MIL SPECS UGE D MM 0000125 0033775 T MBNILS The documentation and process conversion measures necessary to comply with this INCH-POUND revision shall be completed by 21 Mar 94. Le ee ene SUPERSEDING MIL-S-19500/533C 16 December 1991 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, ZENER, VOLTAGE REGULATOR, SOLID GLASS NONCAVITY CONSTRUCTION, TYPES 1N6309 THROUGH 1N6355; 1N6309US THROUGH 1N6336US; PLUS C AND D TOLERANCE SUFFIX; JAN, JANTX, JANTXV, AND JANS This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 4. SCOPE 1.1 Scope. This specification covers the detail requirements for microminiature 500 mW, silicon, metallurgically bonded, voltage regulator diodes with tolerances of 5 percent, 2 percent, and 1 percent. Four levels of product assurance are provided for each device as specified in MIL-S-19500. 1.2 Physical dimensions. See figure 1 (00-35) and figure 2 (surface mount). 1.3 Maximum ratings. Maximum ratings are as shown in columns 6, 7, and 9 of table IV herein, and as follows: Pr = 500 mW, surface mount device with T., = +125C. P. = 500 mW at T= +75C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink at L = .375 inch (9.53 mm). (Derate I, to 0.0 mA de at +175C.) -65C = Top +175C; -65C = Tot = + 75C. 1.4 Primary electrical characteristics at T, = +25C. Primary electrical characteristics are shown in columns 2, 3, and 11 of table IV herein, and as follows: 2.4 V de SV, = 200 V de (nominal). 1N6309D through 1N63550 are 1 percent voitage tolerance. IN6309C through 1N6355C are 2 percent voltage tolerance. 1N6309 through 1N6355 are 5 percent voltage tolerance. Roy = 250C/W (maximum) at L = .375 inch (9.53 mm) nonsurface mount. R = 50C/W (maximum) at L = 0 inch nonsurface mount. Rouec Cend cap) = 50C/W (maximum) surface mount. MIL~$-19500/5330 20 September 1993 | Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be | of use in improving this document should be addressed to: Commander, Defense Electronics Supply | Center, ATTN: DESC-ECT, 1507 Wilmington Pike, Dayton, OH 45444-5270 by using the Standardization | Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by (etter. AMSC N/A FSc 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.MIL SPECS MIL-S-19500/533D PT => wie TT WUE D MM 0000125 0033776 1 MMMILS +e ly Dimensions Symbol Inches Millimeters Notes Min Max Min Max B .018 .022 46 56 go 060 .090 1.52 2.29 G 120 -200 3.05 5.08 L 7.000 | 1.500 | 25.40 | 38.10 | Ly | .050 | 1.27 | 3 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. tead diameter not controlled in this zone to allow for flash, irregularities other than slugs. FIGURE 1. Physical dimensions, (00-35) nonsurface mount devices. lead finish build-up, and minor ~MIL SPECS YUE D MM 0000125 0033777 3 @EMILS MIL-S-19500/533D rf mW | \ tk | | : L_ L NS 7 ee Le b-5D Symbol Inches Millimeters Min Max Min Max G 165 -195 4.19 4.95 F .019 028 0.48 0.71 s 003 0.08 Do .070 -096 1.78 2.16 NOTES: 4. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 2. Physical dimensions, surface mount devices.Tm MIL SPECS W4YE D MM OO0012S 0033778 5 MBMILS MIL-S-19500/533D 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those Listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARDS MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 40, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated detail specification. The individual item requirements shall be in accordance with MIL-S-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500 and as follows: EC- ----------- End cap Tee rrr Temperature, end cap. US- -------+---- Surface mount, square end cap. