PC755CMGHU366LE - E2V Technologies (UK), Ltd.

Features

• 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz (PC755)

• 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745)

• 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)

• Selectable Bus Clock (12 CPU Bus Dividers up to 10x)

• PD Typical 6.4W at 400 MHz, Full Operating Conditions

• Nap, Doze and Sleep Modes for Power Savings

• Superscalar (3 Instructions per Clock Cycle) Two Instruction + Branch

• 4 Beta Byte Virtual Memory, 4-GByte of Physical Memory

• 64-bit Data and 32-bit Address Bus Interface

• 32-KB Instruct ion and Data Cache

• Six Independent Execution Units

• Write-back and Write-through Operations

• fINT max = 400 MHz (TBC)

• fBUS max = 100 MHz

• Voltage I/O 2.5V/3.3V; Voltage Int 2.0V

Description

The PC755 and PC745 PowerPC® microprocessors are high-performance, low-

power, 32-bit implementations of the PowerPC Reduced Instruction Set Computer

(RISC) architecture, especially enhanced for embedded applications.

The PC755 and P C745 microprocessors differ o nly in that the PC755 features a n

enhanced, dedicated L2 cache interface with on-chip L2 tags. The PC755 is a drop-in

replacement for the award winning PowerPC 750™ microprocessor and is footprint

and user software code compatible with the MPC7400 microprocessor with AltiVec™

technolo gy . The PC7 45 i s a d rop- in repl ac eme nt fo r the PowerPC 740 ™ microproces-

sor and i s also foo tprin t and use r softwar e code compat ible with th e Po werPC 603e ™

microp rocess or. PC75 5/745 mic roproc essors pr ovide on- chip debu g support and are

fully JTAG-compliant.

The PC745 microprocessor is pin compatible with the TSPC603e family.

ZF suffix

PBGA255

Flip-Chip Plastic Ball Grid Array

ZF suffix

PBGA360

Flip-Chip Plastic Ball Grid Array

G suffix

CBGA360

Ceramic Ball Grid Array

GH suffix

HITCE 360

Ceramic Ball Grid Array

GS suffix

CI-CGA360

Ceramic Ball Grid Array with

Solder Column Interposer (SCI)

PowerPC

755/745 RISC

Microprocessor

PC755/745

Preliminary

β-site

Rev. 2138C–HIREL–01/03

2PC755/745 2138C–HIREL–01/03

Screening

This product is manufactured in full compliance with:

• CBGA + CI-CGA + FC-PBGA up screenings based upon Atmel standards

•HiTCE

• Full military temperature range (Tj = -55°C,+125°C)

industrial temperature range (Tj = -40°C,+110°C)

General Des cription

Simplified Bloc k Diagr am The PC7 55 is targeted for low power syst ems and support s power man agement fea-

tures suc h as doze, nap, sl eep, an d dyna mic power man age ment. Th e PC75 5 consi sts

of a processor core and an internal L2 Tag combined with a dedicated L2 cache inter-

face and a 60x bus.

Figure 1. PC755 Block Diagram

Additional Features

¥ Time Base Counter/Decrementer

¥ Clock Multiplier

¥ JTAG/COP Interface

¥ Thermal/Power Management

¥ Performance Monitor

Fetcher Branch Processing

BTIC

64-Entry

+ x Ö FPSCR

CR FPSCR

L2CR

CTR

BHT

Data MMU

Instruction MMU

Not in the PC745

+ x Ö

Instruction Unit

Unit

Instruction Queue

(6-Word)

2 Instructions

Reservation Station Reservation Station Reservation Station

Integer Unit 1 System Register

Unit

Dispatch Unit 64-Bit

(2 Instructions)

SRs

ITLB

(Shadow) IBAT

Array 32-Kbyte

I Cache

Tags

128-Bit

(4 Instructions)

Reservation Station

32-Bit

Floating-Point

Unit

Rename Buffers

(6)

FPR File

32-Bit 64-Bit 64-Bit

Reservation Station

(2-Entry)

Load/Store Unit

(EA Calculation)

Store Queue

GPR File

Rename Buffers

(6)

32-Bit

SRs

(Original)

DTLB

DBAT

Array

64-Bit

Completion Unit

Reorder Buffer

(6-Entry)

Tags 32-Kbyte

D Cache

60x Bus Interface Unit

Instruction Fetch Queue

L1 Castout Queue

Data Load Queue L2 Controller

L2 Tags

L2 Bus Interface

Unit

L2 Castout Queue

32-Bit Address Bus

32-/64-Bit Data Bus

17-Bit L2 Address Bus

64-Bit L2 Data Bus

Integer Unit 2

PC755/745

2138C–HIREL–01/03

General Parameters The following list provides a summary of the general parameters of the PC755:

Features This section summarizes features of the PC755’s implementation of the PowerPC archi-

tecture. Major features of the PC755 are as follows:

• Branch Pr oc es sing Uni t

– Four instructions fetched per clock

– One branch processed per cycle (plus resolving 2 speculations)

– Up to 1 speculative stream in execution, 1 additional speculative stream in

fetch

– 512-entry branch history table (BHT) for dynamic prediction

– 64-entry, 4-way set associative Branch Target Instruction Cache (BTIC) for

eliminating branch delay slots

• Dispatch Unit

– Full hardware detection of dependencies (resolved in the execution units)

– Dispatch two instructions to six independent units (system, branch,

load/store, fixed-point unit 1, fixed-point unit 2, floating-point)

– Serialization control (predispatch, postdispatch, execution serialization)

• Decode

– Register file access

– Forwarding control

– Partial instruction decode

• Completion

– 6 entry completion buffer

– Instruction tracking and peak completion of two instructions per cycle

– Completion of instructions in program order while supporting out-of-order

instruction execution, completion serialization and all instruction flow

changes

• Fixed Point Units (FXUs) that share 32 GPRs for Integer Operands

– Fixed Point Unit 1 (FXU1)-multiply, divide, shift, rotate, arithmetic, logical

– Fixed Point Unit 2 (FXU2)-shift, rotate, arithmetic, logical

– Singl e-cy c le arith meti c , shifts, ro tate s, log ical

Techno log y 0. 22 µm CMO S, six- l ay er met al

Die size 6.61 mm x 7.73 mm (51 mm2)

Transistor count 6.75 million

Logic design Fully-static Packages

PC745 Surface mount 255 Plastic Ball Grid Array (PBGA)

PC755 Surface mount 360 Plastic Ball Grid Array (PBGA)

Surf ace mount 36 0 Cerami c Ball Gri d Array (C I-CGA, CBG A,

HiTCE)

Core power supply 2V ± 100 mV DC (nominal; some parts support core voltages

down to 1.8V; see Table 5 for recommended operating

conditions)

I/O power supply 2.5V ± 100 mV DC or 3.3V ± 165 mV DC (input thresholds are

configuration pin selectable)

4PC755/745 2138C–HIREL–01/03

– Multiply and divide support (multi-cycle)

– Early out multiply

• Floating-point Unit and a 32-entry FPR File

– Support for IEEE-754 standard single and double precision floating point

arithmetic

– Hardwar e su ppo rt for divi de

– Hardwar e su ppo rt for denor ma li ze d numbe rs

– Single-entry reservation station

– Supports non-IEEE mode for time-critical operations

•System Unit

– Executes CR logical instruct ions and miscellaneous system instructions

– Special register transfer instructions

• Load/Store Unit

– One cycle load or store cache access (byte, half-word, word, double-word)

– Effective address generation

– Hits under misses (one outstanding miss)

– Single-cycle unaligned access within double word boundary

– Alignment, zero padding, sign extend for integer register file

– Floating point internal format conversion (alignment, normalization)

– Sequencing for load/store multiples and string operations

– St ore gathering

– Cache and TLB instructions

– Big and Little-endian byte addressing supported

– Misaligned Little-endian supported

– Level 1 Cache structure

– 32K, 32 bytes line, 8-way set associative instruction cache (iL1)

– 32K, 32 bytes line, 8-way set associative data cache (dL1)

– Cache locking for both instruction and data caches, selectable by group of

ways

– Singl e- cy cle ca che acces s

– Pseudo least-recently used (PLRU) replacement

– Copy-back or Write Through data cache (on a page per page basis)

– Supports all PowerPC memory coherency modes

– Non-Blocking instruction and data cache (one outstanding miss under hits)

– No snooping of instruction cache

• Level 2 (L2) Cache Interface (not implemented on PC745)

– Internal L2 cache controller and tags; external data SRAMs

– 256K, 512K, and 1-Mbyte 2-way set associative L2 cache support

– Copyback or write-through data cache (on a page basis, or for all L2)

– Instruction-only mode and data-only mode.

– 64 bytes (256K/512K) or 128 bytes (1M) sectored line size

– Supports flow through (register-buffer) synchronous burst SRAMs, pipelined

(register-r egister ) synchronou s burst SRAMs (3-1-1-1 or strob eless 4- 1-1- 1)

and pipelined (register-register) late-write synchronous burst SRAMs

PC755/745

2138C–HIREL–01/03

– L2 configurable to direct mapped SRAM interface or split cache/direct

mapped or private memory

– Core-to-L2 frequency divisors of 1, 1.5, 2, 2.5, and 3 supported

– 64-bit data bus

– Selectable interface voltages of 2.5V and 3.3V

– Parity checking on both L2 address and data

• Memory Management Unit

– 128 entry, 2-way set associative instruction TLB

– 128 entry, 2-way set associative data TLB

– Hardwar e reloa d for TLBs

– Hardware or optional software tablewalk support

– 8 instruction BATs and 8 data BATs

– 8 SPRGs, for assistance with software tablewalks

– Virtual memory support for up to 4 hexabytes (252) of virtual memory

– Real memory support for up to 4 gigabytes (232) of physical memory

• Bus Interface

– Compatible with 60X processor interface

– 32-bit address bus

– 64-bit data bus, 32-bit mode selectable

– Bus-to-core frequency multipliers of 2x, 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x,

7x, 7.5x, 8x, 10x supported

– Selectable interface voltages of 2.5V and 3.3V.

– Parity checking on both address and data busses

• Power Management

– Low-power design with thermal requirements very similar to PC740/750.

– Selectable interface voltage of 1.8V/2.0V can reduce power in output buffers

(compared to 3.3V)

– Three static power saving modes: doze, nap, and sleep

– Dyn amic powe r man agem ent

• Testability

– LSSD scan design

– IEEE 1149.1 JTAG interface

• Integrated Thermal Management Assist Unit

– One- sh ip therma l sen so r and co ntr ol logic

– Thermal Management Interrupt for software regulation of junction

temperature

6PC755/745 2138C–HIREL–01/03

Pin Assignments Figure 2 (in part A ) show s the pi nout o f the PC745, 255PB GA package as viewe d from

the top surface. Part B shows the side profile of the PBGA package to indicate the direc-

tion of the top surface view.

Figure 2. Pinout of the PC745, 255 PB GA Package as Viewed from the To p Sur face

12345678 91011121314151

Not to Scale

View Die

Substrate Assembly

Encapsulant

Part B

Part A

PC755/745

2138C–HIREL–01/03

Figure 3 (in part A) shows the pinout of the PC755, 360 PBGA packages as viewed from

the top surface. Part B shows the side profile of the PBGA package to indicate the direc-

tion of the top surface view.

Figure 3. Pinout of the P C755, 360 PBGA, CBGA and CI-CGA Packages as Viewed

from the Top Surface

1234567891011121314151

Not to Scale

17 18 19

View Die

Substrate Assembly

Encapsulant

Part B

Part A

8PC755/745 2138C–HIREL–01/03

Pinout Listings Table 1 provides the pinout listing for the PC745, 255 PBGA package.

