IntelliMAXt Ultra-Small, Slew-Rate-Controlled Load Switch FPF1203, FPF1203L, FPF1204 www.onsemi.com Description The FPF1203 / 03L / 04 are ultra-small integrated IntelliMAX load switches with integrated P-channel switch and analog control features. Integrated slew-rate control prevents inrush current and the resulting excessive voltage drop on the power rail. The input voltage range operates from 1.2 V to 5.5 V to provide power-disconnect capability for post-regulated power rails in portable and consumer products. The low shut-off current allows power designs to meet standby and off-power drain specifications. The FPF120x are controlled by a logic input (ON pin) compatible with standard CMOS GPIO circuitry found on Field Programmable Gate Array (FPGA) embedded processors. The FPF120x are available in 0.76 mm x 0.76 mm 4-bump WLCSP. WLCSP4 0.76x0.76x0.586 CASE 567SS MARKING DIAGRAM X&K X&2 &. &Z Features * 1.2 V to 5.5 V Input Voltage Operating Range * Typical RON: XX (QL, QP, QM, VS) &K &2 &. &Z 45 mW at VIN = 5.5 V 55 mW at VIN = 3.3 V 90 mW at VIN = 1.8 V 185 mW at VIN = 1.2 V Slew Rate Control with tR: 100 ms Output Discharge Function on FPF1204 Low <1.5 mA Quiescent Current ESD Protected: Above 7 kV HBM, 2 kV CDM GPIO / CMOS-Compatible Enable Circuitry 4-Bump, WLCSP 0.76 mm x 0.76 mm, 0.4 mm Pitch These are Pb-Free Devices * * * * * * * = Specific Device Code = 2-Digits Lot Run Traceability Code = 2-Digit Date Code = Pin One Dot = Assembly Pant Code ORDERING INFORMATION See detailed ordering and shipping information on page 8 of this data sheet. Applications * * * * * * Mobile Devices and Smart Phones Portable Media Devices Tablet PCs Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment (c) Semiconductor Components Industries, LLC, 2011 July, 2020 - Rev. 4 1 Publication Order Number: FPF1203/D FPF1203, FPF1203L, FPF1204 APPLICATION DIAGRAM VIN V IN V OUT V OUT FPF1203/03L/04 + - C IN ON C OUT GND Figure 1. Typical Application FUNCTIONAL BLOCK DIAGRAM FPF1203/03L/04 V IN V OUT CONTROL LOGIC ON Turn-On Slew Rate Controlled Driver R ESD Protection Output Discharge (Optional) GND Figure 2. Functional Block Diagram (Output Discharge for FPF1204) www.onsemi.com 2 FPF1203, FPF1203L, FPF1204 PIN CONFIGURATIONS Figure 3. WLCSP Bumps Facing Down (Top View) Figure 4. WLCSP Bumps Facing Up (Bottom View) VOUT A1 A2 VIN VIN A2 A1 VOUT GND B1 B2 ON ON B2 B1 GND Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View) PIN DEFINITONS Pin No. Name Description A1 VOUT A2 VIN B1 GND B2 ON ON/OFF Control, active HIGH; FPF1203/04 B2 ON ON/OFF Control, active LOW; FPF1203L Switch output Supply input: input to the power switch Ground ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit -0.3 6.0 V VIN VIN, VOUT, VON to GND ISW Maximum Continuous Switch Current at Ambient Operating Temperature - 2.2 A PD Power Dissipation at TA = 25C - 1.0 W TSTG Storage Temperature Range QJA Thermal Resistance, Junction-to-Ambient ESD Electrostatic Discharge Capability (Note 1, 2) -65 +150 C 1S2P with One Thermal Via (Note 1) - 110 C/W 1S2P without Thermal Via (Note 2) - 95 Human Body Model, JESD22-A114 7 - Charged Device Model, JESD22-C101 2 - kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured using 2S2P JEDEC std. PCB. 2. Measured using 2S2P JEDEC PCB COLD PLATE Method. www.onsemi.com 3 FPF1203, FPF1203L, FPF1204 RECOMMENDED OPERATING CONDITIONS Symbol Min Max Unit VIN Input Voltage Parameter 1.2 5.5 V TA Ambient Operating Temperature -40 +85 C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VIN = 1.2 V to 5.5 V and TA = -40 to +85C. Typical values are at VIN = 3.3 V and TA = 25C.) Parameter Symbol Condition Min Typ Max Unit 1.2 - 5.5 V mA BASIC OPERATION VIN Supply Voltage IQ(OFF) Off Supply Current ISD Shutdown Current IQ RON Quiescent Current FPF1203/04 VON = GND, VOUT = Open, VIN = 5.5 V - 0.1 1.0 FPF1203L VON = VIN, VOUT = Open, VIN = 5.5 V - 1.0 2.0 FPF1203/04 VON = GND, VOUT = GND - 0.1 1.0 FPF1203L VON = VIN, VOUT = GND - 1.2 3.0 FPF1203/04 IOUT = 0 mA, VON = VIN, = 5.5 V - 0.1 1.5 mA FPF1203L IOUT = 0 mA, VON = GND, VIN, = 5.5 V VIN = 5.5 V, IOUT = 200 mA, TA = 25C - 45 55 (Note 3) mW VIN = 3.3 V, IOUT = 200 mA, TA = 25C - 55 65 (Note 3) VIN = 1.8 V, IOUT = 200 mA, TA = 25C - 90 100 (Note 3) VIN = 1.2 V, IOUT = 200 mA, TA = 25C - 185 220 (Note 3) VIN = 1.8 V, IOUT = 200 mA, TA = 85C (Note 3) - - 105 - 65 75 W On Resistance mA RPD Output Discharge RPULL DOWN VIN = 3.3 V, VON = OFF, IFORCE = 20 mA, TA = 25C, FPF1204 VIH On Input Logic HIGH Voltage VIN = 1.2 V to 5.5 V 1.15 - - V VIL On Input Logic LOW Voltage VIN = 1.2 V to 5.5 V - - 0.65 V Pull-Down Resistance at ON Pin VIN = 1.2 V to 5.5 V - 8.3 - MW On Input Leakage VON = VIN or GND - - 1 mA VIN = 3.3 V, RL = 10 W, CL = 0.1 mF, TA = 25C, FPF1204 - 70 - ms - 100 - - 170 - - 0.5 - - 2.0 - - 2.5 - - 6 - - 115 - - 121 - - 4.0 - - 2.9 - - 7.3 - RON_PD ION DYNAMIC CHARACTERISTICS tDON Turn-On Delay (Note 4) tR VOUT Rise Time (Note 4) tON Turn-On Time (Note 6) tDOFF Turn-Off Delay (Note 4, 5) tF VOUT Fall Time (Note 4, 5) tOFF Turn-Off Time (Note 5, 7) tDOFF Turn-Off Delay (Note 4, 5) tF VOUT Fall Time (Note 4, 5) tOFF Turn-Off Time (Note 5, 7) tDOFF Turn-Off Delay (Note 4, 5) tF VOUT Fall Time (Note 4, 5) tOFF Turn-Off Time (Note 5, 7) VIN = 3.3 V, RL = 10 W, CL = 0.1 mF, TA = 25C, FPF1203L VIN = 3.3 V, RL = 500 W, CL = 0.1 mF, TA = 25C, FPF1203L VIN = 3.3 V, RL = 10 W, CL = 0.1 mF, TA = 25C, FPF1203 www.onsemi.com 4 ms ms ms FPF1203, FPF1203L, FPF1204 ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VIN = 1.2 V to 5.5 V and TA = -40 to +85C. Typical values are at VIN = 3.3 V and TA = 25C.) (continued) Symbol Parameter Condition Min Typ Max Unit - 6 - ms - 115 - - 121 - - 4.0 - - 2.5 - - 6.5 - - 6 - - 11 - - 17 - DYNAMIC CHARACTERISTICS tDOFF Turn-Off Delay (Note 4, 5) tF VOUT Fall Time (Note 4, 5) tOFF Turn-Off Time (Note 5, 7) tDOFF Turn-Off Delay (Note 4, 5) tF VOUT Fall Time (Note 4, 5) tOFF Turn-Off Time (Note 5, 7) tDOFF Turn-Off Delay (Note 4, 5) tF VOUT Fall Time (Note 4, 5) tOFF Turn-Off Time (Note 5, 7) VIN = 3.3 V, RL = 500 W, CL = 0.1 mF, TA = 25C, FPF1203 VIN = 3.3 V, RL = 10 W, CL = 0.1 mF, TA = 25C, FPF1204 (Note 5) VIN = 3.3 V, RL = 500 W, CL = 0.1 mF, TA = 25C, FPF1204 (Note 5) ms ms Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON / tDOFF / tR / tF are defined in Figure 23. 5. Output discharge enabled during off-state. 6. tON = tR + tDON 7. tOFF = tF + tDOFF TYPICAL PERFORMANCE CHARACTERISTICS Figure 7. Shutdown Current vs. Temperature Figure 8. Shutdown Current vs. Supply Voltage Figure 9. Off Supply Current vs. Temperature (VOUT Floating) Figure 10. Off Supply Current vs. Supply Voltage (VOUT Floating) www.onsemi.com 5 FPF1203, FPF1203L, FPF1204 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) Figure 11. Quiescent Current vs. Temperature Figure 12. Quiescent Current vs. Supply Voltage Figure 13. RON vs. Temperature Figure 14. RON vs. Supply Voltage