Datasheet CMOS LDO Regulator Series for Portable Equipments Versatile Package FULL CMOS LDO Regulator BUxxTD3WG series General Description BUxxTD3WG series is high-performance FULL CMOS regulator with 200-mA output, which is mounted on versatile package SSOP5 (2.9 mm x 2.8 mm x 1.25 mm). It has excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 35A. It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.ROHM's. Key Specifications Output voltage: Accuracy output voltage: Low current consumption: Operating temperature range: 1.0V to 3.4V 1.0% (25mV) 35A -40C to +85C Applications Battery-powered portable equipment, etc. Package SSOP5: Features High accuracy detection low current consumption Compatible with small ceramic capacitor(Cin=Co=0.47uF) With built-in output discharge circuit High ripple rejection ON/OFF control of output voltage With built-in over current protection circuit and thermal shutdown circuit Package SSOP5 is similar to SOT-23-5 (JEDEC) Low dropout voltage 2.90mm x 2.80mm x 1.25mm Typical Application Circuit STBY VIN STBY VOUT VOUT VIN GND GND GND Fig.1 Application Circuit Product structure:Silicon monolithic integrated circuit This product is not designed protection against radioactive rays. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211114001 1/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series Connection Diagram VOUT SSOP5 N.C. Lot. No Marking VIN GND STBY TOP VIEW Pin Descriptions SSOP5 PIN No. Symbol Function 1 VIN Power Supply Voltage 2 GND Grouding 3 STBY 4 N.C. ON/OFF control of output voltage (High: ON, Low: OFF) Unconnected Terminal 5 VOUT Output Voltage Ordering Information B U x Part Number x Output Voltage 10 : 1.0V T D 3 Series Maximum Output Current 200mA W G with Package output discharge G : SSOP5 - Halogen Free G : compatible Blank : incompatible T R Packageing and forming specification Embossed tape and reel TR : The pin number 1 is the upper right 34 : 3.4V SSOP5 +6 4 -4 2.90.2 5 1 2 0.2Min. 2.80.2 +0.2 1.6 -0.1 4 3 0.050.05 1.10.05 1.25Max. +0.05 0.13 -0.03 +0.05 0.42 -0.04 0.95 0.1 (Unit : mm) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series Lineup Marking Output Voltage Part Number F0 1.0V BU10 L6 1.1V BU11 F1 1.2V BU12 M0 1.25V BU1C L5 1.3V BU13 F2 1.5V BU15 F3 1.8V BU18 F4 1.85V BU1J F5 1.9V BU19 F6 2.0V BU20 F7 2.1V BU21 F8 2.5V BU25 F9 2.6V BU26 G0 2.7V BU27 G1 2.8V BU28 G2 2.85V BU2J G3 2.9V BU29 G4 3.0V BU30 G5 3.1V BU31 G6 3.2V BU32 G7 3.3V BU33 G8 3.4V BU34 Absolute Maximum Ratings (Ta=25C) PARAMETER Power Supply Voltage Power Dissipation Maximum junction temperature Operating Temperature Range Storage Temperature Range Symbol Limit Unit VMAX -0.3 +6.5 V 540(*1) mW +125 Topr -40 +85 Tstg -55 +125 Pd TjMAX (*1)Pd deleted at 5.4mW/ at temperatures above Ta=25, mounted on 70x70x1.6 mm glass-epoxy PCB. RECOMMENDED OPERATING RANGE (not to exceed Pd) Symbol Limit Unit Power Supply Voltage PARAMETER VIN 1.76.0 V Maximum Output Current IMAX 200 mA OPERATING CONDITIONS PARAMETER Symbol MIN. TYP. MAX. Unit Input Capacitor Cin 0.22(*2) 0.47 - F Output Capacitor Co 0.22(*2) 0.47 - F CONDITION Ceramic capacitor recommended (*2)Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, changing as time progresses characteristic. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series Electrical Characteristics (Ta=25, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47F, Co=0.47F, unless otherwise noted.) PARAMETER Symbol Limit MIN. TYP. MAX. Unit Conditions Overall Device VOUTx0.99 Output Voltage VOUT VOUT-25mV Operating Current Operating Current (STBY) Ripple Rejection Ratio Dropout Voltage VOUT VOUTx1.01 V VOUT+25mV IOUT=10A, VOUT2.5V IOUT=10A, VOUT2.5V IIN - 35 60 A IOUT=0mA ISTBY - - 1.0 A STBY=0V RR 45 70 - dB VRR=-20dBv, fRR=1kHz, IOUT=10mA - 800 1100 mV 1.0VVOUT1.2V(IOUT=200mA) - 600 900 mV 1.2VVOUT1.5V(IOUT=200mA) - 440 700 mV 1.5VVOUT1.8V(IOUT=200mA) - 380 600 mV 1.8VVOUT2.5V(IOUT=200mA) - 280 540 mV 2.5VVOUT2.6V(IOUT=200mA) - 260 500 mV 2.7VVOUT2.85V(IOUT=200mA) - 240 460 mV 2.9VVOUT3.1V(IOUT=200mA) - 220 420 mV 