FEATURES mw DC - 4 GHz Frequency Range = 5nSec Switching Speed = Low Insertion Loss a Ultra Low DC Power Consumption = Small Chip Size .029 x .036 m Reflective m Plastic Package Available-P/N P35-4250-3 1 BOND PAD CONFIGURATION At 1 GI IN G4 4 7 B1 44R | | [| | : +08 Bt} | [| Ba A2 36 MILS B2 B3 r B2 44R |] [ x AQ A3 GROUNDS GND Gi G1... G4, GND | 3 2 G2. GND G3 3 AS ' 29MILS - B3 44R N fo 2 CHIP THICKNESS: 8 MILS Oo- 3 PAD SIZE: 3.5 x 3.5 MILS MINIMUM G2 O-~ 4 LOGIC TABLE 4 eure. CONTROL PAD VOLTAGE (V) PATH FROM "IN" TO A4 2,3,4 Al B1 A2 B2 A3 i B3 A4 B4 1 2 3 4 : 5 o | -5 | 0 | 6 | 0 | -5 | ON | OFF] OFF | OFF B4 44k a 5 -5 0 0 5 0 -5 | OFF | ON | OFF | OFF RESISTORS ARE 2 K OHMS oO $6 0 5 5 0 oO -5 | OFF | OFF! ON | OFF G3 FETS ARE 600 ym o 5 6 5 0 5 5 0 | OFF OFF |! OFF | ON 'ON'=LOW LOSS STATE 'OFF'= ISOLATED STATE ~ a z i TYPICAL PERFORMANCE GUARANTEED PERFORMANCE ~ @ 25C @ 25C 2.0 60 PARAMETER MIN | TYP) | MAX [| UNITS | CONDITIONS OPERATING FREQUENCY DC a | Giz ist 50 CONTROL VOLTAGE SEE LOGIC TABLE , N\ INSERTION LOSS 06 07 a OCT! Gia Ik. ' ; : XN = Wi 12 |B 2.4GHz 10+ 40 ISOLATION 45 8 B DCTO 1 GHz 37 40 B 1-26H | ST q 30 &B 2.4 Gi . Lt _ YSWR 120 DCTO1 Giz 05 30} 1350/1 1-26Hz _ iso 1927/1 2-4 GHz , IMPEDANCE 50 OHMS ok 20 SWITCHING SPEED 5 TSEC | 50% CONTROL TO 10% / 90% RF 0.05 2 4 RFPOWER: _0/-8V CONTROL 421 dam == | 1.048 COMP. @ 50 MHz | 430 dBm | 1.0dB COMP. ABOVE 100 MHz FREQUENCY (GHz) DAICO INDUSTRIES 263 MS ebO049e20 DO0e4eS 429 This product is manufactured by GEC Marconi Materials, UK, and is distributed by Daico Industries.