Qualification Test 501 -235 AMF Report 13Novo7 Rev C Connector, Micro-Strip, Board To Board 1. INTRODUCTION 1.1. Purpose Testing was performed on AMP* Micro-Strip, Board to Board Connector to determine its conformance to the requirements of AMP Product Specification 108-1272 Rev. O. 1.2. Scope This report covers the electrical, mechanical, and environmental performance of the Micro-Strip, Board to Board Connector manufactured by the Printed Circuit Board Products Division of the Capital Goods Business Unit. 1.3. Conclusion The Micro-Strip, Board to Board Connectors, listed in paragraph 1.5., meet the electrical, mechanical, and environmental performance requirements of AMP Product Specification 108-1272 Rev O. 1.4. Product Description The Micro-strip board to board right angle and vertical connector family is designed to accommodate a variety of printed circuit board thicknesses. The plug assemblies are loaded with .015 inch square male Micro-Strip contacts which mate with receptacle assemblies loaded with female Micro-Strip contacts. The contacts are phosphor bronze or beryllium copper, selective gold over nickel plated. The housings are high temperature thermoplastic, liquid crystal polymer. 1.5. Test Samples The test samples were randomly selected fram normal current production lots, and the following part numbers were used for test: Test Group Quantity Part Nbr Description 1,3 5 ea. 536254-4 100 Position Receptacle Assembly 1,3 5 ea. 536272-4 100 Position Plug Assembly 1,3 5 ea. 536272-6 140 Position Plug Assembly 1,3 5 ea. 536295-6 140 Position Right Angle Assembly 1 5 149012-4 100 Position Plug Assembly 1 5 536317-4 100 Position Receptacle Assembly 2 10 536274-4 100 Position Plug Assembly 2 10 536279-4 100 Position Receptacle Assembly 2 10 121496-4 100 Position Receptacle Assembly 2 10 121354-4 100 Position Plug Assembly CTL7449-090-030 Unrestricted EC 0400-0058-97, BAB AMP Incorporated, Harrisburg, PA This reportis a controlled document. 1of7 * Trademark Copyright 1997 by AMP Incorporated. LOC B | Indicates change All rignts reserved. Form 404-56 30Jan96AiNiF> 501-235 1.6. Qualification Test Sequence Test Groups Test or Examination 1 2 3 Examination of Product 1,9 1,9 1,8 Termination Resistance, Dry Circuit 3,7 2,7 Dielectric Withstanding Voltage 3,7 Insulation Resistance 2,6 Temperature Rise vs Current 3,8 Vibration 5 6 Physical Shock 6 Mating Force 2 Unmating Force 8 Durability 4 Thermal Shock Humidity-Temperature Cycling Mixed Flowing Gas Temperature Life NOTE The numbers indicate sequence in which tests were performed. 2. SUMMARY OF TESTING 2.1. Examination of Product - All Groups All samples submitted for testing were selected from normal current production lots. They were inspected and accepted by the Product Assurance Department of the Capital Goods Business unit. 2.2. Termination Resistance, Dry Circuit - Groups 1 and 2 All termination resistance measurements, taken at 100 milliamperes DC maximum and 50 millivolts open circuit voltage were less than 20 millionms for vertical contacts, 25 millionms for right angle contacts, 40 millionms for M-bus contacts, and 10 millichms for ground contacts initially, and a maximum change in resistance (AR) of 7.0 millionms for all signal contacts and a maximum change in resistance (AR} of 4.0 millionms for all ground contacts after testing. Rev C 2of 7 Form 404-34 20Nov96-ANF Test Nbr of Group Samples 1 470 2 600 1 25 2 30 1 175 1 35 2 600 2.3. Termination Resistance Condition Min Vertical Signal Contacts Initial 8.60 After Mechanical(AR) -3.76 Initial 8.22 After Current Verif.(AR) -2.74 Vertical Ground Contacts Initial 1.26 After Mechanical(AR) -0.34 Initial 1.25 After Current Verif.(AR) -0.16 Right Angle Signal Contacts Initial 11.66 After Mechanical(AR) -3.54 Right Angle Ground Contacts Initial 1.41 After Mechanical(AR) -0.03 M-Bus Signal Contacts 27.13 -1.15 Initial After Current Verif.