemented on AR0230CS is limited in the number of available delay steps and differs from the HiSPi specification as described in this section. Table 19: Channel Skew Measurement Conditions: VDD_HiSPi = 1.8V;VDD_HiSPi_TX = 0.4V; Data Rate =480 Mbps; DLL set to 0 Data Lane Skew in Reference to Clock AR0230CS/D Rev. 8, Pub. 11/15 EN tCHSKEW1PHY 30 -150 ps (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Power-On Reset and Standby Timing Power-On Reset and Standby Timing Power-Up Sequence The recommended power-up sequence for the AR0230CS is shown in Figure 11. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the separation specified below. 1. Turn on VDD_PLL power supply. 2. After 100s, turn on VAA and VAA_PIX power supply. 3. After 100s, turn on VDD_IO power supply. 4. After 100s, turn on VDD power supply. 5. After 100s, turn on VDD_SLVS power supply. 6. After the last power supply is stable, enable EXTCLK. 7. Assert RESET_BAR for at least 1ms. The parallel interface will be tri-stated during this time. 8. Wait 150000 EXTCLKs (for internal initialization into software standby. 9. Configure PLL, output, and image settings to desired values. 10. Wait 1ms for the PLL to lock. 11. Set streaming mode (R0x301a[2] = 1). Figure 11: Power Up VDD_PLL (2.8) VAA_PIX VAA (2.8) VDD_IO (1.8/2.8) VDD (1.8) t0 t1 t2 t3 VDD_SLVS (0.4) EXTCLK t4 RESET_BAR tx t5 Hard Reset AR0230CS/D Rev. 8, Pub. 11/15 EN 31 Internal Initialization t6 Software Standby PLL Lock Streaming (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Power-On Reset and Standby Timing Table 20: Power-Up Sequence Definition Symbol Minimum Typical Maximum Unit VDD_PLL to VAA/VAA_PIX3 VAA/VAA_PIX to VDD_IO VDD_IO to VDD VDD to VDD_SLVS Xtal settle time Hard Reset Internal Initialization PLL Lock Time t0 t1 t2 t3 tx t4 t5 t6 0 0 0 0 - 12 150000 1 100 100 100 100 301 - - - - - - - - - - - s s s s ms ms EXTCLKs ms Notes: AR0230CS/D Rev. 8, Pub. 11/15 EN 1. Xtal settling time is component-dependent, usually taking about 10 - 100 ms. 2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard reset is held down by RC circuit, then the RC time must include the all power rail settle time and Xtal settle time. 3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the others. If the case happens that VDD_PLL is powered after other supplies then sensor may have functionality issues and will experience high current draw on this supply. 32 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Power-On Reset and Standby Timing Power-Down Sequence The recommended power-down sequence for the AR0230CS is shown in Figure 12. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the separation specified below. 1. Disable streaming if output is active by setting standby R0x301a[2] = 0 2. The soft standby state is reached after the current row or frame, depending on configuration, has ended. 3. Turn off VDD_SLVS. 4. Turn off VDD. 5. Turn off VDD_IO. 6. Turn off VAA/VAA_PIX. 7. Turn off VDD_PLL. Figure 12: Power Down VDD_SLVS (0.4) t0 VDD (1.8) t1 V DD_IO (1.8/2.8) t2 VAA_PIX VAA (2.8) t3 VDD_PLL (2.8) EXTCLK t4 Power Down until next Power up cycle Table 21: Power-Down Sequence Definition Symbol Minimum Typical Maximum Unit VDD_SLVS to VDD VDD to VDD_IO VDD_IO to VAA/VAA_PIX VAA/VAA_PIX to VDD_PLL Power Down until Next Power Up Time t0 t1 t2 t3 t4 0 0 0 0 100 - - - - - - - - - - s s s s ms t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged. AR0230CS/D Rev. 8, Pub. 11/15 EN 33 (c)Semiconductor Components Industries, LLC, 2015. 80iBGA 10 x 10 Package Diagram Figure 13: AR0230CS/D Rev. 8, Pub. 11/15 EN Package Diagrams (c)Semiconductor Components Industries, LLC, 2015 AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Power-On Reset and Standby Timing 34 AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Revision History Revision History Rev. 