 
   
SCLS160D − DECEMBER 1982 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DWide Operating Voltage Range of 2 V to 6 V
DOutputs Can Drive Up To 10 LSTTL Loads
DLow Power Consumption, 80-µA Max ICC
DTypical tpd = 12 ns
D±4-mA Output Drive at 5 V
DLow Input Current of 1 µA Max
SN54HC4040 ...J OR W PACKAGE
SN74HC4040 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54HC4040 . . . FK PACKAGE
(TOP VIEW)
NC − No internal connection
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
QL
QF
QE
QG
QD
QC
QB
GND
VCC
QK
QJ
QH
QI
CLR
CLK
QA
3212019
910111213
4
5
6
7
8
18
17
16
15
14
QJ
QH
NC
QI
CLR
QE
QG
NC
QD
QC
Q
Q
NC
A
CLK V
Q
B
GND
NC
CC
F
L
K
Q
Q
description/ordering information
The ’HC4040 devices are 12-stage asynchronous binary counters, with the outputs of all stages available
externally. A high level at the clear (CLR) input asynchronously clears the counter and resets all outputs low.
The count is advanced on a high-to-low transition at the clock (CLK) input. Applications include time-delay
circuits, counter controls, and frequency-dividing circuits.
ORDERING INFORMATION
TAPACKAGEPACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube of 25 SN74HC4040N SN74HC4040N
Tube of 40 SN74HC4040D
SOIC − D Reel of 2500 SN74HC4040DR HC4040
SOIC − D
Reel of 250 SN74HC4040DT
HC4040
−40°C to 85°CSOP − NS Reel of 2000 SN74HC4040NSR HC4040
−40 C to 85 C
SSOP − DB Reel of 2000 SN74HC4040DBR HC4040
Tube of 90 SN74HC4040PW
TSSOP − PW Reel of 2000 SN74HC4040PWR HC4040
TSSOP − PW
Reel of 250 SN74HC4040PWT
HC4040
CDIP − J Tube of 25 SNJ54HC4040J SNJ54HC4040J
−55°C to 125°CCFP − W Tube of 150 SNJ54HC4040W SNJ54HC4040W
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54HC4040FK SNJ54HC4040FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2003, Texas Instruments Incorporated
   ! "#$ !  %#&'" ($)
(#"! "  !%$""! %$ *$ $!  $+! !#$!
!(( ,-) (#" %"$!!. ($!  $"$!!'- "'#($
$!.  '' %$$!)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
 %(#"! "%'  /01232 '' %$$! $ $!$(
#'$!! *$,!$ $()  '' *$ %(#"! %(#"
%"$!!. ($!  $"$!!'- "'#($ $!.  '' %$$!)
 
   
SCLS160D − DECEMBER 1982 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FUNCTION TABLE
(each buffer)
INPUTS
FUNCTION
CLK CLR
FUNCTION
LNo change
L Advance to next stage
X H All outputs L
logic diagram (positive logic)
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
R
T
R
T
R
T
R
T
R
T
R
T
R
T
R
T
R
T
R
T
R
T
R
T
953
2 4 13 12 14 15 1
11
10
CLR
CLK
QAQDQE
QHQKQL
QFQGQIQJ
7
QB
6
QC
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 82°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
 
   
SCLS160D − DECEMBER 1982 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HC4040 SN74HC4040
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
V
IH
High-level input voltage VCC = 4.5 V 3.15 3.15 V
VIH
High-level input voltage
VCC = 6 V 4.2 4.2
V
VCC = 2 V 0.5 0.5
V
IL
Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VIL
Low-level input voltage
VCC = 6 V 1.8 1.8
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
t/vInput transition rise/fall time VCC = 4.5 V 500 500 ns
t/v
Input transition rise/fall time
VCC = 6 V 400 400
ns
TAOperating free-air temperature −55 125 −40 85 °C
If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HC4040 SN74HC4040
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 1.9 1.998 1.9 1.9
I
OH
= −20 µA4.5 V 4.4 4.499 4.4 4.4
V
OH
V
= V
or V
IOH = −20 µA
6 V 5.9 5.999 5.9 5.9 V
VOH
IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84
V
IOH = −5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
I
OL
= 20 µA4.5 V 0.001 0.1 0.1 0.1
V
OL
V
= V
or V
IOL = 20 µA
6 V 0.001 0.1 0.1 0.1 V
VOL
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
V
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA
Ci2 V to 6 V 3 10 10 10 pF
 