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500 and on figures 1 and 2 herein. 3.3.1 Lead finish. Lead finish shall be solderable in accordance with MIL-S-19500 and MIL-STO-750. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). 3.3.2 Diode construction. All devices shall be metatlurgically bonded, thermally matched, noncavity, double plug construction in accordance with MIL-S-19500, sppendix A, and 3.3.3.1 and 3.3.3.2 herein. 3.3.2.1 Metallurgical bond for diodes with V, 26.8 v dc. Category I bonds as defined in accordance with MIL-S-19500 shall be utilized. . 3.3.2.2 Metallurgical bond for diodes with V, = 6.8 dc. Category I, category Il, or category III bonds as defined in accordance with MIL-S-19500 may be utilized. 3.4 Marking. Marking shall be in accordance with MIL-$-19500.MIL SPECS 3.4.1 the cathode marking. the initial container. 3.4.2 Polarity. 3.5 Selection of tight tolerance devices. JANTXV, or JANS devices, body or equivalent. Marking of US version. W4YE D MM 0000125 0033779 7 MEMILS MIL-S-19500/5330 The polarity shall be indicated with a contrastin Alternately for surface mount (US) devices, the periphery of the cathode end may be used. 4. QUALITY ASSURANCE PROVISIONS 4.1 specified herein. 4.2 Qualification inspection. 4.2.1 Group E inspection. table II herein. 4.3 Screening (JANS, JANTX, AND JANTXV Levels only). MIL-S-19500, and as specified herein. Sampling and_ inspection. Qualification inspection shail be in accordance with MIL-$-19500. Group E inspection shall be conducted in accordance with MIL-S-19500 and herein. Oevices that exceed the Limits of table I herein shall not be acceptable. Screen (see Measurement table II of MIL-S-19500) JANS level JANTX and JANTXV Levels 3a Temperature cycling [Temperature cycling 3c_1/__|Thermal_impedance (see 4.5.7) [Thermal impedance (see 4.5.7) | | 9 Inq, Vzo, and ql, |Not applicable | | 1 Ipy and V5; Alp, = 100 percent of = | Ip, and V Reiat vitue of sa nA dc, whichever | R 2 Jis greater. AV 2 = 1 percent of | initial value; i * 35 percent of initial value or bo, whichever is greater. 12 See 4.2.1 See 4.2.1, t = 96 hours 13(a) 2/ |Subgroups 2 and 3 of table I herein; |Subgroup 2 of table I herein; | Al, = 100 percent of initial value [AI = 100 percent of initial value | or do nA de, whichever is greater; Jor do nA dc, whichever is greater; &Vo9 = 1 percent of initial value. &V79 = 21 percent of initial value. 1/ Thermal impedance may be performed anytime after sealing provided temperature cycling is performed in accordance with MIL-S-19500, screen 3 prior to this test. 2/ Zoyx Need not to be performed at screen 13, if performed prior to screen 13. For US version only; all marking may be omitted from the device except for ALL marking which is omitted from the body of the device shalt appear on the Label of g color band to denote the cathode end. a minimum of three evenly spaced contrasting color dots around No color coding will be permitted. The and 0 suffix devices shall be selected from JAN, JANTX, which have successfully completed all applicable screening, testing as 5 percent tolerance devices. subgroup 2, at tightened tolerances. for reference purpose to establish correlation. and groups A, 8, and C ALL sublots of C and D suffix devices shail pass group A, Tighter tolerances for mounting clip temperature shall be maintained For C and D