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/18/14 * Initial release Rev. 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9/22/14 * Updated Table 1, "Key Parameters," on page 1 * Updated Table 2, "Available Part Numbers," on page 1 * Updated "Packaging" on page 19 * Updated Table 9, "Operating Current Consumption in Parallel Output and Linear Mode," on page 26 * Updated Table 10, "Operating Current Consumption in Parallel Output and HDR Mode," on page 26 * Updated Table 11, "Operating Current in HiSPi (HiVCM) Output and Linear Mode," on page 27 * Updated Table 12, "Operating Current in HiSPi (HiVCM) Output and HDR Mode," on page 27 * Updated Table 13, "Operating Current in HiSPi (SLVS) Output and Linear Mode," on page 28 * Updated Table 14, "Operating Current in HiSPi (SLVS) Output and HDR Mode," on page 28 * Deleted references to iLCC package: - Figure 4: 48 iLCC Package, Parallel Output - Table 3: Pin Descriptions - Figure 5: 48 iLCC Package, HiSPi Output - Table 4: Pin Descriptions, 48 iLCC - Figure 16: 48iLCC 10x10 Parallel Package Diagram - Figure 17: 48iLCC 10x10 Serial Package Diagram Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/20/15 * Updated to Production * Updated Table 2, "Available Part Numbers," on page 1 * Updated "General Description" on page 6 * Updated "Analog/Digital Gains" on page 18 * Updated "Temperature Sensor" on page 19 * Updated "HDR" on page 15 * Updated Figure 5: "Pixel Array Description," on page 13 * Replaced Tables 9-14 with Table 10, "1080p30 Linear 74MHz Parallel 1.8v," on page 25 to Table 19, "Line Interleaved HiVcm," on page 29. Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/15/15 * Updated "Ordering Information" on page 2 Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/8/15 * Updated "Ordering Information" on page 2 Rev. 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9/3/15 * Updated Rev. History to follow ON Semiconductor rules * Updated "Ordering Information" on page 2 * Updated max. dynamic range (from 105 to 96 dB) on p.1 and p. 15 * Updated Table 6, "I/O Timing Characteristics," on page 24 AR0230CS/D Rev. 8, Pub. 11/15 EN 35 (c)Semiconductor Components Industries, LLC, 2015. AR0230CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor Revision History * Replaced Table 7, "Operating Current Consumption in Parallel Output and Linear Mode," on page 21 with Table 9, "1080p30 HDR (ALTM) 74MHz Parallel 2.8V," on page 26 * Replaced Table 8, "Operating Current Consumption in Parallel Output and HDR Mode," on page 21 with Table 10, "1080p30 Linear 74MHz Parallel 2.8V," on page 26 * Replaced Table 9, "Operating Current in HiSPi (HiVCM) Output and Linear Mode," on page 22 with Table 11, "1080p30 HDR (ALTM) 74MHz Parallel 1.8V," on page 26 * Replaced Table 10, "Operating Current in HiSPi (HiVCM) Output and HDR Mode," on page 22with Table 12, "1080p30 Linear 74 MHz Parallel 1.8V," on page 27 * Replaced Table 11, "Operating Current in HiSPi (SLVS) Output and Linear Mode," on page 23 with Table 13, "1080p30 HDR (ALTM) 74 MHz HiSPi SLVS (Low Power Mode)," on page 27 * Replaced Table 12, "Operating Current in HiSPi (SLVS) Output and HDR Mode," on page 23 with Table 14, "1080p30 Linear 74 MHz HiSPi SLVS," on page 28 * Added Table 15, "1080p30 HDR (ALTM) 74 MHz HiSPi HiVcm (Low Power Mode)," on page 28, Table 16, "1080p30 Linear 74 MHz HiSPi HiVcm," on page 29, Table 17, "Line Interleaved HiSPi SLVS," on page 29, and Table 18, "Line Interleaved HiSPi HiVcm," on page 30 DR-Pix is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC's product/patent coverage may be accessed at www.onsemi.com/site/pdf/ Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. AR0230CS/D Rev. 8, Pub. 11/15 EN 36 (c)Semiconductor Components Industries, LLC, 2015 .