   
SCLS160D − DECEMBER 1982 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
TA = 25°C SN54HC4040 SN74HC4040
UNIT
V
CC MIN MAX MIN MAX MIN MAX
UNIT
2 V 5.5 3.7 4.3
f
clock
Clock frequency 4.5 V 28 19 22 MHz
fclock
Clock frequency
6 V 33 22 25
MHz
2 V 90 135 115
CLK high or low 4.5 V 18 27 23
tw
Pulse duration
CLK high or low
6 V 15 23 20
ns
twPulse duration 2 V 70 105 90 ns
CLR high 4.5 V 14 21 18
CLR high
6 V 12 18 15
2 V 60 90 75
t
su
Setup time, CLR inactive before CLK4.5 V 12 18 15 ns
tsu
Setup time, CLR inactive before CLK
6 V 10 15 13
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC4040 SN74HC4040
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 5.5 10 3.7 4.3
f
max
4.5 V 28 45 19 22 MHz
fmax
6 V 33 53 22 25
MHz
2 V 62 150 225 190
t
pd
CLK Q
A
4.5 V 16 30 45 38 ns
tpd
CLK
QA
6 V 12 26 38 32
ns
2 V 63 140 210 175
t
PHL
CLR Any 4.5 V 17 28 42 35 ns
tPHL
CLR
Any
6 V 13 24 36 30
ns
2 V 28 75 110 95
t
t
Any 4.5 V 8 15 22 19 ns
tt
Any
6 V 6 13 19 16
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load 88 pF
 
   
SCLS160D − DECEMBER 1982 − REVISED SEPTEMBER 2003
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
th
tsu
50%
50%50% 10%10% 90% 90%
VCC
VCC
0 V
0 V
trtf
Reference
Input
Data
Input
50%
High-Level
Pulse 50%
V
CC
0 V
50% 50%
VCC
0 V
tw
Low-Level
Pulse
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
VC
C
VO
H
VO
L
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VO
H
VO
L
tr
tf
tPHL tPLH
Out-of-Phase
Output
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
85004012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85004012A
SNJ54HC
4040FK
8500401EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8500401EA
SNJ54HC4040J
8500401FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8500401FA
SNJ54HC4040W
SN54HC4040J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC4040J
SN74HC4040D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI -40 to 85
SN74HC4040DBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74HC4040DWR OBSOLETE SOIC DW 16 TBD Call TI Call TI -40 to 85
SN74HC4040N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC4040N
SN74HC4040N3 OBSOLETE PDIP N 16 TBD Call TI Call TI -40 to 85
SN74HC4040NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC4040N
SN74HC4040NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI -40 to 85
SN74HC4040PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PWT ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SN74HC4040PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC4040
SNJ54HC4040FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85004012A
SNJ54HC
4040FK
SNJ54HC4040J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8500401EA
SNJ54HC4040J
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54HC4040W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8500401FA
SNJ54HC4040W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC4040, SN74HC4040 :
Catalog: SN74HC4040
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 4
Military: SN54HC4040
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC4040DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HC4040DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC4040DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC4040PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC4040PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC4040DBR SSOP DB 16 2000 367.0 367.0 38.0
SN74HC4040DR SOIC D 16 2500 367.0 367.0 38.0
SN74HC4040DR SOIC D 16 2500 333.2 345.9 28.6
SN74HC4040PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74HC4040PWT TSSOP PW 16 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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