PROTECTION PRODUCTS
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PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
EClamp2410P
ESD Protection Device
for T-Flash/MicroSD Interfaces
Description Features
Package Confi guration
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
The EClampTM2410P is a combination EMI fi lter and line
termination device with integrated TVS diodes for use on
Multimedia Card interfaces. This state-of-the-art de-
vice utilizes solid-state silicon-avalanche technology for
superior clamping performance and DC electrical char-
acteristics. They have been optimized for protection of
T-Flash/MicroSD interfaces in cellular phones and other
portable electronics.
The device consists of six circuits that include series im-
pedance matching resistors and pull up resistors as re-
quired by the SD specifi cation. TVS diodes are included
on each line for ESD protection. An additional TVS diode
connection is included for protection of the voltage (Vdd)
bus. Termination resistor value of 45 Ohms is included
on the DAT0, DAT1, DAT2, DAT3, CMD, and CLK lines.
Pull up resistors of 15k Ohms are included on DAT0,
DAT1, DAT2, and CMD lines while a 50k Ohm pull up is
inlcuded on the DAT3 line. These may be confi gured for
devices operating in SD or SPI mode . The TVS diodes
provide effective suppression of ESD voltages in excess
of ±15kV (air discharge) and ±8kV (contact discharge)
per IEC 61000-4-2, level 4.
The EClamp2410P is in a 16-pin, RoHS/WEEE compliant,
SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm.
The leads are spaced at a pitch of 0.5mm and are fi n-
ished with lead-free NiPd.
Mechanical Characteristics
Pin Confi guration
Applications
T-Flash / MicroSD Interfaces
MMC Interfaces
CDMA, GSM, 3G Cell Phones
SLP4016P16 16-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead fi nish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Bidirectional EMI/RFI fi ltering and line termination
with integrated ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
TVS working voltage: 5V
Termination Resistors: 45Ω
Pull Up Resistors: 15kΩ (3 each) and 50kΩ
Typical Capacitance per Line: 12pF (VR = 2.5V)
Protection and termination for six lines + Vdd
Solid-state technology
Pin Designation (Top View)
Revision 07/20/2006
DAT1 In
DAT0 In
CLK In
Rup1
1
Vdd
CMD In
DAT3 In
DAT2 In DAT2 Out
DAT3 Out
CMD Out
Rup2
Rup3
CLK Out
DAT1 Out
DAT0 Out
16
4.00
1.60
0.58
0.50 BSC
12
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PRELIMINARY
PROTECTION PRODUCTS
EClamp2410P
Schematics & Component Values
DAT3
CLK
Pin Confi guration (Top View)
DAT1, DAT2
Pin Symbol Identifi cation
1, 16 DAT1 Data line #1 input/output with pull-up resistor
2, 15 DAT0 Data line #0 input/output with pull-up resistor
3, 14 Clock Clock line Input/Output
4 Rup1 15k Pull-up resistor from DAT1 & DAT2
5 Vdd Power Supply ESD Protection
6, 11 CMD Command Line Input/Output
7, 10 DAT3 Data line #3 input/output with pull-up resistor
8, 9 DAT2 Data line #2 input/output with pull-up resistor
12 Rup2 50k Pull-Up Resistor from DAT3
13 Rup3 15k Pull-up resistor from DAT0 & CMD
Center
tab GND Ground connection
Pin Identifi cation and Confi guration
Vdd DAT0, CMD
12345678
910111214 1316 15
Rup
15K
45 Ohms
Pin 4
Pin 1, 8 Pin 9, 16
Rup
50K
45 Ohms
Pin 12
Pin 7 Pin 10
45 Ohms
Pin 3 Pin 14
Pin 5
Rup
15K
45 Ohms
Pin 13
Pin 2, 6 Pin 11, 15
DAT0, CMD Line
3
2006 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2410P
Maximum Ratings
Electrical Characteristics (T = 25oC)
Rating Symbol Value Units
ESD per IEC61000-4-2 (Air)
ESD per IEC61000-4-2 (Contact) VESD
+/- 17
+/- 12kV
kV
Operating Temperature TJ-40 to +85 o C
Storage Temperature TSTG -55 to +150 o C
Parameter Symbol Conditions Minimum Typical Maximum Units
TVS Reverse Stand-Off Voltage VRWM 5V
TVS Reverse Breakdown Voltage VBR It = 1mA 6 8 10 V
TVS Reverse Leakage Current IRVRWM = 3.0V 0.5 µA
Series Resistors R Each Line 38 45 52 Ohms
DAT Pull Up Resistor 1 Rup1 12 15 17 k Ohms
DAT Pull Up Resistor 2 Rup2 42 50 58 k Ohms
Total Capacitance Cin Input to Gnd,
Each Line
VR = 2.5V, f = 1MHz
10 12 15 pF
42006 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2410P
Typical Characteristics
Typical Insertion Loss S21 (Each Line) ESD Clamping (+8kV Contact)
Normalized Capacitance vs. Reverse Voltage Series Resistance vs. Temperature
Pull Up Resistance (Rup2) vs. Temperature
2
3
4
START
.