Table 1. Pinout Listing for the PC745, 255 PBGA Package

Signal Name Pin Number Active I/O

I/F Voltages Supported(1)

1.8V/2.0V 3.3V

A[0-31] C16, E4, D13, F2, D14, G1, D15, E2, D16, D4, E13, G2,

E15, H1, E16, H2, F13, J1, F14, J2, F15, H3, F16, F4, G13,

K1, G15, K2, H16, M1, J15, P1

High I/O – –

AACK L2 Low Input – –

ABB K4 Low I/O – –

AP[0-3] C1, B4, B3, B2 High I/O – –

ARTRY J4 Low I/O – –

AVDD A10 – – 2V 2V

BG L1 Low Input – –

BR B6 Low Output – –

BVSEL(3)(4)(5) B1 High Input GND 3.3V

CI E1 Low Output – –

CKSTP_IN D8 Low Input – –

CKSTP_OUT A6 Low Output – –

CLK_OUT D7 – Output – –

DBB J14 Low I/O – –

DBG N1 Low Input – –

DBDIS H15 Low Input – –

DBWO G4 Low Input – –

DH[0-31] P14, T16, R15, T15, R13, R12, P11, N11, R11, T12, T11,

R10, P9, N9, T10, R9, T9, P8, N8, R8, T8, N7, R7, T7, P6,

N6, R6, T6, R5, N5, T5, T4

High I/O – –

DL[0-31] K13, K15, K16, L16, L15, L13, L14, M16, M15, M13, N16,

N15, N13, N14, P16, P15, R16, R14, T14, N10, P13, N12,

T13, P3, N3, N4, R3, T1, T2, P4, T3, R4

High I/O – –

DP[0-7] M2, L3, N2, L4, R1, P2, M4, R2 High I/O – –

DRTRY G16 Low Input – –

GBL F1 Low I/O – –

GND C5, C12, E3, E6, E8, E9, E11, E14, F5, F7, F10, F12, G6,

G8, G9, G11, H5, H7, H10, H12, J5, J7, J10, J12, K6, K8,

K9, K11, L5, L7, L10, L12, M3, M6, M8, M9, M11, M14, P5,

P12

HRESET A7 Low Input – –

INT B15 Low Input – –

L1_TSTCLK(2) D11 High Input – –

L2_TSTCLK(2) D12 High Input – –

LSSD_MODE(2) B10 Low Input – -–

PC755/745

2138C–HIREL–01/03

Notes: 1. OVDD supplies power to the processor bus, JTAG, and all control signals and VDD supplies power to the processor core and

the PLL (after fil tering to become AVDD). These columns s erv e as a refe rence for the nominal vol tag e su ppo rted on a given

signal a s select ed by the BVSEL p in con figurat ion of T able 4 and the v oltage suppl ied. Fo r actua l recomm ended value of VIN

or supply voltages see Table 3.

2. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.

3. To allow f or fu ture I/O v ol tag e c han ge s, p rov id e th e o pti on to c on nec t BVSEL in de pen den tly to ei ther OVDD (selects 3.3V) or

to OGND (selects 1.8V/2.0V).

4. Uses one of 15 existing no-connects in PC745’s 255-BGA package.

5. Internal pull up on die.

6. Internally tied to GND in the PC745 255-BGA package to indicate to the power supply that a low-voltage processor is

present. This signal is not a power supply input.

MCP C13 Low Input – –

NC (No-

Connect) B7, B8, C3, C6, C8, D5, D6, H4, J16, A4, A5, A2, A3, B5 – – – –

OVDD C7, E5, E7, E10, E12, G3, G 5, G12, G14, K3, K5, K12 , K14,

M5, M7, M10, M12, P7, P10 – – 1.8V/2.0V 3.3V

PLL_CFG[0-3] A8, B9, A9, D9 High Input – –

QACK D3 Low Input – –

QREQ J3 Low Output – –

RSRV D1 Low Output – –

SMI A16 Low Input – –

SRESET B14 Low Input – –

SYSCLK C9 – Input – –

TA H14 Low Input – –

TBEN C2 High Input – –

TBST A14 Low I/O – –

TCK C11 High Input – –

TDI(5) A11 High Input – –

TDO A12 High Output – –

TEA H13 Low Input – –

TLBISYNC C4 Low Input – –

TMS(5) B11 High Input – –

TRST(5) C10 Low Input – –

TS J13 Low I/O – –

TSIZ[0-2] A13, D10, B12 High Output – –

TT[0-4] B13, A15, B16, C14, C15 High I/O – –

WT D2 Low Output – –

VDD 2 F6, F8, F9, F11, G7, G10, H6, H8, H9, H11, J6, J8, J9, J11,

K7, K10, L6, L8, L9, L11 – – 2V 2V

VOLTDET(6) F3 High Output – –

Table 1. Pinout Listing for the PC745, 255 PBGA Package (Continued)

Signal Name Pin Number Active I/O

I/F Voltages Supported(1)

1.8V/2.0V 3.3V

10 PC755/745 2138C–HIREL–01/03

Table 2 provides the pinout listing for the PC755, 360 PBGA, CBGA and CI-CGA + HiTCE

Table 2. Pinout Listing for the PC755, 360 PBGA, CBGA and CI-CGA Packages + HiTCE(8)

Signal Name Pin Number Active I/O

I/F Voltages

Supported(1)

1.8V/2.0V 3.3V

A[0-31] A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12, G3, G6, H2,

E2, L3, G5, L4, G4 , J4, H7, E1 , G2, F3, J 7, M3, H3, J2 , J6, K3, K2 ,

High I/O – –

AACK N3 Low Input – –

ABB L7 Low I/O – –

AP[0-3] C4, C5, C6, C7 High I/O – –

ARTRY L6 Low I/O – –

AVDD A8 - - 2V 2V

BG H1 Low Input – –

BR E7 Low Output – –

BVSEL(3)(5)(6) W1 High Input GND 3.3V

CI C2 Low Output – –

CKSTP_IN B8 Low Input – –

CKSTP_OUT D7 Low Output – –

CLK_OUT E3 – Output – –

DBB K5 Low I/O – –

DBDIS G1 Low Input – –

DBG K1 Low Input – –

DBWO D1 Low Input – –

DH[0-31] W12, W11, V11, T9, W10, U9, U10, M11, M9, P8, W7, P9, W9,

R10, W6, V7, V6, U8, V9, T7, U7, R7, U6, W5, U5 , W4, P7, V5, V4 ,

W3, U4, R5

High I/O – –

DL[0-31] M 6, P3, N4, N5, R3, M7, T2, N6, U2, N7, P11, V13, U12, P12, T13,

W13, U13, V10, W8, T11, U11, V12, V8, T1, P1, V1, U1, N1, R2,

V3, U3, W2

High I/O – –

DP[0-7] L1, P2, M2, V2, M1, N2, T3, R1 High I/O – –

DRTRY H6 Low Input – –

GBL B1 Low I/O – –

GND D10, D14, D16, D4, D6, E12, E8, F4, F6, F10, F14, F16, G9, G11,

H5, H8, H10, H12, H15, J9, J11, K4, K6, K8, K10, K12, K14, K16,

L9, L11, M5, M8, M 10, M12, M 15, N9, N1 1, P4, P6, P1 0, P14, P16 ,

R8, R12, T4, T6, T10, T14, T16

––GNDGND

HRESET B6 Low Input – –

INT C11 Low Input – –

L1_TSTCLK(2) F8 High Input – –

L2ADDR[0-16] L17, L18, L19, M19, K18, K17, K15, J19, J18, J17, J16, H18, H17,

J14, J13, H19, G18 High Output – –

PC755/745

2138C–HIREL–01/03

L2AVDD L13 – – 2V 2V

L2CE P17 Low Output – –

L2CLKOUTA N15 – Output – –

L2CLKOUTB L16 – Output – –

L2DATA[0-63] U14, R13, W14, W15, V15, U15, W16, V16, W17, V17, U17, W18,

V18, U18, V19, U19, T18, T17, R19, R18, R17, R15, P19, P18,

P13, N14, N13, N19, N17, M17, M13, M18, H13, G19, G16 , G15,

G14, G13, F19, F18, F13, E19, E18, E17, E15, D19, D18, D17,

C18, C17, B19, B18, B17, A18, A17, A16, B16, C16, A14, A15,

C15, B14, C14, E13

High I/O – –

L2DP[0-7] V14, U16, T19, N18, H14, F17, C19, B15 High I/O – –

L2OVD D D15, E14, E16, H16, J15, L15, M16, P15, R14, R16, T15, F15 – – 1.8V/2V 3.3V

L2SYNC_IN L14 – Input – –

L2SYNC_OUT M14 – Output – –

L2_TSTCLK(2) F7 High Input – –

L2VSEL(1)(3)(5)(6) A19 High Input GND 3.3V

L2WE N16 Low Output – –

L2ZZ G17 High Output – –

LSSD_MODE(2) F9 Low Input – –

MCP B11 Low Input – –

NC (No-Connect) B3, B4, B5, W19, K9, K114, K194–– ––

OVDD D5, D8, D12, E4, E6, E9, E11, F5, H4, J5, L5, M 4, P5, R4, R6, R9,

R11, T5, T8, T12 ––1.8V/2V3.3V

PLL_CFG[0-3] A4, A5, A6, A7 High Input – –

QACK B2 Low Input – –

QREQ J3 Low Output – –

RSRV D3 Low Output – –

SMI A12 Low Input – –

SRESET E10 Low Input – –

SYSCLK H9 – Input – –

TA F1 Low Input – –

TBEN A2 High Input – –

TBST A11 Low I/O – –

TCK B10 High Input – –

TDI(6) B7 High Input – –

TDO D9 High Output – –

Table 2. Pinout Listing for the PC755, 360 PBGA, CBGA and CI-CGA Packages + HiTCE(8) (Continued)

Signal Name Pin Number Active I/O

I/F Voltages

Supported(1)

1.8V/2.0V 3.3V

12 PC755/745 2138C–HIREL–01/03

Notes: 1. OVDD supplies power to the processor bus, JTAG, and all control signals except the L2 cache controls (L2CE, L2WE, and

L2ZZ); L2OVDD supplies power to the L2 cache interface (L2ADDR[0-16], L2DATA[0-63], L2DP[0-7] and L2SYNC-OUT)

and the L2 control signals; and VDD supplies power to the processor core and the PLL and DLL (after filtering to become

AVDD and L2AVDD respectivel y). Thes e columns serve as a referen ce for the nomina l volta ge supp orted on a given s ignal as

selected by the BVSEL/L2VSEL pin configurations of Table 4 and the voltage supplied. For actual recommended value of

VIN or supply voltages see Table 5.

2. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.

3. To allow for future I/O voltage changes, provide the option to connect BVSEL and L2VSEL independently to either OVDD

(selects 3.3V) or to OGND (selects 1.8V/2.0V).

4. These pins are reserved for potential future use as additional L2 address pins.

5. Uses one of 9 e xist ing no-connects in PC750’s 360-BGA package.

6. Internal pull up on die.

7. Internally tied to L2OVDD in the P C75 5 36 0 -BGA package to indicate the power present at the L2 cache interface. This sig-

nal is not a power supply input.

8. This is different from the PC745 255-BGA package.

TEA J1 Low Input – –

TLBISYNC A3 Low Input – –

TMS(6) C8 High Input – –

TRST(6) A10 Low Input – –

TS K7 Low I/O – –

TSIZ[0-2] A9, B9, C9 High Output – –

TT[0-4] C10, D11, B12, C12, F11 High I/O – –

WT C3 Low Output – –

VDD G8, G10, G12, J8, J10, J12, L8, L10, L12, N8, N10, N12 – – 2V 2V

VOLTDET(7) K13 High Output – –

Table 2. Pinout Listing for the PC755, 360 PBGA, CBGA and CI-CGA Packages + HiTCE(8) (Continued)

Signal Name Pin Number Active I/O

I/F Voltages

Supported(1)

1.8V/2.0V 3.3V

PC755/745

2138C–HIREL–01/03

Signal Description

Figure 4. PC755 Microprocessor Signal Groups

ABB

TT[0-4]

AP[0-3]

TBST

TS1Z[0-2]

GBL

AACK

ARTRY

DBG

DBWO

DBB

L2ADDR [16-0]

L2DATA [0-63]

L2DP [0-7]

L2CLK-OUT [A-B]

L2WE

A[0-31] L2SYNC_OUT

L2SYNC_IN

INT

SMI

MCP

HRESET

CKSTP_IN

CKSTP_OUT

SYSCLK,

PLL_CFG [0-3]

Factory Test

JTAG:COP

ADDRESS

ARBITRATION

ADDRESS

START

ADDRESS

BUS

TRANSFER

ATTRIBUTE

ADDRESS

TERMINATION

DATA

ARBITRATION

L2 CACHE

L2 VSEL

ADDRESS/

DATA

L2 CACHE

CLOCK/CONTROL

INTERRUPTS

RESET

CLOCK

CONTROL

TEST INTERFACE

D[0-63]

DATA

TRANSFER D[P0-7]

DBDIS

DATA

TERMINATION DRTRY

TEA

PC755B

L2AVDD

L2VDD

SRESET

RSRV

TBEN

TLBISYNC

QREQ

QACK

PROCESSOR

STATUS

CONTROL

CLK_OUT

VDD AVDD

L2CE

L2ZZ

Not supported in the PC745B

GND

OVDD

VOLTDET

14 PC755/745 2138C–HIREL–01/03

Detailed

Specification

Scope This drawing describes the specific requirements for the microprocessor PC755, in com-

pliance with Atmel Grenoble standard screening.

