FPF1203LUCX - ON SEMICONDUCTOR

July, 2020 − Rev. 4

1Publication Order Number:

FPF1203/D

IntelliMAXt Ultra-Small,

Slew-Rate-Controlled Load

Switch

FPF1203, FPF1203L,

FPF1204

Description

The FPF1203 / 03L / 04 are ultra−small integrated IntelliMAX load

switches with integrated P−channel switch and analog control

features. Integrated slew−rate control prevents inrush current and the

resulting excessive voltage drop on the power rail. The input voltage

range operates from 1.2 V to 5.5 V to provide power−disconnect

capability for post−regulated power rails in portable and consumer

products. The low shut−off current allows power designs to meet

standby and off−power drain specifications.

The FPF120x are controlled by a logic input (ON pin) compatible

with standard CMOS GPIO circuitry found on Field Programmable

Gate Array (FPGA) embedded processors. The FPF120x are available

in 0.76 mm x 0.76 mm 4−bump WLCSP.

Features

•1.2 V to 5.5 V Input Voltage Operating Range

•Typical RON:

♦45 mW at VIN = 5.5 V

♦55 mW at VIN = 3.3 V

♦90 mW at VIN = 1.8 V

♦185 mW at VIN = 1.2 V

•Slew Rate Control with tR:

♦100 ms

•Output Discharge Function on FPF1204

•Low <1.5 mA Quiescent Current

•ESD Protected: Above 7 kV HBM, 2 kV CDM

•GPIO / CMOS−Compatible Enable Circuitry

•4−Bump, WLCSP 0.76 mm x 0.76 mm, 0.4 mm Pitch

•These are Pb−Free Devices

Applications

•Mobile Devices and Smart Phones

•Portable Media Devices

•Tablet PCs

•Advanced Notebook, UMPC, MID

•Portable Medical Devices

•GPS and Navigation Equipment

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MARKING DIAGRAM

XX (QL, QP, = Specific Device Code

QM, VS)

&K = 2−Digits Lot Run Traceability Code

&2 = 2−Digit Date Code

&. = Pin One Dot

&Z = Assembly Pant Code

See detailed ordering and shipping information on page 8 of

this data sheet.

ORDERING INFORMATION

WLCSP4 0.76x0.76x0.586

CASE 567SS

X&K

X&2

&. &Z

FPF1203, FPF1203L, FPF1204

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APPLICATION DIAGRAM

Figure 1. Typical Application

FPF1203/03L/04

VIN

VIN VOUT

COUT

VOUT

GND

CIN

−

FUNCTIONAL BLOCK DIAGRAM

Figure 2. Functional Block Diagram (Output Discharge for FPF1204)

GND

CONTROL

LOGIC

Turn−On Slew Rate

Controlled Driver

ESD Protection

FPF1203/03L/04

Output Discharge

(Optional)

VIN

VOUT

FPF1203, FPF1203L, FPF1204

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PIN CONFIGURATIONS

Figure 3. WLCSP Bumps Facing Down

(Top View)

Figure 4. WLCSP Bumps Facing Up

(Bottom View)

Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View)

A 2 A 1

B 2 B 1

A2A1

B2B1

VOUT

GND

VIN

VOUT

GND

PIN DEFINITONS

Pin No. Name Description

A1 VOUT Switch output

A2 VIN Supply input: input to the power switch

B1 GND Ground

B2 ON ON/OFF Control, active HIGH; FPF1203/04

B2 ON ON/OFF Control, active LOW; FPF1203L

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Min Max Unit

VIN VIN, VOUT

, VON to GND −0.3 6.0 V

ISW Maximum Continuous Switch Current at Ambient Operating Temperature −2.2 A

PDPower Dissipation at TA = 25°C−1.0 W

TSTG Storage Temperature Range −65 +150 °C

QJA Thermal Resistance, Junction−to−Ambient 1S2P with One Thermal Via (Note 1) −110 °C/W

1S2P without Thermal Via (Note 2) −95

ESD Electrostatic Discharge Capability (Note 1, 2) Human Body Model, JESD22−A114 7−kV

Charged Device Model, JESD22−C101 2−

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Measured using 2S2P JEDEC std. PCB.

2. Measured using 2S2P JEDEC PCB COLD PLATE Method.

FPF1203, FPF1203L, FPF1204

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RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VIN Input Voltage 1.2 5.5 V

TAAmbient Operating Temperature −40 +85 °C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VIN = 1.2 V to 5.5 V and TA = −40 to +85°C. Typical values are at VIN

= 3.3 V and TA = 25°C.)

