© Semiconductor Components Industries, LLC, 2013
July, 2018 Rev. 2
1Publication Order Number:
FAN48610/D
FAN48610
Fixed-Output Synchronous
Regulator, TINYBOOST),
2.5 MHz
Description
The FAN48610 is a low-power boost regulator designed to provide
a minimum voltage-regulated rail from a standard single-cell Li-Ion
battery and advanced battery chemistries. Even below the minimum
system battery voltage, the device maintains the output voltage
regulation for a minimum output load current of 1.0 A. The
combination of built-in power transistors, synchronous rectification,
and low supply current suit the FAN48610 for battery-powered
applications.
The FAN48610 is available in a 9-bump, 0.4 mm pitch, Wafer-Level
Chip-Scale Package (WLCSP).
Features
Input Voltage Range: 2.5 V to 4.8 V
Output Voltages Range: 3.0 V to 5.0 V
IOUT 1 A at VOUT = 5.0 V, VIN 2.5 V
IOUT 1.5 A at VOUT = 5.0 V, VIN 3.0 V
Up to 94% Efficient
Internal Synchronous Rectification
Soft-Start with True Load Disconnect
Short-Circuit Protection
9-Bump, 1.215 mm × 1.215 mm, 0.4 mm Pitch WLCSP
Three External Components: 2016 0.47 mH Inductor,
0603 Case Size Input / Output Capacitors
Total Application Board Solution Size: < 11 mm2
Applications
Class-D Audio Amplifier and USB OTG Supply
Boost for Low-Voltage Li-Ion Batteries
Smart Phones, Tablets, Portable Devices, Wearables
Figure 1. Typical Application
FAN48610
VOUT
PGND
COUT
L1
0.47 mH
22 mF
VIN
SW
EN
CIN
+
Battery SYSTEM
LOAD
AGND
10 mF
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WLCSP9
CASE 567QW
See detailed ordering and shipping information on page 2 of
this data sheet.
ORDERING INFORMATION
MARKING DIAGRAM
XX = KA / KF / KN
&K = Lot Code
&. = Alphabetical Year Code
&2 = Numeric Date Code
&Z = Assembly Plant Code
XX&K
&.&2&Z
PIN ASSIGNMENT
(Top View)
B3B2
C3C2
A3A2
B1
A1
C1
VOUT
SW
PGND
VIN
EN
AGND
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Table 1. ORDERING INFORMATION
Part Number VOUT
Operating
Temperature Package PackingDevice Marking
FAN48610UC50X 5.0 V 40°C to 85°CWLCSP, 0.4 mm Pitch Tape and Reel KF
FAN48610BUC50X (Note 1)
FAN48610BUC45X (Note 1) 4.5 V KA
FAN48610BUC33X (Note 1) 3.3 V KN
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
1. Includes backside lamination.
BLOCK DIAGRAM
Figure 2. IC Block Diagram
Q2
Q2B Q2A
EN
L1
COUT
VOUT
Q1
Modulator
Logic & Control
VIN
SW
CIN
Synchronous
Rectifier
Control
PGND
AGND
Table 2. RECOMMENDED COMPONENTS
Component Description Ventor Parameter Typ. Unit
L1 0.47 mH, 30%, 2016 Toko: DFE201612C DFR201612C
Cyntec: PIFE20161B
L 0.47 mH
DCR (Series R) 40 mW
CIN 10 mF, 10%, 6.3 V, X5R, 0603 Murata: GRM188R60J106K
TDK: C1608X5R0J106K
C 10 mF
COUT 22 mF, 20%, 6.3 V, X5R, 0603 TDK: C1608X5R0J226M C 22 mF
FAN48610
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PIN CONFIGURATION
Figure 3. Top View Figure 4. Bottom View
B3 B2
C3 C2
A3 A2
B1
A1
C1
B3B2
C3C2
A3A2
B1
A1
C1
VOUT
SW
PGND
VIN
EN
AGND
Table 3. PIN DEFINITIONS
Pin # Name Description
A1, A2 VOUT Output Voltage. This pin is the output voltage terminal; connect directly to COUT.
A3 VIN Input Voltage. Connect to Li-Ion battery input power source and the bias supply for the gate drivers.