Applicable Documents 1) MIL-STD-883: Test methods and procedures for electronics.

2) MIL-PRF-38535 appendix A: General specifications for microcircuits.

Requirements

General The microcircuits are in accordance with the applicable documents and as specified

herein.

Design and Construction

Terminal Connections Depending on the package, the terminal connections is shown in Table 1, Table 2 and

Figure 4.

Absolute Maximum Rating

Notes : 1 . Funct ional and tes ted op erating cond itions are gi ven i n Table 5. Abs olute m axim um rat ings a re stre ss rati ngs o nly, a nd func-

tional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause

permanent damage to the device.

2. Caut ion: VIN must not exceed OVDD or L2OVDD by more than 0.3V at any time including during power-on reset.

3. Caution: L2OVDD/OVDD must not exceed VDD/AVDD/L2AVDD by more than 1.6V during normal operation. During power-on

reset and power-down sequences, L2OVDD/OVDD may ex ceed V DD/AVDD/L2AVDD by up to 3.3V for up to 20 ms, or by 2.5V

for up to 40 ms. Excursions beyond 3.3V or 40 ms are not supported.

4. Caution: VDD/AVDD/L2AVDD must not exceed L2OVDD/OVDD by more than 0.4V during normal operation. During power-on

reset and power-down sequences, VDD/AVDD/L2AVDD may exceed L2OVDD/OVDD by up to 1.0V for up to 20 ms, or by 0.7V

for up to 40 ms. Excursions beyond 1.0V or 40 ms are not supported.

5. This is a DC sp ec ifi cat ions only. VIN may ove r sh oot /un ders hoot to a voltage and for a maximu m d uration as sh ow n i n Fi gu re

Table 3. Absolute Maximum Ratings(1)

Characteristic Symbol Maximum Value Unit

Core supply voltage(4) VDD -0.3 to 2.5 V

PLL supply voltage(4) AVDD -0.3 to 2.5 V

L2 DLL supply voltage(4) L2AVDD -0.3 to 2.5 V

Processo r bus supp ly voltage (3) OVDD -0.3 to 3.6 V

L2 bus supply voltage(3) L2OVDD -0.3 to 3.6 V

Input voltage Processor bus(2)(5) Vin -0.3 to OVDD + 0.3V V

L2 Bus(2)(5) Vin -0.3 to L2OVDD + 0.3V V

JTAG Signals Vin -0.3 to 3.6 V

Storage temperature range Tstg -65 to 150 °C

Rework Temperature Trwk 220 °C

PC755/745

2138C–HIREL–01/03

Figure 5 sh ows the allowable un dershoot and overs hoot voltage on the PC 755 and

PC745.

Figure 5. Overshoot/Undershoot Voltage

The PC755 provides several I/O voltages to support both compatibility with existing sys-

tems and migration to future systems. The PC755 core voltage must always be provided

at nominal 2.0V (see Table 5 for actual recommended core voltage). Voltage to the L2

I/Os and Processor Interface I/Os are provided through separate sets of supply pins and

may be p rovi ded at the v olta ges s ho wn i n Table 4. T he i np ut v ol tag e th re sh old for e ac h

bus is selected by sampling the state of the voltage select pins BVSEL and L2VSEL dur-

ing operation. These signals must remain stable during part operation and cannot

change. The output v ol tag e wi ll swi ng fro m GND to the max im um vo ltag e ap pl ied to th e

OVDD or L2OVDD power pins.

Table 4 describes the input threshold voltage setting.

Notes: 1. Caution: The input threshold selection must agree with the OVDD/L2OVDD voltages supplied.

2. The inpu t thr eshold s ettings abov e are d ifferent for all revis ions prior to Rev. 2.8 (Rev. E). For mor e inform ation , conta ct your

local Atmel sales office.

(L2) OVDD +20%

(L2) OVDD +5%

(L2) OVDD

Gnd - 1.0V

Gnd - 0.3V

Gnd

VIH

Not to exceed 10%

of tSYSCLK

VIL

Table 4. Input Threshold Voltage Setting

Part Revision BVSEL Signal Processor Bus Interface Voltage L2VSEL Signal L2 Bus Interface Voltage

E 0 Not Available 0 Not Available

1 2.5V/3.3V 1 2.5V/3.3V

16 PC755/745 2138C–HIREL–01/03
Notes: 1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support.
3. 2.0V nominal.
4. 2.5V nominal.
5. 3.3V nominal.
Thermal Characteristics
Package Characteristics Table 6 provides the package thermal characteristics for the PC755.
Notes : 1 . Junctio n tempera ture is a functio n of on-chi p power  dissip ation, pa ckage  thermal resis tance , mountin g site (boa rd) temp era-
ture, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
Table 5.  Recommended Operating Conditions(1)
Recommended Value
Unit300 MHz, 350 MHz 400 MHz
Characteristic Symbol Min Max Min Max
Core supply voltage(3) VDD 1.80 2.10 1.90 2.10 V
PLL supply voltage(3) AVDD 1.80 2.10 1.90 2.10 V
L2 DLL supply voltage(3) L2AVDD 1.80 2.10 1.90 2.10 V
Processo r bus supp ly voltage (2)(4)(5) BVSEL = 1 OVDD 2.375 2.625 2.375 2.625 V
3.135 3.465 3.135 3.465 V
L2 bus supply voltage(2)(4)(5) L2VSEL = 1 L2OVDD 2.375 2.625 2.375 2.625 V
3.135 3.465 3.135 3.465 V
Input voltage Processor bus Vin GND OVDD GND OVDD V
L2 Bus Vin GND L2OVDD GND L2OVDD V
JTAG Signals Vin GND OVDD GND OVDD V
Die-junction temperature Military temperature range Tj-55 125 -55 125 °C
Industrial temperature Tj-40 110 -40 110 °C
Table 6.  Package Th ermal  Charac ter isti cs
Characteristic Symbol
Value
Unit
PC755 
CBGA PC755 
PBGA PC745 
PBGA
Junction-to-ambient thermal resistance, natural convection(1)(2) RθJA 24 31 34 °C/W
Junction-to-ambient thermal resistance, natural convection, four-layer 
(2s2p) board(1)(3) RθJMA 17 25 26 °C/W
Junction-to-ambient thermal resistance, 200 ft./min. airflow, single-layer 
(1s) board(1)(3) RθJMA 18 25 27 °C/W
Junction-to-ambient thermal resistance, 200 ft./min. airflow, four-layer 
(2s2p) board(1)(3) RθJMA 14 21 22 °C/W
Juncti on-to -bo ard thermal resistan ce (4) RθJB 81717°C/W
Junction-to-case thermal resistance(5) RθJC < 0.1 < 0.1 < 0.1 °C/W

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2138C–HIREL–01/03

4. Thermal re sis ta nce bet we en the di e an d the prin ted circuit boa rd pe r JEDE C J ESD 51-8 . Board tem pe ratur e is mea su red o n

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the calculated case temperature. The actual value of RÉýJC for the part is less than 0.1°C/W.

Note: Refer to Section “Thermal Management Information“ page 18 for more details about thermal management.

Package Thermal

Characteristics for HiTCE Table 7 provides the package thermal characteristics for the PC755, HiTCE.

Note: 1. Simulation, no convecti on air flow .

The board designer can choose between several types of heat sinks to place on the

PC755 . There ar e seve ral comm erci ally -ava ilabl e heat si nks fo r the PC7 55 provid ed by

the following vendors:

For the exposed-die packaging tec hnology, shown in Table 5, the intrins ic conduction

thermal resistance paths are as follows:

• The die junction-to-case (or top-of-die for exposed silicon) thermal resistance

• The die junction-to-ball thermal resistance

Figure 6 depicts the primary heat transfer path for a package with an attached heat sink

mounted to a printed-circuit board.

Heat generated on the active side of the chip is conducted through the silicon, then

through the heat sink atta ch material ( or thermal interface mater ial), and fi nally to the

heat sink where it is removed by forced-air convection.

Since the silicon thermal resistance is quite small, for a first-order analysis, the tempera-

ture drop in the silicon may be neglected. T hus, the heat sink attach material and the

heat sink conduction/convective thermal resistances are the dominant terms.

Figure 6. C4 Package with Head Sink Mounted to a Printed-circuit Board

Note the internal versus external package resistance.

Table 7. Package Thermal Characteristics for HiTCE Package

Characteristic Symbol

Value

UnitPC755 HiTCE

Junction-to-bottom of balls(1) RθJTBD °C/W

External Resistance

Internal Resistance

Radiation Convection

Heat Sink

Printed ± Circuit Board

Thermal Interface Material

Package/Leads

Die Junction

Die/Package

18 PC755/745 2138C–HIREL–01/03

Thermal Management

Assistance The PC755 incorporates a thermal management assist unit (TAU) composed of a ther-

mal sensor, digital-to-analog converter, comparator, control logic, and dedicated

special -purpose re gisters (SPRs). Speci fications for the therm al sensor portion of the

TAU are found in Table 8. More information on the use of this feature is given in the

Motorola PC755 RISC Microprocessor User’s manual.

Notes: 1. The temperature is the junction temperature of the die. The thermal assist unit’s raw

output does not indicate an absolute temperature, but must be interpreted by soft-

ware to derive the absolute junction temperature. For information about the use and

calibration of the TAU, see Motorola Application Note AN1800/D, “Programming the

Therma l Assist Unit in the PC750 Micr o processor ”.

2. The com para tor s ettling ti me va lue m ust be converted into the number of C PU c loc ks

that need to be written into the THRM3 SPR.

3. Guarante ed by des ig n and cha rac teri zation.

Thermal Management

Information T his sectio n provides thermal management info rmation for the ceramic bal l grid array

(BGA) package fo r air-co oled appl ications . Proper ther mal cont rol design is primarily

dependent upon the system-level design-the heat sink, airflow and thermal interface

material. To reduce the die-junction temperature, heat sinks may be attached to the

package by several methods-adhesive, spring clip to holes in the printed-circuit board or

package, and mounting clip and screw assembly; see Figure 7. This spring force should

not exceed 5.5 pounds of force.

Figure 7. Package Exploded Cross-Sectional View with Several Heat Sink Options

Table 8. Thermal Sensor Specifications at Recommended Operating Conditions

(see Table 5)

Characteristic Min Max Unit

Temperature range(1) 0127°C

Comparator settling time(2)(3) 20 – s

Resolution(3) 4–°C

Accuracy(3) -12 +12 °C

Adhesive

Thermal Interface Material

Heat Sink

Clip

Printed ± Circuit Board Option

BGA Package

PC755/745

2138C–HIREL–01/03

Ultimately, the final selection of an appropriate heat sink depends on many factors, such

as thermal performance at a given air velocity, spatial volume, mass, att achment

method, assembly, and cost.

Adhesives and Thermal

Interface Materials Figure 8. Thermal Perfo rmance of Select Thermal Interface Material

A thermal interface material is recommended at the package lid-to-heat sink interface to

minimize the thermal contact resistance. For those applications where the heat sink is

attached by spring clip mechanism, Figure 8 shows the thermal performance of three

thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint,

and a join t with thermal gr ease as a fun ction of co ntact pr essur e. As sho wn, the per for-

mance of these thermal interface materials improves with increasing contact pressure.