tolerance levels, tT, = 30 t 2C at 0.375" from Sampling and inspection shall be in accordance with MIL-S-19500, and as Lot accumulation period shall be 6 months in Lieu of 6 weeks. Screening shall be in accordance with table II of The following measurements shall be made in accordance with table I | | | | | | |MIL SPECS MIL-S-19500/533D 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: I column 7 of table IV; mounting conditions in accordance with method 1026 of MIL-STD-750; T room ambient as defined in 4.5 of MIL-STD-750; A . Tec = +#100C to +125C for surface mount devices. z wou 4.3.2 Scope display evaluation. The reverse breakdown region of the voltage-current characteristic shall be viewed over the applicable voltage-current range (see table IV, columns 2 and 3) on an oscilloscope with a presentation magnitude of at least 5 cm in both the horizontal and vertical direction. Reverse peak power over the knee shall be at least 10 mW pk. Any discontinuity or dynamic instability of the trace shall be cause for rejection of the device, as described in MIL-STD-750, method 4023. 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table I herein. End-point electrical measurements shall be in accordance with the applicable steps of table III herein. The following test conditions shall be used for Teasxe group A inspection: Zedx = 15C/W. 2 A minimum. 10 ms. ct a 1 mA to 10 mA. uw =z u twp = 100 Ws maximum. 4.4.2 Group 8 inspection. Group B inspection shall be conducted jin accordance with the conditions specified for subgroup testing in table IVa (JANS) and table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table III herein. 4.4.2.1 Group B inspection, table IVa (JANS) of MIL-S-19500. Subgrou Method Condition 3 4066 T, = 425C 5C (see 4.5.1); Tsu = column 9 of table Iv (shall be performed on each sublot). 4 1037 I, = column 7 of table IV at T, = room ambient as defined in 4.5 of MIL-STD-750; t.. = tore = 3 minutes minimum for 2,000 cycles. Mounting conditions in accordance with 4.2.1. No forced air cooling on the device shall be permitted. 5 1027 T, = +#125C +#25C for 96 hours; I,(min) = column 7 of table IV with I, adjusted as required by the chosen T, to give an average lot Ty = 4275C. Marking legibility requirements shall not apply. Mounting conditions in accordance with 4.2.1. 6 3101 4, +25C = T= +35C; see figure 4. 4081 4.4.2.2 Group B inspection, table IVb (JAN, JANTX, and JANTXV of MIL-S-19500). Subgrou Method Condition 2 4066 Th, = +25C 25C (see 4.5.1); los = column 3 of table IV (shall be performed on each sublot). 4 1027 1,(min) = 50 percent of column 7 of table IV (mounting conditions in accordance with 4.2.1); T, = room ambient as defined in 4.5 of MIL-STD-750.MIL SPECS W4YE D MM 0000325 0033741 S MEMILS MIL-S~19500/533D 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table III herein. 4.4.3.1 Group C inspection, table Vv of MIL-S-19500. Subgrou Method Condition 2 2036 Test condition A, 4 pounds, t= 15s +35 not applicable to Test condition E, 8 ounces, t = 15 +35 surface mount devices. 6 1026 I,Gmin) = 50 percent of column 7 of table IV (mounting conditions in accordance with 4.2.1); T, = room ambient as defined in 4.5 of MIL-STD-750. 7 4071 (For JAN, JANTX, and JANTXV only); L = column 4 of table Iv; Ty = +25C 5C; Ty = +425C (see 4.5.4); LTPD = 10. 