Rev.2.00 Sep 07, 2005 page 1 of 6
2SK2328
Silicon N Channel MOS FET REJ03G1007-0200
(Previous: ADE-208-13 55)
Rev.2.00
Sep 07, 2005
Application
High speed power switching
Features
Low on-resistance
High speed switching
Low drive current
No secondary breakdown
Suitable for sw i t c hi ng regulator, DC- DC con vert er
Outline
RENESAS Package code: PRSS0004AC-A
(Package name: TO-220AB)
1. Gate
2. Drain
(Flange
)
3. Source
123
D
G
S
2SK2328
Rev.2.00 Sep 07, 2005 page 2 of 6
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage VDSS 650 V
Gate to source voltage VGSS ±30 V
Drain current ID 7 A
Drain peak current ID(pulse)*1 28 A
Body to drain diode reverse drain current IDR 7 A
Channel dissipation Pch*2 75 W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10 µs, duty cycle 1 %
2. Value at Tc = 25°C
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V(BR)DSS 650 V ID = 10 mA, VGS = 0
Gate to source breakdown voltage V(BR)GSS ±30 — V IG = ±100 µA, VDS = 0
Gate to source leak current IGSS ±10 µA VGS = ±25 V, VDS = 0
Zero gate voltage drain current IDSS — 250 µA VDS = 550 V, VGS = 0
Gate to source cutoff voltage VGS(off) 2.0 3.0 V ID = 1 mA, VDS = 10 V
Static drain to source on state
resistance RDS(on) 1.0 1.4 I
D = 4A, VGS = 10 V*3
Forward transfer admittance |yfs| 4.0 6.5 S ID = 4 A, VDS = 10 V*3
Input capacitance Ciss 1180 pF
Output capacitance Coss 265 pF
Reverse transfer capacitance Crss 50 pF
VDS = 10 V, VGS = 0,
f = 1 MHz
Turn-on delay time td(on) 15 ns
Rise time tr50 ns
Turn-off delay time td(off)105 ns
Fall time tf45 ns
ID = 4 A, VGS = 10 V,
RL = 7.5
Body-drain diode forward voltage VDF0.95 V IF = 7 A, VGS = 0
Body-drain diode reverse recovery
time trr420 ns
IF = 7 A, VGS = 0,
diF / dt = 100 A / µs
Note: 3. Pulse test
2SK2328
Rev.2.00 Sep 07, 2005 page 3 of 6
Main Characteristics
Case Temperature T
C
(°C)
Channel Dissipation Pch (W)
Power vs. Temperature Derating
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
Maximum Safe Operation Area
10
20 50
Drain to Source Voltage V
DS
(V)
Typical Output Characteristics
8
2
10 30 400
4
6
Drain Current I
D
(A)
V
GS
= 3.5 V
Pulse Test
4.5 V
6 V
5 V
4 V
10 V
10
410
Gate to Source Voltage V
GS
(V)
Drain Current I
D
(A)
Typical Transfer Characteristics
8
2
2680
4
6
25°C
V
DS
= 20 V
Pulse Test
–25°C
T
C
= 75°C
20
820
Gate to Source Voltage V
GS
(V)
Drain to Source Saturation Voltage V
DS (on)
(V)
16
4
412160
8
12
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
Pulse Test
5 A
I
D
= 10 A
2 A
5
Drain Current I
D
(A)
Static Drain to Source on State Resistance
R
DS (on)
()
2
0.2
0.1
0.5
1
Static Drain to Source on State
Resistance vs. Drain Current
Pulse Test
0.05
20
V
GS
= 10 V
15 V
0.5 1 2 5 10 50
100
75
50
25
050 100 150 200 1 3 10 30 100 300 1000
50
20
10
2
5
1
0.2
0.1
0.05
100 µs
10 µs
1 ms
PW = 10 ms (1shot)
DC Operation (Tc = 25°C)
Operation in
this area is
limited by RDS(on)
Ta = 25°C
0.5
2SK2328
Rev.2.00 Sep 07, 2005 page 4 of 6
5
40 160
Case Temperature T
C
(°C)
Static Drain to Source on State Resistance
R
DS (on)
()
4
1
0 80 120
0
2
3
Static Drain to Source on State
Resistance vs. Temperature
–40
VGS = 10 V
Pulse Test
ID = 10 A
5 A
2 A
50
0.2 5
Drain Current I
D
(A)
10
1
0.5 2
5
2
0.1 1
Forward Transfer Admittance yfs (S)
Forward Transfer Admittance
vs. Drain Current
20
VDS = 20 V
–25°C
TC = 75°C
10
25°C
0.5
Pulse Test
500
0.2 5
Reverse Drain Current I
DR
(A)
200
10
0.5 20.1
50
100
5
1
Reverse Recovery Time trr (ns)
Body to Drain Diode Reverse
Recovery Time
di/dt = 100 A/µs, VGS = 0
Ta = 25°C
20
10
1,000
20 50
Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
10 30 40
Typical Capacitance vs.