B1, B2 SW Switching Node. Connect to inductor.
B3 EN Enable. When this pin is HIGH, the circuit is enabled.
C1, C2 PGND Power Ground. This is the power return for the IC. COUT capacitor should be returned with the shortest
path possible to these pins.
C3 AGND Analog Ground. This is the signal ground reference for the IC. All voltage levels are measured with
respect to this pin – connect to PGND at a single point.
Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min. Max. Unit
VIN Voltage on VIN Pin 0.3 6.0 V
VOUT Voltage on VOUT Pin 6.0 V
SW SW Node DC 0.3 6.0 V
Transient: 10 ns, 3 MHz 1.0 8.0
VCC Voltage on Other Pins 0.3 6.0
(Note 2) V
ESD Electrostatic Discharge Protection Level Human Body Model per JESD22A114 2kV
Charged Device Model per JESD22C101 1
TJJunction Temperature 40 +150 °C
TSTG Storage Temperature 65 +150 °C
TLLead Soldering Temperature, 10 Seconds +260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. Lesser of 6.0 V or VIN + 0.3 V.
FAN48610
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Table 5. RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min. Max. Unit
VIN Supply Voltage 2.5 4.8 V
IOUT Maximum Output Current 1000 mA
TAAmbient Temperature –40 +85 °C
TJJunction Temperature –40 +125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 6. THERMAL PROPERTIES
Symbol Parameter Typical Unit
qJA Junction-to-Ambient Thermal Resistance 50 °C/W
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards in
accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate
TA.
Table 7. ELECTRICAL CHARACTERISTICS
(Recommended operating conditions, unless otherwise noted, circuit per Figure 1, VOUT= 3.0 V to 5.0 V, VIN = 2.5 V to 4.5 V, TA = 40°C
to 85°C. Typical values are given VIN = 3.6 V and TA = 25°C)
Symbol Parameter Conditions Min. Typ. Max. Unit
POWER SUPPLY
IQVIN Quiescent Current VIN = 3.6 V, IOUT = 0 A, EN = VIN 85 125 mA
Shutdown: EN = 0, VIN = 3.6 V 3 10
VUVLO Under-Voltage Lockout VIN Rising 2.2 2.3 V
VUVLO_HYS Under-Voltage Lockout
Hysteresis
150 mV
INPUTS
VIH Enable HIGH Voltage 1.05 V
VIL Enable LOW Voltage 0.4 V
IPD Current Sink Pull-Down EN Pin, Logic HIGH 100 nA
RLOW Low-State Active Pull-Down EN Pin, Logic LOW 200 300 400 kW
OUTPUTS
VREG Output Voltage Accuracy DC (Note 3) Referred to VOUT,
2.5 V VIN VOUT 150 mV
24 %
ILK_OUT VIN-to-VOUT Leakage Current VOUT = 0, EN = 0, VIN = 4.2 V 1mA
ILK VOUT-to-VIN Reverse Leakage
Current
VOUT = 5.0 V, EN = 0, VIN = 2.5 V 3.5 mA
VTRSP Output Voltage Accuracy Transient
(Note 4)
Referred to VOUT
, 50500 mA Load Step 5 5 %
TIMING
fSW Switching Frequency VIN = 3.6 V, VOUT = 5.0 V, Load = 1000 mA 2.0 2.5 3.0 MHz
tSS Soft-Start EN HIGH to Regulation
(Note 4)
50 W Load, VOUT = 5.0 V 600 mA
tRST FAULT Restart Timer (Note 4) 20 ms
FAN48610
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Table 7. ELECTRICAL CHARACTERISTICS (continued)
(Recommended operating conditions, unless otherwise noted, circuit per Figure 1, VOUT= 3.0 V to 5.0 V, VIN = 2.5 V to 4.5 V, TA = 40°C
to 85°C. Typical values are given VIN = 3.6 V and TA = 25°C)
Symbol UnitMax.Typ.Min.ConditionsParameter
POWER STAGE
RDS(ON)N N-Channel Boost Switch RDS(ON) VIN = 3.6 V, VOUT = 5.0 V 80 130 mW
RDS(ON)P P-Channel Sync. Rectifier RDS(ON) VIN = 3.6 V, VOUT = 5.0 V 65 115 mW
IV_LIM Boost Valley Current Limit VOUT = 5.0 V 3.0 A
IV_LIM_SS Boost Soft-Start Valley Current Limit VIN < VOUT < VOUT_TARGET, SS Mode 1.7 A
VMIN_1.0A Minimum VIN for 1000 mA Load
(Note 4)
VOUT = 5.0 V 2.5 V
VMIN_1.5A Minimum VIN for 1500 mA Load
(Note 4)
VOUT = 5.0 V 3.0 V
T150T Over-Temperature Protection (OTP) 150 °C
T150H OTP Hysteresis 20 °C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. DC ILOAD from 0 to 1 A. VOUT measured from mid-point of output voltage ripple. Effective capacitance of COUT > 3 mF.