8 1056 20 cycles of thermal shock from Liquid N. (-195C) to +150C fluoro bath. The diode under test (DUT) shall be stabilized at the temperature extremes for 20 seconds (minimum); transfer time, = 5 s continuously monitor during the last five cycles V_ at 500 mA pk (with an open-circuit voltage clamped at 3 V maximum) on Tektronix 576 scope or equivalent throughout temperature excursions and at temperature extremes for any discontinuity instability hysteresis or other anomaly shall cause for rejection of the device. 20 cycles for group C. LTPD = 10. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.5.1 Surge current (I,.4). The peak currents specified in column 9 of table IV shall be applied in the reverse direction and these shall be superimposed on the current I59 (table IV, column 4); a total of five surges at one-minute intervals. Each individual surge shall be .5-square-wave-pulse of .08-second duration or an equivalent sine wave with the same effective rms current. 4.5.2 Requlator voltage measurements. The test current shall be applied until thermal equilibrium is attained (90 seconds minimum) prior to reading the breakdown voltage. For this test, the diode shall be suspended by its leads with mounting clips whose inside edge is located at .375 inch (9.53 mm) from the body and the mounting clips shall be maintained at a temperature of +25C +8C, -2C. US suffix devices shall be mounted at the end caps. This measurement may be performed after a shorter time following application of the test current than that which provides thermal equilibrium if correlation to stabilized readings can be established to the satisfaction of the Government. 4.5.3 Voltage requlation. for values of V0 (nominal) from 6.8 V de to 200 Vv dc, current at 10 percent of Izy (column 7) shall be maintained for a period of 90 5 seconds, and then V, shall be recorded. The current shall then be increased to 50 percent of Tay (column 7) and maintained For @ period of 90 +5 seconds, and then V, shall be recorded. The voitage change shall not exceed the applicable Limits as shown in table IV, column 8. During this test, the diode shall be suspended by its leads with mounting clips whose inside edge is located between .375 inch (9.53 mm) and .500 inch (12.70 ma) from the device body and the mounting clips shall be maintained at a temperature of +25C +8C, -2c. US suffix devices shall be mounted by the end caps. For values of V 9 (nominal) from 2.4 V de to 6.2 Vv de, the lower test current shall be 2 mA de and the higher current shalt be 20 mA dc. 4.5.4 Temperature coefficient of regulator voltage (Q5). The device shall be temperature stabilized with current applied prior to reading regulator voltage at the specified ambient temperature.MIL SPECS 44GE D MM 0000125 0033742 ? MEMILS MIL-S-19500/533D | Subgroup 5 and 6 | |Not applicable TABLE I. Group A inspection. | . ee {| f Inspection 1/ MIL-STD-750 Symbol Limits | Unit | | | | | Method Conditions Min | Max | | | | | | | Subgroup 1 | | | | |Visual and mechanical | 2071 | | | examination | | | | | Subgroup 2 | | | Thermal impedance | 3101 | (See 4.4.1) |Peux | | 15 "e/a | Forward voltage | 4011 Ip = 1 Adc, pulsed (see 4.5.6) Ve | | 1.4 i de | Reverse current 4016 [DC method, Vp = column 10 of Inq [column 11 [LA de table IV | Regulator voltage 4022 [1,4 = 250 pA dc (see 4.5.2) Va4 column 3 V de | Regulator voltage 4022 |I,5 = column 4 of table IV (see V column 2 column 2 |V de &9 22 22 4.5.2) -5, -2, -1 |+5, +2, +1 percent percent Subgroup 3 High temperature T, = +150C operation: Reverse current 4016 [OC method, Vp = column 10 of I column 12 (LA de