3.2VVOUT3.4V(IOUT=200mA) VSAT Line Regulation VDL - 2 20 mV VIN=VOUT+1.0V to 5.5V (*4), IOUT=10A Load Regulation VDLO - 10 80 mV IOUT=0.01mA to 100mA Over Current Protection (OCP) Limit Current ILMAX 220 400 700 mA Vo=VOUT*0.95 Short Current ISHORT 20 70 150 mA Vo=0V VIN=4.0V, STBY=0V, VOUT=4.0V Standby Block Discharge Resistor RDSC 20 50 80 STBY Pin Pull-down Current ISTB 0.1 0.6 2.0 A ON VSTBH 1.2 - 6.0 V OFF VSTBL -0.3 - 0.3 V STBY Control Voltage STBY=1.5V This product is not designed for protection against radioactive rays. (*3) VIN=2.5V for VOUT1.5V (*4) VIN=2.5V to 3.6V for VOUT1.5V Block Diagrams VIN VIN 1 VREF VOUT Cin VOUT 5 GND 2 OCP Co TSD STBY STBY 3 STBY Discharge Cin0.47F (Ceramic) Co 0.47F (Ceramic) Fig. 2 Block Diagrams Reference data BU18TD3WG (Ta=25C unless otherwise specified.) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series 1.85 Temp=25C 100 Temp=25C 1.84 1.6 Output Voltage (V) 1.4 1.2 1.0 Io=0uA Io=100uA Io=50mA Io=200mA 0.8 0.6 0.4 VIN=STBY 0.2 VIN=STBY 1.82 1.81 1.80 1.79 Io=0uA Io=100uA Io=50mA Io=200mA 1.78 1.77 1.76 0.0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.7 Temp=-40C 1.8 1.9 2 2.1 2.2 2.3 2.4 0 2.5 0.5 1 1.5 Gnd Current (uA) Temp=85C 0.8 0.6 3 3.5 4 4.5 5 5.5 1.85 VIN=2.8V STBY=1.5V 80 VIN=2.8V STBY=1.5V 1.84 Temp=85C 60 40 Temp=-40C Temp=25C 20 Temp=-40C 2.5 Fig 5. Circuit Current IGND 100 1.4 1.2 2 Input Voltage (V) Fig 4. Line Regulation 1.6 Temp=25C Temp=25C 40 Input Voltage (V) Fig 3. Output Voltage 0.4 Temp=85C 60 0 Input Voltage (V) 1.0 VIN=STBY 80 20 1.75 0 STBY Pin Current (uA) Io=0uA 1.83 Output Voltage (V) Output Voltage (V) 1.8 Gnd Current (uA) 2.0 0.2 1.83 Temp=25C 1.82 Temp=85C 1.81 1.80 1.79 1.78 1.77 Temp=-40C 1.76 0 0.0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 1.75 0 5.5 0.05 0.1 0.15 0.2 0 0.05 Fig 6. VSTBY - ISTBY 0.1 0.15 0.2 Output Current (A) Output Current (A) Input Voltage (V) Fig 8. Load Regulation Fig 7. IOUT - IGND 1.85 2.0 2.0 VIN=2.8V STBY=1.5V Io=0.1mA 1.84 1.6 Output Voltage (V) Output Voltage (V) VIN=2.8V VIN=5.5V 1.4 VIN=2.3V 1.2 1.0 0.8 0.6 0.4 Temp=25C 0.2 STBY=1.5V 1.5 1.0 Temp=25C Temp=-40C Temp=85C 0.5 0.0 0.1 0.2 0.3 0.4 0.5 1.83 1.82 1.81 1.80 1.79 1.78 1.77 1.76 0.0 0.0 1.75 0 0.6 0.5 1 1.5 Fig 9. OCP Threshold -15 10 35 60 85 Fig 11. VOUT - Temp Fig 10. STBY Threshold 60 -40 Temp (C) STBY Voltage (V) Output Current (mA) 1.0 VIN=2.8V STBY=1.5V Io=0mA 0.9 Gnd Current (uA) 50 Gnd Current (uA) Output Voltage (V) VIN=3.8V Io=0mA 1.8 40 30 20 VIN=2.8V STBY=0V 0.8 0.7 0.6 0.5 0.4 0.3 0.2 10 0.1 0 0.0 -40 -15 10 35 60 85 -40 -15 Temp (C) Fig 12. IGND - Temp 10 60 85 Fig 13. IGND - Temp (STBY) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 35 Temp (C) 5/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series Reference data BU18TD3WG (Ta=25C unless otherwise specified.) 0 100 50 IOUT=50mA0mA 0 Output Current (mA) 50 IOUT=0mA50mA Output Current (mA) 100 1.90 Output Voltage (V) Output Voltage (V) 1.85 1.80 1.75 1.85 1.80 1.75 1.70 Fig 14. Load Response 50 0 100 50 IOUT=100mA0mA 1.90 Output Voltage (V) Output Voltage (V) 1.85 1.80 1.75 1.70 1.85 1.80 1.75 Fig 16. Load Response Fig 17. Load Response 0 200 100 IOUT=200mA0mA 2.00 Output Voltage (V) Output Voltage (V) 1.90 1.80 1.70 1.60 1.90 1.80 1.70 Fig 18. Load Response Fig 19. Load Response 0 100 IOUT=100mA50mA 50 0 Output Current (mA) 50 Output Current (mA) 100 IOUT=50mA100mA 1.85 Output Voltage (V) 1.90 Output Voltage (V) 0 Output Current (mA) 100 Output Current (mA) 200 IOUT=0mA200mA 1.80 1.70 1.60 1.80 1.75 1.70 Fig 21. Load Response Fig 20. Load Response www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0 Output Current (mA) 100 Output Current (mA) IOUT=0mA100mA Fig 15. Load Response 6/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series Reference data BU18TD3WG (Ta=25C unless otherwise specified.) 