The use of thermal grease significantly reduces the interface thermal resistance. That is,

the bare joint results in a thermal resistance approximately 7 times greater than the ther-

mal grease joint.

Heat sinks are attached to the package by means of a spring clip to holes in the printed-

circuit boa rd (see Figur e 7). This spr ing force shoul d not excee d 5.5 pounds of force.

Ther efore, the sy nthetic gre ase offers the best therm al perfor mance, cons idering th e

low interface pressure.

The board designer can choose between several types of thermal interface. Heat sink

adhesi ve mater ials shou ld be se lected based up on high con ductivit y, yet ad equate

mechanical strength to meet equipment shock/vibration requirements.

Heat Sink Selection Example For preliminary heat sink sizing, th e die-junction tem perature can be expressed as

follows:

Tj = Ta + Tr + (θjc + θint + θsa) * Pd

Where:

Tj is the die-junction temperature

0.5

1.5

2Silicone Sheet (0.006 inch)

Bare Joint

Floroether Oil Sheet (0.007 inch)

Graphite/Oil Sheet (0.005 inch)

Synthetic Grease

Contact Pressure (psi)

Specific Thermal Resistance (Kin2/W)

01020304050607080

20 PC755/745 2138C–HIREL–01/03

Ta is the inlet cabinet ambient temperature

Tr is the air temperature rise within the computer cabinet

θjc is the junction-to-case thermal resistance

θint is the adhesive or interface material thermal resistance

θsa is the heat sink base-to-ambient thermal resistance

Pd is the power dissipated by the device

During operation the die-junction temperatures (Tj) should be maintained less than the

value specified in Table 5. The temperature of the air cooling the component greatly

depends upon the ambient inlet air temperature and the air temperature rise within the

electroni c c ab in et. A n e le ctron ic c abinet inlet -a ir tempera tur e (T a) m ay range fr om 30 to

40°C. The air temper ature rise within a cabinet (Tr) may be in the ra nge of 5 to 10°C.

The thermal resistance of the thermal interface material (θint) is typically about 1°C/W.

Assum ing a Ta of 30°C, a Tr of 5oC, a CBGA packa ge θjc = 0.03, an d a power cons ump-

tion (Pd) of 5.0 watts, the following expression for Tj is obtained:

Die-junction temperature: Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + θsa) * 5.0 W

For a Thermalloy he at sink # 2328B, the heat sink-to -ambient th ermal re sistance (θsa)

versus airflow velocity is shown in Figure 9.

Figure 9. Thermalloy #2328B Hea t Sink-to-Ambi ent Thermal Resistance Versus Ai r-

flow Velocity

Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7°C/W, thus

Tj = 30°C+ 5°C+ (0.03°C/W +1.0°C/W + 7°C/W) * 5.0 W,

resulting in a die-junction temperature of approximately 81°C which is well within the

maximum operating temperature of the component.

0 0.5 1 1.5 2 2.5 3 3.5

Thermalloy #2328B Pin±fin Heat Sink

Approach Air Velocity (m/s)

(25 x28 x 15 mm)

Heat Sink Thermal Resistance °C/W)

PC755/745

2138C–HIREL–01/03

Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakefield Engineering,

and Aavid Engineering offer different heat sink-to-ambient thermal resistances, and may

or may not need air flow.

Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances

are a c ommon figure-of- merit used for comparing the thermal performance o f various

microelectronic packaging technologies, one should exercise caution when only using

this m etric i n det ermini ng ther mal ma nagem ent bec ause n o single param eter c an ade -

quately describe three-dimensional heat flow. The final die-junction operating

temperature, is not only a fu nction of the c omponent-level th ermal resistance , but the

system-level design and its operating conditions. In addition to the component’s power

consumption, a number of factors affect the final operating die-junction temperature —

airf low, bo ard popu latio n (loc al heat fl ux of ad jacent compo nents ), heat s ink effi cienc y,

heat sink attach, heat sink placement, next-level interconnect technology, system air

temperature rise, altitude, etc.

Due to the complexity and the many variations of system-level boundary conditions for

today’s microelectronic equipment, the combined effects of the heat transfer mecha-

nisms (radiati on, convection a nd conduction) may vary widely. For these reasons, we

recommend using conjugate heat transfer models for the board, as well as, system-level

designs. To expedite system-level thermal analysis, several “compact” thermal-package

models are available within FLOTHERM®. These are available upon request.

Power consideration

Power management The PC755 provides four power modes, selectable by setting the appropriate control

bits in the MSR and HIDO registers. The four power modes are as follows:

• Full-power: This is the default power state of the PC755. The PC755 is fully

powered and the internal functional units operate at the full processor clock speed.

If the dynamic power management mode is enabled, functional units that are idle

will automatically enter a low-power state without affecting performance, software

execution, or external hardware.

• Doze: All the functional units of the PC755 are disabled except for the time

base/decrementer registers and the bus snooping logic. When the processor is in

doze mode, an external asynchronous interrupt, a system management interrupt, a

decrementer exception, a hard or soft reset, or machine check brings the PC755

into the full-power state. The PC755 in doze mode maintains the PLL in a fully

powered state and locked to the system external clock input (SYSCLK) so a

transition to the full-power state takes only a few processor clock cycles.

• Nap: The nap mode further reduces power consumption by disabling bus snooping,

leaving only the time base register and the PLL in a powered state. The PC755

returns to the full-power state upon receipt of an external asynchronous interrupt, a

system management interrupt, a decrementer exception, a hard or soft reset, or a

machine check input (MCP). A return to full-power state from a nap state takes only

a few processor clock cycles. When the processor is in nap mode, if QACK is

negated, the processor is put in doze mode to support snooping.

• Sleep: Sleep mode minimizes power consumption by disabling all internal functional

units, after which external system logic may disable the PPL and SUSCLK.

Returning the PC755 to the full-power state requires the enabling of the PPL and

SYSCLK, followed by the assertion of an external asynchronous interrupt, a system

management interrupt, a hard or soft reset, or a machine check input (MCP) signal

after the time required to relock the PPL.

22 PC755/745 2138C–HIREL–01/03

Power Dissipation

Notes: 1. These values apply for all valid processor bus and L2 bus ratios. The values do not

include I/O supply power (OVDD and L2OVDD) or PLL/DLL supply power (AVDD and

L2AVDD). OVDD and L2OVDD power is system dependent, but is typically < 10% of

VDD power. Wors t case powe r consumptio n for AVDD = 1 5 mW and L2AVDD = 15 mW.

2. Ma xim um po wer i s meas ured at no min al VDD (se e Ta ble 5) whi le ru nni ng an ent irel y

cache-resident, contrived sequence of instructions which keep the execution units

maximally busy.

3. Typical power is an average value measured at the nominal recommended VDD

(see Table 5) and 65×C in a system while running a typical code sequence.

4. Not 100% teste d. Chara cte riz ed and period ic all y sampl ed.

Table 9. Power Consumption for PC755

Processor (CPU) Frequency

Unit300 MHz 350 MH z 400 MHz

Full-Power Mode

Typical(1)(3)(4) 3.1 3.6 5.4 W

Maximum(1)(2) 4.5 5.3 8 W

Doze Mode

Maximum(1)(2)(4) 1.8 2 2.3 W

Nap Mode

Maximum(1)(2)(4) 111W

Sleep Mode

Maximum(1)(2)(4) 550 550 550 mW

Sleep Mode-PLL and DLL Disabled

Maximum(1)(2) 510 510 510 mW

PC755/745

2138C–HIREL–01/03

Electrical

Characteristics

Static Characteristics

Notes: 1. Nominal voltages; See Table 5 for recommended operating conditions.

2. For processor bus signals, the re ference i s OVDD while L2OVDD is the reference for the L2 bus signals.

3. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK) and IEEE 1149.1 boundary scan (JTAG) signals.

4. Capacitance is periodically sampled rather than 100% tested.

5. The leakage is measured for nominal OVDD and VDD, or both OVDD and VDD must vary in the same direction (for example,

both OVDD and VDD vary by either +5% or -5%).

Dynamic Characteristics After fabricatio n, parts are sorted by max imum processor cor e frequency as shown i n

the “Clock AC Specifications” Section on page 24 and tested for conformance to the AC

specifications for that frequency. These specifications are for 275, 300, 333 MHz pro-

cessor core frequencies. The processor core frequency is determined by the bus

(SYSCLK) fr equency and the settings of th e PLL_CFG[0-3] signa ls. Parts are sold by

maximum processor core frequency.

Table 10. DC Electrical Specifications at Recommended Operating Conditions (see Table 5)

Characteristic Nominal bus

Voltage(1) Symbol Min Max Unit

Input high voltage (all inputs except SYSLCK)(2)(3) 2.5 VIH 1.6 (L2)OVDD + 0.3 V

3.3 VIH 2(L2)OV

DD + 0.3 V

Input low voltage (all inputs except SYSLCK)(2) 2.5 VIL -0.3 0.6 V

3.3 VIL -0.3 0.8 V

SYSCLK input high voltage 2.5 KVIH 1.8 OVDD + 0.3 V

3.3 KVIH 2.4 OVDD + 0.3 V

SYSCLK input low voltage 2.5 KVIL -0.3 0.4 V

3.3 KVIL -0.3 0.4 V

Input leakage current, (2)(3)

VIN = L2OVDD/OVDD

Iin –10µA

Hi-Z (off-state) lea ka ge current, (2)(3)(5)

VIN = L2OVDD/OVDD

ITSI –10µA

Output high voltage, IOH = -6 mA 2.5 VOH 1.7 – V

3.3 VOH 2.4 – V

Output low voltage, IOL = 6 mA 2.5 VOL –0.45V

3.3 VOL –0.4V

Capacitance, VIN = 0V , f = 1 MHz (3)(4) Cin –5pF

24 PC755/745 2138C–HIREL–01/03
Clock AC Specifications Table 11 provides the clock AC timing specifications as defined in Table 3.
Notes: 1. Caution: The SYSCLK frequency and PLL_CFG[0-3] settings must be chosen such that the resulting SYSCLK (bus) fre-
quency, CPU (core) frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to the PLL_CFG[0-3] signal description in Table 17,” for valid PLL_CFG[0-3] settings
2. Rise and f all tim es meas ureme nts are  now specif ied in  terms  of slew ra tes, ra ther tha n time  to acc ount fo r selec table  I/O bus
interfa ce levels . The minim um sle w rate of 1v/ns  is equivale nt to a 2ns max imum rise /fall tim e measu red  at 0.4V and 2.4V or
a rise/fall time of 1ns measured at 0.4V to 1.4V.
3. Timing is guaranteed by design and characterization.
4. This represents total input jitter – short term and long term combined and is guaranteed by design.
5. Relock timing is guaranteed by design and characterization. PLL-relock time is the maximum amount of time required for
PLL lock after a stable VDD and SYSCLK are reached during the power-on reset sequence. This specification also applies
when the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that HRESET must be held
asserted for a minimum of 255 bus clocks after the PLL-relo ck  time duri ng the powe r-on reset sequence.
Figure 10 provides the SYSCLK input timing diagram.
Figure 10.  SYSCLK Input Timing Diagram
Table 11.  Clock AC Timing Specifications at Recommended Operating Conditions (See Table 5) 
Characteristic Symbol
Maximum P rocessor  Core Frequen cy
Unit300 MHz 350 MHz 400 MHz
Min Max Min Max Min Max
Processor frequency(1) fcore 200 300 200 350 200 400 MHz
VCO frequency(1) fVCO 400 600 400 700 400 800 MHz
SYSCLK frequency(1) fSYSCLK 25 100 25 100 25 100 MHz
SYSCLK cycle time tSYSCLK 10 40 10 40 10 40 ns
SYSCLK rise and fall time(2) tKR & tKF –2–2–2 ns
tKR & tKF –1.4–1.4–1.4 ns
SYSCLK duty cycle measured at OVDD/2(3) tKHKL/tSYSCLK 40 60 40 60 40 60 %
SYSCLK jitter(3)(4) –150–150–150 ps
Internal PLL relock time(3)(5) –100–100–100 µs
SYSCLK VMVMVM
KVIH
KVIL
VM = Midpoint Voltage (OVDD/2)
tSYSCLK
tKR tKF
tKHKL