ID, DRAIN CURRENT (A) 100 100 ms 10 1ms 1 10ms RDS(ON) Limit Single Pulse RJA = 110oC/W TA = 25oC 0.1 100ms 1s 10s DC 0.01 0.1 1 VDS, DRAIN-SOURCE VOLTAGE (V) 10 Figure 16. Drain Current vs. Drain-Source Voltage Safe Operating Area Figure 15. ON Pin Threshold vs. VIN www.onsemi.com 6 FPF1203, FPF1203L, FPF1204 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) Figure 17. Turn-On Response - FPF1203 / 04 (VIN = 3.3 V, CIN = 1 mF, COUT = 0.1 mF, RL = 10 W) Figure 18. Turn-Off Response - FPF1203 (VIN = 3.3 V, CIN = 1 mF, COUT = 0.1 mF, RL = 10 W) Figure 19. Turn-Off Response - FPF1203 (VIN = 3.3 V, CIN = 1 mF, COUT = 0.1 mF, RL = 500 W) Figure 20. Turn-Off Response (VIN = 3.3 V, CIN = 1 mF, COUT = 0.1 mF, RL = 10 W, FPF1204) Figure 21. Turn-Off Response (VIN = 3.3 V, CIN = 1 mF, COUT = 0.1 mF, RL = 500 W, FPF1204) www.onsemi.com 7 FPF1203, FPF1203L, FPF1204 OPERATION AND APPLICATION DESCRIPTION The FPF1203 / 03L / 04 are low-RON P-channel load switches with controlled turn-on. The core of each device is a 55 mW P-channel MOSFET and controller capable of functioning over a wide input operating range of 1.2 to 5.5 V. The FPF1204 contain a 65 W on-chip load resistor for quick output discharge when the switch is turned off. VIN + - V IN COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. 90% 10% V OUT 3.3 V 50% FPF1204 OFF CIN ON ON 10% tF VOUT VOUT 90% tR COUT GND 50% VON 90% 10% VOUT Figure 22. Typical Application t DON Input Capacitor To limit the voltage drop on the input supply caused by transient inrush current when the switch turns on into a discharged load capacitor or short-circuit, a capacitor must be placed between the VIN and GND pins. A 1 mF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher-value CIN can be used to reduce the voltage drop in higher-current applications. t DOFF Figure 23. Timing Diagram for FPF1203/4 Board Layout For best performance, traces should be as short as possible. To be most effective, input and output capacitors should be placed close to the device to minimize the effect of parasitic trace inductance on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON, and GND) minimizes the parasitic electrical effects and the case-ambient thermal impedance. However, the VOUT pin should not connect directly to the battery source due to the discharge mechanism of the load switch. Output Capacitor A 0.1 mF capacitor, COUT, should be placed between the VOUT and GND pins. This capacitor prevents parasitic board inductance from forcing VOUT below GND when the switch is on. CIN greater than COUT is highly recommended. ORDERING INFORMATION Part Number Top Mark Switch (Typical) at 3.3VIN Output Discharge ON Pin Activity tR Package Shipping FPF1203UCX QL 55 mW NA Active HIGH 100 ms 3000 / Tape & Reel FPF1203LUCX QP 55 mW NA Active LOW 100 ms FPF1204UCX QM 55 mW 65 W Active HIGH 100 ms 4-Bump, Wafer-Level Chip-Scale Package (WLCSP), 0.76 mm x 0.76 mm, 0.4 mm Pitch 3000 / Tape & Reel 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. The table below pertains to the Packaging information on the following page. PRODUCT DIMENSIONS D E X Y 760 mm 30 mm 760 mm 30 mm 0.180 mm 0.018 mm 0.180 mm 0.018 mm IntelliMAX is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP4 0.76x0.76x0.586 CASE 567SS ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON16616G WLCSP4 0.76x0.76x0.586 DATE 30 NOV 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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