2.0 1.0 0.0 1.0 0.0 Fig 23. Start Up Time Iout=0mA Iout=200mA VIN=STBY=2.80V 2.0 1.0 0.0 2.0 1.0 0.0 Fig 25. Start Up Time (VIN=STBY) Iout=200mA Fig 24. Start Up Time (VIN=STBY) Iout=0mA Iout=0mA 3.8 2.8 1.81 2.0 Output Voltage (V) Output Voltage (V) 0.0 4.8 VIN=2.8V3.8V2.8V Input Voltage (V) 1.0 STBY Voltage (V) 2.0 STBY=1.50V 2.0 0.0 Output Voltage (V) 0.0 4.0 STBY Voltage (V) 2.0 STBY Voltage (V) VIN=STBY=02.8V Output Voltage (V) 2.0 Fig 22. Start Up Time 4.0 1.0 0.0 1.80 1.79 1.78 Fig 27. VIN Response Fig 26. Discharge Time www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1.0 0.0 Output Voltage (V) Output Voltage (V) 0.0 2.0 STBY=01.5V STBY Voltage (V) 1.0 STBY Voltage (V) 2.0 STBY=01.5V 7/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series z About power dissipation (Pd) As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT)xIOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current) { Measurement conditions Standard ROHM Board Layout of Board for Measurement Top Layer (Top View) IC Implementation Position Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (Double-side board) Board Size 70 mm x 70 mm x 1.6 mm Top layer Wiring Bottom Rate layer Through Hole Metal (GND) wiring rate: Approx. 0% Metal (GND) wiring rate: Approx. 50% Diameter 0.5mm x 6 holes Power Dissipation 0.54W Thermal Resistance ja=185.2C/W 0.6 0.5 0.54W Standard ROHM Board Pd [W] 0.4 0.3 * Please design the margin so that PMAX becomes is than Pd (PMAX<Pd) within the usage temperature range 0.2 0.1 0 0 25 50 75 85 100 125 Ta [] Fig. 28 SSOP5 Power dissipation heat reduction characteristics (Reference) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series Operation Notes 1.) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2.) GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than GND to any pin, even if only transiently. 3.) Thermal design Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating conditions. 4.) Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may result in damage to the IC. 5.) Operation in strong electromagnetic fields Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 6.) Common impedance Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a minimum. 7.) Voltage of STBY pin To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Setting Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. occur on the output. If the IC is switched on again while this voltage is present, overshoot may Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 8.) Over-current protection circuit (OCP) This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 9.) Thermal shutdown circuit (TSD) This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds about 150. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 10.) Input/output capacitor Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with long or winding power supply traces. The output capacitance value is directly related to the Unstablevalue region overall stability and transient response of the regulator, and should be set to the largest possible for the application to increase these characteristics. During design, keep in mind that in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your application.(Please refer the technical note, regarding ceramic capacitor of recommendation) Cout=0.47F, Cin=0.47F, Temp=+25 11.) About the equivalent series resistance (ESR) of a ceramic capacitor 100 Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. 10 capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application. ESR[] [] ESR Since ceramic capacitors, tantalum capacitors, electrolytic 1 0.1 0.01 0 50 100 150 200 IOUT [mA] Fig. 29 www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/10 Stable region (example) TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet BUxxTD3WG series Revision History Date Revision 7.Feb.2013 001 30.Jul.2013 002 21.AUG.2013 003 Changes New Release Adding a Revision History. VSBYH is changed. ELECTRICAL CHARACTERISTICS of each Output Voltage is removed. Adding dropout voltage. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/10 TSZ02201-0RBR0A300030-1-2 21.AUG.2013.Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bu32td3wg - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bu32td3wg SSOP5 3000 3000 Taping inquiry Yes