Symbol Parameter Condition Min Typ Max Unit

BASIC OPERATION

VIN Supply Voltage 1.2 −5.5 V

IQ(OFF) Off Supply Current FPF1203/04 VON = GND, VOUT = Open, VIN = 5.5 V −0.1 1.0 mA

FPF1203L VON = VIN, VOUT = Open, VIN = 5.5 V −1.0 2.0

ISD Shutdown Current FPF1203/04 VON = GND, VOUT = GND −0.1 1.0 mA

FPF1203L VON = VIN, VOUT = GND −1.2 3.0

IQQuiescent Current FPF1203/04 IOUT = 0 mA, VON = VIN, = 5.5 V −0.1 1.5 mA

FPF1203L IOUT = 0 mA, VON = GND, VIN, = 5.5 V

RON On Resistance VIN = 5.5 V, IOUT = 200 mA, TA = 25°C−45 55

(Note 3)

VIN = 3.3 V, IOUT = 200 mA, TA = 25°C−55 65

(Note 3)

VIN = 1.8 V, IOUT = 200 mA, TA = 25°C−90 100

(Note 3)

VIN = 1.2 V, IOUT = 200 mA, TA = 25°C−185 220

(Note 3)

VIN = 1.8 V, IOUT = 200 mA, TA = 85°C

(Note 3)

− − 105

RPD Output Discharge RPULL DOWN VIN = 3.3 V, VON = OFF, IFORCE = 20 mA,

TA = 25°C, FPF1204

−65 75 W

VIH On Input Logic HIGH Voltage VIN = 1.2 V to 5.5 V 1.15 − − V

VIL On Input Logic LOW Voltage VIN = 1.2 V to 5.5 V − − 0.65 V

RON_PD Pull−Down Resistance at ON Pin VIN = 1.2 V to 5.5 V −8.3 −MW

ION On Input Leakage VON = VIN or GND − − 1mA

DYNAMIC CHARACTERISTICS

tDON Turn−On Delay (Note 4) VIN = 3.3 V, RL = 10 W, CL = 0.1 mF,

TA = 25°C, FPF1204

−70 −ms

tRVOUT Rise Time (Note 4) −100 −

tON Turn−On Time (Note 6) −170 −

tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 10 W, CL = 0.1 mF,

TA = 25°C, FPF1203L

−0.5 −ms

tFVOUT Fall Time (Note 4, 5) −2.0 −

tOFF Turn−Off Time (Note 5, 7) −2.5 −

tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 500 W, CL = 0.1 mF,

TA = 25°C, FPF1203L

−6−ms

tFVOUT Fall Time (Note 4, 5) −115 −

tOFF Turn−Off Time (Note 5, 7) −121 −

tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 10 W, CL = 0.1 mF,

TA = 25°C, FPF1203

−4.0 −ms

tFVOUT Fall Time (Note 4, 5) −2.9 −

tOFF Turn−Off Time (Note 5, 7) −7.3 −

FPF1203, FPF1203L, FPF1204

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ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VIN = 1.2 V to 5.5 V and TA = −40 to +85°C. Typical values are at VIN

= 3.3 V and TA = 25°C.) (continued)

Symbol UnitMaxTypMinConditionParameter

DYNAMIC CHARACTERISTICS

tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 500 W, CL = 0.1 mF,

TA = 25°C, FPF1203

−6−ms

tFVOUT Fall Time (Note 4, 5) −115 −

tOFF Turn−Off Time (Note 5, 7) −121 −

tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 10 W, CL = 0.1 mF,

TA = 25°C, FPF1204 (Note 5)

−4.0 −ms

tFVOUT Fall Time (Note 4, 5) −2.5 −

tOFF Turn−Off Time (Note 5, 7) −6.5 −

tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 500 W, CL = 0.1 mF,

TA = 25°C, FPF1204 (Note 5)

−6−ms

tFVOUT Fall Time (Note 4, 5) −11 −

tOFF Turn−Off Time (Note 5, 7) −17 −

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

3. This parameter is guaranteed by design and characterization; not production tested.

4. tDON / tDOFF / tR / tF are defined in Figure 23.