25
PC755/745
2138C–HIREL–01/03
Processor Bus AC 
Specifications Table 1 2 pro vides th e proces sor bus  AC timi ng spe cificat ions  for the PC 755 as  define d
in Figure 11  and Figu re 13. Timi ng speci ficati ons for the L2 bu s are prov ided in  Sectio n
“L2 Clock AC Specifications» page 27.
Notes : 1. All input spec ificat ions a re mea sured  from th e mid point o f th e signal  in  question  to  the mi dpoint  of the  rising  edge  of th e inpu t
SYSCLK. All output specifications are measured from the midpoint of the rising edge of SYSCLK to the midpoint of the sig-
nal in question. All output timings assume a purely resistive 50Ω load (See Figure 11). Input and output timings are
measured at the pin; time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. THe symbology used for timing specifications herein follows the pattern of t(signal)(state)(reference)(state) for inputs and
t(reference)(state)(signal)(state) for outputs. For example, tIVKH symb oli zes t he ti me i nput s ign als (I ) re ach t he va lid s tat e (V ) rel ative
to the SYSCLK  reference (K) g oin g t o th e  hi g h (H) state or input setup time. And tKHOV symbolize s the time from SYSCLK(K)
going highs) until outputs (O) are valid (V) or output valid time. Input hold time can be read as the time that the input signal
(I) went invalid (X) with res pect to the ris ing clock  edge (KH) - note  the posi tion of the  referenc e and its stat e for inputs  – and
output  hol d ti me  ca n be  read as the ti me  from  the  ris in g edge (KH)  unt il t he o utp ut w en t in valid (OX). Fo r add iti onal explan a-
tion of AC timing specifications in Motorola PowerPC microprocessors, see the application note “Understanding AC Timing
Specific atio ns  for PowerPC Mi crop roc es sor s.”
3. The setup and hold time is with respect to the rising edge of HRESET (see Figure 11).
4. This specification is for configuration mode select only. Also note that the HRESET must be held asserted for a minimum of
255 bus clocks after the PLL re-lock time during the power-on reset sequence.
5. tSYSCLK is the peri od o f th e ex tern al clock (SYSCLK ) in  nan os econd s (n s). T he n um ber s g ive n i n th e ta ble  mu st b e mul tiplied
by the period of SYSCLK to compute the actual time duration (in nanoseconds) of the parameter in question.
6. Mode select signals are BVSEL, L2VSEL, PLL_CFG[0-3]
7. Guaranteed by design and characterization.
8. Bus mod e sele ct  pi ns  mu st  rem ain  stabl e during ope rati on. Changing the logic  st ate s o f BVSEL  or  L2VSEL  du rin g o pera tio n
wil l caus e the  bus mode  volt age se lectio n to ch ange.  Chan ging th e log ic sta tes of t he PLL _CFG  pins d uring  operat ion wi ll
caus e the PL L divisio n ratio se lecti on to ch ange. B oth of the se condi tions  are cons idered  outsi de the spe cific ation an d are
not supported. Once HRESET is negated the states of the bus mode selection pins must remain stable.
Figure 11 provides the mode select input timing diagram for the PC755.
Figure 11.  Mode Input Timing Diagram
Table 12.  Processor Bus Mode Selection AC Timing Specifications(1)
At VDD = A VDD = 2.0V 100 mV; -55 ≤ Tj ≤ +125°C, OV DD = 3.3V 165 mV and OVDD = 1.8V ± 100 mV and OVDD = 2.0V 100 mV
Parameter
Symbols(2) All Speed Grades
UnitMin Max
Mode select input setup to HRESET(3)(4)(5)(6)(7) tMVRH 8–t
SYSCLk
HRESET to mode select input hold(3)(4)(6)(7)(8) tMXRH 0–ns
HRESET
MODE SIGNALS
VM = Midpoint Voltage (OVDD/2)
VM
tMVRH tMXRH

26 PC755/745 2138C–HIREL–01/03
Figure 12 provides the AC test load for the PC755.
Figure 12.  AC Test Load
Note s: 1. Revi si ons  p r io r t o  Re v  2.8  ( Re v E )  wer e  l i mi ted  i n  per f orm an c e  an d  did  n ot  co nf o rm t o  t his  s pe ci f ic a tio n.   Con tac t  yo u r  local
Motorola sales office for more information.
2. Guaranteed by design and characterization.
3. tSYSCLK is the perio d of the external  clo ck (SYSCLK) i n na nos ec ond s (n s). Th e nu mb ers giv en  in the  tab le m us t be m ul tip lie d
by the period of SYSCLK to compute the actual time duration (in ns) of the parameter in question.
4. Per the 60x bus protocol, TS, ABB and DBB are driven only by the currently active bus master. They are asserted low then
precharged high before returning to high-Z as shown in Figure 6. The nominal precharge width for TS, ABB or DBB is 0.5 x
tSYSCLK, i.e. less than the minimum tSYSCLK period , to ens ure tha t anoth er maste r assert ing TS, ABB, or  DBB on the following
cloc k wil l no t cont end  with  the pr echa rge.  Out put va lid a nd o utput  hol d timi ng is  teste d fo r the  sign al as sert ed.  Output  val id
time is tested for precharge.The high-Z behavior is guaranteed by design.
5. Per the 60x bus protocol, ARTRY can be driven by multiple bus masters through the clock period immediately following
AACK. Bus contention is not an issue since any master asserting ARTRY will be driving it low. Any master asserting it low in
the fir st clo ck  fo llo wing  AACK wi ll  then go to hi gh-Z  for one cloc k  bef ore  prec ha rgi ng i t h igh  du rin g th e s ec ond  c ycle  afte r th e
assertion of AACK. The nominal precharge width for ARTRY is 1.0 tSYSCLK; i.e., it should be high-Z as shown in Figure 6
before the first opportunity for another master to assert ARTRY. Output valid and output hold timing is tested for the signal
asserted. Output valid time is tested for precharge. The high-Z and precharge behavior is guaranteed by design.
OVDD/2
OUTPUT Z0 = 50Ω
RL = 50Ω
Table 13.  Processor Bus AC Timing Specifications(1) at Recommended Operating Conditions
Parameter Symbols
All Speed Grades Unit
Min Max
Setup Times: All Inputs tIVKH 2.5 – ns
Input Hold Times: TLBISYNC, MCP, SMI tIXKH 0.6 – ns
Input Hold Times: All Inputs, except TLBISYNC, MCP, SMI tIXKH 0.2 – ns
Valid Times: All Outputs tKHOV –4.1ns
Output Hold Times: All Outputs tKHOX 1–ns
SYSCLK to Output Enable(2) tKHOE 0.5 – ns
SYSCLK to Output High Impedance (all except ABB, ARTRY, DBB)(2) tKHOZ –6ns
SYSCLK to ABB, DBB High Impedance After Precharge(2)(3)(4) tKHABPZ –1t
SYSCLK
Maximu m Delay to  ARTRY Precharge(2)(3)(5) tKHARP –1t
SYSCLK
SYSCLK to ARTRY High Impedance After Precharge(2)(3)(5) tKHARPZ –2t
SYSCLK

PC755/745

2138C–HIREL–01/03

Figure 13 provides the input/output timing diagram for the PC755.

Figure 13. Input/Output Timing Diagram

L2 Clock AC Specifications The L2 CLK frequency is progr ammed by the L2 Configur ation Register (L2CR[4:6])

core-to-L2 divis or ratio. See Table 14 for example core and L2 fre quencies at various

divisors. Table 14 provides the potential range of L2CLK output AC timing specifications

as defined in Figure 14.

The minimum L2CLK fr equency of Table 14 is specified by the maximum delay of the

internal DLL. The variable-tap DLL introduces up to a full clock pe riod delay in the

L2CLKOUTA, L2CLKOUTB, and L2SYNC_OUT signals so that the returning

L2SYNC_IN signal is phase aligned with the next core clock (divided by the L2 divisor

ratio). Do not choose a core-to-L2 divisor wh ich results in an L2 fr equency be low this

minimum, or the L2CLKOUT signals provided for SRAM clocking will not be phase

aligned with the PC755 core clock at the SRAMs.

The maximum L2CLK frequency shown in Table 14 is the core frequency divided by

one. Ver y few L2 SRAM des igns will be able to opera te in this mo de. Most de signs wil l

select a greater core-to-L2 divisor to provide a longer L2CLK period for read and write

access to the L2 SRAMs. The maximum L2CLK frequency for any application of the

PC755 will be a fun ction of the AC t iming s of the P C755, th e AC timings fo r the S RAM,

bus loading, and printed circuit board trace length.

SYSCLK

ALL INPUTS

VM = Midpoint Voltage (OVDD/2 or Vin/2)

ALL OUTPUT S

(Except TS, ABB,

ARTRY, DBB)

TS,ABB,DBB

ARTRY

tIVKH tIXKH

tKHOE

tKHOV tKHOX

tKHABPZ

tKHOV

tKHOX

tKHOZ

tKHARPZ

tKHOV

tKHOX

tKHARP

tKHOV

tKHOZ

28 PC755/745 2138C–HIREL–01/03
Motorol a is simila rly limi ted by s ystem co nstraints  and cann ot perform  tests o f the L2
interfac e on  a sock eted  par t on a fun ction al te ste r at  the max i mum  frequen ci es  of Tabl e
14. T herefore func tional ope ration and A C timing i nformation  are tested a t core-to- L2
divisor s of 2 or great er. Functi onality of c ore-to- L2 divisors  of 1 or 1.5 is ver ified at le ss
than maximum rated frequencies.
L2 input and output signals ar e latched or enabled respecti vely by the internal L 2CLK
(which is SYSCLK multiplied up to the core frequency and divided down to the L2CLK
frequency). In other words, the AC timings of Table 15 and Table 16 are entirely inde-
pendent of L2SYNC_IN. In a closed loop system, where L2SYNC_IN is driven through
the board trace by L2SYNC_OUT, L2SYNC_IN only controls the output phase of
L2CLKOUTA and L2CLKOUTB which are used to latch or enable data at the SRAMs.
However, since in a closed loop system L2SYNC_IN is held in phase alignment with the
internal L2CLK, the signals of Table 15 and Table 16 are referenced to this signal rather
than the not- externally- visible i nternal L2CLK. Du ring manufacturing  test, these times
are actually measured relative to SYSCLK.
The L2SYNC_OUT signal is intended to be routed halfway out to the SRAMs and then
returned to the L2SYNC_IN input of the PC755 to synchronize L2CLKOUT at the SRAM
with th e processor ’s int ernal clock . L2CLKOUT  at the S RAM can  be offset for ward or
backward in time by shortening or lengthening the routing of L2SYNC_OUT to
L2SYNC_ IN. S ee M otor ola  Applic atio n Note  AN1 79/D  “Po werPC ™ Bac kside L2 Ti ming
Analysis for the PCB Design Engineer.”
The L2CLKOUTA and L2CLKOUTB signals should not have more than two loads.
Notes: 1. L2CLK outputs are L2CLK_OUTA, L2CLK_OUTB, L2CLK_OUT and L2SYNC_OUT pins. The L2CLK frequency to core fre-
quen cy set tings  must be ch osen s o that t he re sulting  L2CLK  freque ncy an d core  frequ ency do  not exce ed th eir res pecti ve
maximum or minimum operating frequencies. The maximum L2LCK frequency will be system dependent. L2CLK_OUTA
and L2CLK_OUTB must have equal loading.
2. The nominal duty cycle of the L2CLK is 50% measured at midpoint voltage.
3. The DLL re-lock time is specified in terms of L2CLKs. The number in the table must be multiplied by the period of L2CLK to
compute the actual time duration in nanoseconds. Re-lock timing is guaranteed by design and characterization.
4. The L2CR[L2SL] bit should be set for L2CLK frequencies less than 110 MHz. This adds more delay to each tap of the DLL.
5. Allowable skew between L2SYNC_OUT and L2SYNC_IN.
6. This output jitter number represents the maximum delay of one tap forward or one tap back from the current DLL tap as the
phase comparator seeks to minimize the phase difference between L2SYNC_IN and the internal L2CLK. This number must
be comprehe nd ed in the  L2 timing ana ly si s. The  input  jitter  on SYSCLK affect s L2CLK OUT an d the L2 add ress/d ata /co ntro l
signals  e qually and  therefore  is already c om preh en ded  in the  AC ti mi ng and doe s  not have to be  co nsi de red in the  L2 timing
analysis.
7. Guarante ed by  desig n.
Table 14.  L2CLK Output AC Timing Specification. At VDD = AVDD = 2.0V 100 mV; -55 ≤ Tj ≤ +125°C, OVDD = 3.3V
165 mV and OVDD = 1.8V 100 mV and OVDD = 2.0V 100 mV
Parameter Symbols
All Speed Grades
UnitMin Max
L2CLK frequency(1)(4) f L2CLK 80 450 MHz
L2CLK  cycle t ime t L2CLK 2.5 12.5 ns
L2CL K duty  cycle(2)(7) tCHCL/tL2CLK 45 55 %
Internal DLL-relock time(3)(7) – 640 – L2CLK
DLL capture window(5)(7) –010ns
L2CLKOUT output-to-output skew (6)(7) tL2CSKW –50 ps
L2CLKOUT output jitter(6)(7) ––±150ps