4. Guaranteed by design and characterization; not tested in production.
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TYPICAL CHARACTERISTICS
(Unless otherwise specified; VIN = 3.6 V, VOUT = 5.0 V, TA = 25°C, and circuit and components according to Figure 1)
76%
80%
84%
88%
92%
96%
1 10 100 1000
Efficiency
Load Current (mA)
2.6 VIN
3.0 VIN
3.6 VIN
4.2 VIN
2
1
0
1
2
0 250 500 750 1000
Output Regulation (%)
Load Current (mA)
40C
+25C
+85C
2
1
0
1
2
3
0 250 500 750 1000
Output Regulation (%)
Load Current (mA)
2.6 VIN
3.0 VIN
3.6 VIN
4.2 VIN
78%
82%
86%
90%
94%
98%
10 100 1000
Efficiency
Load Current (mA)
40C
+25C
+85C
80%
84%
88%
92%
96%
10 100 1000
Efficiency
Load Current (mA)
2.5 VIN
2.7 VIN
3.0 VIN
76%
80%
84%
88%
92%
96%
1 10 100 1000
Efficiency
Load Current (mA)
40C
+25C
+85C
Figure 5. Efficiency vs. Load Current
and Input Voltage
Figure 6. Efficiency vs. Load Current
and Temperature
Figure 7. Efficiency vs. Load Current
and Input Voltage, VOUT = 3.3 V
Figure 8. Efficiency vs. Load Current and
Temperature, VIN = 3.0 V, VOUT = 3.3 V
Figure 9. Output Regulation vs. Load
Current and Input Voltage (Normalized
to 3.6 VIN, 500 mA Load)
Figure 10. Output Regulation vs. Load
Current and Temperature (Normalized to
3.6 VIN, 500 mA Load, TA = 255C)
FAN48610
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TYPICAL CHARACTERISTICS
(Unless otherwise specified; VIN = 3.6 V, VOUT = 5.0 V, TA = 25°C, and circuit and components according to Figure 1)
0
500
1,000
1,500
2,000
2,500
3,000
0 250 500 750 1000
Switching Frequency (KHz)
Load Current (mA)
2.6 VIN
3.0 VIN
3.6 VIN
4.2 VIN
0
10
20
30
40
50
60
0 250 500 750 1000
Output Ripple (mVpp)
Load Current (mA)
2.6 VIN
3.0 VIN
3.6 VIN
4.2 VIN
0
20
40
60
80
100
120
2.0 2.5 3.0 3.5 4.0 4.5
Input Current ( A)
Input Voltage (V)
40C Auto
+25C Auto
+85C Auto
Figure 11. Quiescent Current vs. Input
Voltage, Temperature
Figure 12. Output Ripple vs. Load Current and
Input Voltage
Figure 13. Frequency vs. Load Current
and Input Voltage
Figure 14. Startup, 50 W Load
Figure 15. Overload Protection Figure 16. Load Transient, 100500 mA,
100 ns Edge
FAN48610
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TYPICAL CHARACTERISTICS
(Unless otherwise specified; VIN = 3.6 V, VOUT = 5.0 V, TA = 25°C, and circuit and components according to Figure 1)
Figure 17. Load Transient, 5001000 mA,
100 ns Edge
Figure 18. Simultaneous Line / Load
Transient, 3.3 3.9 VIN, 10 ms Edge,
5001000 mA Load, 100 ns Edge
Figure 19. Line Transient, 3.33.9 VIN,
10 ms Edge, 500 mA Load
Figure 20. Typical Maximum Output Current
vs. Input Voltage
0.60
1.00
1.40
1.80
2.20
2.60
2.5 3.0 3.5 4.0 4.5
Maximum Output Current (A)
Input Voltage (V)
+25C
+85C
FAN48610
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CIRCUIT DESCRIPTION
FAN48610 is a synchronous boost regulator, typically
operating at 2.5 MHz in Continuous Conduction Mode
(CCM), which occurs at moderate to heavy load current and
low VIN voltages. The regulators Pass-Through Mode
automatically activates when VIN is above the boost
regulators set point.