5. Output discharge enabled during off−state.

6. tON = tR + tDON

7. tOFF = tF + tDOFF

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 7. Shutdown Current vs. Temperature Figure 8. Shutdown Current vs. Supply Voltage

Figure 9. Off Supply Current vs. Temperature

(VOUT Floating)

Figure 10. Off Supply Current vs. Supply Voltage

(VOUT Floating)

FPF1203, FPF1203L, FPF1204

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TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

Figure 11. Quiescent Current vs. Temperature Figure 12. Quiescent Current vs. Supply Voltage

Figure 13. RON vs. Temperature Figure 14. RON vs. Supply Voltage

Figure 15. ON Pin Threshold vs. VIN Figure 16. Drain Current vs. Drain−Source Voltage

Safe Operating Area

0.01

0.1

100

0.1 1 10

ID, DRAIN CURRENT (A)

VDS, DRAIN−SOURCE VOLTAGE (V)

10s

100ms

RDS(ON) Limit

Single Pulse

RθJA = 110oC/W

TA= 25oC

10ms

1ms

100 ms

FPF1203, FPF1203L, FPF1204

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TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

Figure 17. Turn−On Response – FPF1203 / 04

(VIN = 3.3 V, CIN = 1 mF, COUT = 0.1 mF, R L = 10 W)

Figure 18. Turn−Off Response – FPF1203

(VIN = 3.3 V, CIN = 1 mF, COUT = 0.1 mF, R L = 10 W)

Figure 19. Turn−Off Response – FPF1203

(VIN = 3.3 V, CIN = 1 mF, COUT = 0.1 mF, R L = 500 W)

Figure 20. Turn−Off Response (VIN = 3.3 V,

CIN = 1 mF, C OUT = 0.1 mF, R L = 10 W, FPF1204)

Figure 21. Turn−Off Response (VIN = 3.3 V,

CIN = 1 mF, C OUT = 0.1 mF, R L = 500 W, FPF1204)

FPF1203, FPF1203L, FPF1204

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OPERATION AND APPLICATION DESCRIPTION

The FPF1203 / 03L / 04 are low−RON P−channel load

switches with controlled turn−on. The core of each device is

a 55 mW P−channel MOSFET and controller capable of

functioning over a wide input operating range of 1.2 to 5.5 V.

The FPF1204 contain a 65 W on−chip load resistor for

quick output discharge when the switch is turned off.

Figure 22. Typical Application

FPF1204

VIN

VIN VOUT

COUT

VOUT

GND

OFF

CIN

−

Input Capacitor

To limit the voltage drop on the input supply caused by

transient inrush current when the switch turns on into a

discharged load capacitor or short−circuit, a capacitor must

be placed between the VIN and GND pins. A 1 mF ceramic

capacitor, CIN, placed close to the pins is usually sufficient.

Higher−value CIN can be used to reduce the voltage drop in

higher−current applications.

Output Capacitor

A 0.1 mF capacitor, COUT, should be placed between the

VOUT and GND pins. This capacitor prevents parasitic

board inductance from forcing VOUT below GND when the

switch is on. CIN greater than COUT is highly recommended.

COUT greater than CIN can cause VOUT to exceed VIN when

the system supply is removed. This could result in current

flow through the body diode from VOUT to VIN.

Figure 23. Timing Diagram for FPF1203/4

10%

VON

VOUT

tDON tDOFF

10%

3.3 V

90%

10%

50%

Board Layout

For best performance, traces should be as short as

possible. To be most effective, input and output capacitors

should be placed close to the device to minimize the effect

of parasitic trace inductance on normal and short−circuit

operation. Using wide traces or large copper planes for all

pins (VIN, VOUT, ON, and GND) minimizes the parasitic

electrical effects and the case−ambient thermal impedance.

However, the VOUT pin should not connect directly to the

battery source due to the discharge mechanism of the load

switch.

ORDERING INFORMATION

Part Number

Top

Mark

Switch

(Typical)

at 3.3VIN

Output

Discharge

ON Pin

Activity tRPackage Shipping

†

FPF1203UCX QL 55 mWNA Active HIGH 100 ms4−Bump, Wafer−Level

Chip−Scale Package

(WLCSP), 0.76 mm x

0.76 mm, 0.4 mm Pitch

3000 / Tape & Reel

FPF1203LUCX QP 55 mWNA Active LOW 100 ms3000 / Tape & Reel

FPF1204UCX QM 55 mW65 WActive HIGH 100 ms3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

The table below pertains to the Packaging information on the following page.

PRODUCT DIMENSIONS

D E X Y

760 mm ±30 mm760 mm ±30 mm0.180 mm ±0.018 mm0.180 mm ±0.018 mm

IntelliMAX is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.

WLCSP4 0.76x0.76x0.586

CASE 567SS

ISSUE O

DATE 30 NOV 2016

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

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disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

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DOCUMENT NUMBER:

DESCRIPTION:

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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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