Drain to Source Voltage
0
100
VGS = 0
f = 1 MHz
Crss
Coss
Ciss
5,000
5
10
1,000
40 100
Drain to Source Voltage V
DS
(V)
Dynamic Input Characteristics
800
200
20 60 80
400
600
20
16
4
0
8
12
Gate to Source Voltage V
GS
(V)
0
250 V
400 V
VDD = 100 V
VGS
VDS
VDD = 400 V
250 V
100 V
ID = 8 A
Gate Charge Qg (nc)
500
Drain Current I
D
(A)
Switching Time t (ns)
200
5
50
100
10
Switching Characteristics
td (off)
0.5 10.2 2 20
tf
tr
td (on)
20
VGS = 10 V, PW = 2 µs
duty < 1%, VDD 30 V
5
=
..
10
2SK2328
Rev.2.00 Sep 07, 2005 page 5 of 6
10
0.8 2.0
Source to Drain Voltage VSD (V)
Reverse Drain Current IDR (A)
8
0.4 1.2 1.6
4
6
Reverse Drain Current vs.
Source to Drain Voltage
Pulse Test
0
2
5, 10 V V
GS
= 0, –5 V
Pulse Width PW (s)
Normalized Transient Thermal Impedance γS (t)
Normalized Transient Thermal Impedance vs. Pulse Width
Switching Time Test Circuit
Vin Monitor
Vin
10 V 50
D.U.T.
Vout Monitor
R
L
V
DD
30 V
=
..
Waveforms
Vin
t
d
(on)
10%
t
r
10%
90%
Vout 10%
90% 90%
t
f
t
d
(off)
10%
3
1
0.3
0.1
0.03
0.01
10 µ100 µ1 m 10 m 100 m 1 10
DM
P
PW
T
D = PW
T
ch – c(t) = s (t) • ch – c
ch – c = 1.67°C/W, Tc = 25°C
θ γ θ
θ
Tc = 25°C
D = 1
0.5
0.2
0.1
0.05
0.02
0.01
1shot pulse
2SK2328
Rev.2.00 Sep 07, 2005 page 6 of 6
Package Dimensions
0.5 ± 0.1
2.54 ± 0.5
0.76 ± 0.1
14.0 ± 0.5 15.0 ± 0.3
2.79 ± 0.218.5 ± 0.57.8 ± 0.5
10.16 ± 0.2
2.54 ± 0.5
1.26 ± 0.15
4.44 ± 0.2
2.7 Max
1.5 Max
11.5 Max
9.5
8.0
1.27
6.4
+0.2
–0.1
φ 3.6
+0.1
–0.08
Package Name
PRSS0004AC-A TO-220AB / TO-220ABV
MASS[Typ.]
1.8gSC-46
RENESAS CodeJEITA Package Code
Unit: mm
Ordering Information
Part Name Quantity Shipping Container
2SK2328-E 500 pcs Box (Sack)
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of
production before ordering the product.
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