Table 8. OPERATING MODES
Mode Description Invoked When:
LIN Linear Startup VIN > VOUT
SS Boost Soft-Start VIN < VOUT < VOUT(TARGET)
BST Boost Operating Mode VOUT= VOUT(TARGET)
PT Pass-Through Mode VIN > VOUT(TARGET)
Boost Mode Regulation
The FAN48610 uses a current-mode modulator to achieve
excellent transient response and smooth transitions between
CCM and DCM operation. During CCM operation, the
device maintains a switching frequency of about 2.5 MHz.
In lightload operation (DCM), frequency is naturally
reduced to maintain high efficiency.
Shutdown and Startup
When EN is LOW, all bias circuits are off and the regulator
is in Shutdown Mode. During shutdown, current flow is
prevented from VIN to VOUT, as well as reverse flow from
VOUT to VIN. It is recommended to keep load current draw
below 500 mA until the devices successfully executes
startup. The following table describes the startup sequence.
Table 9. BOOST STARTUP SEQUENCE
Start Mode Entry Exit End Mode Timeout (ms)
LIN1 VIN > VUVLO, EN = 1 VOUT > VIN 300 mV SS
TIMEOUT LIN2 512
LIN2 LIN1 Exit VOUT > VIN 300 mV SS
TIMEOUT FAULT 1024
SS LIN1 or LIN2 Exit VOUT = VOUT(TARGET) BST
OVERLOAD TIMEOUT FAULT 64
LIN Mode
When EN is HIGH and VIN > VUVLO, the regulator first
attempts to bring VOUT within 300 mV of VIN by using the
internal fixed-current source from VIN (Q2). The current is
limited to the LIN1 set point.
If VOUT reaches VIN 300 mV during LIN1 Mode, the SS
Mode is initiated. Otherwise, LIN1 times out after 512 ms
and LIN2 Mode is entered.
In LIN2 Mode, the current source is incremented to 1.6 A.
If VOUT fails to reach VIN 300 mV after 1024 ms, a fault
condition is declared and the device waits 20 ms to attempt
an automatic restart.
SoftStart (SS) Mode
Upon the successful completion of LIN Mode
(VOUT VIN 300 mV), the regulator begins switching
with boost pulses current limited to 50% of nominal level.
During SS Mode, if VOUT fails to reach regulation during
the SS ramp sequence for more than 64 ms, a fault is
declared. If large COUT is used, the reference is
automatically stepped slower to avoid excessive input
current draw.
Boost (BST) Mode
This is a normal operating mode of the regulator.
Pass-Through (PT) Mode
In normal operation, the device automatically transitions
from Boost Mode to Pass-Through Mode if VIN goes above
the target VOUT. In Pass-Through Mode, the device fully
enhances Q2 to provide a very low impedance path from
VIN to VOUT. Entry to the Pass-Through Mode is triggered
by condition where VIN > VOUT and no switching has
occurred during the past 5 ms. To soften the entry into
Pass-Through Mode, Q2 is driven as a linear current source
for the first 5 ms. Pass-Through Mode exit is triggered when
VOUT reaches the target VOUT voltage. During Automatic
Pass-Through Mode, the device is short-circuit protected by
a voltage comparator tracking the voltage drop from VIN to
VOUT; if the drop exceeds 300 mV, a fault is declared.