030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -6.145 dB
300 MHz
2: -14.437 dB
900 MHz
3: -23.847 dB
1.8 GHz
4: -32.024 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
1
Pull Up Resistance (Rup1) vs. Temperature
40
41
42
43
44
45
46
47
48
49
50
-40 -25 -10 5 20 35 50 65 80
Temperature (0C)
Series Resistance (Ohm)
15200
15300
15400
15500
15600
15700
15800
15900
16000
16100
16200
-40-30-20-100 1020304050607080
Temperature (
o
C)
Pull Up Resistance (Ohm)
48000
49000
50000
51000
52000
53000
54000
55000
56000
57000
58000
-40-30-20-10 0 1020304050607080
Temperature (
o
C)
Pull Up Resistance (Ohm)
0
0.2
0.4
0.6
0.8
1
1.2
012345
Reverse Voltage - VR (V)
CJ(VR) / CJ(VR=2.5)
f = 1 MHz
5
2006 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2410P
Applications Information
Device Connection
The EClamp2410P is a microSD/T-Flash interface device
designed for use in cell phones and other portable
electronic devices. The EClamp2410P is comprised of
series and pull up resistors required on the microSD
interface. Each line also includes TVS diodes for ESD
protection. The device may be confi gured for SD or SPI
mode operation. In SD mode for example, the 15k Ohm
pull up resistors (Rup 1 and Rup 3) are connected to
VDD. In SPI mode pin 4 is not connected (Rup 1) since
these are reserved lines. The 50k Ohm pull up resistor
is used for card detection or SPI mode selection during
power up and is disconnected by the user during regular
data transfer.
The EClamp2410P is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the bottom
of the device. The device has a fl ow through design for
easy layout. Pin connections are noted in Figure 1. A
center tab serves as the ground connection. Recom-
mendations for the ground connection are given below.
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the fi ltering and ESD performance of the device.
Ground loop inductance can be reduced by using mul-
tiple vias to make the connection to the ground plane.
Figure 2 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20
mm) while the two external vias have a diameter of
0.010 inches (0.250mm). The internal vias are spaced
approximately evenly from the center of the pad. The
designer may choose to use more vias with a smaller di-
ameter (such as 0.005 inches or 0.125mm) since chang-
ing the diameter of the via will result in little change in
inductance.
Layout Guidelines for Optimum ESD Protection
Good circuit board layout is critical not only for signal
integrity, but also for effective suppression of ESD
induced transients. For optimum ESD protection, the
following guidelines are recommended:
Place the device as close to the connector as
possible. This practice restricts ESD coupling into
adjacent traces and reduces parasitic inductance.
The ESD transient return path to ground should be
kept as short as possible. Whenever possible, use
multiple micro vias connected directly from the
device ground pad to the ground plane.
Avoid running critical signals near board edges.