table IV R Re Subgroup 4 {Small-signal reverse | 4051 |1, = column 4 of table Iv, |Z, | {column |Q | breakdown impedance | [sig = 10 percent of I55 | | | | [Knee impedance | 4051 2K = 250 WA dc, Ieig = 25 WA rms |?2K | jcotunn 6 reise density | [1,4 = 250 pA de (see 4.5.5) {No | |euunn 16 |LVAViz | | | Capacitance | Vp = OV de, 100 kHz = f = 1 MHz | | | | | | | | | | | i column 16 |pf | | | | | | | See footnotes at end of table.MIL SPECS coefficient of regulator voltage {1Z = column 4 of table Iv, |T, = +25 c 5C; Tz = +125C YUE D MM O0001c5 0033783 9 MBMILS MIL-S-19500/5330 TABLE I. Group A_inspection - Continued. | 2/ | Inspection 1/ MIL-STD-750 Symbol Limits Unit | | | Method Conditions Min |. Max | | | Subgroup 7 116 devices, = 0 | | | |Scope display See 4.2.2 | | evaluation | | | | Subgroup 8 LTPD = 10 | [outage regulation | | (See 4.5.3) V7 (reg) |cotums 8 [V de | Temperature 4071 | JANS Level, ay? |column 15 [%/C | | | | | [(see 4.5 4) 1/ For sampling plan, see MIL-S-19500. 2/ Column references are to table Iv. TABLE II. Group E inspection (all quality levels) for qualification only. MIL-STD-750 Inspection Sampling Small lot quality plan 1/ conformance Method Conditions inspection n/c Subgroup 1 5 12/0 Temperature cycling 1051 500 cycles, condition C Electrical measurement See table III, steps 2 and 3 Subgroup 2 Not applicable Subgroup 3 Not applicable Subgroup 4 5 12/0 Thermal resistance 3101 or} (See 4.5.8) 4081 1/ For sampling plans not specified, see MIL-S-19500.MIL SPECS WUE D MB 0000125 0033784 0 MENILS MIL-S-19500/5330 TABLE III. Groups 8, C, and E electrical measurements. 1/ 2/ 3/ MIL-STD-750 Limits 4/ Step Inspection Symbol Unit Method Conditions Min Max 1 Reverse current 4016 |0C method, Ve = column 10 Th4 column pA de of table IV 11 2 |Reverse current 4016 |0C method, Vp, = column 10 Ip3 column HA de of table IV 13 3 | Forward voltage 4011 |I, = 1A de Ve 1.4 V de 4 {Regulator voltage 4022 |1, = column 4 of table IV Vza column column V de (bee 4.5.2) 2 -5 percent |+5 percent 5 |Knee impedance 4057 |I, = 250 WA dc, Lax column Q I... = 25 HA rms 6 sig 6 |Small-signal 4051 I, = column 4 of table Iv, zy column Q breakdown impedance Ieig = 10 percent of I, 5 7 |Regulator voltage 4022 {1, = column 4 of table IV Ava 1 percent of (bee 4.5.2) initial value. 8 |Reverse current 4016 [DC method, V, = column 10 Alp, 100 percent of of table IV initial value or 50 nA de, which- ever is greater. 9 |Smalt-signal 4051 |1, = column 4 of Az, +35 percent of breakdown impedance table Iv, I iq? 10 initial value or percent of ns 2 2, whichever is greater. 1/ The electrical measurements for table IVa (JANS) of MIL-S-19500 are as follows: a. Subgroup 3, see table III herein, steps 1, 3, 4, and 5. b. Subgroup 4, see table III herein, steps 1, 3, 4, 5, 6, 7, 8, and 9. c. Subgroup 5, see table 111 herein, steps 2, 3, 4, 5, 6, 7, 8, and 9. 2/ The electrical measurements for table IVb (JANTX and JANTXV) of MIL-S-19500 are as follows: a. Subgroup 2, see table 111 herein, steps 1, 3, and 4. b. Subgroup 3, see table III herein, steps 2, 3, 4, and 7. c. Subgroup 6, see table III herein, steps 2, 3, and 4. 3/ The electrical measurements for table V of MIL-S-19500 are as follows: a. Subgroups 2 and 3, see table III herein, steps 1, 3, 4, and 5 for JANS and steps 1, 3, and 4 for JAN, JANTX, and JANTXV. b. Subgroup 6, see table II1 herein, steps 1, 3, 4, and 5 for JANS and steps 2, 3, and 4 for JAN, JANTX, and JANTXV. 