Fault State
The regulator enters Fault State under any of the following
conditions:
VOUT fails to achieve the voltage required to advance
from LIN Mode to SS Mode.
VOUT fails to achieve the voltage required to advance
from SS Mode to BST Mode.
Boost current limit triggers for 2 ms during BST Mode.
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VIN – VOUT > 300 mV; this fault can occur only after
successful completion of the soft-start sequence.
VIN < VUVLO.
Once a fault is triggered, the regulator stops switching and
presents a high-impedance path between VIN and VOUT.
After waiting 20 ms, an automatic restart is attempted.
Over-Temperature
The regulator shuts down if the die temperature exceeds
150°C. Restart occurs when the IC has cooled by
approximately 20°C.
APPLICATION INFORMATION
Output Capacitance (COUT)
The effective capacitance (CEFF (Note 5)) of small,
high-value ceramic capacitors decreases as their bias
voltage increases, as illustrated in the graph below:
Figure 21. CEFF for 22 mF, 0603, X5R, 6.3 V-Rated
Capacitor (TDK C1608X5R0J226M)
0
5
10
15
20
25
0123456
Capacitance ( F)
DC Bias Voltage (V)
FAN48610 is guaranteed for stable operation with the
minimum value of CEFF (CEFF(MIN)) outlined in Table 10.
Table 10. MINIMUM CEFF REQUIRED FOR STABILITY
Operating Conditions CEFF(MIN)
(mF)
VOUT (V) VIN (V) ILOAD (mA)
5.0 2.5 to 4.5 0 to 1000 3.0
5. CEFF varies by manufacturer, capacitor material, and case size.
6. CEFF、。
Introduction Selection
Recommended nominal inductance value is 0.47 mH. The
FAN48610 employs valley-current limiting, so peak
inductor current can reach 3.8 A for a short duration during
overload conditions. Saturation effects cause the inductor
current ripple to become higher under high loading, as only
the valley of the inductor current ripple is controlled.
Startup
Input current limiting is in effect during soft-start, which
limits the current available to charge COUT and any
additional capacitance on the VOUT line. If the output fails
to achieve regulation within the limits described in the
Soft-Start section above, a fault occurs, causing the circuit
to shut down. It waits about 20 ms before attempting
a restart. If the total combined output capacitance is very
high, the circuit may not start on the first attempt, but
eventually achieves regulation if no load is present. If a high
current load and high capacitance are both present during
soft-start, the circuit may fail to achieve regulation and
continually attempt soft-start, only to have the output
capacitance discharged by the load when in Fault State.
Output Voltage Ripple
Output voltage ripple is inversely proportional to COUT.
During tON, when the boost switch is on, all load current is
supplied by COUT.
VRIPPLE(P*P) +tON @
ILOAD
COUT
(eq. 1)
And
tON +tSW @D+tSW @ǒ1*
VIN
VOUTǓ(eq. 2)
therefore:
VRIPPLE(P*P) +tSW @ǒ1*
VIN
VOUTǓ@
ILOAD
COUT
(eq. 3)
tSW +1
fSW
(eq. 4)
The maximum VRIPPLE occurs when VIN is minimum and
ILOAD is maximum. For better ripple performance, more
output capacitance can be added.
Layout Recommendations
The layout recommendations below highlight various
topcopper pours by using different colors.
To minimize spikes at VOUT, COUT must be placed as
close as possible to PGND and VOUT, as shown below.
For thermal reasons, it is suggested to maximize the pour
area for all planes other than SW. Especially the ground pour
should be set to fill all available PCB surface area and tied
to internal layers with a cluster of thermal vias.
FAN48610
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Figure 22. Layout Recommendation
PRODUCT-SPECIFIC DIMENSIONS (This table pertains to the package information on the following page.)
DE X Y
1.215 ±0.030 mm 1.215 ±0.030 mm 0.2075 mm 0.2075 mm
TINYBOOST is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States
and/or other countries.
WLCSP9 1.215x1.215x0.581
CASE 567QW
ISSUE O DATE 31 OCT 201
6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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October, 2002 − Rev. 0 Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
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DESCRIPTION:
98AON13355G
ON SEMICONDUCTOR STANDARD
WLCSP9 1.215x1.215x0.581
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