ASDL-4561
High Performance Infrared Emitter (870nm) ChipLED
Data Sheet
Description
ASDL-4561 Infrared emitter is a 0603 ChipLED SMT
package that is designed for applications with low space
requirements and high radiant intensity coupled with
high speed. It is optimized for eciency at emission
wavelength of 870nm and encapsulated with a at lens
for wide viewing angle applications.
Applications
• High-Speed Machine Automated System
• Remote Control
• Smoke Detector
• Medical Applications
• Non-Contact Position Sensing
• Optical Encoders
Ordering Information
Features
• 870nm wavelength
• Industry Standard Footprint:
0603 ChipLED SMT Package
• Top Emitting
• Low Forward Voltage
• High Pulse Rate
• High Speed
• Wide Viewing Angle
• Lead Free and ROHS Compliant
• Tape & Reel for automation placement
Part Number Packaging Shipping Option
ASDL-4651-C22 Tape & Reel 12Kpcs
2
Package Outline
All Dimensions are in Millimeters
Tape and Reel Dimension
All Dimensions are in Millimeters (Inches)
3
Absolute Maximum Ratings at 25°C
Parameter Symbol Min. Max Unit Reference
Peak Forward Current IFPK 300 mA Tp=500ns
Tw=100ns
Duty Cycle=20%
Continuous Forward Current IFDC 60 mA
Power Dissipation PDISS 120 mW
Reverse Voltage Vr11 V Ir=100uA
Operating Temperature TO-40 85 °C
LED Junction Temperature TJ110 °C
Lead Soldering Temperature 260 for 5 sec °C
Electrical Characteristics at 25°C
Parameter Symbol Min. Typ. Max. Unit Condition
Forward Voltage VF1.3
1.35
1.75
1.85
V
V
IF=20mA
IF=50mA
Reverse Voltage Vr11 V IR=100uA
Thermal Resistance 400 °C/W
Diode Capacitance CO50 pF Vr=0V, f=1MHz
Optical Characteristics at 25°C
Parameter Symbol Min. Typ. Max. Unit Condition
Radiant On-Axis Intensity IE1.64 2.2 mW/Sr IF=50mA
Viewing Angle 2θ1/2 150 deg
Peak wavelength λPK 870 nm IF = 50mA
Spectral Width Δλ 45 nm IF = 50mA
Optical Rise Time tr20 ns IFPK=500mA
Duty Factor=20%
Pulse Width=100ns
Optical Fall Time tf17 ns IFPK=500mA
Duty Factor=20%
Pulse Width=100ns
4
Typical Electrical / Optical Characteristics Curve (TA = 25°C Unless Otherwise Stated)
Figure 1. Peak Wavelength Vs Relative Radiant Intensity Figure 2. Forward Current Vs Forward Voltage
Figure 3. Forward Current Vs Radiant Intensity Figure 4.Angular Displacement Vs Relative Radiant Intensity
Figure 5. Forward Current versus Ambient Temperature derated based on
Tj – 110 °C and thermal resistance at 400 °C/W
0.2
0.4
0.6
0.8
1.0
1.2
700 800 900 1000
Peak Wavelength (nm)
Relative Radiant Intensity
0
0
0.02
0.04
0.06
0.08
0.10
0.12
0 0.5 1 1.5
Vf Forward Voltage (V)
If Forward Current (A)
0
0.2
0.4
0.6
0.8
1
-0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8
Ie - Relative Radiant Intensity
0
5
10
15
20
25
30
35
40
45
50
55
60
65
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - oC
IDC
MAX - MAXIMUM DC CURRENT PER SEGMENT - mA
0
1
2
3
4
5
0 20 40 60 80 100 120
Forward Current (mA)
Radiant Intensity (mW/Sr)
5
50 100 150 200 250 300
t-TIME
(SECONDS)
25
80
120
150
180
200
230
255
0
T - TEMPERATURE (°C)
R1
R2
R3 R4
R5
217
MAX 260C
60 sec to 90 sec
Above 217 C
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL DOWN
Process Zone Symbol DT
Maximum DT/Dtime
or Duration
Heat Up P1, R1 25°C to 150°C 3°C/s
Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s
Solder Reow P3, R3
P3, R4
200°C to 260°C
260°C to 200°C
3°C/s
-6°C/s
Cool Down P4, R5 200°C to 25°C -6°C/s
Time maintained above liquidus point , 217°C > 217°C 60s to 90s
Peak Temperature 260°C -
Time within 5°C of actual Peak Temperature - 20s to 40s
Time 25°C to Peak Temperature 25°C to 260°C 8mins
The reow prole is a straight-line representation of a nominal temperature prole for a convective reow solder
process. The temperature prole is divided into four process zones, each with dierent DT/Dtime temperature change
rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at
the component to printed circuit board connections.
In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the ux in the
solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC
board and component pins.
Process zone P2 should be of sucient time duration (100 to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder.
Process zone P3 is the solder reow zone. In zone P3, the temperature is quickly raised above the liquidus point of
solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60
and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good
solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections
becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze
solid.
Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder
to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and
component pins to change dimensions evenly, putting minimal stresses on the component.
It is recommended to perform reow soldering no more than twice.
Recommended Reow Prole
Recommended Land Pattern
All Dimensions are in Millimeters (Inches)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0276EN - April 27, 2007