4/ Column references are to table Iv. 10WHE D MM O0001e5 0033745 2 MBNILS MIL SPECS MIL-S-19500/533D TABLE IV. Characteristics and ratings. | | | | | | | i JCol 1 {Col 2{col 3}col 4|Col 5]/col 6{Col 7} cot 8 [Col 9] Col 10{col V1}Col 12 [Col 13}cok 14} Col 15/col 16 | | | | | | | | | | | | | | | | Y22 | V4 | 172 | zy | 20K | Loy |"2reg)|Tzsm | Vp | Tpq | Ipo | Ip3 | Np | yz | c |Type | nom | min |test | at | at | | | surge| | at fat T, | life | at | lat Ov | | at | at [cur- | | | | | | | | | | | Ino | Ip, [rent | 1,5 oN +25C |=+150 250 UA vw | 250 1-3 A kHz v v ma | Q Q mA v A v LA LA HA |pvAdH2| 47C | pF APH ars 1N6309| 2.4 | 1.1 20 30 [1,200] 177 1.50 | 2.50{ 1.0 100 200 150 1.0 | -.085{ 2,000 1N6310| 2.7 | 1.2 20 30 |1,300| 157 1.50 | 2.20| 1.0 60 150 100 1.0 | -.080} 1,900 > 1N6317| 3.0 | 1.3 20 29 |1,400| 141 1.50 | 2.00] 1.0 30 100 60 1.0 | -.075] 1,800 1N6312/ 3.3 | 1.5 20 24 11,400] 128 1.60 | 1.80/ 1.0 5 20 10 1.0 | -.070| 1,650 1N6313] 3.6 | 1.8 20 22 |1,400| 117 1.60 | 1.65] 4.0 3 12 6 1.0 | -.065] 1,600 1N6314/ 3.9 | 2.0 20 20 |1,700| 108 1.60 | 1.50} 1.0 2 12 4 1.0 | -.060! 1,400 IN63151 4.3 | 2.4 20 18 (1,700; 99 0.90 | 1.40] 1.0 2 12 4 1.0 | ~.045/ 1,350 +.020 1N6316] 4.7 | 2.8 20 16 {1,500} 90 0.50 | 1.27) 1.5 5 12 10 1.0 | -.028] 1,300 | +.032 | 1N6317| 5.1 | 3.3 20 14 |1,300] 83 0.40 | 1.17] 2.0 5 12 10 1.0 | -.020| 1,200 +.035 1N6318} 5.6 [| 4.3 20 8 |1,200| 76 0.40 | 1.10] 2.5 5 10 10 2.0 | +.050/ 1,150 1N6319/ 6.2 | 5.2 20 3 800, 68 0.30 | 0.97] 3.5 5 10 10 5.0 | +.060} 1,050 4N6320{ 6.8 | 6.0 20 3 400{ 63 0.35 1.23| 4.0 2 50 4 5.0 | +.062] 1,000 1N6321| 7.5 | 6.6 20 4 400| 57 0.40 | 1.16] 5.0 2 30 4 5.0 | +.068 900 1N6322| 8.2 | 7.5 20 5 400; 52 0.40 | 1.07; 6.0 1 10 2 | 20.0 | +.075 800 | | See footnotes at end of table. 11MIL SPECS W4UE D MM 0000125 0033746 4 MMBNILS MIL-S-19500/533D TABLE IV. Characteristics and ratings - Continued. { | | | jcol 1 {Col 2[Col 3/Col 4/col 5|/cot 6[Col 7| Col 8 [Col 9| Col 1O|Cok 11|[Col 12 [Col 13|Cot 14|Col 15[Col 16] | L | | | | | | | | Vz2 | Yr1 | lz2 | ly | 22K | tom |Y2reg)| Tse | VR | Ip | Ip2 | Tez | Ny | Oy | c | |Type | nom | min |test | at | at | |surge| | at jat T, | life at | jat OV | | at | at feur- | | | | | | | Ino | Igy [rent | Iz | 250 +25C |=+150 250 pA| A | 1 | 250 1- LA kHz v v m | Q Qa mA v A v yA A pA |pvAiz| %/C | pF 1N6323| 9.1 | 8.4 [20.0 6 500{ 47 0.50 | 0.97] 7.0 1.00 10 2.000 40 | +.076| 700 1N6324/10.0 | 9.1 {20.0 6 500| 43 0.50 {| 0.89{ 8.0 1.00 10 2.000 80 | +.079| 600 1N6325/11.0 [10.0 [20.0 7 550| 39 0.50 | 0.83] 8.5 1.00 10 2.000| 100 | +.082{ 500 1N6326(12.0 [11.0 {20.0 7 550| 35 0.55 | 0.77} 9.0 1.00 10 2.000| 100 | +.083] 450 1N6327{13.0 [11.9 | 9.5 8 550| 33 0.55 | 0.71| 9.9 0.05 10 0.100| 100 | +.079] 400 1N6328/15.0 [13.8 | 8.5 10 | 600] 28 | 0.70 | 0.62/11.0 | 0.05 10 | 0.100] 100 | +.082| 350 1N6329/16.0 |14.7 | 7.8 12 600| 27 0.75 | 0.58(12.0 0.05 10 0.100} 100 | +.083] 325 1N6330|18.0 [16.6 | 7.0 14 600| 24 0.85 | 0.52(14.0 0.05 10 0.100; 100 | +.085| 300 1N6331(20.0 [18.5 | 6.2 18 500; 21 0.95 | 0.47/15.0 0.05 10 0.100} 100 | +.086| 275 1N6332]22.0 [20.4 | 5.6 20 500| 19 1.05 | 0.43|17.0 0.05 10 0.100| 100 | +.087| 260 1N6333(24.0 [22.3 | 5.2 24 500; 18 1.15 | 0.39|18.0 0.05 10 0.100} 100 | +.088| 240 1N6334(27.0 [25.2 | 4.6 27 500| 16 4.30 | 0.35/21.0 0.05 10 0.100} 100 | +.090| 220 1N6335|30.0 [28.0 | 4.2 {| 32 { 500) 14 4.45 | 0.31/23.0 | 0.05 10 | 0.100] 100 | +.091| 200 1N6336|33.0 {30.9 | 3.8 40 600| 13 1.60 | 0.28/25.0 0.05 10 0.100} 100 | +.092| 185 See footnotes at end of table. 