Figure 1 - Pin Identifi cation and Confi guration
(Top Side View)
DAT1 In
DAT0 In
CLK In
Rup1
1
Vdd
CMD In
DAT3 In
DAT2 In DAT2 Out
DAT3 Out
CMD Out
Rup2
Rup3
CLK Out
DAT1 Out
DAT0 Out
16
Figure 2 - Recommended Layout using Ground Vias
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PRELIMINARY
PROTECTION PRODUCTS
EClamp2410P
Applications Information
Figure 3 - MicroSD Protection
DAT 1 IN
DAT 0 IN
CLK IN
Rup 15KΩ
VDD
CMD IN
DAT 3 IN
DAT 2 IN
DAT 1 OUT
DAT 0 OUT
CLK OUT
DAT 3 OUT
DAT 2 OUT
CMD OUT
Rup 15KΩ
Rup 50KΩHost IC
EClamp2410P
MicroSD Connector
DAT 1 IN
DAT 0 IN
CLK IN
Rup 15KΩ
VDD
CMD IN
DAT 3 IN
DAT 2 IN
DAT 1 OUT
DAT 0 OUT
CLK OUT
DAT 3 OUT
DAT 2 OUT
CMD OUT
Rup 15KΩ
Rup 50KΩHost IC
EClamp2410P
MicroSD Connector
7
2006 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2410P
Applications Information - Spice Model
Spice Model
Rup
15K
45 Ohms
Pin 4, 13
Pin 1, 8, 2, 6 Pin 9, 16, 11, 15
R1
Rup
50K
45 Ohms
Pin 12
Pin 7 Pin 10
R1
45 Ohms
Pin 3 Pin 14
R1
Pin 5
DAT1, DAT2, DAT0, CMD DAT3
VDDCLK
EClamp2410P Spice Parameters
Parameter Unit D1 (TVS)
IS Amp 2E-15
BV Volt 7.46
VJ Volt 0.777
RS Ohm 1.00
IBV Amp 1E-3
CJO Farad 10E-12
TT sec 2.541E-9
M--0.246
N--1.1
EG eV 1.11
82006 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2410P
Land Pattern - SLP4016P16
Outline Drawing - SLP4016P16
INCHES
.020 BSC
b.007
bbb
aaa
N
D1
L
e
D
.011
.122
DIM
A1
A2
A
MIN
.000
.020
0.300.20.012 0.25
.010
0.38
3.30
0.28
3.10
.004
.003
16
.013
.157
.126
.015
.130
0.08
0.10
16
0.33
3.20
0.50 BSC
MILLIMETERS
MAX
0.05
0.65
DIMENSI ONS
MIN
0.00
NOM
(. 005)
.023
.001
MAX
.002
.026
NOM
0.50
.003
(0. 13)
0.58
CONTROLLING DIMENSIO NS ARE I N MILLIMETERS (ANG LES IN DEG REES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
NOTES:
2.
1.
E1 .010 . 016 .020 0.25 0.40 0.50
4.00
1.60.063E
AB
A1
SEATIN G
C
PLAN E
aaa C
bxN
D
E
bbb C A B
e
12
N
PIN 1
IN D ICATOR
( LASER MAR K)
A2
A
4.103.90.161.153
1.701.50.067.059
E1
LxN E/2
D/2
D1
B.130 3.30
X
Z
P
Y
G(C)
C.060 1.52
F
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YO UR MANUFACTURING GRO UP T O ENSURE YO UR
NOT ES:
1.
DIM
X
Y
P
G
F
MI LLIMET ERSINCHES
0.45
.012
.025
.035
.020
.018
0.30
0.63
0.50
0.89
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.15.085Z
B
9
2006 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2410P
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Marking Ordering Information
Tape and Reel Specifi cation
EMIClamp and EClamp are marks of Semtech Corporation
Device Orientation in Tape
Pin 1 Location
User Direction of feed
PIN 1
INDICATOR
(LASER MAR K)
2410P
YW
Tape
Width B, (Max) D D1 E F K
(MAX) PP0P2T(MAX)W
12 mm 8.2 mm
(.476)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.0 mm
±0.05
(.039)
1.750±.10
mm
(.069±.004)
5.5±0.05
mm
(.217±.002)
4.5 mm
(.177)
4.0±0.1
mm
(.157±.00-
4)
4.0±0.1
mm
(.157±.00-
4)
2.0±0.05m-
m
(.079±.002)
0.4 mm
(.016)
12.0 mm
+ 0.3 mm
- 0.1 mm
(.472±.012)
A0 B0 K0
1.78 +/-0.10 mm 4.30 +/-0.10 mm 0.74 +/-0.10 mm
Part Number Qty per Reel Reel Size
EClamp2410P.TCT 3,000 7 inch