29
PC755/745
2138C–HIREL–01/03
The L2CLK_OUT timing diagram is shown in Figure 14.
Figure 14.  L2CLK_OUT Output Timing Diagram
L2 Bus Input AC Specifications Table 15 provides the L2 bus interface AC timing specifications for the PC755 as
defined in Figure 15 and Figure 16 for the loading conditions described in Figure 17.
VM = Midpoint Voltage (L2OVdd/2)
L2CLK_OUTA
L2CLK_OUTB
L2 Differential Clock Mode
L2 Single-Ended Clock Mode
L2SYNC_OUT
L2CLK_OUTAVM
tL2CR tL2CF
VM
VM
VM
L2CLK_OUTB
VMVM
VM
VM
VM
L2SYNC_OUT
VM VM VM
VM VM VM
VM
VM
tL2CSKW
tL2CLK
tL2CLK
t
CHCL
t
CHCL
Table 15.  L2 Bus Interface AC Timing Specifications at Recommended Operating Conditions
Parameter Symbol
All Speed Grades
UnitMin Max
L2SYNC_IN rise and Fall Time(1) tL2CR & tL2CF –1.0ns
Setup Times: Data and Parity(2) tDVL2CH 1.2 - ns
Input Hold Times: Data and Parity(2) tDXL2CH 0-ns
Valid Times: (3)(4)
All Outputs when L2CR[14-15] = 00
All Outputs when L2CR[14-15] = 01
All Outputs when L2CR[14-15] = 10
All Outputs when L2CR[14-15] = 11
tL2CHOV -
-
-
-
3.1
3.2
3.3
3.7
ns
Output Hold  Times : (3)
All Outputs when L2CR[14-15] = 00
All Outputs when L2CR[14-15] = 01
All Outputs when L2CR[14-15] = 10
All Outputs when L2CR[14-15] = 11
tL2CHOX 0.5
0.7
0.9
1.1
-
-
-
-
ns
L2SYNC_IN to High Imped a nce:(3)(5)
All Outputs when L2CR[14-15] = 00
All Outputs when L2CR[14-15] = 01
All Outputs when L2CR[14-15] = 10
All Outputs when L2CR[14-15] = 11
tL2CHOZ -
-
-
-
2.4
2.6
2.8
3.0
ns

30 PC755/745 2138C–HIREL–01/03

Notes: 1. Rise and fall times for the L2SYNC_IN input are measured from 20% to 80% of L2OVDD.

2. All input specifications are measured from the midpoint of the signal in question to the midpoint voltage of the rising edge of

the input L2SYNC_IN (see Figure 8). Input timings are measured at the pins.

3. All out put specificati ons are me asu r ed from the mid po int v ol tage of the ri si ng e dge of L2 SYN C_IN to the m id poi nt o f the si g-

nal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50Ω load (See

Figure 10).

4. The outputs are valid for both single-ended and differential L2CLK modes. For pipelined registered synchronous Bur-

stRAMs, L2CR[14-15] = 01 or 10 is recommended. For pipelined late write synchronous BurstRAMs, L2CR[14-15] = 11 is

recommended.

5. Guaranteed by design and characterization.

6. Revisions prior to Rev 2.8 (Rev E) were limited in performance.and did not conform to this specification. Contact your local

Atmel sales office for more information.

Figure 15 shows the L2 bus input timing diagrams for the PC755.

Figure 15. L2 Bus Input Timing Diagrams

Figure 16 shows the L2 bus output timing diagrams for the PC755.

Figure 16. L2 Bus Output Timing Diagrams

Figure 17 provides the AC test load for L2 interface of the PC755.

Figure 17. AC Test Load for the L2 Interface

L2SYNC_IN

L2 DATA AND DATA

VM = Midpoint Voltage (L2OV DD/2)

tDVL2CH tDXL2CH

tL2CR tL2CF

PARITY INPUTS

L2SYNC_IN

ALL OUTPUT S

VM = Midpoint Voltage (L2OVDD/2)

L2DATA BUS

tL2CHOX

tL2CHOZ

tL2CHOV

OUTPUT L2OVdd/2

RL = 50Ω

Z0 = 50Ω

31
PC755/745
2138C–HIREL–01/03
IEEE 1149.1 AC Timing 
Specifications
Timing Specifications Table 16 provides the IEEE 1149.1 (JTAG) AC timing specifications as defined in Figure
18, Figure 19, Figure 20, and Figure 21.
Note s: 1. A ll  outpu ts  are m eas ure d fr om t he  midp oint  vol tag e of  th e f allin g/r isi ng ed ge  of T CLK t o t he  mid point  of  the  sig nal  in  ques-
tion. The output timings are measured at the pins. All output timings assume a purely resistive 50Ω load (See Figure 18).
Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
3. Non-JTAG signal input timing with respect to TCK.
4. Non-JTAG signal output timing with respect to TCK.
5. Guaranteed by design and characterization.
Figure 18 provides the AC test load for TDO and the boundary-scan outputs of the PC755.
Figure 18.  ALTERNATE AC Test Load for the JTAG Interface
Table 16.  JTAG AC Timing Spe ci fic at ion s (Independent of SYS CLK ) (1) 
Parameter Symbol Min Max Unit
TCK Frequen cy  of operati on fTCLK 016MHz
TCK Cycle time fTCLK 62.5 - ns
TCK Clock pulse width measured at 1.4V tJHJL 31 - ns
TCK Rise and fall times tJR & tJF 02ns
TRST Assert time(2) tTRST 25 - ns
Input Setup Times:(3)
Boundary-scan data
TMS, TDI tDVJH
tIVJH
4
0-
-
ns
Input Hold Times:(3)
Boundary-scan data
TMS, TDI tDXJH
tIXJH
15
12 -
-
ns
Valid Times:(4)
Boundary-scan data
TDO tJLDV
tJLOV
-
-4
4
ns
Output Hold  Times :(4)
Boundary-scan data
TDO tJLDV
tJLOV
25
12 -
-
ns
TCK  to output high impedance:(4)(5)
Boundary-scan data
TDO tJLDZ
tJLOZ
3
319
9
ns
OVDD/2
OUTPUT Z0 = 50Ω
RL = 50Ω

32 PC755/745 2138C–HIREL–01/03

Figure 19 provides the JTAG clock input timing diagram.

Figure 19. JTAG Clock Input Timing Diagram

Figure 20 provides the TRST timing diagram.

Figure 20. TRST Timing Diagram

Figure 21 provides the boundary-scan timing diagram.

Figure 21. Boundary-Scan Timing Diagram

TCLK VMVMVM

VM = Midpoint Voltage (OVDD/2)

tTCLK

tJR tJF

tJHJL

TRST tTRST

VM = Midpoint Voltage (OVDD/2)

VM VM

TCK

BOUNDARY

DATA OUTPUTS

DATA INPUTS

DATA OUTPUTS

VM = Midpoint Voltage (OVDD/2)

tDXJH

tDVJH

tJLDV

JLDZ

INPUT

DAT A VALID

OUTPUT

tJLDH

DATA

VALID

OUTPUT DATA VALID

PC755/745

2138C–HIREL–01/03

Figure 22 provides the test access port timing diagram.

Figure 22. Test Access Port Timing Diagram

JTAG Configuration Signals Boundar y scan te sting is ena bled thr ough th e JTAG inter face sig nals. The T RST signa l

is optional in the IEEE 1149.1 specification, but is provided on all processors that imple-

ment the P owerPC a rchitecture. While it i s possible to force t he TAP c ontroller to th e

reset state using only the TCK and TMS s ignals, more reliable power-on reset per for-

mance will be obtained if the TRST signal is asserted during power-on reset. Because

the JTAG interface is also used for accessing the common on-chip processor (COP)

function, simply tying TRST to HRESET is not practical .

The COP function of these processors allows a remote computer system (typically, a PC

with dedicated hardware and debugging software) to access and control the internal

operatio ns of the processor . The COP interfac e connects primari ly through the JTAG

port of the processor, with some additional status monitoring signals. The COP port

requires the ability to independently assert HRESET or TRST in order to fully control the

processor. If the target system has i ndependent reset sources, such as vol tage moni-

tors, watchdog timers, power supply failures, or push-button switches, then the COP

reset signals must bemerged into these signals with logic.

The arrangement shown in Figure 23 allows the COP port to independently assert

HRESET or TRST, while ensuring that the target can drive HRESET as well. If the JTAG

interfac e and COP header will not be u sed, TRS T sho uld be ti ed to HRESET thr ough a

0Ω isolation resistor so that it is asserted when the systemreset signal (HRESET) is

asser ted ens uring that th e J T AG s c an c ha in is i nitializ ed duri ng p ower - on . W hil e M oto r-

ola recommends that the COP header be designed into the system as shown in Figure

23, if this is not possib le, the is olation res istor wil l allow futur e access to TRS T in the

casewhere a JTAG interfacemay need to be wired onto the system in debug situations.

The COP header shown in Figure 23 adds many benefits — breakpoints, watchpoints,

are possible through this interface — and can be as inexpensive as an unpopulated

footprint for a header to be added when needed.

The COP interface has a standard header for connection to the target system, based on

the 0. 025" squa re-p ost 0.100" center ed hea der asse mbly (of ten cal led a Berg header ).

The connector typically has pin 14 removed as a connector key.

TCK

TDI, TMS

TDO

VM = Midpoint Voltage (OVDD/2)

TDO

tIXJH

tIVJH

tJLOV

tJLOZ

INPUT

DATA VALID

OUTPUT

tJLOH

DATA

VALID

OUTPUT DATA VALID

34 PC755/745 2138C–HIREL–01/03

Figure 23. JTAG Interface Connec tion

Notes: 1. RUN/STOP, normally found on pin 5 of the COP header, is not implemented on the PC755. Connect pin 5 of the COP

header to OVDD with a 10 kΩ pull-up resist or.

2. Key l ocation; pin 14 is not physically present on the COP heade r.

3. Component not populated. Populate only if debug tool does not drive QACK.

4. Populate only if debug tool uses an open-drain type output and does not actively deassert QACK.

5. If the JTAG interface is implemented, connect HRESET from the target source to TRST from the COP header though an

AND gate to T RST of the part. If th e J TAG i nte rfac e i s not im pl emented, conne ct HRES ET fromthe target source to TRST of

the part through a 0Ω isolation resistor.

HRESET HRESET

From Target

Board Sources

13 SRESET

SRESET SRESET

VDD_SENSE

2kΩ10 kΩ

10 kΩ

OVDD

CHKSTP_IN CHKSTP_IN

8TMS

TDO

TDI

TCK

TMS

TDO

TDI

TCK

4TRST

(if any)

COP Header

14 2

Key

QACK

OVDD

10 kΩOVDD

TRST

10 kΩOVDD

10 kΩ

QACK

CHKSTP_OUT

KEY

No pin

COP Connector

Physical Pin Out

10 kΩ 4OVDD

2kΩ3

0Ω 5

HRESET

PC755/745

2138C–HIREL–01/03

The COP head er show n in Fi gure 24 adds many benefi ts—breakpoi nts, watchpoints,

regist er and mem ory exam ination/ modific ation and other sta ndard d ebugger features

are possible through this interface – and can be as inexpensive as an unpopulated foot-

print for a header to be added when needed.