12- MIL SPECS 44E D MM 0000125 003378? & MEMILS MIL-S-19500/533D TABLE IV. Characteristics and ratings - Continued. | | | | | | | \ | | | | Col 1 [Col 2{Col 3]Col 4{Col S/Col 6/Col 7| Col 8 |Col F[Col 10{Col 11} Col 12 [Col 13] Col 14/Col 15|cal 16 | | | | | | | | | | | | | L | | | | | | | | | | | | Vza | Va | 112 | zy | 22K | lay |Y2reg>|Tzs | YR | Thy | Ip2 | Thy | No | yz | c |Type | nom | min |test | at | at | | | surge| | at lat T, | life at | lat OV | | at | at jeur- | | | | f. | | | | | | | I> | Izy [rent | ty5 | 250 |+25C |=+150C| |250 pA| | | | MA | | | | | wv | 250 1-3 | LUA kHz v v m | Q Q mA v A | VY A pA YA |uvAHz| %/C | pe 1N6337| 36.0{ 33.7] 3.4 50 600|12.0 1.75 [0.260 27 {| 0.05 10 0.100] 100 | +.093! 175 1N6338| 39.0] 36.6; 3.2 55 700/11.0 1.90 [0.240 30 [| 0.05 10 0.100; 100 | +.094|] 170 1N6339{ 43.0{ 40.4] 3.0 65 800| 9.9 2.10 |0.220| 33 | 0.05 10 0.100 80 | +.095} 165 1N6340| 47.0{ 44.2| 2.7 75 900| 9.0 2.25 {0.200 36 | 0.05 10 0.100 80 | +.095| 155 1N6341{ 51.0{ 48.0] 2.5 85 |1,000| 8.3 2.50 |0.180 39 | 0.05 10 0.100 80 | +.096{ 145 1N6342{ 56.0] 52.7] 2.2 | 100 |1,200| 7.6 2.70 {0.170| 43 | 0.05 10 0.100 80 | +.097| 135 1N6343| 62.0] 58.4} 2.0 | 125 |1,300| 6.8 2.90 {0.150 47 | 0.05 10 0.100 80 | +.097| 130 1N6344| 68.0) 64.1] 1.8 | 155 {1,500| 6.3 3.20 [0.130 52 | 0.05 10 0.100 80 | +.098| 120 1N6345| 75.0| 70.8] 1.7 | 180 {1,600| 5.7 3.40 [0.125 56 | 0.05 10 0.100 80 | +.098| 110 1N6346{ 82.0{ 77.4{ 1.5 | 220 {1,800| 5.2 3.80 {0.115 62 | 0.05 10 0.100 80 | +.099| 105 1N6347| 91.0) 86.0) 1.4 | 270 [2,100| 4.7 4.20 10.100 69 | 0.05 10 0.100 80 | +.099{ 100 1N6348|100.0| 94.5] 1.3 | 340 j2,400| 4.3 4.40 |0.095| 76 | 0.05 10 0.100 80 | +.110 95 1N6349(110.0[104.0{ 1.1 | 500 |2,800| 3.9 4.80 |0.085 84 | 0.05 10 0.100 80 | +.110{ 90 1N6350|120.0/113.0] 1.0 | 600 [3,200] 3.5 5.20 |0.080 91 | 0.05 10 0.100 80 | +.110 70 See footnotes at end of table. 13WHE. > = 0000125 00337868 6 MMMILS MIL-S-19500/533D TABLE IV. Characteristics and ratings - Continued. | Col 1 [Col 2]/Col 3{Col 4/Col S|/cot 6{Col 7| Col 8 [Col 9{Col 10{Col 11/Col 12 [Col 13|Col 14/Col 15] colt 16| | | V2 | Yn | 7 | zz | 20K | Tom |Yzregy | tzsm | YR 1h | Ipp | Ip3 | Np | yz | C | Type | nom | min [test [| at | at | } | surge| | at lat T, | life | at | jat Ov] | at | at [eur- | | | | | | | | | | | Ina | Izy [rent Ty9 250 #25C [=150C| 250 WA LA 1/ | 250 1-3 MA kHz v v m | Q 2 mA v A v LA LA pA |uvAHz| %/C | pF 1N6351|130.0| 122 | 0.95] 850 [4,100| 3.3 5.60 [0.070] 99 0.05 10 0.100 80 | +.110 70 1N6352(150.0| 147 | 0.85]1,000/4,500| 2.8 7.00 {0.065| 114 0.05 10 0.100 80 | +.110 65 1N6353{160.0{ 151 | 0.80/1,200/5,000| 2.7 7.50 |0.060| 122 0.05 10 0.100 80 | +.110 65 1N6354/(180.0{ 170 | 0.68/1,500/5,600| 2.4 9.00 [0.050| 137 0.05 10 0.100 80 | +.110 60 1N6355|200.0| 189 | 0.65/1,800|6,500] 2.1 | 12.00 |0.045{ 152 0.05 10 0.100 80 | +.110 55 L 1/ 1N63090 through 1N6355D are 1 percent voltage tolerance. 1N6309C through 1N6355C are 2 percent voltage tolerance. 1N6309 through 1N6355 are 5 percent voltage tolerance. 14MIL SPECS 44UE D MM 0000125 0033749 T MMILS MIL-S-19500/533D LOAD AMPLIFIER RESISTOR BANDPASS FILTER DC POWER SUPPLY fo = 2 kHz 3 db BW = 2 kHz -o- TRUE RMS VOLTMETER NOTES: 1. Input voltage and load resistance should be high so that the DUT can be driven from a constant current source. 