(AR) All values in milliohms Dielectric Withstanding Voltage - Group 3 Max 13.31 4+2.43 13.27 +2.77 1.73 +0.18 1.67 +0.63 18.15 +237 1.65 +0.09 31.25 +1.25 Mean 9.423 -0.088 9.100 +0.118 1.424 -0.037 1.440 +0.030 14.918 -0.061 1.521 +0.031 29.040 -0.003 501-235 No dielectric breakdown or flashover occurred when a test voltage was applied between adjacent contacts. 2.4. Insulation Resistance - Group 3 All insulation resistance measurements were greater than 5000 megohms. 2.5. Temperature Rise vs Cu rrent - Group 2 All samples had a temperature rise of less than 30C above ambient when tested using a baseline rated current of 10.5 amperes and the correct derating factor value based on the samples wiring configuration. 2.6. Vibration - Groups 1 and 2 No discontinuities of the contacts were detected during vibration (Group 1 only). Following vibration, no cracks, breaks, or loose parts on the connector assemblies were visible. 2.7. Physical Shock - Group 1 No discontinuities of the contacts were detected during physical shock. Following physical shock testing, no cracks, breaks, or loose parts on the connector assemblies were visible. 2.8. Mating Force - Group 1 All mating force measurements were less than 8 pounds per inch of connector (1 inch equals 40 signal contacts and 2 ground contacts). 2.9. Unmating Force - Group 1 All unmating force measurements were greater than 2 pounds per inch of connector (1 inch equals 40 signal contacts and 2 ground contacts). Rev C 3 of 7 Form 404-34 20Nov96-AiNiF> 501-235 2.10. Durability - Group 1 No physical damage occurred to the samples as a result of mating and unmating the connector 50 times. 2.11. Thermal Shock - Group 3 No evidence of physical damage to either the contacts or the connector was visible as a result of exposure to thermal shock. 2.12. Humidity-Temperature Cycling - Group 3 No evidence of physical damage to either the contacts or the connector was visible as a result of exposure to humidity-temperature cycling. 2.13. Mixed Flowing Gas - Group 2 No evidence of physical damage to either the contacts or the connector was visible as a result of exposure to the pollutants of mixed flowing gas. 2.14. Temperature Life - Group 2 No evidence of physical damage to either the contacts or the connector was visible as a result of exposure to an elevated temperature. 3. TEST METHODS 3.1. Examination of Product Product drawings and inspection plans were used to examine the samples. They were examined visually and functionally. 3.2. Termination Resistance, Low Level Termination resistance measurements at low level current were made using a 4 terminal measuring technique (Figure 1). The test current was maintained at 100 milliamperes DC with an open circuit voltage of 50 millivolts DC. VOLTAGE PROBES POWER SUPPLY FOWER SUPPLY Figure 1 Typical Termination Resistance Measurement Points Rev C 4ot7 Form 404-34 20Nov96-AiNiF> 501-235 3.3. Dielectric Withstanding Voltage A test potential of 500 volts AC was applied between adjacent signal contacts and between signal contacts and ground contacts. This potential was applied for 1 minute and then returned to zero, 3.4. Insulation Resistance Insulation resistance was measured between adjacent signal contacts and between signal contacts and ground contacts, using a test voltage of 100 volts DC. This voltage was applied for 1 minute before the resistance was measured. 3.5. Temperature Rise vs Current Temperature rise curves were produced by measuring individual contact temperatures at 5 different current levels. These measurements were plotted to produce a temperature rise vs current curve. Thermocouples were attached to the contacts to measure their temperatures. The ambient temperature was then subtracted from this measured temperature to find the temperature rise. When the temperature rise of 3 consecutive readings taken at 5 minute intervals did not differ by more than 1C the temperature measurement was recorded. 