System design information

The COP interface has a standard header for connection to the target system, based on

the 0.025” square-post 0.100” centered header assembly (often called a “Berg” header).

The connector typically has pin 14 removed as a connector key.

Figure 24 shows the COP connector diagram.

Figure 24. COP Connector Diagram

There is no standardized way to number the COP header shown in Fi gure 24; conse-

quently, many different pin numbers have been observed from emulator vendors. Some

are numbered top-to-bottom then left-to-right, while others use left-to-right then top-to-

bottom, while still others number the pins counter clockwise from pin one (as with an IC).

Regard less of the num bering , the signa l placemen t recomm ended in Figure 24 is co m-

mon to all known emulators.

The QACK si gnal sh own in Table 16 is usual ly hoo ked up t o the PCI bridge chip i n a

system and is an input to the PC755 informing it that it can go into the quiescent state.

Under normal operation this occur s during a low power mode selection. In order for

COP to work the PC755 must see this signal asserted (pulled down). While shown on

the COP heade r, not all emulat or prod ucts driv e this si gnal. To preser ve cor rect pow er

down operation, QACK should be merged so that it also can be driven by the PCI

bridge.

CKSTP_OUT

13 9 5 1

610 2

TOP VIEW

15 11 7

16 12 8 4

KEY

No pin

HRESET

SRESET

TMS

RUN/STOP

TCK

TDI

TDO

Ground

TRST

VDD_SENSE

Pins 10, 12 and 14 are no-con nec ts.

Pin 14 is not physically present

QACK

CHKSTP_IN

36 PC755/745 2138C–HIREL–01/03

Preparation for Delivery

Packaging Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.

Certificate of Compliance Atmel offers a certificate of compliances with each shipment of parts, affirming the prod-

ucts are in com pliance ei ther with M IL-PRF- 883 and gu arantyi ng the para meters no t

tested at temperature extremes for the entire temperature range.

Handling MOS devices must be handled with certain precautions to avoid damage due to accu-

mulation of static charge. Input protection devices have been designed in the chip to

minimize the effect of static buildup. However, the following handling practices are

recommended:

1. Devices should be handled on benches with conductive and grounded surfaces.

2. Ground test equipment, tools and operator.

3. Do not handle devices by the leads.

4. Store devices in conductive foam or carriers.

5. Avoid use of plastic, rubber, or silk in MOS areas.

6. Maintain relative humidity above 50 percent if practical.

7. For CI-CGA packages, use specific tray to take care of the highest height of the

package compared with the normal CBGA.

Package Mechanical

Data The fo llowing s ectio ns provi de the pa ckag e param eters an d mecha nical di mensi ons for

the PC745, 255 PBGA package as well as the PC755, 360 CBGA and PBGA packages.

While bot h the P C755 plasti c and the cera mic pack age s ar e de sc rib ed he re , both pac k-

ages are not guar an tee d to b e av ai lab le at the sa me ti me . Al l n ew de si gns s hou ld a llow

for either ceramic or plastic BGA packages for this device. For more information on

designing a common footprint for both plastic and ceramic package types, please con-

tact your local Motorola sales office.

Parameters for the

PC745

Package Parameters for the

PC745 PB GA The package parameters are as provided in the following list. The package type is

21 x 21 mm, 255-lead plastic ball grid array (PBGA).

Mechanic al Dimensions of the

PC745 PB GA Pac ka ge Figure 2 5 pr ovi des th e m ec hani cal dim ens i ons an d b otto m s urfac e nom enc la tur e o f th e

PC745, 255 PBGA package.

Package outline 21 x 21 mm

Interconnects 255 (16 x 16 ball array – 1)

Pitch 1.27 mm (50 mil)

Minimum module height 2.25 mm

Maximum module height 2.80 mm

Ball diameter (typical) 0.75 mm (29.5 mil)

PC755/745

2138C–HIREL–01/03

Figure 25. Mechanical Dimensions and Bottom Surface Nomenclature of the PC745 PBGA

Parameters for the PC755

PBGA

Package Parameter for the

PC755 PB GA The pack age par ameters are as prov ided i n the f ollowi ng list. The packa ge typ e is 25 x

25 mm, 360-lead plastic ball grid array (PBGA).

Package outline 25 x 25 mm

Interconnects 360 (19 x 19 ball array – 1)

Pitch 1.27 mm (50 mil)

Minimum module height 2.22 mm

Maximum module height 2.77 mm

Ball diameter 0.75 mm (29.5 mil)

Table 1

Millimeters

DIM Min Max

A2.25 2.80

A1 0.50 0.70

A2 1.00 1.20

b0.60 0.90

D21.00 BSC

E21.00 BSC

e1.27 BSC

0.2

A1 CORNER

0.2

AA1

0.2 C

255X

12345678910111213141516

A0.3C

0.15

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

4. CAPACITOR PADS MAY BE UNPOPULATED.

38 PC755/745 2138C–HIREL–01/03

Mechanic al Dimensions of the

PC755 PB GA Figure 2 6 pr ovi des th e m ec hanic al dim ens i ons an d b otto m su rfac e nom enc la ture o f th e

PC755, 360 PBGA package.

Figure 26. Mechanical Dimensions and Bottom Surface Nomenclature of the PC755 PBGA

NOTES:

A. DIMENSIONING AND T OLERANCING PER

ASME Y14.5M, 1994.

B. DIMENSIONS IN MILLIMETERS.

C. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH V ARIOUS

SHAPES. BOTT OM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRA Y.

0.2

360X

A1 CORNER

0.2

12345678910111213141516

A0.3

0.15

AA1

0.2 C

171819

Millimeters

DIM Min Max

A2.22 2.77

A1 0.50 0.70

A2 1.00 1.20

b0.60 0.90

D25.00 BSC

E25.00 BSC

e1.27 BSC

PC755/745

2138C–HIREL–01/03

Mechanical Dimensions of the

PC755 CBGA Packa ge Figure 28 prov i des th e m ec hani c al dim ens ions an d b otto m s urf ace nom enc la tur e o f th e

PC755, 360 CBGA package.

Figure 27. Mechanical Dimensions and Bottom Surface Nomenclature of PC755 (CBGA)

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

360X

12345678910111213141516

A0.3 C

0.15

AA1

0.2C

171819

Millimeters

DIM Min Max

A2.65 3.20

A1 0.79 0.99

A2 1.10 1.30

A3 —0.60

b0.82 0.93

D25.00 BSC

D1 6.75

E25.00 BSC

E1 7.87

e1.27 BSC

0.2

A1 CORNER

0.2

40 PC755/745 2138C–HIREL–01/03

Mechanical Dimensions of the

PC755 HiTCE Package Figure 28 provi des th e m ec hanic al dim ens i ons an d b otto m sur fac e nom enc la ture o f th e

PC755, 360 HiTCE package.

Figure 28. Mechanical Dimensions and Bottom Surface Nomenclature of PC755 (HiTCE)

360X

12345678910111213141516

A0.3 C

0.15

AA1

0.2C

171819

Millimeters

DIM Min Max

A2.65 3.24

A1 0.79 0.99

A2 1.10 1.30

A3 —0.60

b0.82 0.93

D25.00 BSC

D1 6.75

E25.00 BSC

E1 7.87

e1.27 BSC

0.2

A1 CORNER

0.2

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

PC755/745

2138C–HIREL–01/03

Mechanical Dimensions of the

PC755 CI-CG A Packa g e Figure 29 provides the mechanical dimensions and bottom surface nomenclature of

PC755, 360 CI-CGA package

Figure 29. Mechanical Dimensions and Bottom Surface Nomenclature of PC755 (CI-CGA)

Clock Relationship

Choices The PC755’s PLL is configured by the PLL_CFG[0-3] signals. For a given SYSCLK

(bus) fre que ncy , th e PL L co nfi gur ati on sig nal s s et th e in ter nal CPU a nd V C O freq uen cy

of oper ation. The PLL c onfiguratio n for t he PC755 is sh own in F igure 31 fo r exam ple

frequencies.

360X

12345678910111213141516

A0.3 C

0.15

A4 A2

171819

Millimeters

DIM Min Max

A4.04 BSC

A2 1.10 1.30

1.545 1.695

A3 —0.60

b0.79 0.990

D25.00 BSC

D1 6.75

E25.00 BSC

E1 7.87

0.2

A1 CORNER

0.2

A4 0.82 0.9

A5 0.10 BSC

A6 0.25 0.35

1.27 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

360 X A

0.15

42 PC755/745 2138C–HIREL–01/03

Notes: 1. P LL_CFG[0: 3] settings not listed are reserved.

2. The sample bus-to-core frequencies shown are for reference only. Some PLL configurations may select bus, core, or VCO

frequencies which are not useful, not supported, or not tested for by the PC755; see Section «Clock AC Specifications»

page 24 for valid SYSCLK, core, and VCO frequencies.

3. In PLL-bypa ss mo de, th e SYSCLK in pu t sig nal cl ocks the in ternal process or di rectly , the PLL is dis ab led , and the bus mod e

is set for 1:1 mode operation. This mode is intended for factory use and emulator tool use only.

Note: The AC timing specifications given in this document do not apply in PLL-bypass mode.

4. In PLL off mode, no clocking occurs inside the PC755 regardless of the SYSCLK input.

Table 17. PC755 Microprocessor PLL Configuration

PLL_CFG [0-3]

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus-to-Core

Multiplier Core-to VCO

Multiplier Bus 33

MHz Bus 50

MHz Bus 66

MHz Bus 75

MHz Bus 80

MHz Bus 100

MHz

0100 2x 2x -----

200

(400)

1000 3x 2x - - 200

(400) 225

(450) 240

(480) 300

(600)

1110 3.5x 2x - - 233

(466) 263

(525) 280

(560) 350

(700)

1010 4x 2x - 200

(400) 266

(533) 300

(600) 320

(640) 400

(800)

0111 4.5x 2x - 225

(450) 300

(600) 338

(675) 360

(720) -

1011 5x 2x - 250

(500) 333

(666) 375

(750) 400

(800) -

1001 5.5x 2x - 275

(550) 366

5733°---

1101 6x 2x 200

(400) 300

(600) 400

(800) ---

0101 6.5x 2x 216

(433) 325

(650) ----

0010 7x 2x 233

(466) 350

(700) ----

0001 7.5x 2x 250

(500) 375

(750) ----

1100 8x 2x 266

(533) 400

(800) ----

0110 10x 2x 333

(666) -----

0011 PLL off/bypass PLL off, SYSCLK clocks core circuitry directly, 1x bus-to-core implied

1111 PLL off PLL off, no core clocking occurs

PC755/745

2138C–HIREL–01/03

The PC75 5 ge ner ates the cloc k for t he exter nal L2 sync hr onou s data SR AM s by div id-

ing the core clock frequency of the PC755. The divided-down clock is then phase-

adjust ed by an on-chip delay-lock-loop (DLL) circuit and should be routed from the

PC755 to the external RA Ms. A separ ate clock output, L2 SYNC_OUT is sent out hal f

the distance to the SRAMs and then returned as an input to the DLL on pin L2SYNC_IN

so that the ri sing-edge of th e clock as se en at the exter nal RAMs can be ali gned to the

clocking of the internal latches in the L2 bus interface.

The core-to-L2 frequency divisor for the L2 PLL is selected through the L2CLK bits of

the L2CR registe r. General ly, the div isor mus t be chosen ac cording to the freque ncy

supported by the external RAMs, the frequency of the PC755 core, and the phase

adjustm ent r ange th at the L2 DL L sup ports. Figure 18 s hows var ious ex ample L2 c lock

frequencies that can be obtained for a given set of core frequencies. The minimum L2

frequency target is 80 MHz.