2. Input impedance of band pass filter should be high compared with the dynamic impedance of the DUT. 3. Filter bandwidth characteristics shalt be as follows: fy = 2,000 Hz Shape factor, -40 dB to -3 dB, approximately 2. Passband at the -3 dB point is 1,000 Hz #50 Hz to 3,000 Hz 2150 Hz. Passband at the -40 dB point is 500 Hz #50 Hz to 6,000 Hz +600 Hz. FIGURE 3. Circuit for determination of noise density. 15ree; bo So ome MIL SPECS WHE D) MM OOO00%eS 0033790 & MMENILS MIL-S-19500/5330 4.5.5 Noise density. Noise voltage shall be measured using a noise density test circuit as shown on figure 3. Place a low-noise resistor, equivalent in value to the dynamic impedance of the DUT, in the test clips and adjust test current (I,,) to 250 LA dc and measure output-noise voltage. Remove the resistor, insert DUT in test clips, readjust test current to 250 A de and measure output-noise voltage again. To obtain noise density (N,), subtract rms resistor output-noise voltage from rms diode output-noise voltage and divide by product of overall system gain and square root of bandwidth. Ail measurements shall be made at T, = +25C. 4.5.6 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 4.5.7 Thermal impedance. Thermal impedance zZajx measurements shalt be performed in accordance with MIL-STD-750, method 3101. The maximum Limit for La yXx in screening (table II of MIL-S-19500) shall not exceed the group A, subgroup 2 limit). (For conditions, see 4.4.1.) 6.5.7.1 For initial qualification and requalification. Read and record data (Zey ) shall be supplied to the qualifying activity on one lot (random sample of 500 devices minimum) prior to shipment. Twenty-two samples shall be serialized and provided to the qualifying activity for test correlation. 4.5.8 Thermal resistance. Thermal resistance measurement shall be performed in accordance with MIL-STD-750, method 3101 or 4081. Read and record data in accordance with group E herein and shall be included in the qualification report. Forced moving air or draft shall not be permitted across the devices during test. The maximum Limit for R under these condition shall be Royetmax) = 250C/W, for surface mount RoJec = 50C/W. The following conditions shall apply: = 200 mA to 400 mA. H ty = 25 seconds minimum. Iy = 1 mA to 10 mA. tup 7 100 Us maximum. LS = Lead spacing = .375 inch (9.53 mm) as defined on figure 4. COPPER LEAD CLAMP COPPER LEAD CLAMP 375 (9.52) (9.52) INFINITE HEAT-OISSIPATOR NOTES: 1. The lead temperature, Th shall be measured on a lead at a point adjacent to the heat sink clamp (reference point). . The clamping force on each lead shall be 4 20.5 pounds. The DUT shall be shielded from drafts. The heat sink clamps shall be placed equal distances from each end of the diode body. For surface mount devices, the end caps shall be clamped to the heat sinks. me ut FIGURE 4. Mounting details for thermal resistance. 16> MIL SPECS 4GE D MM 0000125 0033791 & MEMILS MIL-S-19500/5330 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shali be in accordance with MIL-S-19500. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. ) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents must specify the fol lowing: a. Issue of DODISS to be cited in the solicitation. 1 b. Lead finish as specified (see 3.3.1). c. Type designation and quality assurance (evel. 6.3 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Preparing activity: Custodians: Army - ER Air Force - 17 Navy ~- EC Air Force - 17 Agent: OLA - ES Review activities: Navy - TD Air Force - 19, & DLA - ES (Project 5961-1527) 17