16-Bit Latche
s
CY74FCT16373
T
CY74FCT162373
T
S
CCS054C - August 1994 - Revised October 2003
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
Copyright © 2003, Texas Instruments Incorporated
Features
•I
off supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
• Industrial temperature range of −40˚C to +85˚C
•V
CC = 5V ± 10%
CY74FCT16373T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
CY74FCT162373T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
Functional Description
CY74FCT16373T and CY74FCT162373T are 16-bit D-type
latches designed for use in bus applications requiring high
speed and low power. These devices can be used as two
independent 8-bit latches or as a single 16-bit latch by
connecting the Output Enable (OE) and Latch (LE) inputs.
Flow-through pinout and small shrink packaging aid in
simplifying board layout.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
The CY74FCT16373T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162373T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162373T is ideal for driving transmission lines.
Logic Block Diagrams Pin Configuration
D
C
1OE
FCT162373-1
1LE
1D11O1
TO 7 OTHERCHANNELS
D
C
2OE
FCT162373-2
2LE
2D12O1
GND
1
2
3
4
5
6
7
8
9
10
11
12
33
32
31
30
29
25
26
27
28
36
35
1OE
34
SSOP/TSSOP/TVSOP
Top View
13
14
15
16
17
18
19
20
21
22
23
24
45
44
43
42
41
37
38
39
40
48
47
46
1O1
1O2
1O3
1O4
1D1
1D2
1D3
1D4
1LE
GND
GND
VCC
1O7
1O8
1O5
1O6
1D5
1D6
1D7
1D8
VCC
GND
GND
2O3
2O4
2O1
2O2
2D1
2D2
2D3
2D4
GND
GND
VCC
2O7
2O8
2O5
2O6
2D5
2D6
2D7
2D8
VCC
GND
2OE 2LE
FCT162373-3
TO 7 OTHERCHANNELS
CY74FCT16373
T
CY74FCT162373
T
2
Maximum Ratings[2, 3]
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Storage Temperature...................... Com’l −55°C to +125°C
Ambient Temperature with
Power Applied.................................Com’l −55°C to +125°C
DC Input Voltage .................................................−0.5V to +7.0V
DC Output Voltage ..............................................−0.5V to +7.0V
DC Output Current
(Maximum Sink Current/Pin)...........................−60 to +120 mA
Power Dissipation..........................................................1.0W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Pin Description
Name Description
D Data Inputs
LE Latch Enable Inputs (Active HIGH)
OE Output Enable Inputs (Active LOW)
O Three-State Outputs
Function Table[1]
Inputs Outputs
D LE OE O
H H L H
L H L L
X L L Q0
X X H Z
Operating Range
Range Ambient
Temperature VCC
Industrial −40°C to +85°C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.[4] Max. Unit
VIH Input HIGH Voltage 2.0 V
VIL Input LOW Voltage 0.8 V
VHInput Hysteresis[5] 100 mV
VIK Input Clamp Diode Voltage VCC=Min., IIN=−18 mA −0.7 −1.2 V
IIH Input HIGH Current VCC=Max., VI=VCC ±1µA
IIL Input LOW Current VCC=Max., VI=GND ±1µA
IOZH High Impedance Output Current
(Three-State Output pins) VCC=Max., VOUT=2.7V ±1µA
IOZL High Impedance Output Current
(Three-State Output pins) VCC=Max., VOUT=0.5V ±1µA
IOS Short Circuit Current[6] VCC=Max., VOUT=GND −80 −140 −200 mA
IOOutput Drive Current[6] VCC=Max., VOUT=2.5V −50 −180 mA
IOFF Power-Off Disable VCC=0V, VOUT≤4.5V[7] ±1µA
Output Drive Characteristics for CY74FCT16373T
Parameter Description Test Conditions Min. Typ.[4] Max. Unit
VOH Output HIGH Voltage VCC=Min., IOH=−3 mA 2.5 3.5 V
VCC=Min., IOH=−15 mA 2.4 3.5 V
VCC=Min., IOH=−32 mA 2.0 3.0 V
VOL Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V
Notes:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance. Q0=Previous state of flip-flop.
2. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature
range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
4. Typical values are at VCC=5.0V, TA= +25˚C ambient.
5. This parameter is specified but not tested.
6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
7. Tested at +25˚C.
CY74FCT16373
T
CY74FCT162373
T
3
Output Drive Characteristics for CY74FCT162373T
Parameter Description Test Conditions Min. Typ.[4] Max. Unit
IODL Output LOW Current[6] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA
IODH Output HIGH Current[6] VCC=5V, VIN=VIH or VIL, VOUT=1.5V −60 −115 −150 mA
VOH Output HIGH Voltage VCC=Min., IOH=−24 mA 2.4 3.3 V
VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V
Capacitance[5] (TA = +25˚C, f = 1.0 MHz)
Parameter Description Test Conditions Typ.[4] Max. Unit
CIN Input Capacitance VIN = 0V 4.5 6.0 pF
COUT Output Capacitance VOUT = 0V 5.5 8.0 pF
Power Supply Characteristics
Parameter Description Test Conditions Typ.[4] Max. Unit
ICC QuiescentPowerSupply Current VCC=Max. VIN≤0.2V,
VIN≥VCC−0.2V 5 500 µA
∆ICC QuiescentPowerSupplyCurrent
(TTL inputs HIGH) VCC=Max. VIN=3.4V[8] 0.5 1.5 mA
ICCD Dynamic Power Supply
Current[9] VCC=Max., One Input
Toggling, 50% Duty Cycle,
Outputs Open, OE=GND
VIN=VCC or
VIN=GND 60 100 µA/MHz
ICTotal Power Supply Current[10] VCC=Max., f1=10 MHz,
50% Duty Cycle, Outputs
Open, One Bit Toggling,
OE=GND, LE=VCC
VIN=VCC or
VIN=GND 0.6 1.5 mA
VIN=3.4V or
VIN=GND 0.9 2.3 mA
VCC=Max., f1=2.5 MHz,
50% Duty Cycle, Outputs
Open,SixteenBitsToggling,
OE=GND, LE=VCC
VIN=VCC or
VIN=GND 2.4 4.5[11] mA
VIN=3.4V or
VIN=GND 6.4 16.5[11] mA
Notes:
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10. IC=I
QUIESCENT + IINPUTS + IDYNAMIC
IC=I
CC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input(VIN=3.4V)
DH= Duty Cycle for TTL inputs HIGH
NT= Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
f0= Clock frequency for registered devices, otherwise zero
f1= Input signal frequency
N1= Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
CY74FCT16373
T
CY74FCT162373
T
4
Switching Characteristics Over the Operating Range[12]
CY74FCT16373AT
CY74FCT162373AT
Parameter Description Min. Max. Unit Fig. No.[13]
tPLH
tPHL Propagation Delay D to O 1.5 5.2 ns 1, 3
tPLH
tPHL Propagation Delay
LE to O 2.0 6.7 ns 1, 5
tPZH
tPZL Output Enable Time 1.5 6.1 ns 1, 7, 8
tPHZ
tPLZ Output Disable Time 1.5 5.5 ns 1, 7, 8
tSU Set-Up Time HIGH or LOW, D to LE 2.0 ns 9
tHHold Time HIGH or LOW, D to LE 1.5 ns 9
tWLE Pulse Width HIGH 3.3 ns 5
tSK(O) Output Skew[14] 0.5 ns —
CY74FCT16373CT
CY74FCT162373CT
Parameter Description Min. Max. Unit Fig. No.[13]
tPLH
tPHL Propagation Delay
D to O 1.5 4.2 ns 1, 3
tPLH
tPHL Propagation Delay
LE to O 2.0 5.5 ns 1, 5
tPZH
tPZL Output Enable Time 1.5 5.5 ns 1, 7, 8
tPHZ
tPLZ Output Disable Time 1.5 5.0 ns 1, 7, 8
tSU Set-Up Time HIGH or LOW, D to LE 2.0 ns 9
tHHold Time HIGH or LOW,
D to LE 1.5 ns 9
tWLE Pulse Width HIGH 3.3 ns 5
tSK(O) Output Skew[14] 0.5 ns —
Notes:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
CY74FCT16373
T
CY74FCT162373
T
5
Ordering Information CY74FCT16373
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
4.2 CY74FCT16373CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT16373CTPVC/PVCT O48 48-Lead (300-Mil) SSOP
CY74FCT16373CTVR - 48-Lead (173-Mil) TVSOP
5.2 CY74FCT16373ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT16373ATPVC/PVCT O48 48-Lead (300-Mil) SSOP
CY74FCT16373ATVR - 48-Lead (173-Mil) TVSOP
Ordering Information CY74FCT162373
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
4.2 74FCT162373CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162373CTPVC O48 48-Lead (300-Mil) SSOP
74FCT162373CTPVCT O48 48-Lead (300-Mil) SSOP
5.2 74FCT162373ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162373ATPVC O48 48-Lead (300-Mil) SSOP
74FCT162373ATPVCT O48 48-Lead (300-Mil) SSOP
CY74FCT16373
T
CY74FCT162373
T
6
Package Diagrams
48-Lead Shrunk Small Outline Package O48
48-Lead Thin Shrunk Small Outline Package Z48
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74FCT162373ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162373ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162373ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162373CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162373CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162373ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
74FCT162373ETPVCT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
74FCT16373ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16373ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16373ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16373ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16373CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16373CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16373CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT162373ATPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT162373CTPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT162373ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
CY74FCT162373ETPVC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2010
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CY74FCT16373ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16373ATPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16373ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16373CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16373CTPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16373CTVR ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16373CTVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16373CTVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16373ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
CY74FCT16373ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
CY74FCT16373ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available
CY74FCT16373ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available
FCT162373ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162373ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162373ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162373CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162373CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2010
Addendum-Page 3
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
74FCT162373ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
74FCT162373ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
74FCT162373CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT16373ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT16373ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
CY74FCT16373CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT16373CTVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74FCT162373ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0
74FCT162373ATPVCT SSOP DL 48 1000 367.0 367.0 55.0
74FCT162373CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0
CY74FCT16373ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0
CY74FCT16373ATPVCT SSOP DL 48 1000 367.0 367.0 55.0
CY74FCT16373CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0
CY74FCT16373CTVR TVSOP DGV 48 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°–ā8°
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
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