Note: The core and L2 frequencies are for reference only. Some examples may repre-

sent core or L2 frequencies which are not useful, not supported, or not tested

for by the PC755; see Section “L2 Clock AC Specifications” page 27 for valid

L2CLK frequencies. The L2CR[L2SL] bit should be set for L2CLK frequencies

less than 110 MHz.

System Design

Information

PLL Power Supply Filtering The AVDD and L2AVDD power signals are provided on the PC755 to provide power to the

clock generation phase-locked loop and L2 cache delay-locked loop respectively. To

ensure stabili ty of the i nternal cloc k, the power suppli ed to the A VDD inp ut signal sh ould

be filter ed of any no ise i n the 500 kH z to 10 MHz resonan t frequ ency ra nge of the PLL.

A circuit similar to the one shown in Figure 31 using surface mount capacitors with mini-

mum Effective Series Inductance (ESL) is recommended. Consistent with the

recommend ati ons of Dr. Howa rd Joh nson i n Hig h Sp eed D igital Design : A Ha ndbo ok of

Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recom-

mended over a single large value capacitor.

Table 18. Sample Core-to-L2 Frequencies

Core Frequency in MHz 1 1.5 2 2.5 3

250 250 166 125 100 83

266 266 177 133 106 89

275 275 183 138 110 92

300 300 200 150 120 100

325 325 217 163 130 108

333 333 222 167 133 111

350 350 233 175 140 117

366 366 244 183 146 122

375 375 250 188 150 125

400 400 266 200 160 133

44 PC755/745 2138C–HIREL–01/03

The circuit should be placed as close as possible to the AVDD pin to minimize noise cou-

pled from nearby ci rcuits . An identic al but se parat e circui t should be placed as close as

possible to the L2AVDD pin. It is often possible to route directly from the capacitors to the

AVDD pin, which is on the periphery of the 360 BGA footprint, without the inductance of

vias. The L2AVDD pin may be more difficult to route but is proportionately less critical.

Figure 30. PLL Power Supply Filter Circuit

Power Supply V o ltage

Sequencing The notes in Figure 32 contain cautions about the sequencing of the external bus volt-

ages and core voltage of the PC755 (when they are different). These cautions are

neces sary for th e long term reli ability of the par t. If they are vio lated, th e ESD (Ele ctro-

static Discharge) protection diodes will be forward biased and excessive current can

flow thro ugh these dio des. If the sys tem power supply des ign does not co ntrol the volt-

age sequencing , the ci r cuit o f F igu re 32 c an be a dded to meet thes e r eq uir e men ts. The

MUR420 Schottky diodes of Figure 32 control the maximum potential difference

between the external bus and core power supplies on power-up and the 1N5820 diodes

regulate the maximum potential difference on power-down.

Figure 31. Example Voltage Sequencing Circuit

Decoupling

Recommendations Due to the PC755’s dynamic power management feature, large address and data

buses, and high operating frequencies, the PC755 can generate transient power surges

and high frequency noise i n its power supply, e specially while driving lar ge capacitive

loads. This noise must be prevented from reaching other components in the PC755 sys-

tem, and the PC755 itself requires a clean, tightly regulated source of power. Therefore,

it is recommended that the system designer place at least one decoupling capacitor at

each VDD, OVDD, and L2OVDD pin of the PC755. It is also recommended that these

decoupling capacitors receive their power from separate VDD, (L2)OVDD and GND power

planes in the PCB, utilizing short traces to minimize inductance.

These capacitors should have a value of 0.01 ∝F or 0.1 ∝F. Only ceramic SMT (surface

mount technology) capaci tors should be used to minimiz e lead inductance, preferably

0508 or 0603 orientations where connections are made along the length of the part.

VDD AVDD (or L2AVDD)

10 Ω

2.2 µF 2.2 µF

GND

Low ESL Surface Mount Capacitors

3.3V 2.0V

MURS320

1N5820

MURS320

1N5820

PC755/745

2138C–HIREL–01/03

In addition, it is recommended that there be several bulk storage capacitors distributed

around the P CB, f eedin g the VDD, L2O VDD, and OV vplanes, to enable quick recharging

of the smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent

series resistance) rating to ensure the quick response time necessary. They should also

be connec ted to the po wer and gr o und pl an es through two vi as to mi nim ize i nduc ta nce.

Suggested bulk capacitors – 100-330 ∝F (AVX TPS tantalum or Sanyo OSCON).

Connection

Recommendations To ensure reliable operation, it is highly recommended to connect unused inputs to an

appropriate sig nal level through a resistor. Unused activ e low inputs shoul d be tied to

OVDD. Unus ed ac tiv e h igh in puts s hou ld b e c onn ected t o G ND. A ll NC ( no -con nec t) si g-

nals must remain unconnected.

Power a nd ground connectio ns must be made to all ex ternal VDD, OVDD, L2OVDD, and

GND pins of the PC755.

Output Buffer DC Impedance The PC755 60x and L2 I/O drivers are characterized over process, voltage, and temper-

atur e. To me asur e Z0, an external resistor is connected from the chip pad to (L2)OVDD or

GND. The n, the va lue of each re si st or is va ried u nti l the pad vo ltage is (L2)O VDD/2 (See

Figure 33).

The output im pedanc e is the avera ge of two compo nents, the resista nces of the pull- up

and pull- dow n dev ices . Wh en Data is he ld low, SW 2 is clos ed ( SW1 is ope n) , and R N is

trimmed until the voltage at the pad equals (L2)OVDD/2. RN then beco m es th e r esistance

of the pull-down devices. When Data is held high, SW1 is closed (SW2 is open), and RP

is trimmed until the voltage at the pad equals (L2)OVDD/2. RP then becomes the resis-

tance of the pull-up devices.

NO TAG describes the driver impedance measurement circuit described above.

Figure 32. Driver Impedance Measurement Circuit

(L2)OVDD

OGND

Pad

Data

SW1

SW2

(L2)OVDD

46 PC755/745 2138C–HIREL–01/03

Alternately, the followi ng is another method to determine the output impedance of the

PC755. A voltage source, Vforce, is connected to the output of the PC755 as in Figure 33.

Data is hel d lo w, the v oltage source is s et to a value that i s eq ual to (L2) OVDD/2 and th e

curren t sourced by Vforce i s measured . The vo ltage drop ac ross th e pull-down device,

which is equal to (L2)OVDD/2, is divided by the measured current to determine the output

impedance of the pull-down device, RN. Similarly, the impedance of the pull-up device is

determined by dividing the voltage drop of the pull-up, (L2)OVDD/2, b y the cur rent s ank

by the pul l-up when the data is hig h and Vforce is equal to (L2)OVDD/2. Thi s met hod c an

be employed with either empirical data from a test set up or with data from simul ation

models, such as IBIS.

RP and RN are designed to be close to each other in value. Then Z0 = (RP + RN)/2.

Figure 33 describes the alternate driver impedance measurement circuit.

Figure 33. Alternate Driver Impedance Measurement Circuit

Table 19 summariz es the signal impedanc e results . The drive r impedanc e values were

characterized at 0°C, 65 °C, and 105°C. The im pedance in cr ea ses with juncti on te mpe r-

ature and is relatively unaffected by bus voltage.

Pull–up Resistor

Requirements The PC755 requires high-resistive (weak: 10 KΩ) pull-up resistors on several control

pins of the bus interface to maintain the control signals in the negated state after they

have been act ively negated an d released by the PC75 5 or other bus ma sters. Thes e

pins are TS, ABB, ARTRY.

Thre e test pins al so requir e pull-up resistor s (weak or stronger : 4.7 kΩ - 10 kΩ). These

pins are L1_TSTCLK, L2_TSTCLK, and LSSD_MODE. These signals are for factory

use only and must be pulled up to OVDD for normal machine operation.

In addition, the PC755 has one open-drain style output that requires a pull-up resistor

(weak or stronger: 4.7 KW-10 KW) if it is used by the system. This pin is CKSTP_OUT.

Table 19. Impedance Characteristics

VDD = 2.0V, OVDD = 3.3V, Tc = 0 - 105°C

Impedance Processor bus L2 bus Symbol Unit

RN 25-36 25-36 Z0W

RP 26-39 26-39 Z0W

(L2)OVDD

BGA

Data Pin

OGND

Vforce

PC755/745

2138C–HIREL–01/03

During inactive periods on the bus, the address and transfer attributes may not be

driven by any master and may therefore float in the high-impedance state for relatively

long periods of time. Since the PC755 must continually monitor these signals for snoop-

ing, this float condition may cause excessive power draw by the input receivers on the

PC755 or by other receivers in the system. It is recommended that these signals be

pulled up through weak (i.e. 10 KΩ ) pull-up resistors by the system, or that they may be

otherwise driven by the system during inactive periods of the bus. The snooped address

and transfer attribute inputs are:

A[0:31], AP[0:3], TT[0:4], TBST and GBL.

The data bus input receivers are normally turned off when no read operation is in

progress and therefore do not require pull-up resistors on the bus. Other data bus

receivers in the system, however, may require pull-ups, or that those signals be other-

wise driven by the system during inactive periods by the system. The data bus signals

are: DH[0:31], DL[0: 31] and DP[0 :7]

If 32-bit data bus mode is selected, the input receivers of the unused data and parity bits

will be disab led, and th eir out put s will drive logi c zeros when they woul d othe rwise nor-

mally be driven. For this mode, these pins do not require pull-up resistors, and should be

left unconnected by the system to minimize possible output switching.

If address or data parity is not used by the system, and the respective parity checking is

disabled through HID0, the input receivers for those pins are disabled, and those pins

do not req uir e p ul l-up res i sto rs an d s houl d b e le ft un con nec te d by the s yst em. I f all pa r-

ity gene ratio n is disa bl ed throug h H ID0, then all pari ty c hec ki ng should als o be di sa ble d

through HID0, and all parity pins may be left unconnected by the system.

The L2 interface does not normally require pull-up resistors.

Definitions

Datasheet Status Validity

Objective specification This datasheet contains target and goal specification for

discussion with customer and application validation. Before design phase.

Target specification This datasheet contains target or goal specification for

product development. Valid during the design phase.

Preliminary specification ∝ site This datas heet contains pre liminary data . Additional data

may be published later; could include simulation result. Valid bef ore characterization phase.

Preliminary specification β site This datasheet contains also characterization results. Valid before the industrialization

phase.

Product specification This datasheet contains final product specification. Valid for production purpose.

Limiting Values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the

limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at

any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values

for extended periods may affect device reliability.

Application Inform ation

Where application information is given, it is advisory and does not form part of the specification.

48 PC755/745 2138C–HIREL–01/03

Life Support

Applications These produc ts are not des ign ed f or use i n li fe sup por t a pplia nc es , dev ice s, o r sy s tems

where malfunction of these products can reasonably be expected to result in personal

injury. Atmel customers using or selling these products for use in such applications do

so at their own risk and agree to fully indemnity Atmel for any damages resulting from

such improper use or sale.

Difference s w ith

Commercial Part

Ordering Information

Note: For availability of different versions, contact your Atmel sales office.

Commercial part Military part

Temperature range Tj = 0 to 105°CT

j = -55°C to 125°C

PC755C M ZF U 300 L x

Type

Package:

ZF: FC-PBGA

G: CBGA

GS: CI-CGA

GH: HiTCE Screening Level(1)

U: Upscreening Test

Revision Level(1)

E: Rev. 2.8

Temperature Range: Tj

M: -55 C, +125 C

V: -40 C, +110 C

Bus divider

(to be confirmed)

L: Any valid PLL configuration

Max internal processor speed

300: 300 MHz

350: 350 MHz

366: 366 MHz

400: 400 MHz, TBC

Printed on recycled paper.

Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty

which is detailed in Atmel’s Term s and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors

which may appear in this docum ent, reserves the right to change devices or specifications detailed herein at any time w ithout notice, and does

not make any commitment to update t he information contained herein. No licenses to patents or other intellectual property of Atmel are granted

by the Company in connec tion with the sale of Atmel p roducts, expres sly or by implication. At mel’s pr oduct s are not aut horized for use as crit ical

components in life s upport devic es or s ystems.

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2138C–HIREL–01/03 0M

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