3.6. Vibration, Random Mated vertical connectors were subjected to a random vibration test, specified by a random vibration spectrum, with excitation frequency bounds of 50 and 2000 Hz. The power spectral density at 50 Hz was 0.025 G?/Hz. The spectrum sloped up at 6 dB per octave to a PSD of 0.10 G?/Hz at 100 Hz. The spectrum was flat at 0.10 G?/Hz from 100 to 1000 Hz. The spectrum sloped down at 6 dB per octave to the upper bound frequency of 2000 Hz, at which the PSD was 0.025 G*/Hz. The root-mean square amplitude of the excitation was 11.95 GRMS. The connectors were monitored for discontinuities on 1 microsecond or greater, using a current of 100 milliamperes in the monitoring circuit (Group 1). Samples were energized with a test current producing 18C temperature rise (Group 2). Mated M-bus connectors were subjected to a random vibration test, specified by a random vibration spectrum, with excitation frequency bounds of 10 and 500 Hz. The power spectral density at 10 Hz was 0.006 G?/Hz. The spectrum sloped up at 6 dB per octave to a PSD of 0.10 G*/Hz at 100 Hz. The spectrum was flat at 0.10 G?/Hz from 100 to 500 Hz. The reot-mean square amplitude of the excitation was 7.01 GRMS. Samples were energized with a test current producing 18C temperature rise. 3.7. Physical Shock Mated connectors were subjected to a physical shock test, having a half-sine waveform of 50 gravity units (g peak) and a duration of 11 milliseconds. Three shocks in each direction were applied along the 3 mutually perpendicular planes, for a total of 18 shocks. The connectors were monitored for discontinuities greater than 1 microsecond, using a current of 100 milliamperes in the monitoring circuit. 3.8. Mating Force The force required to mate individual connectors was measured, using a tensile/compression device with a crosshead rate of travel at 1.0 inch/minute and a free floating fixture. The force per inch of connector was calculated. 3.9. Unmating Force The force required to unmate individual connectors was measured, using a tensile/compression device with a crosshead rate of travel at 1.0 inch/minute and a free floating fixture. The force per inch of connector was calculated. Rev C 5ot 7 Form 404-34 20Nov96-AiNiF> 501-235 3.10. Durability Connectors were mated and unmated 50 times at a rate not exceeding 600 per hour. 3.11. Thermal Shock Mated connectors were subjected to 5 cycles of temperature extremes with each cycle consisting of 30 minutes at each temperature. The temperature extremes were -65 and 125C. The transition between temperatures was less than 1 minute. 3.12. Humidity-Temperature Cycling Mated connectors were exposed to 10 cycles of humidity-temperature cycling. Each cycle lasted 24 hours and consisted of cycling the temperature between 25 and 65C twice while the relative humidity was held at 95%, HUMIDITY-TEMPERATURE CYCLING (108-23-3) re er ee TO +- 90-96%; AH rhe - e-9-G: AYH ~-~ 4] ~~~ & 8 a a Chamber Temperature (deg } 8 6 = o o 2 4 6 & 10 12 14 16 18 20 22 24 Time (hours) Figure 2 Typical Humidity-Temperature Cycling Profile 3.13. Mixed Flowing Gas, Class III Mated connectors were exposed for 20 days to a mixed flowing gas Class III exposure. Class III exposure is defined as a temperature of 30C and a relative humidity of 75% with the pollutants of C1, at 20 ppb, NO, at 200 ppb, and H,5 at 100 ppb. 3.14. Temperature Life Mated samples were exposed to a temperature of 105C for 500 hours. Rev C 6ot 7 Form 404-34 20Nov96-ANP 501-235 4, VALIDATION Prepared by: Luan Pega 1089193 Terrance M. Shingara Test Engineer Design Assurance Testing Corporate Test Laboratory Reviewed by: Cla QQ \Waskond Lr ayes SN j p A Richard A. Groft Supervisor Design Assurance Testing Corporate Test Laboratory Approved by: Lh B Beth sw y21@3 Edward Gill Manager Engineering & Design Assurance Capital Goods Business Unit Rev CG 7ot7 Form 404-34 20Nov96-